Abstract: A light fixture system comprising a light fixture comprising light sources arranged in groups, wherein each group comprises one or more light sources, and a controller, wherein the controller is arranged to control the groups so that each of the groups is repeatedly switched on and off, wherein at a first point in time some groups are switched on and others are switched off, at a second point in time some of the groups which were switched on at the first point in time are switched off, and some of the groups which were switched off at the first point in time is switched on, and at a third point in time some of the groups which were switched on at the second point in time are switched off, and some of the groups which were switched off at the second point in time are switched on.

Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.

Abstract: A vehicular driver monitoring system includes a camera disposed at an interior rearview mirror assembly of a vehicle equipped with the vehicular driver monitoring system, an electronic control unit (ECU) with an image processor for processing image data captured by the camera. The camera includes an imaging array sensor and a lens and the camera is adjustable by at least one of (i) adjusting a position of the imaging array sensor relative to the lens and (ii) adjusting a position of the lens relative to the imaging array sensor. The system, responsive to processing at the ECU of image data captured by the camera, monitors a body portion of a driver of the vehicle and adjusts the camera to adjust the position of where the monitored body portion of the driver is imaged at the imaging array sensor.

Abstract: A light emission device includes: a wiring board; a plurality of light-emitting elements being disposed on the wiring board and electrically connected to a wiring layer of the wiring board; a first light diffusing member being disposed on the wiring board, the first light diffusing member having a plurality of throughholes and containing a light-diffusive material, each of the plurality of light-emitting elements being disposed in a corresponding one of the plurality of throughholes; a plurality of second light diffusing members covering the plurality of light-emitting elements and being disposed in the plurality of throughholes, each second light diffusing member containing a light-diffusive material, such that a content ratio of the light-diffusive material in each second light diffusing member is higher than a content ratio of the light-diffusive material in the first light diffusing member; and a wavelength converting member.

Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.

Abstract: The disclosed technology relates to a hard and soft light module having a housing with a first surface that accommodates a lens. A first plurality of LEDs are disposed along a periphery of the first surface, the first plurality of LEDs are configured to generate light in a first direction toward an edge of the lens. A second plurality of LEDs are disposed proximate to the first surface, the second plurality of LEDs are configured to generate light in a second direction through the lens. The first plurality of LEDs are configured to generate a soft light and the second plurality of LEDs are configured to generate a hard light.

Abstract: A sensor switch includes abase unit having bottom, top and intermediate layer assemblies cooperatively defining a receiving space. One of the bottom, top and intermediate layer assemblies has a mounting surface. A sensor unit is disposed in the receiving space and includes a light emitter, a light receiver, and a rolling member for changing the amount of light received by the light receiver. A conducting unit includes a power supply section, a power supply conducting element disposed on the mounting surface, and a signal conducting element disposed on the mounting surface and spaced apart from the power supply conducting element.

Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

Abstract: A semiconductor device includes a light-emitting element, a light-receiving element, a switching element, an input-side terminal, an output-side terminal, and a resin layer. The light-emitting element, the light-receiving element and the switching element are provided at the front side of the resin layer. The light-receiving element and the switching element are arranged in a first direction along the front side of the resin layer. The switching element is electrically connected to the light-receiving element. The light-receiving element is provided between the light-emitting element and the resin layer. The input-side and output-side terminals are provided at the backside of the resin layer. The input-side terminal is electrically connected to the light-emitting element. The output-side terminal is electrically connected to the switching element.

Abstract: A light emitting device including a first LED sub-unit, a second LED sub-unit disposed under the first LED sub-unit, a third LED sub-unit disposed under the second LED sub-unit, a first ohmic electrode interposed between the first LED sub-unit and the second LED sub-unit, and in ohmic contact with the first LED sub-unit, a second ohmic electrode interposed between the second LED sub-unit and the third LED sub-unit, and in ohmic contact with the second LED sub-unit, a third ohmic electrode interposed between the second ohmic electrode and the third LED sub-unit, and in ohmic contact the third LED sub-unit, a plurality of electrode pads disposed on the first LED sub-unit, in which at least one of the first ohmic electrode, the second ohmic electrode, and the third ohmic electrode has a patterned structure.

Abstract: Light-emitting devices are described herein. A device includes a packaging substrate having a top surface and a bottom surface and a hybridized device having a bottom surface on the top surface of the packaging substrate. The hybridized device includes a silicon backplane that includes input/output (I/O) pins and a light-emitting diode (LED) array having a bottom surface on a top surface of the silicon backplane. Passive components are disposed on the top surface of the packaging substrate. Conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: A light-emitting module includes: a semiconductor light-emitting element; a circuit board on which a lighting control circuit configured to perform control to turn on and off the semiconductor light-emitting element is provided; and an element metal plate on which the semiconductor light-emitting element is mounted. The circuit board is a resin substrate in which a wiring portion connecting the semiconductor light-emitting element and the lighting control circuit is provided.

Abstract: PIC die packages may include a PIC die including: a body having a plurality of layers including a plurality of interconnect layers. A first optical fiber is positioned in a groove and a second optical fiber positioned in another groove in the edge of the body. The first optical fiber is aligned with an optical component in a first layer of the body at a first vertical depth, and the second optical fiber is aligned with another optical component in a second, different layer of the body at a second different vertical depth. A cover is over at least a portion of the body. The cover includes a member having a face defining a first seat therein having a first height to receive a portion of the first optical fiber, and defining a second seat therein having a second, different height to receive a portion of the second optical fiber.

Abstract: An optical sensor includes a substrate, a light emitting element, a light receiving element, and an electronic circuit element. Light from the light emitting element is blocked by a detection object to detect the detection object. The light emitting element, the electronic circuit element and the light receiving element are mounted on the same surface of the substrate. The electronic circuit element is disposed between the light emitting element and the light receiving element on a mounting surface of the substrate.

Abstract: Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: A semiconductor package includes a base material, a capture land, an interconnection structure, a semiconductor chip and an encapsulant. The base material has a top surface and an inner lateral surface. The capture land is disposed in or on the base material, and has an outer side surface. The interconnection structure is disposed along the inner lateral surface of the base material, and on the capture land. The interconnection structure has an outer side surface. An outer side surface of the semiconductor package includes the outer side surface of the capture land and the outer side surface of the interconnection structure. The semiconductor chip is disposed on the top surface of the base material. The encapsulant is disposed adjacent to the top surface of the base material, and covers the semiconductor chip.

Abstract: An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrates.

Abstract: An LED lighting device capable of adjusting color temperature by software and hardware cooperative control to achieve high-performance output includes at least one light source and a drive circuit. The light source includes first-wavelength LED, second-wavelength LED, third-wavelength LED and fourth-wavelength LED. When a modulator is operated to select only one of the first-wavelength LED, the second-wavelength LED, the third-wavelength LED and the fourth-wavelength LED to receive a maximum rated current, the drive circuit outputs four times of the maximum drive power to the corresponding LEDs; or when the first-wavelength LED, the second-wavelength LED, the third-wavelength LED and the fourth-wavelength LED receive a quarter of the maximum rated current separately, the drive circuit outputs a quarter of the maximum drive power to the LEDs separately, and the output pulse width of the drive power will be modulated to maintain the light source to carry a constant rated power.

Abstract: A light emitting device including a substrate, a first semiconductor layer disposed on the substrate, a mesa including a second semiconductor layer and an active layer disposed on the first semiconductor layer, a first contact electrode contacting the first semiconductor layer, a second contact electrode contacting the second semiconductor layer, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode, and including a first opening disposed on the first contact electrode and a second opening disposed on the second contact electrode, and first and second bump electrodes electrically connected to the first and second contact electrodes through the first and second openings, respectively, in which the first and second bump electrodes are disposed on the mesa, the passivation layer is disposed between the first bump electrode and the second contact electrode, and the first contact electrode includes an alloy layer.

Abstract: A sensor package includes a sensor, at least one external wall, and an interposer, arranged between the sensor and the at least one external wall. The sensor is wire bonded to the interposer and the interposer is wire bonded to the at least one external wall. Using an interposer, wire bonded to both the sensor and the at least one external wall, is an improved approach to electrically connecting a sensor and a sensor package. The interposer allows for short wire bonds from the sensor and the at least one external wall to the interposer, replacing the single, long wire bond from the sensor to the at least one external wall in the prior art. This provides improved resilience of the sensor package under high stress. Furthermore, it allows an existing sensor and package combination to be improved without needing to redesign either component.

Abstract: A display module including a display panel comprising a plurality of pixels each comprising a plurality of sub pixels, the pixels being disposed on a plurality of row lines of the display panel and a driver. The driver being configured to apply a pulse width modulation (PWM) data voltage to the sub pixels in a sequential order of the row lines; and drive the display panel such that the sub pixels included in a plurality of consecutive row lines among the plurality of row lines emit light, in the sequential order of the row lines, for a time corresponding to the applied PWM data voltage.

Abstract: Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.

Abstract: An endoscope apparatus includes a camera and circuitry. The camera is detachably connected to a base of an endoscope adapted to be inserted in a subject and includes a sensor configured to image a subject image captured by the endoscope. The circuitry is configured to process an image captured by the camera and generate a video signal for display, calculate a gain in white balance based on the captured image, and perform mask edge detecting processing for detecting a boundary point between the subject image and a mask area other than the subject image included in the captured image.

Abstract: Disclosed herein are photonic package assemblies, packages, and devices that include photonic dies and optical coupling structures aligned with photonic dies to enable exchange of electromagnetic signals. In one aspect, a photonic package assembly includes a photonic integrated circuit (PIC) die having one or more PICs, and an optical coupling structure (OCS) positioned adjacent to the PIC die such that electromagnetic signals may be exchanged between at least one of the one or more PICs and the OCS. The assembly further includes a structure that forms a bridge, and, thereby, provides mechanical coupling, between the OCS and the PIC die. Providing a bridge structure that directly attaches an OCS to a PIC die may improve achieving and maintaining the desired alignment between the OCS and the PIC die, which may lead to an improved coupling performance over the lifetime of products.

Abstract: An endoscope includes an insertion portion in which a rigid distal end portion, a bending portion, and a flexible portion are provided in a connected row arrangement, and an optical fiber that is inserted through the insertion portion. The endoscope has, in the rigid distal end portion, an optical transmission module in which an image pickup device, an optical device in which a light-emitting portion is formed, and a holding member that has a through hole. A length in the bending portion of the optical fiber whose distal end portion is inserted into and fixed in the through hole of the holding member is longer than a length L0 of the bending portion.

Abstract: An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

Abstract: A high-power packaged laser array that is thermal reflow compatible is described. Notably, a high-power III-V laser array is integrated on a silicon substrate with a matching array of ball lenses, an isolator and a coupler (such as a reflective layer) to achieve an edge-coupled or a surface-normal output laser array. In some embodiments, an isolator with a permanent magnet is used to preserve the magnetic domain or state of the isolator during the thermal reflow(s), which can involve temperatures up to 250 C. In order to relax the misalignment tolerance when integrating with the silicon chip, a laser array with a larger optical mode may be used to increase the output beam size. Moreover, a III-V laser array with an angled output optical waveguide can be used to improve the stability of the lasers at high power.

Abstract: An integrated photonic module includes a semiconductor substrate configured to serve as an optical bench. Alternating layers of insulating and conducting materials are deposited on the substrate and patterned so as to define electrical connections. An optoelectronic chip is mounted on the substrate in contact with the electrical connections. A drive chip is mounted on the substrate so as to provide an electrical drive current to the optoelectronic chip via the electrical connections.

Abstract: A method of reducing data transfer while increasing image information over an 802.15.4 network includes obtaining an image with a sensor, modulating a representation of the image using a first 802.15.4 modem, sending the representation of the image to a coordinator, demodulating the representation of the image using a second 802.15.4 modem, and digitally enhancing at least one of the representation of the image and the image. A system for communication over an 802.15.4 network includes a sensor for obtaining data, the size of the data being at least an order of magnitude greater than the size of an 802.15.4 packet, a first 802.15.4 modem coupled to the sensor, a buffer for temporarily storing the data to allow transmission of portions of the data; the buffer being coupled to the sensor, a coordinator coupled to the sensor, the coordinator being capable of communicating with a computer, and a second 802.15.4 modem coupled to the coordinator.

Abstract: A light irradiation device includes a plurality of light-emitting portions that emit light by being supplied with a current. The light-emitting portions each have a first power supply terminal, and a second power supply terminal; a plurality of light-emitting elements; and a wiring pattern. The wiring pattern has a first wiring region and a second wiring region. Two of the light-emitting portions that are disposed adjacent to each other are disposed such that the space between the respective first wiring regions or the space between the respective second wiring regions is smaller than the space between the first wiring region of one of the light-emitting portions and the second wiring region of the other of the light-emitting portions.

Abstract: An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

Abstract: This invention discloses a method of manufacturing a package assembly, a package assembly, and a display device. The method includes: providing a base substrate, provided with a first pattern layer and a second pattern layer located outside the first pattern layer; forming a first cladding layer on the base substrate, the first cladding layer covering a second pattern layer and a region surrounded by the second pattern layer; forming a second cladding layer on the first cladding layer, the second cladding layer covering a top portion of the first pattern layer and a region surrounded by the first pattern layer; forming an organic layer on the first cladding layer and the second cladding layer, the organic layer covering the first pattern layer and a region surrounded by the first pattern layer; and forming a third cladding layer on the organic layer and the first cladding layer.

Abstract: A method of reducing data transfer while increasing image information over an 802.15.4 network includes obtaining an image with a sensor, modulating a representation of the image using a first 802.15.4 modem, sending the representation of the image to a coordinator, demodulating the representation of the image using a second 802.15.4 modem, and digitally enhancing at least one of the representation of the image and the image. A system for communication over an 802.15.4 network includes a sensor for obtaining data, the size of the data being at least an order of magnitude greater than the size of an 802.15.4 packet, a first 802.15.4 modem coupled to the sensor, a buffer for temporarily storing the data to allow transmission of portions of the data; the buffer being coupled to the sensor, a coordinator coupled to the sensor, the coordinator being capable of communicating with a computer, and a second 802.15.4 modem coupled to the coordinator.

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.

Abstract: An array substrate, an in-cell touch screen and a touch display device are provided. The array substrate includes a common electrode layer, wherein the common electrode layer is provided with a plurality of driving electrodes and a plurality of sensing electrodes with extending directions perpendicular to each other, each of the driving electrodes includes a plurality of driving sub-electrodes which are connected to one another, each of the sensing electrodes includes a plurality of sensing sub-electrodes which are connected to one another, and adjacent driving sub-electrode and sensing sub-electrode have concave-convex structures in a staggered arrangement at an border and are insulated from each other.

Abstract: A method of reducing data transfer while increasing image information over an 802.15.4 network includes obtaining an image with a sensor, modulating a representation of the image using a first 802.15.4 modem, sending the representation of the image to a coordinator, demodulating the representation of the image using a second 802.15.4 modem, and digitally enhancing at least one of the representation of the image and the image. A system for communication over an 802.15.4 network includes a sensor for obtaining data, the size of the data being at least an order of magnitude greater than the size of an 802.15.4 packet, a first 802.15.4 modem coupled to the sensor, a buffer for temporarily storing the data to allow transmission of portions of the data; the buffer being coupled to the sensor, a coordinator coupled to the sensor, the coordinator being capable of communicating with a computer, and a second 802.15.4 modem coupled to the coordinator.

Abstract: A connector is provided and includes a housing with an electronic module receiving passageway positioned therein. The housing includes a first housing and a second housing. The first housing includes a pair of first sidewalls positioned opposite from each other and a pair of partitions forming a slot extending along each of the pair of first sidewalls. The second housing includes a pair of second sidewalls positioned opposite one another, an extension disposed on each the pair of second sidewalls and corresponding with the slot, and a plurality of ribs extending outward from the extension and corresponding with inner surface of the pair of partitions.

Abstract: A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The photonic chip may be implemented using a silicon-on-insulator technology, and may include an optical waveguide that conveys an optical signal and traces that are electrically coupled to the driver integrated circuit. Moreover, the interposer may be electrically coupled to the traces. Furthermore, the optical gain chip may include a III/V compound semiconductor (and, more generally, a semiconductor other than silicon), and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Additionally, the optical gain chip may be electrically coupled to the interposer.

Abstract: An optical device may include a semiconductor laser chip to independently generate four laser beams at different wavelengths. Each laser beam, of the four laser beams, may be directed to a respective optical output of the optical device with a sub-micron level of tolerance of each laser beam relative to the respective optical outputs of the optical device, and each laser beam, of the four laser beams, may be associated with a different optical path from the semiconductor laser chip to the respective optical output of the optical device. The optical device may include a lens to receive each of the four laser beams. The lens may be positioned to direct each laser beam, of the four laser beams, toward the respective optical output of the optical device. The optical device may include an optical isolator to receive each of the four laser beams.

Abstract: An optical communication apparatus comprises a laser, a laser driver chip, a photodetector, an amplifier chip, an assembling plate and at least two I/O interfaces. The laser, the laser driver chip, the photodetector and the amplifier chip are disposed on the assembling plate. The laser is connected to the laser driver chip via transmission lines and the photodetector is connected to the amplifier chip via transmission lines. A plurality of conducting vias are formed in the assembling plate, the laser driver chip and the amplifier chip are respectively connected to different I/O interfaces via electrical transmission lines passing through the conducting vias. The laser is connected to an optical fiber to transmit optical signals, and the photodetector is connected to another optical fiber to receive optical signals. A method of assembling such an optical communication apparatus is also provided.

Abstract: A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame.

Abstract: An LED switch device and a matrix thereof are disclosed. There is an electroluminescent semiconductor element with a first polarity contact and a second polarity contact. There is also a first polarity LED lead frame, to which the electroluminescent semiconductor element is mounted. The first polarity contact of the electroluminescent semiconductor element is electrically connected to the first polarity LED lead frame. The LED switch device has a second polarity LED lead frame electrically connected to the second polarity contact of the electroluminescent semiconductor element. The LED switch device also has a touch sensor lead frame that is electrically connected to a touch sensor lead.

Abstract: A method is provided for producing a plurality of optoelectronic components. A number of semiconductor chips are arranged on a connection carrier assembly. A frame assembly with a number of openings is arranged in such a way, relative to the connection carrier assembly, that the semiconductor chips are each arranged in one of the openings. A number of optical elements are positioned in such a way, relative to the frame assembly, that the optical elements cover the openings. The connection carrier assembly with the frame assembly and the optical elements is singulated into the number of optoelectronic components, such that each optoelectronic component includes one connection carrier with at least one optoelectronic semiconductor chip, one frame with at least one opening and at least one optical element.

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract: A solid-state imaging device includes a plurality of photoelectric conversion portions each provided in a semiconductor substrate and receives incident light through a light sensing surface, and a pixel separation portion provided to electrically separate a plurality of pixels. At least a pinning layer and a light shielding layer are provided in an inner portion of a trench provided on a side portion of each of the photoelectric conversion portions in an incident surface side, the trench includes a first trench and a second trench formed to be wider than the first trench in a portion shallower than the first trench, the pinning layer is formed in an inner portion of the first trench to cover an inside surface of the second trench, and the light shielding layer is formed to bury an inner portion of the second trench at least via the pinning layer.

Abstract: The present invention provides an LED and the manufacturing method thereof, and a light emitting device. The LED includes a first electrode, for connecting the LED to a negative electrode of a power supply; a substrate, located on the first electrode; and an LED die, located on the substrate; in which a plurality of contact holes are formed extending through the substrate, the diameter of upper parts of the contact holes is less than the diameter of lower parts of the contact holes, and the contact holes are filled with electrode plugs connecting the first electrode to the LED die. The light emitting device includes the LED, and further includes a susceptor and an LED mounted on the susceptor.

Abstract: A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.

Abstract: A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and a light extraction structure that extracts light from the light emitting structure. The light extraction structure includes at least a first light extraction zone and a second light extraction zone, where a period and/or size of first concave and/or convex structures of the first light extraction zone is different from a period and/or size of second concave and/or convex structures of the second light extraction zone.

Abstract: A method for wafer transfer includes forming a spreading layer, including graphene, on a single crystalline SiC substrate. A semiconductor layer including one or more layers is formed on and is lattice matched to the crystalline SiC layer. The semiconductor layer is transferred to a handle substrate, and the spreading layer is split to remove the single crystalline SiC substrate.