Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: A fixing holder for fixing an electronic component having wire-shaped leg portions to a printed circuit board, the holder being an almost cylindrical-shaped holder for holding the electronic component having the wire-shaped leg portions in a manner that the leg portions pass through and protrude therefrom, the fixing holder comprises: a holder main body portion for holding a main body portion of the electronic component; and a base portion continuously provided to the holder main body portion, wherein one surface of the base portion on a forward side is opened to form an opening, at least a portion of periphery of the opening is configured to form a flat surface, and a side surface of the holder main body portion on a side where the opening is formed is protruded forward to form an engagement nail portion to be engaged with the printed circuit board.

Abstract: A mounting apparatus for mounting a CPU (53) in a socket (52), includes a base (20), a plurality of resilient members (300) respectively disposed at opposite sides of the base and a movement unit (40) having a pressing portion (402) received in the base which moves vertically with respect to the base. The base includes a concave (201) defined in a bottom thereof for receiving the CPU therein. The resilient members cooperate with each other to locate the CPU within the base. The pressing portion is provided to push the CPU off the base so as to vertically mount the CPU into the socket. The base includes projection portions (221, 233) to be received in slots (521, 523) in the socket.

Abstract: An anti-electrostatic discharge (ESD) tool for engaging electronic device under test (DUT) boards whereby ESD damage to the tested devices is prevented. The tool includes an aluminum support frame, guides on opposing edges of one side of the frame for slidably receiving a DUT board, and at least one electrical shorting connector extending from the frame and electrically connecting and shorting socket connectors and leads of electronic devices when the DUT board is inserted into the guides. The electrical shorting connector preferably comprises an array of fine wire brushes which have sufficient rigidity and flexibility for engaging solder points on the DUT board for the socket connectors.

Abstract: An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.

Abstract: An apparatus is provided for engaging electrical hardware devices. The apparatus has a handle; a planar body; a planar engagement bar projecting normal from the body; a pair of arms, one arm formed at each of two ends of the bar; and each arm further bending and terminating in a bottom hook portion, the bottom hooks aligned in a common plane parallel to and spaced a gap distance from the bar and generally normal to the planar body. The hook spacing dimension is about equal to or slightly greater than an outer dimension of an electrical hardware device workpiece body but less than an outer dimension of a rectilinear lip element projecting from the hardware device workpiece. The gap distance is about equal to or slightly greater than a thickness dimension of the rectilinear lip element.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract: This invention is directed to prevention of setting a component feeding unit set with other storage member than a storage member storing same type of components as components in shortage in an electronic component mounting apparatus. A component mounting apparatus sends notice information about component shortage to a control computer when a number of electronic components in a storage member reduces and reaches a level for sending the notice information of component shortage during mounting operations. The control computer stores the notice information, and sends the notice information to a monitor computer to display this information on a monitor. A new storage member having the corresponding components is set in the component feeding unit based on the displayed notice information, and an operator inputs information A about which component feeding unit is set with the storage member and which components are stored in the storage member set in the component feeding unit.

Abstract: A broken trim die tool detection sensor. The lands of the tie bar die connect with the leads of the unit to form switches. The states of these switches indicate broken die lands or other malfunctions.

Abstract: A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.

Abstract: An electric-component mounting system wherein a determining device is operated for presently required operations of working devices disposed on a common main body, to determine a cycle-time-determinant working device which determines a cycle time of the system such that the cycle time is determined by a required operating time of the cycle-time-determinant working device as calculated when the presently required operation is performed at predetermined maximum acceleration and deceleration values or a predetermined maximum operating speed, and a slowdown device determines actual acceleration and deceleration values or an actual operating speed of each of non-cycle-time-determinant working device, so as to be lower than the predetermined maximum acceleration and deceleration values or operating speed thereof, such that the presently required operation of each non-cycle-time-determinant working device can be completed within the cycle time determined by the cycle-time-determinant working device.

Abstract: An electric-component mounting system including a substrate-holding device for holding at least one circuit substrate, at least one first mounting unit and at least one second mounting unit, each of which has at least one mounting head each operable to receive a selected one of the electric components while each mounting unit is located in a component-supplying area, and to mount the electric component onto the at least one circuit substrate held by the substrate-holding device located in a component-mounting area, and a mounting-unit moving device operable to move the at least one first mounting unit and the at least one second mounting unit past each other, between the component-supplying and component-mounting areas in opposite directions, along respective two paths, without an interference between the first mounting unit and second mounting units.

Abstract: Substrates can be transported on a top transporting section to component-fitting locations of a component-fitting apparatus. Conveying sections for substrates which are to be routed past the component-fitting locations are arranged on a number of conveying levels beneath the transporting section.

Abstract: A component suction device includes a suction nozzle for sucking and holding a component, a nozzle turning device for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device which is located above the nozzle turning device and which is connected to the suction nozzle for moving up and down the suction nozzle along an axial direction of the suction nozzle.

Abstract: An electric-component mounting system for mounting a plurality of electric components onto a circuit board. The system includes a plurality of electric-component mounting units which are arranged in a predetermined direction with a spacing distance between each adjacent pair of the electric-component mounting units. Each of the electric-component mounting units includes (a) a board holding device which is capable of holding the circuit board in a predetermined position, (b) a component mounting device which is capable of mounting the electric components onto the circuit board held by the board holding device, and (c) a component supplying device which is capable of supplying the electric components to the component mounting device. The system further includes a spacing-distance changing device capable of changing the spacing distance.

Abstract: A substrate carrying device reduces time necessary for conducting changing work for changing the types of flat panel displays or the like. A substrate support member (10) has a support body (11) provided with an outer peripheral part (11a), which is joined to an inner peripheral part (21b) of an extension support member (20) to connect the substrate support member (10) to the extension support member (20). Only by the substrate support member (10) is used for supporting a small glass substrate (41) to carry the small glass substrate (41). A combination of the substrate support member (10) and the extension support member (20) is used for supporting a large glass substrate (41?) to carry the large glass substrate (41?).

Abstract: A vacuum pipette has a filter grid that is shifted into its extended interior and whose cross section is considerably greater than the cross section of an end-side suction opening. The gaps formed in the filter grid can be so narrow that even very small components are reliably retained. Nevertheless, the entire passage cross section available is considerably greater than in the case of a filter grid arranged at the end side. As a result, favorable suction forces are generated under constant suction conditions.

Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Abstract: The invention provides a mounting apparatus with a beam which is free from adverse effect on its performance due to thermal distortion and misalignment of its guide rails, on which the beam for mounting operation travels. One end of the beam is rotatably supported on a slide, which moves along the guide rails. Another end of the beam is also rotatably supported on another slider through a moving element. The slider and the mounting element move along the guide rail. The moving element moves in a direction perpendicular to the guide rails.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. A wafer support, to support a diced semiconductor wafer having microelectronic dies, is mounted to the frame. An ejector head is connected to the frame for movement below the wafer. A pick head is connected to the frame for movement above the wafer. The ejector head has a passageway therethrough and an intake and an outlet. An air pump is connected to the intake to shoot air from the outlet towards one of the dies. The air impinges the wafer support, exerting a force on the die, to assist the pick head in removing the die from the wafer support.

Abstract: A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: An electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device to move the head, and a substrate-transferring device to move at least one substrate on which electric components are to be mounted, and wherein the substrate-transferring device stops each substrate at at least one stop position which corresponds to at least one of the component-mounting devices and at which operations of the component-mounting devices are concurrently performed on the at least one substrate.

Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.

Abstract: For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles 3a, 3b, 3c, 3d, 3e and 3f are kept in holes 5 provided in a straight line row in nozzle stocker 4 in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head 1 has to go to a place above the nozzle stocker 4 to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head 1 is required to move only to a place above the next nozzle 3b after returning the used nozzle 3a to a hole 5. Thus the stroke L of transfer head 1 needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

Abstract: In an electric-component mounting system including an illuminating device including a light source which emits a light for illuminating an object, a camera which takes an image of the object, and a processing and controlling device which includes a data processing portion that processes image data representing the image of the object taken by the camera, at least one of the camera and the illuminating device includes a brightness controlling device which controls a brightness of an image taken by the camera, and the processing and controlling device includes a brightness detecting portion which detects a brightness of at least a portion of the image of the object taken by the camera, and a control-parameter varying portion which varies, based on the brightness detected by the brightness detecting portion, at least one control parameter of the brightness controlling device so that a brightness of at least a portion of an image taken by the camera is equal to a preset brightness.

Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: A component mounting apparatus has an intermittently rotated rotary mounting section which has a driver at an upper part for driving motors of mounting heads arranged on periphery of the rotary mounting section. A controller in a stationary part of the apparatus inputs power and control signals to the rotating driver which is formed in an annular shape, and includes motor driver mounting plates with motor drivers for controlling power supplied to each motor. The motor driver mounting plates are arranged radially around a rotation axis of the rotating driver with planar surfaces in parallel to the rotation axis.

Abstract: A supply module for feeding electrical components to an automatic component-mounting machine has a locking element which is a piezoceramic bending transducer that extends in the longitudinal direction of the supply module along a supply path for the components. A free end of the locking element projects into a window of the supply module to an extent such that the locking element is located slightly above the component which has been conveyed there and is ready for removal. By applying an operating voltage to the locking element, the locking element can be deflected laterally to an extent such that it is moved out of the coverage region over the component transversely with respect to the component advancing direction.

Abstract: This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.

Abstract: An electric-component handling device includes a suction nozzle, fiducial mark, an image-taking device, a relative-movement device and an image data processing device. The electric-component handling device is operable to handle an electric component.

Abstract: The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of magnetic forces generated by the invention, in combination with physical manipulation of the DUT boards and transfer structures, IC chips are quickly and efficiently transferred.

Abstract: An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

Abstract: A component transfer apparatus is provided. The component transfer apparatus comprises a pick and place machine having a component feed source and a movable pick head having access to the component feed source. A component alignment detector is directed toward the component feed source and a controller is coupled to the component alignment detector. The controller contains instructions which, when executed by the controller, cause the controller to compare the detected component alignment with a known component alignment.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down. The present invention also comprises at least one arm affixed at one end to a swivel joint. The swivel joint allows the arm to rotate about a vertical axis. The upper portion of the swivel joint is hinged such that the arm can rotate about a horizontal axis. The combination of movement about the horizontal and vertical axis allows the arm to be positioned at any point over the pallet.

Abstract: A printed-board holding device for holding a printed board in a work system in which the printed board and a working head are moved relative to each other in a direction parallel with a top surface of the printed board so that the working head executes a desired operation in each of a plurality of predetermined portions of the top surface of the printed board. The printed-board holding device includes (a) a supporting member which is to be brought into contact with a central portion of a bottom surface of the printed board and is capable of supporting the central portion, and (b) a pressing member which is to be brought into contact with a central portion of the top surface and is capable of forcing the printed board toward the supporting member.

Abstract: A heat sink base (10) includes a rectangular body (11) made of aluminum and a circular core (12) made of copper. The body defines a circular through opening (111). A diameter of the opening is slightly less than a diameter of the core. The core is attached within the body according to the following steps: a) pressing the core into the through opening of the body; b) stamping the core to cause it to plastically deform in radial directions and thereby become firmly combined with the body; and c) removing any burring of the core flowing out from the opening such that surfaces of the core and the body are coplanarly smooth.

Abstract: When both first and second preferred nozzles are set up as valid, and both nozzles are stored in a nozzle stocker, the replacement with the recommended nozzle stored in the stocker is made and a CPU controls the operation based on control data. When both are set up as valid, but only the second preferred nozzle, not the first preferred nozzle, is stored in the stocker, the CPU 20 recognizes which nozzle is available by using nozzle positioning data stored in a RAM, and then the replacement with an alternative nozzle is made, and the CPU controls the operation according to the control data of the alternative nozzle.

Abstract: A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

Abstract: There are disclosed an apparatus for mounting electronic components, with which the electronic components can be reversed, up and down, and mounted onto a circuit board in a short mounting process time by performing picking up, delivering and receiving of components between heads, and mounting of the components onto the circuit board in parallel. A plurality of reverse-supply heads are mounted on a component supply holder for performing indexing rotation, while a plurality of mounting heads are mounted on a component mounting holder for performing indexing rotation in synchronization with the indexing rotation of the component supply holder. By (i) picking up an electronic component, (ii) delivering the electronic component from the reverse-supply head to the mounting head, and (iii) mounting the electronic component onto the circuit board at prescribed positions, operations from (i) to (iii) can be carried out in parallel.

Abstract: An apparatus and method for force mounting semiconductor packages onto printed circuit boards without the use of solder. The apparatus includes a substrate, a first integrated circuit die mounted onto the substrate, a housing configured to house the first integrated circuit die mounted onto the substrate, and a force mechanism configured to force mount the housing including the integrated circuit die and substrate onto a printed circuit board. The method includes mounting a first integrated circuit die onto a first surface of a substrate, housing the first integrated circuit die mounted onto the substrate in a housing, and using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit board. According to various embodiments, the force mechanism includes one of the following types of force mechanisms clamps, screws, bolts, adhesives, epoxy, or Instrument housings or heat stakes.

Abstract: A spindle assembly for a component pick and place machine includes a housing containing a spindle for movement therein along a longitudinal axis of the spindle; the housing accommodating a valve for controlling the flow of air to an inner bore of the spindle; the inner bore of the spindle having an opening at one end for communicating the flow of air for picking and placing the components; and the flow of air from the valve to the inner bore of the spindle is internal to the housing through passageways.

Abstract: There is provided a feeder device for a pick-and-place machine used to surface mount connectors on printed circuit boards. The feeder is designed for use with matrixes of connectors, such as pin headers. The feeders, with the proper conversion kits, can be configured to feed any type and/or size of the connector. Individual connectors are separated from the matrix by the feeder using a rotating clamping device. Preferably, the feeders are microprocessor controlled, use an edge conveyor to transport the strips to the pick point, and pneumatic cylinders to break each pin header from the strip.

Abstract: A tool for reworking a connector attached to an electronic board having a plurality of stacked wafer modules thereon. The tool includes first and second jaws for grasping and removing a selected one of the modules from the board, a holding structure for holding the board, and movement structure for moving the two jaws relative to the holding structure, at least one of the jaws adapted for separating each selected module from a module on each opposing side of the selected module such that removal of the selected module is attained without damage to the separated, adjacent modules.

Abstract: An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.