Abstract: A transfer apparatus includes: a body portion; and an adhesive portion connected to the body portion, with which a point light source of a display apparatus is attachable to and detachable from the transfer apparatus by contact therewith. The adhesive portion is defined by a plurality of surfaces in different planes from each other.

Abstract: A packaged electronic device structure includes a substrate having a major surface. A semiconductor device is connected to the major surface of the substrate, the semiconductor device having a first major surface, a second major surface opposite to the first major surface, and a side surface extending between the first major surface and the second major surface. A package body encapsulates a portion of the semiconductor device, wherein the side surface of the semiconductor device is exposed through a side surface of the package body. In some examples, the side surface of the semiconductor device is an active surface. In some examples, the package body comprises a molded structure that contacts and overlaps the first major surface of the semiconductor device.

Abstract: A light-emitting device includes a light-emitting element, a wavelength conversion member, a light-reflective member and a light-distributing member. The wavelength conversion member is arranged on the light-emitting element. The light-reflective member covers lateral surfaces of the light-emitting element. The light-distributing member is made of silicon and defines a through-hole disposed above the wavelength conversion member. The upper edge of the through-hole defined by an upper surface of the light-distributing member is disposed on an inner side of an outer edge of the light-emitting element in plan view.

Abstract: A carrier of one or more light sources for a lighting and/or signaling module especially for an automotive vehicle, comprising: a substrate having at least one aperture and electrical tracks on at least one side; and at least one light-emitting diode (LED) having a body and electrical connection leads lateral to the body. The LED or at least one of the LEDs is placed through a respective aperture of the substrate, and the connection leads make contact with respective electrical tracks. The substrate is a rigid molded part having a three-dimensional shape possibly providing an optical function such as that of a reflector. In this case, the LEDs are directly supported by the optical part.

Abstract: A chip scale packaging (CSP) light-emitting device including a light-emitting semiconductor die and a layer-by-layer photoluminescent (PL) structure disposed on the light-emitting semiconductor die is disclosed. The PL structure includes a second PL layer and a first PL layer disposed over the second PL layer, wherein the first PL layer functions as a photoluminescent layer and a barrier layer protecting the second PL from ambient oxygen and moisture. The first PL layer includes a less-moisture-sensitive PL material dispersed within a first polymer matrix material, whereas the second PL layer includes a moisture-sensitive PL material dispersed within a second polymer material. With these arrangements, the outermost first PL layer comprising the less-moisture-sensitive photoluminescent material functions as a wavelength-conversion layer and also serves as a barrier layer protecting the inner second PL layer comprising the moisture-sensitive photoluminescent material from ambient oxygen and moisture.

Abstract: An handheld illuminating device with orb-shaped lens for enhancing forward and lateral visibility including a flashlight having at least one light source that emits light rays through an orb-shaped lens. The orb-shaped lens is semi-spherical and adapted to disperse the light rays through a substantially 270° arc of uniform light for illuminating more than one area around the user, diffusing the light rays to soften the illumination from the light source, and eliminates shadows that are inherent in flat or curvilinear lenses. A reflector reflects light rays from the light source to the orb-shaped lens. A power supply powers the light source. A switch regulates power and intensity of the light source. A transparent cover protects the orb-shaped lens from physical damage.

Abstract: A transfer apparatus includes: a body portion; and an adhesive portion connected to the body portion, with which a point light source of a display apparatus is attachable to and detachable from the transfer apparatus by contact therewith. The adhesive portion is defined by a plurality of surfaces in different planes from each other.

Abstract: Disclosed are examples of optical/electrical devices including a variable TIR lens assembly having a transducer, an optical lens and an electrowetting cell coupled to an exterior wall of the lens. The electrowetting cell contains two immiscible liquids having different optical and electrical properties. One liquid has a high index of refraction, and the other liquid has a low index of refraction. At least one liquid is electrically conductive. A signal causes the high index of refraction and the low index of refraction liquids to assume various positions within the electrowetting cell along the exterior wall. The properties of the optical lens, e.g. its total internal reflectivity, change depending upon the position of the respective liquids along the exterior wall. The light characteristics of the assembly change to produce a light beam over a range of light beam outputs or a field of view over a range of fields of view.

Abstract: A method and apparatus for collecting and projecting light into a specified target illuminance. A lens may be mounted or otherwise paired to a carrier to form a lens/carrier combination, which may then be mounted to a printed circuit board assembly (PCBA) containing a light emitting diode (LED). The lens/carrier combination may establish an optimum optical relationship between the LED and the lens, such that a predetermined photometric distribution of the LED is collected by the lens, while the remaining photometric distribution of the LED is rejected by the carrier. The lens may include a first pair of opposing surfaces forming a first focus and a second pair of opposing surfaces forming a second focus. The first and second foci may cause light to be subtended into one or more of collimated light focused light, diffused light, and shifted light. The carrier may include an obstruction extending toward the PCBA.

Abstract: The invention relates to a vehicle headlight having at least one light source arrangement comprising a laser, and having a headlight lens comprising a body composed of a transparent material, wherein the body comprises at least one light tunnel and a light-conducting part having at least one optically active light exit surface, wherein the light tunnel comprises at least one, more particularly optically active, light entrance surface and undergoes transition with a bend into the light-conducting part for the purpose of imaging the bend as a bright-dark boundary by means of light coupled or radiated from the light source arrangement into the light entrance surface.

Abstract: A light emitting device includes a base substrate having a recessed portion at a flat upper surface thereof. The recessed portion has an inner wall. A sealing member is provided in the recessed portion. The sealing member contains surface-treated particles, or particles coexisting with a dispersing agent. The particles have a particle diameter of 1 nm or more and 100 ?m or less. The particles are made of an organic material or an inorganic material. The organic material and the inorganic material are free of a phosphor. The at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion which is a boundary between a surface of the inner wall and the flat upper surface. The at least one of the particles and aggregates of particles are unevenly distributed in the region.

Abstract: A display device including: a substrate configured to include a first region and a second region formed at an outer periphery of the first region; an emission layer disposed on the first region and the second region of the substrate; a polarizer disposed on the emission layer; a touch panel disposed on the polarizer; a window disposed on the touch panel; and a light blocking layer covering side surfaces of the polarizer and the touch panel and a top surface of the emission layer disposed on the second region of the substrate. The polarizer and the touch panel cover the first region of the substrate and expose the second region of the substrate.

Abstract: A projection optical system includes a light source to emit light and an optical element including an incidence plane on which the light from the light source is incident and an emission plane having a plurality of flat planes to emit the light, wherein the plurality of flat planes includes a first inclination plane inclining in a direction of the light-emitting surface.

Abstract: An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads.

Abstract: A vehicle lighting unit can achieve line-shaped light emission with reduced luminance unevenness more than the conventional ones. The vehicle lighting unit can include: an LED having an optical axis in an illumination direction as a forward direction; and a light guiding lens having a plate shape and disposed in front of the LED. The light guiding lens can have a light incident face formed at a rear end thereof; a light exiting face formed at a front end thereof and having an elongated face extending along a left-right direction.

Abstract: A non-breakable display device, electronic appliance, or lighting device is provided. A bendable display device in which a first flexible substrate and a second flexible substrate provided with transistors overlap each other with a bonding layer therebetween is fabricated. The display device is bent so that the first substrate is positioned on the inner side (the valley side) and the second substrate is positioned on the outer side (the mountain side).

Abstract: A vehicle headlamp comprising first second light sources and first and second lens. Each lens comprising a precision-molded, one-piece, element of a transparent material. Each one-piece element comprising a light tunnel and a light-conducting part having an optically effective light exit surface. The first lens light tunnel comprises an optically effective, light inlet surface and transitions into a light-conducting part while making a first bend for imaging the first bend as a light-shadow line by means of light coupled in or irradiated onto the light inlet surface. The second lens light tunnel comprises a second optically active, light inlet surface and transitions into a second light-conducting part while making a second bend for imaging the second bend by means of light coupled in or irradiated onto the light inlet surface, the second bend (substantially) being a variant of the first bend mirrored on a straight line.

Abstract: Techniques for encoded data processing which allow for continuous data processing as encoded data changes. Data is decomposed into one or more blocks with each block containing at least one data record. At least one data record within a given block is encoded with a first encoding process selected from one or more encoding processes. The first encoding process is associated with the given data block. Techniques evaluate whether or not to implement an encoding change for a given block when updating a given data record in the given block. Responsive to the evaluation, the given block is re-encoded with a second encoding process. Responsive to the re-encoding, the association of the given block is updated. A map is formed to convert the given data record encoded with the first encoding process to the second encoding process so as to preserve comparative relationships of the given data record.

Abstract: An LED is provided, the LED comprising a lighting assembly and a light bead. The light head encases the lighting assembly. A cross-section of an upper portion of the light bead is an asymmetric shape with respect to the projection of a normal of the lighting assembly on the cross-section of the upper portion of the light bead, while a cross-section at the lower portion of the light bead perpendicular to the axis is a symmetric shape with respect to the projection of the normal of the lighting assembly on the cross-section at the lower portion of the light bead. The lighting assembly is located at a symcenter of the lower portion of the light bead. The aforementioned LED can increase its visible range, and can ensure an even distribution of the internal stress surrounding the lighting assembly. An LED packaging method is also provided.

Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.

Abstract: A light emitting device (100) according to the present disclosure includes a base substrate (10) having a recessed portion (15) at its upper surface (11); a light emitting element (20) provided in the recessed portion (15); and a sealing member (30) provided in the recessed portion (15), in which the sealing member (30) contains surface-treated particles (40), or particles (40) coexisting with a dispersing agent, and at least a part of an edge portion of the sealing member (30) is a region located in the vicinity of an edge (17) of the recessed portion, and in which at least one of the particles (40) and aggregates (41) of particles are unevenly distributed.

Abstract: An envelope of a point light source includes first to fourth surfaces. The first surface protrudes ahead of a light-emitting element and extends to a left side and a right side of the light-emitting element when viewed from the light-emitting element. The second surface is connected to the first surface on the left side and the right side of the light-emitting element and is in contact with the light-emitting element. The third surface is connected to an upper end of the first surface and an upper end of the second surface and forms a first depression that sinks from the first surface toward the second surface. The fourth surface is connected to a lower end of the first surface and a lower end of the second surface and forms a second depression that sinks from the first surface toward the second surface.

Abstract: An illumination device includes a light-emitting device and a diffusion member. The light-emitting device has a plurality of light-emitting elements that emit light having a peak wavelength in a wavelength region of 380 to 420 nm, a first phosphor that emits visible light having a peak wavelength in a wavelength region of 560 to 600 nm, a second phosphor that is excited by ultraviolet ray or short-wavelength visible light and emits visible light in complementary color relationship with the visible light emitted by the first phosphor, and a light-transmitting member that covers the plurality of light-emitting elements and contains the first phosphor and the second phosphor dispersed therein. The diffusion member diffuses at least a part of the light emitting from the light-emitting device.

Abstract: A lens for an LED includes a top face, a bottom face, and a circumferential periphery interconnecting the top and bottom faces. The top face defines a recess therein. A concave wall defines a bottom of the recess. In cross section of the lens, the concave wall consists of two symmetrical curves extending outward and upwardly from a bottom tip of the recess to connect with the top face. Each curve is a part of a hyperbola. The cavity is for receiving an LED therein. The lens further forms a cone-shaped top wall enclosing a top of the cavity. Light emitted from the LED travels through the cone-shaped top wall to strike the concave wall and be reflected thereby to radiate sideward and downwardly. The sideward and downwardly reflected light then is reflected by a reflective coating on a substrate to illuminate upwardly.

Abstract: The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N>1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Abstract: This invention proposes a photo-luminescence coating and its applications. The photo-luminescence coating is a mixture of photo-luminescence phosphors, glass powder, macromolecule compounds and solvent. The photo-luminescence coating is coated on a substrate and, after a drying, de-binding and sintering process, a photo-luminescence glass layer is formed, and especially the pattern can be designed. The photo-luminescence glass is made from a solidifying procedure of a melt glass mixed with photo-luminescence phosphors, and especially can be made to have a specialized shape.

Abstract: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a p-side electrode, a plurality of n-side electrodes, a first insulating film, a p-side interconnect unit, and an n-side interconnect unit. The p-side interconnect unit is provided on the first insulating film to connect to the p-side electrode through a first via piercing the first insulating film. The n-side interconnect unit is provided on the first insulating film to commonly connect to the plurality of n-side electrodes through a second via piercing the first insulating film. The plurality of n-side regions is separated from each other without being linked at the second surface. The p-side region is provided around each of the n-side regions at the second surface.

Abstract: The invention relates to a sealed thin-film device (10, 12, 14), to a method of repairing a sealing layer (20) applied to a thin-film device (30) to produce the sealed thin-film device, to a system (200) for repairing the sealing layer applied to the thin-film device to generate the sealed thin-film device and to a computer program product. The sealed thin-film device comprises a thin-film device and a sealing layer applied on the thin-film device for protecting the thin-film device from environmental influence. The sealed thin-film device further comprises locally applied mending material (40; 42, 44) for sealing a local breach (50) in the sealing layer. An effect of this sealed thin-film device is that the operational life-time of the sealed thin-film device is improved. Furthermore, the production yield of the production of sealed thin-film devices is improved.

Abstract: Provided is an organic light emitting diode including an organic light-emitting part including a first electrode, an organic material layer having a light-emitting layer, and a second electrode, and an encapsulating layer included on an entire top surface of the organic light-emitting part. Here, the encapsulating layer has a structure in which at least two of a water barrier film, a glass cap, a metal foil and a conductive film are stacked. Accordingly, the diode may have excellent water and oxygen barrier effects, and deterioration of the diode or running failure may be prevented.

Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, a conductive support member disposed under the second conductive semiconductor layer, an insulating layer disposed between the second conductive semiconductor layer and the conductive support member, and a stepped conductive layer disposed between the second conductive semiconductor layer and the conductive support member. The stepped conductive layer includes a lower parts and an upper parts. The upper parts are directly contacted with the second conductive semiconductor layer. The lower parts are disposed between the insulating layer and the conductive support member. The insulating layer is laterally disposed between the plurality of upper parts.

Abstract: This invention is a photon-interactive Gaussian surface lens method means that converts incident photons from a single or a plurality of wide band gap semiconductor class light emitting diode dies, into a secondary emission of photons emanating from a composite photon transparent colloidal stationary suspension of quantum dots, high efficiency phosphors, a combination of quantum dots and high efficiency phosphors and nano-particles of metal, silicon or similar semiconductors from the IIIB and IVB Group of the Periodic Table and any nano-material and/or micro/nano spheres that responds to Rayleigh Scattering and/or Mie Scattering; and a plurality of quantum dots in communication with said nano-particles in said suspension. The apparatus and methods according to the present invention provides in improved narrow pass-band of red, green, and blue photon efficiency over phosphor based conversion.

Abstract: A light-emitting device includes an LED chip, and a case including a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip. The case further includes a resin that includes a glass fiber and is integrally formed by injection molding. An average length of the glass fiber is greater than a thickness of the sidewall portion. The resin has a refractive index different from the glass fiber.

Abstract: Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Abstract: A light-emitting device includes a light-emitting element mounted on a lead frame, and a sealing material sealing the light-emitting element and having a thickness of not more than 1 mm and including a silicone resin as a main component. The sealing material includes a first gas barrier layer that a physical property value obtained by dividing a difference between a value of an average spin-spin relaxation time of 1H nuclei at a resonance frequency of 25 MHz at 140° C. and that at 25° C. by 115 is not more than 3.5 and the average spin-spin relaxation time at 140° C. is not more than 500 ?sec.

Abstract: A highly reliable light-emitting module or light-emitting device is provided. A method for manufacturing a highly reliable light-emitting module is provided. The light-emitting module includes, between a first substrate and a second substrate, a first electrode provided over the first substrate, a second electrode provided over the first electrode with a layer containing a light-emitting organic compound interposed therebetween, and a sacrifice layer formed using a liquid material provided over the second electrode.

Abstract: A light emitting diode (LED) package is provided. According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate; a light emitting device on one of the at least two distinct electrodes, wherein the at least two distinct electrodes are electrically separated from each other and spaced from each other; a guide unit on the substrate and around the light emitting device, wherein the guide unit includes an inner side surface, an outer side surface, a top surface and a bottom surface; and lenses including a first lens and a second lens on the substrate, wherein at least one of the lenses includes a convex shape and a portion of the at least one of the lenses is located higher than the top surface of the guide unit.

Abstract: Apparatuses and methods for producing light emitting devices maximizing luminous flux output are disclosed. In one possible embodiment, a light emitting device comprises a substrate and a reflective layer at least partially covering the substrate. The reflective layer is non-yellowing, and may be substantially light transparent. One or more light emitting diode (LED) chips are disposed on the substrate. The light emitting device may emit white light. The reflective layer may comprise a silicone carrier with light reflective particles dispersed in the silicone carrier. A light diffusion lens may also be disposed on the substrate and surrounding the LED chips. Furthermore, one or more microspheres, light scattering particles, and/or phosphor particles may be dispersed in the lens. In one possible method for producing a light emitting device, a substrate is provided.

Abstract: Disclosed are a light emitting device. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer, an electrode connected to the first conductive semiconductor layer. First to third conductive layers are disposed under the second conductive semiconductor layer. A protective layer is disposed outward further than the first conductive layer. A support member is disposed under the third conductive layer. A buffer layer is disposed between protective layer and the third conductive layer. The protective layer includes a first opening, a first portion, and a second portion. The second portion of the protective layer and the buffer layer is overlapped with the third conductive layer and is disposed outwardly further than a lateral surface of the first conductive layer.

Abstract: A non-chip LED illumination device includes a retaining layer having one or more chambers for engaging with light emitting diode elements each of which include an outer surface and two terminals disposed on the outer surface of the light emitting diode element. A covering layer is engaged onto the retaining layer and the light emitting diode element and includes one or more openings aligned with the light emitting diode elements respectively. One or more fluorescent members of different colors are engaged into the openings of the covering layer for allowing the light generated by the light emitting diode elements to emit through the fluorescent members of different colors.

Abstract: A light emitting device, comprising: a package which is formed of a resin and has a recess which is provided with a bottom face and two pairs of opposite inner walls surrounding the bottom face, the package having two pairs of opposite side walls made of the inner walls and corresponding outer walls; a lead frame exposed at the bottom face; a light emitting element which is provided on the lead frame; and a sealing resin provided in the recess for sealing the light emitting element, wherein the lead frame has a bottom plate portion and a reflector portion exposed along one of the pair of opposite inner walls, and a first angle between the reflector portion and the bottom face is greater than a second angle between another one of the pair of opposite inner walls which is opposite to the reflector portion and the bottom face, is provided.

Abstract: Optical assemblies comprising an optical device and a composition comprising a resin-linear organosiloxane block copolymer are disclosed. In some embodiments, the organosiloxane block copolymers has a weight average molecular weight of at least 20,000 g/mole and includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R2—SiO3/2] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups. R1 is independently a C1 to C30 hydrocarbyl and R2 is independently a C1 to C20 hydrocarbyl. At least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains. Each linear block is linked to at least one non-linear block.

Abstract: A lighting device comprising a light emitter chip, a reflective cup and a lumiphor positioned between the chip and the cup. Also, a lighting device comprising a light emitter chip, a wire bonded to a first surface of the chip and a lumiphor which faces a second surface of the chip. Also, a lighting device comprising a light emitter chip, and a lumiphor, a first surface of the chip facing a first region of the lumiphor, a second surface of the chip facing a second region of the lumiphor. Also, a lighting device comprising a light emitter chip and first and second lumiphors, a first surface of the chip facing the second lumiphor, a second surface of the chip facing the first lumiphor. Also, methods of making lighting devices.

Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

Abstract: A method for manufacturing a light-emitting case includes forming a flat panel light emitting diode, and covering the flat panel light emitting diode with transparent plastic material. The transparent plastic material has properties of flexibility, high gas-resistance and water-resistance. When the light-emitting case is forced, the shape of the light-emitting case can be changed.

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

Abstract: There is provided a light emitting device package including: a package substrate; a blue light emitting device and a green light emitting device mounted on the package substrate; a flow prevention part formed on the package substrate and substantially enclosing the blue light emitting device; and a wavelength conversion part including a red wavelength conversion material and formed on a region defined by the flow prevention part to cover the blue light emitting device, so that white light having a high degree of color reproducibility may be emitted thereby.

Abstract: An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.

Abstract: An object of the present invention is to provide a package from which a metal wiring and the like are difficult to be detached even when heat is generated from a semiconductor light-emitting element. This object is achieved with a package for a semiconductor light-emitting device comprising at least a molded resin containing (A) a SiH-containing polyorganosiloxane and (B) a filler, wherein an amount of SiH existing in the molded resin, after a heat treatment thereof at 200° C. for 10 minutes, is 20 to 65 ?mol/g.

Abstract: A light emitting device includes a first resin layer which is made of transparent resin and provided outside a solid-state light-emitting element mounted on a mounting substrate; and a second resin layer which is provided outside the first resin layer and made of transparent resin that contains a phosphor which is excited with a luminescence wavelength of the solid-state light-emitting element, wherein when the refractive index of the solid-state light-emitting element is set to be N1, the refractive index of the first resin layer is set to be N2, and the refractive index of the second resin layer is set to be N3, the relationship of N1?N2?N3?1 is established.