Abstract: Provided is a chip mounter for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n?1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds.

Abstract: A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract: Component placement apparatus (1, 21) comprising a storage device (2) for storing components, means (5, 25, 71, 81, 91) for transporting a component from the storage device (2) to a transfer device (6, 26) comprising at least one component pickup position (11), and a component pick and place device (7) for picking up a component from the pickup position and placing the component on a desired location on a substrate (8) positioned on a substrate support. The transfer device (6, 26) is movable between a position relatively close to the stationary storage device (2) and a variable desired position above the substrate support relatively close to the movable pick and place device whilst the means (5, 25, 71, 81, 91) for transporting a component from the storing device to the transfer device (6, 26) comprise guiding means for guiding a tape (4) comprising components from reel (3) located in the storage device (2) into the component pickup position (11) on the transfer device (6, 26).

Abstract: A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Abstract: A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.

Abstract: An apparatus for manufacturing a semiconductor device, includes: a collet; an alignment stage; and a sheet feeding mechanism. The collet is configured to suck a surface of a semiconductor chip. The surface is on opposite side of a bonding surface to be bonded to a bonding target. The bonding surface is provided with a film-like adhesive layer. The collet includes a heater for heating the adhesive layer. The alignment stage is configured to support the semiconductor chip and to correct position of the semiconductor chip. The sheet feeding mechanism is configured to feed a release sheet onto the alignment stage.

Abstract: A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.

Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Abstract: A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport opposite to the component feeder.

Abstract: Retractable protection apparatus, and methods for use, provide protection for vertically oriented electrical connection pins from unintended bending, while further providing operability that allows protected pins to be uncovered to at least the extent necessary to make electrical connection with one or more connectors, and covered after coupling with the connectors is no longer required. In a further aspect, a locking mechanism is provided to prevent the retractable protection mechanism from retracting during shipping or similar handling. In a still further aspect, the retractable protection apparatus is segmented so that only selected portions of the vertically oriented electrical connection pins may be exposed for electrical access.

Abstract: A land grid array (LGA) socket uses a series of inclined engagement features to transfer a lateral load into a normal load to retain the LGA package in the socket. The number and position of the engagement features along the side of the socket permits a more uniform transfer of load to the solder ball array as compared to current mechanisms.

Abstract: For purposes of assembling contact pins (12) disposed in a row onto a circuit board (16), the pins (12) are grasped via a force fit in an insulating body (20) at their ends facing away from the circuit board (16)and are supported to prevent tilting. The body (20) has a suction surface (26) for an automated assembly device. After insertion of the pins (12) into the circuit board (16) and after the soldering process, the body (20) is pulled off the pins (12), so that they sit freely in the circuit board (16).

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.

Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.

Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.

Abstract: Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser/deserialiser blocks, using the TSVs.

Abstract: A vacuum bonding tool for pick-and-place and bonding semiconductor chips onto a substrate or onto a previously mounted die to form a die stack includes a shank and a suction part. The shank has a vacuum conduit extending from a first end to a second end of the shank. The shank is adapted for cooperative engagement with the suction part at the second end, and the shank has a plate at the second end to support the suction part. The suction part has a surface for contacting a semiconductor chip during pick-and place operation. According to the invention, the suction part is made of an elastically deformable conductive or non-conductive material. In various embodiments, the chip contacting surface of the elastically deformable suction part flat overall, or is concave, of has a flat central region and concave regions.

Abstract: In this crimping device, a press slide (5) is provided with a crimp-height adjuster (20) for the insulation crimper (9). The crimp-height adjuster (20) arranged on the press slide (5) above an upper tool (7) consists essentially of a rotationally hindered eccentric disk (21), a lever (22), and a magnet (23) with plunger (24). The eccentric disk (21) is mounted rotatably on an axle (25). During production of crimp connections, the plunger (24) is at rest outside an elongated hole (28) of the lever (22). The press slide (5) with the upper tool (7) can be moved up and down without hindrance. With the plunger (24) inserted into the elongated hole (28) and with an upward motion of the press slide (5), after overcoming the friction of a disk-spring assembly the eccentric disk (21) executes rotational motion in clockwise direction. The lever (22) that is rigidly connected to the axle (25) turns the eccentric disk (21) about the axle (25).

Abstract: A component recognition apparatus for a chip mounter includes a head portion having a frame and at least one nozzle portion installed on the frame, the nozzle portion picking up an electronic component and mounting the electronic component on a substrate, a camera coupled with the frame and comprising an imaging device, and a mirror portion having a mirror support portion installed on the frame and a mirror held by the mirror support portion in a space that does not interfere with the movement path of the electronic component held by the nozzle portion. The camera includes a lens portion, and an image of the electronic component held by the nozzle portion is reflected by the mirror, passes off-axis through the lens portion, and is formed on the imaging device.

Abstract: Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: The invention relates to a method for applying an electronic component (24), which is provided with terminal faces (34, 35), to a substrate (33), which is provided with terminal faces (31, 32), wherein the component is removed from a feeding device by means of an application device (27), the component is subsequently positioned on the substrate by means of the application device in such a manner that the component terminal faces extending from a contact side (37) of the component up to a component rear side (38) and the substrate terminal faces are in an overlapping position and the terminal faces are subsequently contacted by means of a direct application of laser energy to the component terminal faces.

Abstract: A printed-board supporting apparatus includes a support pin that is attached to a pin-supporting table. An image of the support surface of the support pin is taken by a mark-image taking device, at a first position where a center of an image-take surface of the mark-image taking device is expected to coincide with a center of the support surface of the support pin. Another image of the support surface is taken at a second position where the center of the image-take surface is distant from the center of the support surface by a predetermined distance. At the second position, the image of the support surface is formed on the image-take surface at a position corresponding to the height of the support surface. Based on the position corresponding to the height of the support surface, the height of the support surface relative to the mark-image taking device is obtained.

Abstract: The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.

Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: In a linear driving mechanism for electronic component mounting apparatus that performs mounting operation for mounting an electronic component on a substrate and linearly drives a transfer beam 8 in a Y direction using a linear motor, an object to be driven and the linear motor are disposed such that a position P of thrust generated by the linear motor for driving the transfer beam 8 in the Y direction approximately corresponds to a central position D1 of inertial resistance of the object to be driven comprising movable portions such as transfer beam 8, loading head 9, and transfer plate 12. Accordingly, twisting moment applied to the transfer beam 8 due to inertial force is eliminated in acceleration/deceleration, and loading position accuracy is ensured and a component life can be lengthened.

Abstract: A flip chip mounting method includes holding a circuit board (213) and a semiconductor chip (206), aligning the circuit board (213) with the semiconductor chip (206) while holding them with a predetermined gap therebetween, heating the circuit board (213) or the semiconductor chip (206) to a temperature at which solder powder in a solder resin composition (216) formed of solder powder (214) and a resin (215) is melted, supplying the solder resin composition (216) by a capillary phenomenon, and curing the resin (215), wherein the melted solder powder (214) in the solder resin composition (216) is moved through the predetermined gap across which the circuit board (213) and the semiconductor chip (206) are held, and self-assembled and grown, whereby the connection terminals (211) and the electrode terminals (207) are connected to each other electrically.

Abstract: In a component insertion head, by grasping of a device portion of a component by a device chuck, a lead wire is stretched on a fulcrum given by a grasping position of the lead wire by a transfer chuck so that the device portion is placed at a component insertion position, by which correction of an insertion posture of the component is performed, and the lead wire of the component that has been corrected in terms of its insertion posture is inserted into an insertion hole of a board.

Abstract: A tool is provided for removing a circuit breaker from a mounting member or a housing. The tool includes a housing having a first end, a second end, a first side, a second side, a surface, and an axis. Disposed at the first end of the housing is a recess that is structured to receive the operating handle or actuator lever of the circuit breaker, while a number of apertures are disposed substantially adjacent to the second end of the housing. One or more mechanical fasteners extend through the apertures and secure the housing to the circuit breaker.

Abstract: A component-holding-tape connecting apparatus for connecting two component holding tapes through a connecting member, by caulking end portions of the respective two component holding tapes and the connecting member in a caulking position. The apparatus includes: (a) a supplying device supplying the connecting members to the caulking position; (b) a holding device holding, in the caulking position, the end portions of the respective two component holding tapes and the connecting member which is supplied by the supplying device; and (c) a caulking device caulking the end portions of the respective two component holding tapes and the connecting member which are held by the holding device, by causing caulking claws of the connecting member, to pierce through each the end portions of the respective two component holding tapes, and deforming the caulking claws. The supplying device includes a rotary body positioning the connecting members one by one in a predetermined position.

Abstract: A chip carrier member comprises a rotatable chip-receiving element. The rotatable chip-receiving element is rotatable essentially about a point.

Abstract: This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle.

Abstract: A pick-up tool for gripping a die comprises a sleeve and a gripping member. The sleeve has a longitudinal bore extending in the longitudinal direction in which the gripping member is inserted. The gripping member is held in the sleeve displaceably in the longitudinal direction. A portion of the gripping member protrudes from the sleeve. The gripping member assumes a predetermined position relative to the sleeve at the absence of any external action of force on the portion of the gripping member protruding from the sleeve, in which the portion of the gripping member protruding from the sleeve is held in a play-free manner radially to the longitudinal direction. In the case of action of force in the longitudinal direction on the portion of the gripping member protruding from the sleeve, the gripping member can be inserted further into the sleeve and is then radially movably held in the longitudinal bore of the sleeve. The mass of the gripping member is not more than 1 gram.

Abstract: A semiconductor mounting apparatus contains a pick and place system having a bonding head, which has a first drive system and a second drive system for displacing the bonding head in a predetermined direction. The first drive system has a first pivot arm and a first stationary situated drive, which is used to pivot the pivot arm back-and-forth within a predefined pivot range. The second drive system is mounted on the pivot arm and comprises a stationary situated electric motor.

Abstract: A multiple-axis sensor package and method of assembling a multiple-axis sensor package are provided. The package includes a first accelerometer for sensing acceleration in a first sensing axis. The package also includes a second substrate having a second accelerometer for sensing acceleration in a second sensing axis. The package further includes one or more bent lead connectors connecting the first substrate to the second substrate, wherein the one or more bent lead connectors are bent so that the first sensing axis is different than the second sensing axis.

Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.

Abstract: The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.

Abstract: An apparatus and a method for manufacturing a printed circuit board are disclosed. The apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which press the board and an insulator together; an elastic coating layer, formed on a surface of the upper roller; and a cleaning device, which removes impurities from a surface of the elastic coating layer. The apparatus does not require a separate device for performing a cushioning function and a detaching function between the bumps and the rollers, and the rollers can be kept clean using a cleaning device.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.

Abstract: A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises: Forward feeding the substrate along a transport direction designated as x direction, Equipping a predetermined number of columns with semiconductor chips in accordance with the steps: Moving the pick and place device to an x position corresponding to the column to be equipped, Moving the die ejector to this x position, and Equipping the substrate places of the column.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.