Encapsulation (epo) Patents (Class 257/E33.059)
-
Patent number: 11959606Abstract: A package structure including a carrier, a photonic device, a supporting frame, and an encapsulant is provided. The photonic device is disposed on the carrier. The supporting frame is disposed on the carrier and surrounds the photonic device. The encapsulant covers the supporting frame and surrounds the photonic device.Type: GrantFiled: March 30, 2021Date of Patent: April 16, 2024Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Chen-Hsiu Lin, Cheng-Ying Lee, Ming-Sung Tsai
-
Patent number: 11955589Abstract: A light-emitting device comprises a carrier, which comprises a plurality of side surfaces, an insulating layer, an upper conductive layer arranged on the insulating layer, a lower conductive layer arranged under the insulating layer, and a plurality of conductive through holes arranged between and connected to the upper conductive layer and the lower conductive layer; a plurality of light-emitting units arranged on and electrically connected to the upper conductive layer; and a transparent unit fully covering the plurality of light-emitting units, and exposing the lower conductive layer, wherein the plurality of conductive through holes are not completely buried within the insulating layer, and each conductive through hole is sandwiched by two adjacent ones of the plurality of side surfaces.Type: GrantFiled: July 15, 2021Date of Patent: April 9, 2024Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Tzu-Hsiang Wang
-
Patent number: 11948850Abstract: In one aspect of the semiconductor module, the sealing material on the lower side of the die stage is thinner than the sealing material on the upper side of the semiconductor element, a bent portion that forms a step with respect to vertical direction in the first lead is provided in a region sealed by the sealing material in the first lead, the side where the die stage is present of the step is positioned below the side where the die stage is not present of the step due to the step, the side where the die stage is not present of the step in the first lead protrudes from one end side of the sealing material, and a groove is provided on an upper side surface, a lower side surface, or both of them of the bent portion of the first lead.Type: GrantFiled: September 2, 2021Date of Patent: April 2, 2024Assignee: Mitsubishi Electric CorporationInventor: Akitoshi Shirao
-
Patent number: 11942757Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example method includes coupling a first surface of a light-emitter substrate to a reference surface of a carrier substrate. The method also includes registering a mold structure with respect to the reference surface of the carrier substrate. Furthermore, the method includes using the mold structure to form an optical material over at least a portion of the light-emitter substrate. The optical material is shaped according to a shape of the mold structure and includes at least one registration feature. The method also includes coupling an optical lens element to the optical material such that the optical lens element is registered to the at least one registration feature.Type: GrantFiled: January 19, 2021Date of Patent: March 26, 2024Assignee: Waymo LLCInventors: Paul Karplus, Matthew Last
-
Patent number: 11943971Abstract: In a display device in which an OLED is formed by a separate coating method, improving the accuracy of vapor deposition position and reducing display defects are established. In the array substrate, a display unit that displays an image configured with a plurality of pixels is formed. A first convex portion and a second convex portion are provided on a surface of a boundary region between the pixels of the array substrate. A first organic layer including a layer exhibiting a first emission color is stacked on the pixel electrode of the pixel, and second organic layers including a layer exhibiting a second emission color are stacked on the pixel electrode of the pixels. The first organic layer is provided to cover only the first convex portion. The second organic layers are provided not to cover any one of the first convex portion and the second convex portion.Type: GrantFiled: May 3, 2021Date of Patent: March 26, 2024Assignee: Japan Display Inc.Inventor: Masamitsu Furuie
-
Patent number: 11936990Abstract: A photographing method, a storage medium, and an electronic device (100). The electronic device (100) comprises a display screen (21) and a camera module (22), and the display screen (21) comprises a liquid crystal panel (211), a backlight module (212), and electrochromic glass (213) which are stacked. When an HDR image needs to be captured, image acquisition is performed on a current scene by means of the camera module (22), an acquired image is analyzed, then the light transmittance of the liquid crystal panel (211) is adjusted according to brightness distribution information, and finally, secondary image acquisition is performed by means of the camera module (22) to obtain a target image.Type: GrantFiled: March 30, 2020Date of Patent: March 19, 2024Assignee: JRD COMMUNICATION (SHENZHEN) LTD.Inventors: Bo Yang, Guangyue Luo
-
Patent number: 11926254Abstract: An optical element, comprising a light guide body. The light guide body comprises a plurality of light-incident parts arranged along a length extension direction of the light guide body, a light guide part and a light-emitting part; each light-incident part is provided with at least one light-incident unit; the light guide part is configured to guide light received by each light-incident unit to be emitted toward the light-emitting part; the shape of a forward projection plane of the light-emitting part is of a strip shape. The optical element can reduce the occupied space and improve the space utilization rate, facilitates reducing positioning mounting errors, has an appearance with a narrow and elongated shape, and can be applied in vehicle lamp modules, vehicle lamps and vehicles.Type: GrantFiled: December 10, 2020Date of Patent: March 12, 2024Assignee: HASCO VISION TECHNOLOGY CO., LTD.Inventors: He Zhu, Wenhui Sang, Cong Li, Dapan Zhang, Zhiping Qiu
-
Patent number: 11920954Abstract: A sensor is disclosed. The sensor includes: an elongated and hollow housing having a first opening formed in a longitudinal direction of the housing, and a second opening formed at one end thereof; a cap closing the second opening; an elongated cover covering the first opening and having one end coupled to the cap; a first receiving groove formed on the housing at a position adjacent to the first opening and facing the cover; a second receiving groove formed on the cap at a position facing the cover; a front sealing member inserted into the first receiving groove and the second receiving groove, and coming into contact with the cover; a groove formed on the cap at a position adjacent to the second opening and facing one end of the housing; and a side sealing member inserted into the groove and coming into contact with the one end of the housing.Type: GrantFiled: March 3, 2020Date of Patent: March 5, 2024Assignee: AUTONICS CORPORATIONInventor: Doick Hwang
-
Patent number: 11923399Abstract: A micro light-emitting diode display panel includes a substrate, at least one light-emitting element, a reflective layer and a light-absorbing layer. The at least one light-emitting element is disposed on the substrate to define at least one pixel, and each light-emitting element includes micro light-emitting diodes. The reflective layer is disposed on the substrate and located between the micro light-emitting diodes. The reflective layer has cavities surrounding the micro light-emitting diodes, such that a thickness of a portion of the reflective layer close to any one of the micro light-emitting diodes is greater than a thickness of a portion of the reflective layer away from the corresponding micro light-emitting diode. The light-absorbing layer is at least disposed in the cavities of the reflective layer.Type: GrantFiled: March 31, 2021Date of Patent: March 5, 2024Assignee: PlayNitride Display Co., Ltd.Inventors: Sheng-Yuan Sun, Loganathan Murugan, Po-Wei Chiu, Yun-Li Li
-
Patent number: 11908984Abstract: The present disclosure relates to a light-emitting device. The light-emitting device includes a substrate, a first light-emitting chip, a first wavelength conversion member, and a barrier member. The first light-emitting chip is mounted on the substrate. The first wavelength conversion member covers the upper surface of the first light-emitting chip. A first reflective member covers the side surface of the first wavelength conversion member. Further, the barrier member includes an outer wall surrounding the side surfaces of the first light-emitting chip and the first reflective member.Type: GrantFiled: February 16, 2022Date of Patent: February 20, 2024Assignee: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Hye In Kim, Jung Hun Son
-
Patent number: 11908987Abstract: A display device includes a substrate and a display element layer disposed on the substrate and emitting light. The display element layer includes a first electrode electrically connected to a portion of a first light emitting element, a second electrode electrically connected to another portion of the first light emitting element, and at least one insulating structure disposed on the substrate and having a convex shape protruding from the substrate. The first light emitting element is disposed in a space of the at least one insulating structure. A method of manufacturing the display device is also disclosed.Type: GrantFiled: November 17, 2022Date of Patent: February 20, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Kwang Soo Bae, Dong Uk Kim, Beom Soo Park, Min Jeong Oh, Young Je Cho
-
Patent number: 11903129Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.Type: GrantFiled: March 10, 2022Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chi Seong Kim, Won Seok Lee, Guh Hwan Lim, Jin Uk Lee, Jin Oh Park
-
Patent number: 11895381Abstract: An image pickup apparatus for endoscope includes: an image pickup member provided with a plurality of image pickup side faces; a first optical member provided with first side faces; a first bonding layer bonding together the image pickup member and the first optical member; a second optical member provided with second side faces; and a second bonding layer bonding together the second optical member and the first optical member, in which a plurality of first side faces include first near side faces closer to an optical axis than are the second side faces and the image pickup side faces, and the image pickup apparatus for endoscope further includes a sealing resin covering the first near side faces, at least part of the first bonding layer, and the second bonding layer.Type: GrantFiled: August 6, 2021Date of Patent: February 6, 2024Assignee: OLYMPUS CORPORATIONInventor: Jumpei Yoneyama
-
Patent number: 11871643Abstract: A display device may include a first electrode, a second electrode, an emission layer, an intervening layer, and a first encapsulation layer. The second electrode may overlap the first electrode. The emission layer may be disposed between the first electrode and the second electrode, may overlap the first electrode, and may include a light emitting material. The intervening layer may directly contact the second electrode, may be spaced from each of the first electrode and the emission layer, and may include a fluorine compound. A first section of the first encapsulation layer may overlap the emission layer. The intervening layer may be positioned between the second electrode and a second section of the first encapsulation layer.Type: GrantFiled: March 10, 2021Date of Patent: January 9, 2024Assignee: Samsung Display Co., Ltd.Inventors: Jae Sik Kim, Jae Ik Kim, Jung Sun Park, Seung Yong Song, Duck Jung Lee, Yeon Hwa Lee, Joon Gu Lee, Kyu Hwan Hwang
-
Patent number: 11867372Abstract: A vehicle light guide body includes an incident surface that light from the light source enters, a first reflective surface that internally reflects the light that has entered from the incident surface to form nearly parallel light, a second reflective surface that internally reflects the light from the first reflective surface, a third reflective surface provided in a position located in front of the second reflective surface in a front-rear direction and in a portion in at least one of end faces in a left-right direction, a light shielding part that shields a part of the light reflected by the second reflective surface, and a light emitting surface that emits the light that has been internally reflected by the second reflective surface and has passed through the light shielding part to illuminate a headlight pattern in front of a vehicle.Type: GrantFiled: March 26, 2021Date of Patent: January 9, 2024Assignee: Ichikoh Industries, Ltd.Inventor: Kei Onoma
-
Patent number: 11871607Abstract: A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.Type: GrantFiled: March 15, 2022Date of Patent: January 9, 2024Assignees: Universal Display Corporation, The Trustees of Princeton UniversityInventors: Prashant Mandlik, Ruiqing Ma, Jeffrey Silvernail, Julia J. Brown, Lin Han, Sigurd Wagner, Luke Walski
-
Patent number: 11859786Abstract: The present invention relates to a vehicle lamp and, more particularly, to a vehicle lamp using a semiconductor light-emitting device. The present invention provides a vehicle lamp comprising: a substrate; first and second bar-shaped light sources arranged parallel to one side of the substrate and extending along one direction thereof; and a lens disposed on one surface of the substrate and extending along the one direction so as to overlap with the first and second light sources, wherein the cross-section of the lens, which is perpendicular to the extending directions of the two light sources and cut along a virtual plane perpendicular to the substrate, includes a part of an ellipse.Type: GrantFiled: February 10, 2020Date of Patent: January 2, 2024Assignee: LG ELECTRONICS INC.Inventor: Hooyoung Song
-
Patent number: 11859293Abstract: Methods to partially decrease reflectivities of at least two regions on a mirror platform relative to a reflectivity of a third region are taught. A first region is defined on a surface of the mirror platform. The first region is a media display device viewing area. A second region is defined on the surface of the mirror platform. The second region is a back lit area. A first material is selectively disposed onto a rear surface of the mirror platform outside of the first region and outside of the second region. The first material increases the reflectivity of the mirror platform outside of the first region and outside of the second region. When the mirror platform is viewed from a front side a reflectivity of a third region, which is outside of the first region and outside of the second region, is greater than a reflectivity of either the first region or the second region; and a reflectivity of the first region is different than a reflectivity of the second region.Type: GrantFiled: April 4, 2021Date of Patent: January 2, 2024Assignee: ELECTRIC MIRROR, LLCInventors: James V. Mischel, Jr., James V. Mischel, Sr.
-
Patent number: 11854788Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: March 16, 2021Date of Patent: December 26, 2023Assignee: X Display Company Technology LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Patent number: 11837688Abstract: In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.Type: GrantFiled: May 8, 2019Date of Patent: December 5, 2023Assignee: OSRAM OLED GmbHInventor: Michael Zitzlsperger
-
Patent number: 11837684Abstract: Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.Type: GrantFiled: November 21, 2019Date of Patent: December 5, 2023Assignee: CreeLED, Inc.Inventors: David Suich, Daniel E. Stasiw, Samuel Richard Harrell, Jr.
-
Patent number: 11837616Abstract: The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.Type: GrantFiled: March 24, 2022Date of Patent: December 5, 2023Assignee: Sony Semiconductor Solutions CorporationInventor: Taichi Natori
-
Patent number: 11830857Abstract: A light-emitting device and a method for manufacturing the light-emitting device is disclosed. Such a light-emitting device comprises a substrate, a plurality of cells disposed on the substrate, and a plurality of semiconductor dice, wherein each of the plurality of cells accommodates at least one of the plurality of dice. Each of the plurality of cells may be filled with an encapsulant, phosphor or a mixture of an encapsulant with phosphor to control light characteristics of the light-emitting device. In an alternative aspect, cells may be filled with an encapsulant, and comprise a transparent cover coated with or filled with phosphors to control light characteristics of the light-emitting device.Type: GrantFiled: August 19, 2020Date of Patent: November 28, 2023Assignee: BRIDGELUX, INC.Inventors: Rene Peter Helbing, Tao Xu
-
Patent number: 11830898Abstract: The present technology relates to an imaging element, a method of manufacturing the imaging element, and an electronic apparatus that make it possible to suppress generation of a void in an infrared cutoff filter layer. The imaging element includes: a light receiving sensor that performs photoelectric conversion of incoming light; a cover glass that protects a top surface side serving as a light incidence surface of the light receiving sensor; a frame that is disposed in an outer peripheral portion between the light receiving sensor and the cover glass, and is formed with use of an inorganic material; and an infrared cutoff filter layer that is formed on an inner side on a same plane as the frame. The present technology is applicable to, for example, an imaging element having a CSP structure, and the like.Type: GrantFiled: March 24, 2022Date of Patent: November 28, 2023Assignee: Sony Semiconductor Solutions CorporationInventor: Taichi Natori
-
Patent number: 11828969Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light emitting devices on the substrate; a first reflective layer on the substrate; a resin layer on the first reflective layer; and a second reflective layer on the resin layer. The resin layer includes a first surface from which light emitted from the plurality of light emitting devices is emitted, and a second surface opposite to the first surface, wherein the first surface of the resin layer includes a first exit surface having a first curvature, and a second exit surface having a flat surface or a second curvature, wherein a maximum distance from the second surface to the first exit surface may be greater than a maximum distance from the second surface to the second exit surface.Type: GrantFiled: November 14, 2022Date of Patent: November 28, 2023Assignee: LG INNOTEK CO., LTD.Inventors: Seong Jin Kim, Hyun Ho Choi
-
Patent number: 11824148Abstract: Disclosed is a semiconductor light emitting device including: A semiconductor light emitting device comprising: a semiconductor light emitting device chip including a plurality of semiconductor layers, and electrodes electrically connected to the plurality of semiconductor layers, the plurality of semiconductor layers including an active layer adapted to generate light by recombination of electrons and holes; an encapsulating member of a lens shape made of a light-transmitting thermoplastic resin having at least 90% transmissivity for light of a wavelength band ranging from 100 nm to 400 nm, for surrounding the semiconductor light emitting device chip; and an external substrate including conductive layers electrically connected to the electrodes of the semiconductor light emitting device chip. The encapsulating member is formed in a way that all faces of the encapsulating member are exposed to outside, except for a portion of the lower face thereof in contact with the external substrate.Type: GrantFiled: July 21, 2022Date of Patent: November 21, 2023Assignee: Elphoton Inc.Inventors: Kyoung Min Kim, Bong Hwan Kim, Jung Woo Han
-
Patent number: 11817307Abstract: The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.Type: GrantFiled: July 24, 2019Date of Patent: November 14, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Guangcai Yuan, Zhijun Lv, Haixu Li, Xiaoxin Song, Feng Zhang, Wenqu Liu, Liwen Dong, Zhao Cui, Libo Wang, Detian Meng
-
Patent number: 11810485Abstract: An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.Type: GrantFiled: December 6, 2022Date of Patent: November 7, 2023Assignee: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Li-Wei Mao, Chi-Liang Chang, Chia-Hui Lin
-
Patent number: 11812630Abstract: A display device includes a substrate, a switching element on the substrate, a pixel electrode disposed on the switching element and connected to the switching element, a light emitting layer on the pixel electrode, a common electrode on the light emitting layer, and a sealing portion on the common electrode. The sealing portion includes an organic layer, and at least one first composite inorganic layer disposed between the organic layer and the common electrode. The at least one first composite inorganic layer includes a first inorganic layer between the common electrode and the organic layer, and a second inorganic layer between the first inorganic layer and the organic layer. A refractive index of the first inorganic layer and a refractive index of the second inorganic layer are different from each other, and the first inorganic layer and the second inorganic layer contact each other.Type: GrantFiled: January 29, 2019Date of Patent: November 7, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Wooyong Sung, Junghan Seo, Kwanhyuck Yoon
-
Patent number: 11784457Abstract: A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.Type: GrantFiled: September 12, 2021Date of Patent: October 10, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ramakanth Alapati, Darrell Paul Baker, Anthony B. Taguinod
-
Patent number: 11784292Abstract: A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.Type: GrantFiled: August 4, 2022Date of Patent: October 10, 2023Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Min Jang, Chang Youn Kim
-
Patent number: 11777068Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.Type: GrantFiled: August 10, 2022Date of Patent: October 3, 2023Assignee: ROHM CO., LTD.Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
-
Patent number: 11778854Abstract: Provided is an organic electroluminescent display device, including a substrate, an organic light-emitting device on the substrate, and an encapsulation layer formed on the organic light-emitting device and the substrate. The encapsulation layer includes an inorganic layer and a polymer organic layer alternatingly stacked with an intermediate layer formed of a first organic monomer between the inorganic layer and the polymer organic layer, and one surface of the intermediate layer is bonded to the inorganic layer through bonding sites on a surface of the inorganic layer and another surface of the intermediate layer is bonded to the organic layer by polymerization.Type: GrantFiled: October 14, 2022Date of Patent: October 3, 2023Assignee: Samsung Display Co., Ltd.Inventors: Min-Ho Oh, Yoon-Hyeung Cho, Yong-Tak Kim, So-Young Lee, Jong-Woo Kim, Ji-Young Moon
-
Patent number: 11764341Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.Type: GrantFiled: May 3, 2022Date of Patent: September 19, 2023Assignee: BRIDGELUX, INC.Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
-
Patent number: 11754762Abstract: A plurality of light-emitting units (140) are provided on a first surface (100a) of a substrate (100) and are separated from each other. Each light-emitting unit (140) includes a light-transmitting first electrode (110), an organic layer (120), and a light-reflective second electrode (130). The organic layer (120) is located between the first electrode (110) and the second electrode (130). A light-transmitting region is located between the light-emitting units (140) and transmits light in the thickness direction of a light-emitting device (10). An optical filter (200) overlaps the light-transmitting region and does not overlap the plurality of light-emitting units (140).Type: GrantFiled: January 20, 2021Date of Patent: September 12, 2023Assignee: Pioneer CorporationInventors: Teruichi Watanabe, Hiroki Tan, Isamu Ohshita
-
Patent number: 11754852Abstract: The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.Type: GrantFiled: December 12, 2022Date of Patent: September 12, 2023Assignee: Liminal Space, Inc.Inventor: Nathaniel Huber
-
Patent number: 11756939Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a first phosphor sheet containing a first phosphor and a third phosphor, and covering a top face of the first light emitting element, and a second phosphor sheet containing a second phosphor and a fourth phosphor, and covering a top face of the second light emitting element, wherein a peak wavelength of light which is wavelength-converted by the first phosphor or the third phosphor is equal to or less than a peak wavelength of light which is wavelength-converted by the second phosphor or the fourth phosphor.Type: GrantFiled: April 25, 2022Date of Patent: September 12, 2023Assignees: Citizen Electronics Co., Ltd., Citizen Watch Co., Ltd.Inventors: Yuki Suto, Jo Kinosita
-
Patent number: 11742335Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.Type: GrantFiled: December 14, 2020Date of Patent: August 29, 2023Assignee: INNOLUX CORPORATIONInventors: Shih-Chang Huang, Chia-Lun Chen, Ming-Hui Chu, Chin-Lung Ting, Chien-Tzu Chu, Hui-Chi Wang
-
Patent number: 11739917Abstract: The instant invention relates to a sub-miniature high powered light emitting diode and accompanying mounting tab device. The instant invention seeks to provide a solution to light fixture designers by making a readily available and tightly compact light emitting diode mounting device. The instant invention provides for a mounting tab with a heat dissipating element to take advantage of the tiny size of sub-miniature high powered light emitting diodes while adding negligible mounting and heat dissipating elements to set a new lighting device standard in versatility, optimal heat dissipation, and minimal mounting overhead.Type: GrantFiled: March 1, 2022Date of Patent: August 29, 2023Inventor: Gary Lagasse
-
Patent number: 11735699Abstract: A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.Type: GrantFiled: January 12, 2022Date of Patent: August 22, 2023Assignee: NICHIA CORPORATIONInventors: Shunsuke Minato, Masahiko Sano
-
Patent number: 11728179Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.Type: GrantFiled: August 24, 2018Date of Patent: August 15, 2023Assignee: Nexperia B.V.Inventors: Ricardo Yandoc, Adam Richard Brown, Haibo Fan, Kow Siew Ting, Nam Khong Then, Wei Leong Tan
-
Patent number: 11715819Abstract: A light emitting device includes a light emitting element, a light guide member, a reflecting member, a wavelength conversion member. The light emitting element has a light emitting surface and lateral surfaces. The light guiding member is provided on at least a portion of the lateral surfaces of the light emitting element. The reflecting member is provided on the lateral surface of the light emitting element with the light guiding member interposed therebetween. The wavelength conversion member is provided on the light emitting surface of the light emitting element, the light guiding member and the reflecting member. The wavelength conversion member is provided with a recess between an outer lateral surface of the wavelength conversion member and the light guiding member. The reflecting member is provided in the recess.Type: GrantFiled: March 23, 2022Date of Patent: August 1, 2023Assignee: Nichia CorporationInventor: Toru Hashimoto
-
Patent number: 11699689Abstract: A method for manufacturing a planar light source includes preparing a wiring substrate including a first region that includes a light source placement section; disposing a light-reflective member in the first region of the wiring substrate; preparing a light guide plate including a first major surface, a second major surface opposite to the first major surface, and a first hole extending from the first major surface to the second major surface; disposing a light source on the light-reflective member at the light source placement section; disposing the light guide plate on the wiring substrate to cause the wiring substrate and the second major surface of the light guide plate to face each other to cause the light source to be positioned in the first hole; and disposing a first light-transmitting member in the first hole.Type: GrantFiled: January 28, 2021Date of Patent: July 11, 2023Assignee: NICHIA CORPORATIONInventor: Toru Hashimoto
-
Patent number: 11698295Abstract: An optical sensor includes a light emitter to emit light, a light receiver to receive the light emitted from the light emitter, a first resin body that covers the light emitter and the light receiver to transmit the light emitted from the light emitter to emit the light outside, and a second resin body that seals the light emitter and the light receiver, in which the second resin body is included inside the first resin body, and the second resin body is harder than the first resin body.Type: GrantFiled: January 6, 2022Date of Patent: July 11, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hiroshi Watanabe, Kohei Sugahara, Takatoshi Kato
-
Patent number: 11694998Abstract: Light-emitting sub-pixels and pixels for micro-light-emitting diode-based displays are provided. Also provided are methods of fabricating individual sub-pixels, pixels, and arrays of the pixels. The sub-pixels include a double-layered film that includes a coupling layer disposed over a light-emitting diode and a light-emission layer disposed over the coupling layer.Type: GrantFiled: April 8, 2021Date of Patent: July 4, 2023Assignee: Kateeva, Inc.Inventor: Florian Pschenitzka
-
Patent number: 11684267Abstract: Provide is a lens which outputs light, emitted by a plurality of light sources, with uniform light distribution. The lens includes a lens body having a first surface which is flat and has an incident hole formed therein, and a second surface which is convex and opposite the first surface; and a plurality of incident surfaces which are recessed from the incident hole toward the second surface, each of the plurality of incident surfaces corresponding to a light source of the plurality of light.Type: GrantFiled: April 6, 2020Date of Patent: June 27, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Dong Ho Kim
-
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
Patent number: 11688815Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.Type: GrantFiled: October 27, 2020Date of Patent: June 27, 2023Assignee: STMicroelectronics (Grenoble 2) SASInventors: Karine Saxod, Alexandre Mas, Eric Saugier, Gaetan Lobascio, Benoit Besancon -
Patent number: 11688836Abstract: A light emitting module including a substrate, a first light emitting part disposed on the substrate, and a second light emitting part disposed on the substrate and spaced apart from the first light emitting part by an isolation trench between the first and the second light emitting parts, in which the first light emitting part and the second light emitting part include a first light emitting region and a second light emitting region, respectively, the second light emitting region being spaced apart from the first light emitting region, each of the first and second light emitting parts further includes a wavelength conversion layer covering the first and second light emitting regions, the wavelength conversion layers further include a barrier layer, and the isolation trench and the barrier layer vertically overlap each other on the base substrate.Type: GrantFiled: October 19, 2021Date of Patent: June 27, 2023Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jong Min Lee, Bang Hyun Kim, Jae Ho Lee
-
Patent number: 11690248Abstract: A light emitting display device includes a lower substrate, a thin film transistor on the lower substrate, a passivation layer disposed on the thin film transistor and including hydrogen, an overcoating layer disposed on the passivation layer and planarizing the passivation layer, a light emitting element disposed on the overcoating layer and including an anode, a light emitting layer on the anode, and a cathode on the light emitting layer, a bank disposed on the overcoating layer and defining a light emitting area, an adhesive layer on the light emitting element and the bank, and a hydrogen absorbing layer disposed on the adhesive layer and including a hydrogen absorbing filler, wherein a side end of the bank is disposed more inwardly than side ends of the adhesive layer and the hydrogen absorbing layer, wherein the side ends of the adhesive layer and the hydrogen absorbing layer are disposed more inwardly than a side end of the overcoating layer.Type: GrantFiled: December 30, 2020Date of Patent: June 27, 2023Assignee: LG DISPLAY CO., LTD.Inventors: Yeon Kim, Goeun Kim, HyeonTae Seo, Eunjin Kim, Jungyeon Kim, JinHo Kim, Tae-Hoon Kim, KyoungHoon Kim, KwangSeon Lee, Hongdae Shin
-
Patent number: 11677059Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.Type: GrantFiled: April 6, 2021Date of Patent: June 13, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi