Housing (epo) Patents (Class 257/E33.058)
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Patent number: 7834372Abstract: A high luminous flux warm white solid state lighting device with a high color rendering is disclosed. The device comprising two groups of semiconductor light emitting components to emit and excite four narrow-band spectrums of lights at high luminous efficacy, wherein the semiconductor light emitting components are directly mounted on a thermal effective dissipation member; a mixing cavity for blending the multi-spectrum of lights; a back-transferred light recycling member deposited on top of an LED driver and around the semiconductor light emitters; and a diffusive member to diffuse the mixture of output light from the solid state lighting device. The solid state lighting device produces a warm white light with luminous efficacy at least 80 lumens per watt and a color rendering index at least 85 for any lighting application.Type: GrantFiled: December 16, 2008Date of Patent: November 16, 2010Inventors: Jinhui Zhai, Israel Morejon, Thong Bui
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Publication number: 20100276708Abstract: Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.Type: ApplicationFiled: July 13, 2010Publication date: November 4, 2010Inventors: Ban P. Loh, Nicholas W. Medendorp, JR.
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Patent number: 7825423Abstract: In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.Type: GrantFiled: February 1, 2007Date of Patent: November 2, 2010Assignee: Shinko Electric Industries Co., Ltd.Inventors: Akinori Shiraishi, Yuichi Taguchi, Masahiro Sunohara, Hideaki Sakaguchi, Naoyuki Koizumi, Kei Murayama, Mitsutoshi Higashi
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Patent number: 7825426Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.Type: GrantFiled: March 28, 2008Date of Patent: November 2, 2010Assignee: Rohm Co., Ltd.Inventor: Masahiko Kobayakawa
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Publication number: 20100270573Abstract: Provided are a light emitting device, a light emitting device package, and a lighting system including the light emitting device and the light emitting device package. The light emitting device includes a light emitting structure, a dielectric, a second electrode layer, a semiconductor region, and a first electrode. The light emitting device includes a plurality of semiconductor layers that form a heterojunction that produces light and a homojunction that protects the device from a reverse current.Type: ApplicationFiled: April 27, 2010Publication date: October 28, 2010Inventor: Sung Min HWANG
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Publication number: 20100270576Abstract: There is provided a light emitting diode package, including a package body including a recess portion having a housing space and a lead frame mounted on the recess portion to be exposed; a light emitting diode chip mounted to be electrically connected to the lead frame; and a position indicator formed on the lead frame and guiding the mounting position of the light emitting diode chip.Type: ApplicationFiled: November 13, 2009Publication date: October 28, 2010Inventors: Geun Chang Ryo, Jae Chul Ro
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Publication number: 20100270545Abstract: A voltage switchable dielectric material (VSD) material as part of a light-emitting component, including LEDs and OLEDs.Type: ApplicationFiled: July 7, 2010Publication date: October 28, 2010Inventor: Lex Kosowsky
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Publication number: 20100264451Abstract: A light emitting diode includes a base, a dispersing member, a chip, a pole, a cover, an electrode, and a lens. The base is capable of conducting heat and insulated from electricity. The base has a first surface and a second surface opposite to the first surface. The dispersing member is disposed on a first surface of the base. The chip is disposed on a second surface of the base. The pole runs through the base, and two ends of the pole are connected to the dispersing member and the chip correspondingly. The cover to allow light to run therethrough is disposed on the second surface of the base and covers the chip. The electrode is disposed on the second surface the base and electrically connected to a circuit inside the base. The circuit electrically connected to the chip. The lens seals the cover.Type: ApplicationFiled: July 14, 2009Publication date: October 21, 2010Inventors: Xinpei Xue, Xinshen Xue
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Patent number: 7816697Abstract: A packaging structure and method are provided for packaging an optoelectronic device. Generally, the packaging structure includes: (i) an integrated circuit (IC) package to which the optoelectronic device is affixed; (ii) an optical plug mounted to the IC package, the optical plug positioned relative to the optoelectronic device to direct light to or from the optoelectronic device, the optical plug having an interior optical surface closest to the optoelectronic device that does not make physical contact with either the optoelectronic device or the IC package. Preferably, the packaging structure can further include air or an index matching fluid in a gap between the interior optical surface and the optoelectronic device or IC package. More preferably, both the IC package and the optical plug include features to facilitate alignment and mounting of the optical plug to the IC package during assembly. Other embodiments are also disclosed.Type: GrantFiled: February 23, 2007Date of Patent: October 19, 2010Assignee: Cypress Semiconductor CorporationInventors: Brett A. Spurlock, Edward D. Huber, Jahja I. Trisnadi
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Publication number: 20100258835Abstract: A semiconductor is disclosed. The semiconductor may include a transparent layer having a first surface. The semiconductor may further include a first doped layer formed over the first surface of the transparent layer. The first doped layer may have a plurality of first-type metal electrodes formed thereon. The semiconductor may further include a second doped layer formed over the first surface of the transparent layer. The second doped layer may have a plurality of second-type metal electrodes formed thereon. The semiconductor may also include an active layer formed over the first surface of the transparent layer and disposed between the first doped layer and the second doped layer. The first-type metal electrodes and the second-type metal electrodes may be alternately arranged and the distances between each first-type metal electrode and its adjacent second-type metal electrodes may be substantially equal.Type: ApplicationFiled: April 10, 2009Publication date: October 14, 2010Inventor: Chin-Yuan HSU
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Patent number: 7812365Abstract: A heat dissipation member includes a first plate-shaped member and a second plate-shaped member. The first plate-shaped member has a first surface thermally connectable with a heat generating element and a second surface. The second plate-shaped member is thermally connected with the second surface of the first plate-shaped member. The first plate-shaped member and the second plate-shaped member form a laminated-plate-shaped member. The laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid. The second surface of the first plate-shaped member forms asperities thereon.Type: GrantFiled: December 12, 2008Date of Patent: October 12, 2010Assignee: Nichia CorporationInventor: Takashi Murayama
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Publication number: 20100244084Abstract: A light emitting device (LED), an LED package, and a lighting system including the LED package are provided. The light emitting device (LED) may include a light emitting structure, a carrier injection layer, and an electrode layer. The light emitting structure may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. The carrier injection layer may be positioned over the light emitting structure, and the electrode layer may be positioned over the carrier injection layer.Type: ApplicationFiled: March 23, 2010Publication date: September 30, 2010Inventor: Hyun Don SONG
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Patent number: 7800124Abstract: A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.Type: GrantFiled: June 30, 2006Date of Patent: September 21, 2010Assignee: Panasonic Electric Works Co., Ltd.Inventors: Youji Urano, Takuya Nakatani, Yasuhiro Hidaka
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Publication number: 20100230697Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.Type: ApplicationFiled: August 11, 2008Publication date: September 16, 2010Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Steffen Köhler, Moritz Engl, Frank Singer, Stefan Grötsch, Thomas Zeiler, Mathias Weiss
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Publication number: 20100230694Abstract: An optoelectronic component is specified that emits a useful radiation. It comprises a housing having a housing base body with a housing cavity, and a light-emitting diode chip arranged in the housing cavity. At least one base body material of the housing base body has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. According to another embodiment of the component, the housing additionally or alternatively has a housing material transmissive for the useful radiation that has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. In addition, a method for manufacturing such a component is specified.Type: ApplicationFiled: March 26, 2008Publication date: September 16, 2010Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Karlheinz Arndt, Kirstin Petersen
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Publication number: 20100230708Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.Type: ApplicationFiled: March 10, 2009Publication date: September 16, 2010Applicant: NEPES LED, INC.Inventor: Nguyen The Tran
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Patent number: 7795628Abstract: An LED assembly includes a substrate and a plurality of LEDs mounted on the substrate. Each LED comprises an LED die, a base supporting the LED die thereon and thermally contacting the substrate to take heat generated by the LED die to the substrate, a pair of leads electrically connecting the LED die to input a current to the LED die, and an encapsulant enveloping the LED die. The pair of leads hover above the substrate to separate an electrical route of the LED assembly from a heat conducting pathway thereof. Furthermore, each LED has a plurality of legs extending radially from the base thereof to fit in the base of an adjacent LED, to thereby engagingly lock with the adjacent LED.Type: GrantFiled: April 27, 2008Date of Patent: September 14, 2010Assignee: Foxconn Technology Co., Ltd.Inventor: Chin-Long Ku
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Patent number: 7794127Abstract: A light emitting diode (10) includes an LED chip (14) and an encapsulant (16) enclosing the LED chip. The LED chip has a light emitting surface (141), and the encapsulant has a light output surface (161) over the light emitting surface. The light output surface defines a plurality of annular, concentric grooves (163). Each groove is cooperatively enclosed by a first groove wall (165) and a second groove wall (166). The first groove wall is a portion of a circumferential side surface of a cone, and a conical tip of the cone is located on the light emitting surface of the LED chip.Type: GrantFiled: April 15, 2008Date of Patent: September 14, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Chung-Yuan Huang, Jer-Haur Kuo, Ye-Fei Yu, Lin Yang, Xin-Xiang Zha
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Publication number: 20100219422Abstract: A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip.Type: ApplicationFiled: February 24, 2010Publication date: September 2, 2010Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chao-Hsuan SU, Lu-Ming LAI, Ying-Zhong CHEN
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Patent number: 7786492Abstract: A light-emitting device offering satisfactory light emission characteristics combined with improved reliability has a substrate on the principal surface of which a non-polar electrode layer is formed, an LED chip mounted in a predetermined region on the non-polar electrode layer, a plurality of cathode and anode electrode layers formed on the principal surface of the substrate for supplying electric power to the LED chip, and a reflective frame formed of a metal material containing aluminum as its main content, the reflective frame having its inner circumferential surface formed into a reflective surface for reflecting the light from the LED chip. The reflective frame is fixed, directly, or indirectly with adhesive, to the non-polar electrode layer so as to surround the LED chip, with the inside of the reflective frame sealed with a light-transmitting member.Type: GrantFiled: August 1, 2008Date of Patent: August 31, 2010Assignee: Sanyo Electric Co., Ltd.Inventors: Mitsuhiro Omae, Jun Oki, Takafumi Watanabe
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Publication number: 20100213499Abstract: To provide a light emitting device that is compact and has high efficiency of extracting light comprising a support body that incorporates a light emitting element. The light emitting device has the protective element 106 mounted on the electrically conductive member 103a and the base 105 mounted on the electrically conductive member 103a, while at least part of the protective element 106 is covered with the base 105, and the light emitting element 104 is mounted on the top surface of the base 105.Type: ApplicationFiled: February 23, 2010Publication date: August 26, 2010Applicant: NICHIA CORPORATIONInventor: Saiki YAMAMOTO
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Publication number: 20100213500Abstract: A sealed infrared radiation source includes an emitter membrane stimulated by an electrical current conducted through the membrane, which acts like an electrical conductor, wherein the membrane is mounted between first and second housing parts, at least one being transparent in the IR range, each housing part defining a cavity between the membrane and the respective housing part of each side of the membrane. The housing parts are at least partially electrical conductive, and a first of the housing parts is electrically coupled to a first end of the electrical conductor and insulated from the second end of the electrical conductor, the second housing part being electrically coupled to a second end of the electrical conductor and being insulated from the first end of the electrical conductor, thus allowing a current applied from the first housing part to the second housing part to pass through and heat the membrane.Type: ApplicationFiled: May 5, 2010Publication date: August 26, 2010Applicant: SINTEFInventors: Henrik Rogne, Dag Thorstein Wang, Trond Andreas Hansen, Sigurd Teodor Moe, Alain Ferber
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Publication number: 20100213484Abstract: A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.Type: ApplicationFiled: January 11, 2010Publication date: August 26, 2010Inventor: Chen-Hsiu Lin
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Patent number: 7781792Abstract: A solid state illumination device includes a solid state light emitting diode and a mounting base. The solid state light emitting diode includes encapsulation material, a wafer, and first and second electrodes. The first and second electrodes have first ends electrically connecting with the wafer, and opposite second ends exposed outside the encapsulation material. The wafer and the first ends are encapsulated in the encapsulation material. The mounting base includes a main body with a receptacle defined therein, first and second receiving holes receiving the first and second electrodes. The main body defines an indent communicating with the first receiving holes receiving a bulge extending from the first electrodes.Type: GrantFiled: September 18, 2008Date of Patent: August 24, 2010Assignee: Foxsemicon Integrated Technology, Inc.Inventor: Wen-Jang Jiang
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Publication number: 20100207150Abstract: Exemplary systems and methods for LED light engines include an LED package with electrical leads, each lead forming a compliant portion for making electrical and mechanical connection upon insertion into a receptacle of a circuit substrate. In an illustrative example, the electrical and mechanical connections may be formed upon the insertion of the compliant portion into the receptacle and without further process steps involving solder. Various examples may further include an elongated thermal dissipation member extending from a bottom of a package that contains the LED, where the elongated thermal member (e.g., tab) may be in substantial thermal communication with the LED die. As an example, the tab may provide a substantially reduced thermal impedance for dissipating heat from the LED die. Upon insertion into a circuit substrate, the LED package may be releasable by mechanical extraction without applied heat to facilitate repair or replacement, for example.Type: ApplicationFiled: February 12, 2010Publication date: August 19, 2010Applicant: ONCE INNOVATIONS, INC.Inventor: Zdenko Grajcar
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Publication number: 20100200879Abstract: A photoelectric semiconductor device has a metal wiring layer packed or embedded into a housing for enhancing package stability and electric connectivity. The housing has a cavity structure, and at least one LED chip and an encapsulating material are configured inside the cavity structure. The metal wiring layer locates inside the housing, or in other words, between the top surface and the bottom surface of the housing, and extends to the bottom of the cavity structure to electrically connect the LED chip. With fully wrapping around, the metal wiring layer has higher stability and more reliability from being harmed by outside changes in humidity and temperature.Type: ApplicationFiled: August 27, 2009Publication date: August 12, 2010Inventors: Tien-Yu Lee, Chia-Hao Wu, Chen-Hsiu Lin
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Publication number: 20100200870Abstract: The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space.Type: ApplicationFiled: February 4, 2010Publication date: August 12, 2010Inventor: Yu-Nung Shen
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Patent number: 7772609Abstract: LED packages are provided that include a material that is both thermally conductive and has a coefficient of thermal expansion that is matched to that of an LED. The material can be a ceramic such as aluminum nitride. The package has a body that includes a bottom surface and a cavity disposed into the body. The cavity has a floor for bonding to the LED so that the LED sits within the cavity. The thermally conductive material is disposed between the floor of the cavity and the bottom surface of the package. The body can be fabricated from a number of layers where the thermally conductive material is in a layer disposed between the floor and the bottom surface. The other layers of the body can also be fabricated from the thermally conductive material. A light emitting device is made by attaching the LED to the LED package.Type: GrantFiled: October 26, 2005Date of Patent: August 10, 2010Assignee: LedEngin, Inc. (Cayman)Inventor: Xiantao Yan
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Patent number: 7772604Abstract: Embodiments of the present invention provide separate optical devices operable to couple to a separate LED, the separate optical device comprising an entrance surface to receive light from a separate LED when the separate optical device is coupled to the separate LED, an exit surface opposite from and a distance from the entrance surface and a set of sidewalls. The exit surface has at least a minimum area necessary to conserve brightness for a desired half-angle of light projected from the separate optical device. Furthermore, each sidewall is positioned and shaped so that at least a majority of rays having a straight transmission path from the entrance surface to that sidewall reflect to the exit surface with an angle of incidence at the exit surface at less than or equal to a critical angle at the exit surface.Type: GrantFiled: January 3, 2007Date of Patent: August 10, 2010Assignee: IllumitexInventors: Dung T. Duong, Paul N. Winberg, Matthew R. Thomas
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Patent number: 7772610Abstract: A structure of LED of high heat-conducting efficiency is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein.Type: GrantFiled: July 12, 2009Date of Patent: August 10, 2010Assignee: Pyroswift Holding Co., LimitedInventor: Pei-Choa Wang
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Publication number: 20100193811Abstract: The invention discloses a light-emitting diode including a substrate, a main stack structure, a plurality of secondary pillars, a transparent insulating material, a transparent conducting layer, a first electrode and a second electrode. The pillars are formed on the substrate and surrounding the main stack structure. The main stack structure and each of the pillars has a first conducting-type semiconductor layer, a luminescing layer, and a second conducting-type semiconductor layer formed on the substrate in sequence. The transparent insulating material fills the gaps between the pillars and is as high as the pillars. The transparent conducting layer is coated on the main stack, the pillars and the transparent insulating material. The first electrode is formed on the transparent conducting layer and second electrode is formed on the first conducting-type semiconductor layer.Type: ApplicationFiled: April 3, 2009Publication date: August 5, 2010Inventors: Lin-Chieh Kao, Shu-Ying Yang
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Publication number: 20100193806Abstract: Disclosed are a light emitting diode unit, a display apparatus having the same, and a method of manufacturing the same. The light emitting diode unit includes at least one light emitting diode, a quantum dot layer, and a buffer layer. The light emitting diode emits first light. The quantum dot layer is provided on the light emitting diode and includes a plurality of quantum dots that absorb the first light to emit second light having a wavelength different from a wavelength of the first light. The buffer layer is interposed between the light emitting diode and the quantum dot layer and separates the light emitting diode from the quantum dot layer. The buffer layer includes a scattering agent which is dispersed in resin to diffuse the light emitted from the light emitting diode.Type: ApplicationFiled: July 9, 2009Publication date: August 5, 2010Inventor: Jinseob Byun
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Patent number: 7767486Abstract: An optical connector module complete with optoelectronic devices, supporting integrated circuitry, and connector housing may be fabricated on a wafer level. A plurality of cavities may be formed on the backside of the wafer to accommodate an optoelectronic device. Active circuitry may be formed in a front side of the wafer. Through-vias electrically connect the front side to the back side. The backside of the wafer is overmolded with a polymer layer which when singulated into individual dies forms the plastic housing of an optical connector module.Type: GrantFiled: November 21, 2007Date of Patent: August 3, 2010Assignee: Intel CorporationInventors: Mohammed Edris, Daoqiang Lu
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Publication number: 20100181591Abstract: An object of this invention is to provide an LED illumination device that can substitute for a fluorescent light and obtain uniform light with high efficiency. The LED illumination device comprises an LED with a thin-plate-shaped semiconductor element body transmitting the light generated in a PN junction area in a thickness direction and emits it from the surface, a surface electrode that covers the surface of the semiconductor element body, and columnar dielectric antennas that penetrate the surface electrode in the thickness direction and that condense the light transmitted in a body of the semiconductor element and emit it outside, a diffraction member that is arranged on a luminous surface side of the LED and that diffracts and disperses the light emitted by the LED, and a diffusion member that is arranged outside the diffraction member and that diffuses the light dispersed by the diffraction member and emits it outside.Type: ApplicationFiled: July 9, 2007Publication date: July 22, 2010Applicant: ABEL SYSTEMS INCORPORATIONInventor: Fumio Suzuki
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Publication number: 20100181593Abstract: A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.Type: ApplicationFiled: October 6, 2009Publication date: July 22, 2010Applicant: Yeh-Chiang Technology Corp.Inventor: Ke-Chin Lee
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Patent number: 7755100Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.Type: GrantFiled: July 21, 2008Date of Patent: July 13, 2010Assignee: Electronics and Telecommunications Research InstituteInventors: Sang Kuk Choi, Kwang Yong Kang, Mun Cheol Paek, Min Hwan Kwak
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Patent number: 7750361Abstract: A surface mount LED apparatus is provided which can prevent separation of the surface of an LED chip from a sealing resin portion. Patterned circuits on a substrate are provided with a device mounting region and a wire bond region, and an increased-thickness portion having a thickness 1.6 times or more than the greater of the thickness of the device mounting region and the thickness of the wire bond region. When the apparatus is heated, this configuration allows for inducing interfacial separation between the increased-thickness portion and the sealing resin portion earlier than interfacial separation is induced between the LED chip and the sealing resin portion. This configuration can prevent interfacial separation between the LED chip and the sealing resin portion.Type: GrantFiled: August 7, 2008Date of Patent: July 6, 2010Assignee: Stanley Electric Co., Ltd.Inventor: Seishi Watanabe
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Publication number: 20100163918Abstract: The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.Type: ApplicationFiled: July 4, 2007Publication date: July 1, 2010Applicant: Seoul Semiconductor Co., LtdInventors: Do Hyung Kim, Suk Jin Kang
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Patent number: 7745835Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.Type: GrantFiled: June 12, 2007Date of Patent: June 29, 2010Assignee: Citizen Electronics Co., Ltd.Inventors: Nodoka Oishi, Koichi Fukasawa, Sadato Imai
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Publication number: 20100157583Abstract: An LED device and an LED lighting apparatus using the same can include a casing including a cavity and at least one pair of LED chips including a first and second LED chips. The LED chips can be adjacently located in the cavity, and an encapsulating resin including a phosphor can be disposed in the cavity so as to encapsulate the LED chips. A light-emitting surface of the first LED chip can be covered with a transparent resin, and therefore color temperatures of light emitted from the first and second LED chips can be located on a substantially black body due to a difference between their distances to the encapsulating resin. Thus, the LED lighting apparatus using the LED device can selectively emit white light having a preferable color temperature that is close to a natural color between the color temperatures by adjusting current applied to the LED chips.Type: ApplicationFiled: December 19, 2009Publication date: June 24, 2010Inventor: Toshiyuki Nakajima
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Publication number: 20100155751Abstract: An exemplary light emitting diode (LED) assembly includes a cover, a substrate, a LED unit, a first electrode terminal, and a second electrode terminal. The substrate includes a first surface and a second surface on an opposite side of the substrate thereto. The substrate and the cover cooperatively define a cavity. The LED unit is received in the cavity. The first and the second electrode terminals extend from the second surface. The first electrode terminal is electrically connected to one of a positive lead and a negative lead of the LED unit and the second electrode terminal is electrically connected to the other. The second electrode terminal includes a first electrode portion and a second electrode portion symmetrically arranged at opposite sides of the first electrode terminal. The first and the second electrode portions are at least partially symmetrical with respect to the first electrode terminal.Type: ApplicationFiled: November 6, 2009Publication date: June 24, 2010Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: Kun-Sheng Kuo, Chuan-Fu Yang, Yuan-Fa Chu
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Publication number: 20100148211Abstract: A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.Type: ApplicationFiled: December 15, 2009Publication date: June 17, 2010Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Sheng-Jia Sheu, Chih-Hung Hsu, Chung-Chuan Hsieh
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Publication number: 20100148210Abstract: An embodiment of the invention provides a package structure for chip. The package structure for chip includes: a carrier substrate having an upper surface and an opposite lower surface; a chip overlying the carrier substrate and having a first surface and an opposite second surface facing the upper surface, wherein the chip includes a first electrode and a second electrode; a first conducting structure overlying the carrier substrate and electrically connecting the first electrode; a second conducting structure overlying the carrier substrate and electrically connecting the second electrode; a first through-hole penetrating the upper surface and the lower surface of the carrier substrate and disposed next to the chip without overlapping the chip; a first conducting layer overlying a sidewall of the first through-hole and electrically connecting the first conducting electrode; and a third conducting structure overlying the carrier substrate and electrically connecting the second conducting structure.Type: ApplicationFiled: December 11, 2009Publication date: June 17, 2010Inventors: Tien-Hao HUANG, Shang-Yi Wu
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Patent number: 7737462Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.Type: GrantFiled: June 12, 2007Date of Patent: June 15, 2010Assignee: Citizen Electronics Co., LtdInventors: Nodoka Oishi, Koichi Fukasawa, Sadato Imai
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Patent number: 7737460Abstract: A white LED includes an LED chip formed on one main surface of a sapphire substrate, the LED chip being formed in a semiconductor stack structure including a light emitting layer and emitting light of a predetermined wavelength, a light extracting film applied on the other main surface of the substrate, the light extracting film being formed of a material having a refractive index within a range of ±5% of a refractive index of the substrate and a surface of the light extracting film that is located on an opposite side to the substrate being processed into a recess and projection shape, and a phosphor member provided on an opposite side of the substrate with respect to the light extracting film, and generating white light as light is incident thereon.Type: GrantFiled: February 9, 2006Date of Patent: June 15, 2010Assignee: Kabushiki Kaisha ToshibaInventors: Akira Fujimoto, Koji Asakawa
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Publication number: 20100140654Abstract: Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material.Type: ApplicationFiled: March 9, 2006Publication date: June 10, 2010Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATIONInventors: Kouki Hatsuda, Hiroshi Samukawa
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Publication number: 20100139767Abstract: A chip package structure including a heat dissipation substrate, a chip and a heterojunction heat conduction buffer layer is provided. The chip is disposed on the heat dissipation substrate. The heterojunction heat conduction buffer layer is disposed between the heat dissipation substrate and the chip. The heterojunction heat conduction buffer layer includes a plurality of pillars perpendicular to the heat dissipation substrate. The aspect ratio of each pillar is between about 3:1 and 50:1.Type: ApplicationFiled: May 26, 2009Publication date: June 10, 2010Applicant: Industrial Technology Research InstituteInventors: Jui-Ching Hsieh, Pin Chang, Chung-De Chen, Li-Chi Pan, Yu-Jen Wang, Chin-Horng Wang
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Patent number: 7728399Abstract: Apparatuses and methods directed to an integrated circuit package having an optical component are disclosed. The package may include an integrated circuit die having at least one light sensitive region disposed on a first surface thereof. By way of example, the die may be a laser diode that emits light through the light sensitive region, or a photodetector that receives and detects light through the light sensitive region. An optical concentrator may be positioned adjacent the first surface of the first die. The optical concentrator includes a lens portion positioned adjacent the light sensitive region and adapted to focus light.Type: GrantFiled: July 22, 2008Date of Patent: June 1, 2010Assignees: National Semiconductor Corporation, The Regents of the University of CaliforniaInventors: Randall L. Walberg, Luu T. Nguyen, Robert Dahlgren, James B. Wieser, Kenneth Pedrotti, Jacob A. Wysocki
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Patent number: 7728342Abstract: A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.Type: GrantFiled: December 29, 2006Date of Patent: June 1, 2010Assignee: Citizen Electronics Co., Ltd.Inventors: Kazuhiro Yoshida, Mitsunori Ishizaka
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Patent number: 7728346Abstract: An LED illumination device can include a bridge connection circuit that includes five LED chips. The LED chips can be installed such that four LED chips, through which half-wave rectified current flows, are disposed in a generally cross-shaped opposed arrangement with the remaining LED chip interposed therebetween. The remaining LED chip can also have a full-wave rectified current flowing therethrough. Half-wave rectified currents having phases shifted by 180° (half the period) can flow through respective LED chips installed at a generally right angle. The placement range for the five LED chips can be limited, and the LED chips can be sealed with a wavelength conversion material.Type: GrantFiled: October 30, 2006Date of Patent: June 1, 2010Assignee: Stanley Electric Co., Ltd.Inventor: Hiroshi Takikawa