Abstract: An array substrate is disclosed, which includes a connection structure of a second short-circuit ring and one corresponding data line, and this connection structure includes: a first electrode disposed on a base substrate; a connection line disposed on the first electrode; a first insulating layer disposed on the first electrode and the connection line, in which the data line connected with the second short-circuit ring is disposed on the first insulating layer; a second insulating layer disposed on the data line connected with the second short-circuit ring; and a second electrode disposed on the second insulating layer, in which the second electrode is connected with the data line connected with the second short-circuit ring through a first via hole and connected with the first electrode through a second via hole.

Abstract: A display device includes: a gate electrode, a gate line, and data lines on a substrate, the data lines in a same layer as the gate line; a gate insulating layer on the gate line; a semiconductor member on the gate insulating layer; an etch stopper layer on the semiconductor member and the gate insulating layer; a first passivation layer on the etch stopper layer; a source electrode on the first passivation layer and the etch stopper layer and connected to the data lines; a drain electrode on the etch stopper layer; a common electrode on the first passivation layer and separated from the source electrode and the drain electrode; a second passivation layer on the source electrode, the drain electrode and the common electrode; and a pixel electrode on the second passivation layer and connected to the drain electrode.

Abstract: A disclosed display device includes a first oxide semiconductor layer and an oxide semiconductor connection wire both formed from an oxide semiconductor material layer over a substrate. The oxide semiconductor connection wire is integrally connected to the first oxide semiconductor layer and has a lower sheet resistance than the first oxide semiconductor layer. The display device also includes a first gate electrode either over the first oxide semiconductor layer or between the first oxide semiconductor layer and the substrate. The display device further includes a first gate insulation layer between the first oxide semiconductor layer and the first gate electrode.

Abstract: By using a conductive layer including Cu as a long lead wiring, increase in wiring resistance is suppressed. Further, the conductive layer including Cu is provided in such a manner that it does not overlap with the oxide semiconductor layer in which a channel region of a TFT is formed, and is surrounded by insulating layers including silicon nitride, whereby diffusion of Cu can be prevented; thus, a highly reliable semiconductor device can be manufactured. Specifically, a display device which is one embodiment of a semiconductor device can have high display quality and operate stably even when the size or definition thereof is increased.

Abstract: It is an object of the present invention to provide a method for preventing a breaking and poor contact, without increasing the number of steps, thereby forming an integrated circuit with high driving performance and reliability. The present invention applies a photo mask or a reticle each of which is provided with a diffraction grating pattern or with an auxiliary pattern formed of a semi-translucent film having a light intensity reducing function to a photolithography step for forming wires in an overlapping portion of wires. And a conductive film to serve as a lower wire of a two-layer structure is formed, and then, a resist pattern is formed so that a first layer of the lower wire and a second layer narrower than the first layer are formed for relieving a steep step.

Abstract: The present disclosure relates to a pixel cell circuit of compensation feedback voltage. The pixel cell circuit is provided with the compensation capacitance (C_co), one end of the compensation capacitance (C_co) electrically connects to the compensation level wirings G(m)_co, and the other end of the compensation capacitance (C_co) electrically connects to the drain of the TFT (T1) and the pixel electrode (P). A level of the compensation signals transmitted by the compensation level wirings G(m)_co is opposite to the level of the scanning signals transmitted by the scanning lines G(m). When the pixel electrode has been fully charged, the compensation capacitance generates a pull-up feedback voltage for compensating the pull-down voltage caused by the parasitic capacitance so as to eliminate the effects toward the pixel electrodes caused by the scanning signals transmitted by the scanning lines. This configuration not only decreases the flickers, but also the image sticking.

Abstract: A semiconductor device includes a gate, a first electrode, a first insulating layer, an active layer, an etching stop layer, a second insulating layer, a source, a drain and a second electrode. The first insulating layer covers the gate and the first electrode. The active layer and the etching stop layer are disposed on the first insulating layer above the gate and the first electrode respectively. The second insulating layer covers the active layer and the etching stop layer and has a first opening and a second opening exposing the active layer and a third opening exposing the etching stop layer. The source and the drain are disposed on the second insulating layer and contact with the active layer through the first opening and the second opening respectively. The second electrode is located on the second insulating layer and contacts with the etching stop layer through the third opening.

Abstract: Provided is a display device and a method of manufacturing the same. The display device includes a reflective display part including a first cathode electrode and a first anode electrode and a liquid crystal layer, a light emitting display part including a second cathode electrode and a second anode electrode and a light emission film, and a thin film transistor part being electrically connected to the first and second anode electrodes. The light emitting display part further includes a bank disposed on one side of the second anode electrode between the second anode electrode and the light emission film.

Abstract: A subpixel structure for a display device and a method of fabricating the display device are discussed. The subpixel structure can include a light emitting diode, a first switching transistor having a first gate electrode and a first active layer, a driving transistor having a second gate electrode and a second active layer, a second switching transistor including a third gate electrode and a third active layer, and at least one of the first, second and third gate electrodes is disposed between the corresponding first, second and third active layers and a substrate.

Abstract: An object is to prevent an operation defect and to reduce an influence of fluctuation in threshold voltage of a field-effect transistor. A field-effect transistor, a switch, and a capacitor are provided. The field-effect transistor includes a first gate and a second gate which overlap with each other with a channel formation region therebetween, and the threshold voltage of the field-effect transistor varies depending on the potential of the second gate. The switch has a function of determining whether electrical connection between one of a source and a drain of the field-effect transistor and the second gate of the field-effect transistor is established. The capacitor has a function of holding a voltage between the second gate of the field-effect transistor and the other of the source and the drain of the field-effect transistor.

Abstract: A display device according to the present disclosure includes: a transistor section that includes a gate insulating film, a semiconductor layer, and a gate electrode layer, the semiconductor layer being laminated on the gate insulating film, the gate electrode film being laminated on an opposite side to the semiconductor layer of the gate insulating film; a first capacitor section that includes a first metal film and a second metal film, the first metal film being disposed at a same level as wiring layers that are electrically connected to the semiconductor layer and is disposed over the transistor section, the second metal film being disposed over the first metal film with a first interlayer insulating film in between; and a display element that is configured to be controlled by the transistor section.

Abstract: A pixel structure and a method of manufacturing a pixel structure are provided. The pixel structure includes an active device, a gate insulation layer, a dielectric insulation layer, a capacitance electrode, a protection layer and a pixel electrode. The active device includes a gate, a semiconductor channel layer, a source and a drain. The dielectric insulation layer covers the semiconductor channel layer. A dielectric index of the dielectric insulation layer is greater than a dielectric index of the gate insulation layer. The capacitance electrode is overlapped with the drain. The capacitance electrode, the drain and the dielectric insulation layer between the two constitute a storage capacitor structure. The protection layer is disposed on the dielectric insulation layer and the capacitance electrode is located between the protection layer and the dielectric insulation layer. The pixel electrode is disposed on the protection layer and connected to the drain of the active device.

Abstract: An array substrate includes a gate line, a data line and a plurality of pixel units defined by the gate line and the data line intersecting with each other, which are formed on a base substrate, and each pixel unit includes a thin film transistor. The farther the thin film transistor is away from a gate driver side of the array substrate, the more likely an overlapping area between an active layer and a source electrode of the thin film transistor shows an increasing trend. By changing the overlapping area between the active layer and the source electrode, a dielectric constant between a gate electrode and the source electrode increases to enlarge a gate-source capacitance Cgs, leading to an increase of ?Vp; as a result, a common electrode voltage tends to be stable, thus avoiding crosstalk at the time of displaying.

Abstract: A liquid crystal display (LCD) device includes a first LCD panel and a second LCD panel. The first LCD panel is arranged on a backlight source, and is the black mode, the second LCD panel is the white mode. A response time of the first LCD panel changing from the black mode to the white mode is less than a response time of the second LCD panel changing from the black mode to the white mode, and a response time of the first LCD panel changing from the white mode to the black mode is longer than a response time of the second LCD panel changing from the white mode to the black mode.

Abstract: A luminescent display device includes a substrate and a thin-film transistor above the substrate. The thin-film transistor includes a semiconductor layer, a gate insulating film on the semiconductor layer, a gate electrode on the gate insulating film, a source electrode, and a drain electrode. The luminescent display device further includes an interlayer insulating film on the gate electrode, a first capacitor electrode on the interlayer insulating film in a region above the gate electrode, and a luminescent element configured to be driven by a driver to produce luminescence. The driver includes the thin-film transistor, and the first capacitor electrode and the gate electrode constitute a capacitor.

Abstract: A method of manufacturing a display apparatus includes forming an amorphous silicon layer on a substrate, splitting a first laser beam emitted from a first laser source into a first master beam in a first polarization state and a second master beam in a second polarization state, changing the first polarization state of the first master beam to the second polarization state to output a third master beam having the second polarization state and corresponding to the first master beam having the second polarization state, combining the second master beam with the third master beam to output a merged laser beam, and irradiating the amorphous silicon layer with the merged laser beam to form a polysilicon layer.

Abstract: An organic light-emitting diode (OLED) display panel, a manufacturing method thereof and a display device are provided. In the manufacturing method, pixel electrodes, required to be deposited with a material, on a base substrate are charged, and electrodes at an evaporation source are charged to form an electric field; evaporation material corresponding to the material required to be deposited are placed into the evaporation source and ionized, and the ionized evaporation material are deposited on the base substrate under the action of the electric field; deposited material in other pixel units are etched off and removed, so that the evaporation material only on the previously charged pixel electrodes on the base substrate are retained; and patterns of the required material are formed by the processes of deposition and etching in turn. The manufacturing method improves the resolution of finished products and can help to improve the resolution of the OLED.

Abstract: A display device includes a first substrate arranged with a plurality of pixels on a first surface, the plurality of pixels having a display element including a transistor, and a first wiring connected to the transistor, a through electrode arranged in a first contact hole reaching the first wiring from a second surface facing the first surface of the first substrate, a second wiring connected with the through electrode, a first insulation film arranged covering the second wiring on the second surface of the first substrate, and a terminal connected with a second wiring via a second contact hole arranged in the first insulation film.

Abstract: A laser annealing apparatus includes a beam splitter that splits a laser beam emitted from a laser source into a reflection light beam and a transmission light beam, a beam vibrator that makes an irradiation point of the reflection light beam or the transmission light beam vibrate in a predetermined direction, a beam inverter that inverts the reflection light beam or the transmission light beam, and a light collector that collects the reflection light and the transmission light.

Abstract: An organic light-emitting diode (OLED) display panel, a manufacturing method thereof and a display device are provided. In the manufacturing method, pixel electrodes, required to be deposited with a material, on a base substrate are charged, and electrodes at an evaporation source are charged to form an electric field; evaporation material corresponding to the material required to be deposited are placed into the evaporation source and ionized, and the ionized evaporation material are deposited on the base substrate under the action of the electric field; deposited material in other pixel units are etched off and removed, so that the evaporation material only on the previously charged pixel electrodes on the base substrate are retained; and patterns of the required material are formed by the processes of deposition and etching in turn. The manufacturing method improves the resolution of finished products and can help to improve the resolution of the OLED.

Abstract: The present invention teaches a TFT-LCD array substrate manufacturing method: a) forming a gate electrode, a gate electrode insulator layer, an active layer, a source electrode and a drain electrode, a passivation layer, and a passivation layer via on top of the drain electrode on a glass substrate; b) depositing an ITO film on the glass substrate processed by the step a), removing through exposure and development the photo resist in a TFT area outside the passivation layer via and a part of the photo resist in a pixel area where gaps are to be formed, and revealing the ITO film outside the passivation layer via in the TFT area; c) removing a remaining photo resist in the pixel area where gaps are to be formed using a fourth dry etch, so that the ITO film on the gaps to be formed is revealed; d) removing the revealed ITO film using a third wet etch; and e) peeling the photo resist not yet removed, and forming an ITO electrode that is connected to the passivation layer via.

Abstract: Provided are methods of patterning metal gate structures including a high-k gate dielectric. In an embodiment, a soluble hard mask layer may be used to provide a masking element to pattern a metal gate. The soluble hard mask layer may be removed from the substrate by water or a photoresist developer. In an embodiment, a hard mask including a high-k dielectric is formed. In a further embodiment, a protection layer is formed underlying a photoresist pattern. The protection layer may protect one or more layers formed on the substrate from a photoresist stripping process.

Abstract: A method of fabricating a high mobility semiconductor metal oxide thin film transistor including the steps of depositing a layer of semiconductor metal oxide material, depositing a blanket layer of etch-stop material on the layer of MO material, and patterning a layer of source/drain metal on the blanket layer of etch-stop material including etching the layer of source/drain metal into source/drain terminals positioned to define a channel area in the semiconductor metal oxide layer. The etch-stop material being electrically conductive in a direction perpendicular to the plane of the blanket layer at least under the source/drain terminals to provide electrical contact between each of the source/drain terminals and the layer of semiconductor metal oxide material. The etch-stop material is also chemical robust to protect the layer of semiconductor metal oxide channel material during the etching process.

Abstract: An array substrate, a liquid crystal display panel and a display device are disclosed. The array substrate includes a base substrate, a plurality of pixel units disposed on the base substrate, a drive module providing each of the pixel units with a display signal; a photovoltaic battery component electrically connected to the drive module, which includes a plurality of photovoltaic sub-batteries, each of the photovoltaic sub-batteries including a first transparent electrode, a photovoltaic thin film and a second transparent electrode; the orthographic projection of the photovoltaic thin film on the base substrate lies within the light blocking region. Because the orthographic projection of the photovoltaic thin film on the base substrate lies within the light blocking region, aperture ratio of each pixel unit in the array substrate will not be affected.

Abstract: A projector includes a projection lens (reflective projection lens) that has a reflective optical element (reflective lens) and reflects and projects a modulated light flux, an optical unit formed of optical elements disposed downstream of a light source apparatus and upstream of the reflective projection lens, a support that supports the reflective projection lens in an detachable manner with the optical unit, and an angle adjuster that adjusts a setting angle of the reflective projection lens.

Abstract: Disclosed are a self-aligned thin film transistor capable of simultaneously improving an operation speed and stability and minimizing a size thereof by forming source and drain electrodes so as to be self-aligned, and a fabrication method thereof. The method of fabricating a thin film transistor according to an exemplary embodiment of the present disclosure includes: forming an active layer, a gate insulator, and a gate layer on a substrate; forming a photoresist layer pattern for defining a shape of a gate electrode on the gate layer; etching the gate layer, the gate insulator, and the active layer by using the photoresist layer pattern; depositing a source and drain layer on the etched substrate by a deposition method having directionality; and forming a gate electrode and self-aligned source electrode and drain electrode by removing the photoresist layer pattern.

Abstract: A light-emitting device in which reduction in performance due to moisture is suppressed is provided. The light-emitting device has a structure in which a partition having a porous structure surrounds each of light-emitting elements. The partition having a porous structure physically adsorbs moisture; therefore, in the light-emitting device, the partition functions as a hygroscopic film at a portion extremely close to the light-emitting element, so that moisture or water vapor remaining in the light-emitting device or entering from the outside can be effectively adsorbed. Thus, reduction in performance of the light-emitting device due to moisture or water vapor can be effectively suppressed.

Abstract: According to a semiconductor substrate (40), a space (A) between a plurality of Si thin film (16), which are provide apart from one another on the insulating substrate (30), is (I) larger than a difference between elongation of part of the insulating substrate which part corresponds to the space (A) and elongation of each of Si wafers (10) when a change is made from room temperature to 600° C. and (II) smaller than 5 mm. This causes an increase in a region of each of a plurality of semiconductor thin films which region has a uniform thickness, and therefore prevents transferred semiconductor layers and the insulating substrate from being fractured or chipped.

Abstract: A display device includes a laminated wiring formed of a low-resistance conductive film, and a low-reflection film mainly containing Al and functioning as an antireflective film which are sequentially arranged on a transparent substrate, a wiring terminal part provided at an end part of the laminated wiring and has the same laminated structure as that of the laminated wiring, and an insulating film for covering the laminated wiring and the wiring terminal part, in which the insulating film side serves as a display surface side, the wiring terminal part has a first opening part penetrating the insulating film and the low-reflection film and reaching the low-resistance conductive film, and an outer peripheral portion of the first opening part has a laminated structure of the low-resistance conductive film, the low-reflection film, and the insulating film, in at least one part.

Abstract: An object is to provide a semiconductor device with high aperture ratio or a manufacturing method thereof. Another object is to provide semiconductor device with low power consumption or a manufacturing method thereof. A light-transmitting conductive layer which functions as a gate electrode, a gate insulating film formed over the light-transmitting conductive layer, a semiconductor layer formed over the light-transmitting conductive layer which functions as the gate electrode with the gate insulating film interposed therebetween, and a light-transmitting conductive layer which is electrically connected to the semiconductor layer and functions as source and drain electrodes are included.

Abstract: Thin film transistors having a high current drive capability and a suitable threshold voltage are provided. The thin film transistor includes a gate electrode, an insulating layer formed on the gate electrode, a semiconductor layer formed on the insulating layer, and source/drain electrodes formed on the semiconductor layer. The semiconductor layer includes a plurality of regions separated from each other in a longitudinal direction of the source/drain electrodes.

Abstract: Provided is an array substrate including a base substrate, a thin film transistor having a semiconductor layer disposed on a first part of the base substrate. The semiconductor layer includes a source electrode and a drain electrode, a gate electrode disposed on the semiconductor layer and insulated from the semiconductor layer. A light-blocking layer disposed between the base substrate and the thin film transistor. The light-blocking layer comprises a first layer continuously disposed on and around the first part of the base substrate, and a second layer formed on the first part of the base substrate without extending outside of the first part, the second layer being disposed on the first layer.

Abstract: Radio frequency and microwave devices and methods of use are provided herein. According to some embodiments, the present technology may comprise an ohmic layer for use in a field effect transistor that includes a plurality of strips disposed on a substrate, the plurality of strips comprising alternating source strips and drain strips, with adjacent strips being spaced apart from one another to form a series of channels, a gate finger segment disposed in each of the series of channels, and a plurality of gate finger pads disposed in an alternating pattern around a periphery of the plurality of strips such that each gate finger segment is associated with two gate finger pads.

Abstract: Methods of forming semiconductor structures that include bodies of a semiconductor material disposed between rails of a dielectric material are disclosed. Such methods may include filling a plurality of trenches in a substrate with a dielectric material and removing portions of the substrate between the dielectric material to form a plurality of openings. In some embodiments, portions of the substrate may be undercut to form a continuous void underlying the bodies and the continuous void may be filled with a conductive material. In other embodiments, portions of the substrate exposed within the openings may be converted to a silicide material to form a conductive material under the bodies. For example, the conductive material may be used as a conductive line to electrically interconnect memory device components. Semiconductor structures and devices formed by such methods are also disclosed.

Abstract: A highly reliable display device which has high aperture ratio and includes a transistor with stable electrical characteristics is manufactured. The display device includes a driver circuit portion and a display portion over the same substrate. The driver circuit portion includes a driver circuit transistor and a driver circuit wiring. A source electrode and a drain electrode of the driver circuit transistor are formed using a metal. A channel layer of the driver circuit transistor is formed using an oxide semiconductor. The driver circuit wiring is formed using a metal. The display portion includes a pixel transistor and a display portion wiring. A source electrode and a drain electrode of the pixel transistor are formed using a transparent oxide conductor. A semiconductor layer of the pixel transistor is formed using the oxide semiconductor. The display portion wiring is formed using a transparent oxide conductor.

Abstract: An object is to reduce the manufacturing cost of a semiconductor device. An object is to improve the aperture ratio of a semiconductor device. An object is to make a display portion of a semiconductor device display a higher-definition image. An object is to provide a semiconductor device which can be operated at high speed. The semiconductor device includes a driver circuit portion and a display portion over one substrate. The driver circuit portion includes: a driver circuit TFT in which source and drain electrodes are formed using a metal and a channel layer is formed using an oxide semiconductor; and a driver circuit wiring formed using a metal. The display portion includes: a pixel TFT in which source and drain electrodes are formed using an oxide conductor and a semiconductor layer is formed using an oxide semiconductor; and a display wiring formed using an oxide conductor.

Abstract: An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer.

Abstract: An organic light emitting display device including: a substrate; a plurality of first electrodes formed over the substrate; a pixel defining layer (PDL) formed over the substrate, and separating the plurality of first electrodes from one another when viewed in a thickness direction of the display device; a plurality of light emitting layer portions, each of which is formed over one of the plurality of first electrodes; at least a second electrode formed over the plurality of light emitting layer portions; and a filter unit formed over the at least a second electrode. The filter unit includes a black matrix layer having an opening and a plurality of color filters formed over the black matrix layer, and each color filter comprising at least one embossed portion formed over one of the plurality of openings.

Abstract: An image display device includes a resin film, an organic film which is formed above the resin film, a circuit layer which is formed above the organic film and includes at least a thin film transistor, and a barrier layer which is formed between the organic film and the circuit layer. The organic film has a first surface which faces the circuit layer and a side surface which crosses the first surface. The barrier layer covers the first surface and the side surface.

Abstract: A method of manufacturing multiple finFET devices having different thickness gate oxides. The method may include depositing a first dielectric layer on top of the semiconductor substrate, on top of a first fin, and on top of a second fin; forming a first dummy gate stack; forming a second dummy gate stack; removing the first and second dummy gates selective to the first and second gate oxides; masking a portion of the semiconductor structure comprising the second fin, and removing the first gate oxide from atop the first fin; and depositing a second dielectric layer within the first opening, and within the second opening, the second dielectric layer being located on top of the first fin and adjacent to the exposed sidewalls of the first pair of dielectric spacers, and on top of the second gate oxide and adjacent to the exposed sidewalls of the second pair of dielectric spacers.

Abstract: A method of manufacturing an array substrate for a fringe field switching mode liquid crystal display includes: forming an auxiliary insulating layer on a second passivation layer and having a first thickness; forming first and second photoresist patterns on the auxiliary insulating layer and having second and third thicknesses, respectively, the second thickness greater than the third thickness; etching the auxiliary insulating layer, the second passivation layer and a first passivation layer to form a drain contact hole; performing an ashing to remove the second photoresist pattern and expose the auxiliary insulating layer therebelow; performing a dry etching to remove the auxiliary insulating layer not covered by the first photoresist pattern and expose the first passivation layer and to form an insulating pattern below the first photoresist pattern, the insulating pattern and the first photoresist pattern forming an undercut shape; forming a transparent conductive material layer having a fourth thickness

Abstract: Disclosed herein is a thin film transistor array substrate. The thin film transistor array substrate includes a display area and a non-display area. The non-display area includes a signal line, a connecting line and a metal contact. The connecting line is formed in a first patterned metal layer. The signal line and the metal contact are formed in a second patterned metal layer. The connecting line is connected to the signal line by a first through-hole, and the connecting line is connected to the metal contact by a second through-hole. Furthermore, a method of fabricating the thin film transistor array substrate is also disclosed.

Abstract: The present invention provides a TFT-LCD array substrate having a gate-line metal layer, a data-line metal layer crossing the gate-line metal layer and a plurality of layers covering a periphery of the gate-line metal layer and the data-line metal layer; the gate-line metal layer has first gate lines and second gate lines parallel and alternately arranged, the date-line metal layer has first data lines and second data lines parallel and alternately arranged; the first gate line and the second gate line are electrically connected; the first data line and the second data line are electrically connected. The present invention further provides a manufacturing method of the TFT-LCD array substrate. Implementing the TFT-LCD array substrate and the manufacturing method can reduce the occurrence of line-broken in the active array of TFT-LCD, increase the aperture ratio of the product and enhance yield rate of the products.

Abstract: The present invention provides a technique by which a component forming a display device, such as a wiring can be formed with good adhesion. In the invention, a component forming a thin film transistor, a display device, or the like is formed with a material which is the same as at least one of the substances forming the formation subject surface added (mixed); thus, adhesion between the component and the formation subject is improved. An insulating layer formed over the component is formed with a laminate of a first insulating layer containing an organic material and a second insulating layer containing an inorganic material; thus, the insulating layer sufficiently covers irregularities on the surface of the component, and is also dense enough so as to be reliable as an insulating layer.

Abstract: Radio frequency and microwave devices and methods of use are provided herein. According to some embodiments, the present technology may comprise an ohmic layer for use in a field effect transistor that includes a plurality of strips disposed on a substrate, the plurality of strips comprising alternating source strips and drain strips, with adjacent strips being spaced apart from one another to form a series of channels, a gate finger segment disposed in each of the series of channels, and a plurality of gate finger pads disposed in an alternating pattern around a periphery of the plurality of strips such that each gate finger segment is associated with two gate finger pads.

Abstract: An object of the present invention is to provide an EL display device having high operation performance and reliability. A third passivation film 45 is disposed under the EL element 203 comprising a pixel electrode (anode) 46, an EL layer 47 and a cathode 48, and diffusion of alkali metals from the EL element 203 formed by ink jet method into TFTs is prevented. Further, the third passivation film 45 prevents penetration of moisture and oxygen from the TFTs, and suppress degradation of the EL element 203 by dispersing the heat generated by the EL element 203.

Abstract: A semiconductor element is operated without being affected even when the substrate is largely affected by heat shrink such as a large substrate. Furthermore, a thin film semiconductor circuit and a thin film semiconductor device each having the semiconductor element. Also, a semiconductor element is operated without being affected even if there is slight mask deviation. In view of them, a plurality of gate electrodes formed so as to overlap a lower concentration impurity region of a semiconductor layer than drain regions on a drain region side. Also, source regions and the drain regions corresponding to the respective gate electrodes are formed so that current flows in opposite directions each other through channel regions corresponding to the gate electrodes. Further, the number of the channel regions in which a current flows in a first direction is equal to the number of the channel regions in which a current flows in a direction opposite to the first direction.

Abstract: A method for manufacturing a display device provided with gate wiring lines (112) disposed on a substrate to supply signals to TFTs, and a plurality of source wiring lines (111) disposed above the gate wiring lines, the method for manufacturing a display device including: a step of forming a first conductive pattern (31) that includes the gate wiring lines (112) by etching a gate metal layer with a first resist pattern as a mask; and a step of forming a second resist pattern (12) at a portion located between the source wirings (111) so as to expose a portion of an edge of an upper surface of the first conductive pattern (31) and so as to cover other parts thereof, at the aforementioned portion of the edge of the upper surface, the first conductive pattern (31) is etched off from the upper surface through an intermediate point along the direction of thickness.

Abstract: An object of the present invention is to apply an insulating film of cure and high quality that is suitably applicable as gate insulating film and protective film to a technique that the insulating film is formed on the glass substrate under a temperature of strain point or lower, and to a semiconductor device realizing high efficiency and high reliability by using it. In a semiconductor device of the present invention, a gate insulating film of a field effect type transistor with channel length of from 0.35 to 2.5 ?m in which a silicon nitride film is formed over a crystalline semiconductor film through a silicon oxide film, wherein the silicon nitride film contains hydrogen with the concentration of 1×1021/cm3 or less and has characteristic of an etching rate of 10 nm/min or less with respect to mixed solution containing an ammonium hydrogen fluoride (NH4HF2) of 7.13% and an ammonium fluoride (NH4F) of 15.4%.

Abstract: A thin-film transistor array substrate and a fabrication method thereof according to an embodiment of the present invention are disclosed to form an interlayer insulating layer, thereby reducing a failure occurred during the process subsequent to a gate electrode. The thin-film transistor disclosed according to the present invention may include a substrate, a gate electrode formed on the substrate, a planarized insulating layer formed at a lateral surface portion of the gate electrode and at an upper portion of the substrate, a gate insulating layer formed on the planarized insulating layer containing an upper portion of the gate electrode, an active layer formed at an upper portion of the planarized insulating layer located at an upper side of the gate electrode, and a source electrode and a drain electrode formed on the active layer and separated from each other based on a channel region.