Abstract: A tape guide for guiding a carrier tape in a component mounting machine, a tape magazine for receiving the tape guide, and a system including the tape guide and the tape magazine. The carrier tape carries components that are positioned in sequence on the carrier tape and are covered by a cover tape. The tape guide includes an exposure mechanism for exposing the components at a picking position, wherein the exposure mechanism includes a separator for separating and lifting a lateral portion of the cover from the carrier tape, leaving the remaining portion of the cover at least partially attached to the carrier tape, and for bringing the lifted portion of the cover aside. The tape guide also includes a lock for enabling ready and quick attachment and detachment of the tape guide to and from the component mounting machine, a guiding for guiding the carrier tape towards a picking position, and a retainer for preventing accidental displacement of the carrier tape along the tape guide.

Abstract: A gripper having a grip tip for parts having different shapes is provided for a surface mount device. The gripper includes a piston installed inside of a through hole formed in a holder, and lifted or lowered by air flown in/out through the through hole, a moving unit connected to fixed blocks of the holder by a connection device configured to increase or decrease an interval according to the lifting or lowering operation of the piston, and multiple grip tips configured to support at least three points of a parts having a different shape.

Abstract: An electric-component mounting system including: nozzle holders each carrying suction nozzles and rotatable to bring selected one of the suction nozzles; a turning device to turn the nozzle holders about a common axis of turning, for stopping each nozzle holder at predetermined working positions including nozzle-selecting, component-receiving and component-mounting positions; a holder rotating device which includes an engaging member engageable with and disengageable from an engaging portion of each nozzle holder, and which is disposed at the nozzle-selecting position, to rotate the nozzle holder, with the engaging member engaging the engaging portion; and an engaging-and-disengaging device to move the engaging member for engagement and disengagement with and from the engaging portion, and wherein each nozzle holder receives an electric component at the selected suction nozzle when each nozzle holder is located at the component-receiving position, and mounts the electric-component onto a circuit substrate whi

Abstract: A method and apparatus to eliminate conductive contamination reliability problems for assembled substrates, such as electrical arcing in power semiconductor leads. One embodiment of the invention involves a method for assembling an electrical component having leads on a substrate having conductive contacts, wherein an elastomer part encapsulates the leads of the electrical component. A second embodiment of the invention involves assembling an electrical component having leads to a substrate having conductive contacts, wherein an elastomer shape cut by a punch die encapsulates the leads of the electrical component. A third embodiment of the invention involves an assembled substrate including an electrical component having leads, and an elastomer surrounding the leads to encapsulate the leads.

Abstract: In a component placement machine, a placement head (4) is driven by a linear motor (5). The stationary part (7) of the motor is attached to the machine frame (1) on which a PCB (8) is attached. The movable part (6) of the motor is connected to a slide (2) on which the placement head (4) is attached. During driving the placement bead, reactive forces of the motor generate vibrations in the stationary part (7) of the motor and thus in the machine frame (20). This causes inaccuracies during the placement of components (9) on the PCB (8). To diminish this problem, the reactive forces are intercepted in a separate force frame (10) which is dynamically disconnected from the machine frame (1).

Abstract: A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.

Abstract: The invention relates to a device for mounting components on a carrier comprising a frame (25) in which a shaft (8) is accommodated, the shaft is provided with a longitudinal bore (16), and means for displacing said hollow shaft (8) in vertical direction through said frame (25), wherein said shaft (8) at one end (8a) facing away from the carrier can be coupled to means (17) for generating an under pressure or vacuum within said bore (16) and wherein the other end (8b) of the shaft facing towards the carrier is provided with means for picking up and mounting a component. According to the invention, the device is characterized in that said shaft (8) is coupled to a yoke (12) which forms part of said displacement means, which coupling can be temporarily disengaged the moment the shaft makes contact with a component or a carrier.

Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.

Abstract: A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained. A component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle.

Abstract: A plurality of self-propelled system heads (5) are made to independently travel along a closed-loop travel track (6) in a manner that the heads do not interfere with each other by controlling respective drive devices (4). Components (2) from a component supply device (8) are held by component holding members (3) of the heads, and thereafter, the components held by the component holding members are mounted on boards (1) positioned by board positioning devices (7).

Abstract: An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.

Abstract: An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.

Abstract: A beam configured pick and place machine has nozzles of differing lengths for carrying large components simultaneously.

Abstract: An apparatus for feeding a plurality of electric-component tapes each of which includes a carrier tape and holds a plurality of electric components in a lengthwise direction of the carrier tape, and supplying, from the each electric-component tape, the electric components, one by one, to an object device, the apparatus including a feeding device which feeds a first electric-component tape in a lengthwise direction thereof, and a connection-portion detecting device which detects a connection portion where a terminal end portion of the first electric-component tape being fed by the feeding device is connected to an initial end portion of a second electric-component tape.

Abstract: A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction.

Abstract: Components are allocated to pipettes of different pipette types in accordance with an inverse greedy method or in accordance with a sequence of flow methods or a linear program as a result of which, for a given consecutive-ones characteristic of all the possible allocations, an optimun solution is ensured for a number of cycles, which can be predetermined, for the process of population a printed circuit board by means of an automatic placement machine.

Abstract: An electric-component mounting system, including a board supporting device, a movable member, a main moving device which moves the movable member, a rotatable body attached to the movable member, a rotatable-body rotating device which rotates the rotatable body, suction nozzles supported by the rotatable body along a circle whose center is located on an axis line of the rotatable body, such that each suction nozzle is not rotatable relative to the body and is movable relative to the body in a direction parallel to the axis line, an engaging member rotatable relative to the rotatable body about the axis line, movable relative to the body in the direction parallel to the axis line, and including a nozzle-engaging portion engageable with one suction nozzle, an engaging-member rotating device which rotates the engaging member to two rotation phases of the rotatable body at each of which the nozzle-engaging portion is engageable with one suction nozzle, an engaging-member moving device which moves the engaging mem

Abstract: The invention provides a method for processing leadframe items to form IC packages, each of the leadframe items comprising an IC carried by a suitable leadframe, the leadframe items being of two or more types. The method includes receiving the two or more types of leadframe items along respective input paths, moving at least two holders alternately between a processing region and a respective leadframe item reception position, each of the holders moving to the processing region and at a time when the other of the holders moves to its respective reception position, the reception positions being on respective ones of the input paths, each of the holders receiving leadframe items of the respective type at the respective reception position and delivering them to the processing region and encapsulating the ICs at the processing position.

Abstract: The component mounting apparatus includes a component delivery unit, a chuck (13) provided on the component delivery unit, a component transfer unit (19) for receiving a component held by the chuck (13), and a head (20) for receiving the component held by the component transfer unit (19). The head (20) includes a main head body (80), a vertically moving mechanism (81) for the main head body (80), insertion nails (68) provided at a bottom portion of the main head body (80), an opening/closing mechanism (82) for the insertion nails (68), and a turning mechanism (83) for moving the insertion nails (68) in forward and backward directions. A cam plate (84) constituting the turning mechanism (83) is mounted detachably on the main head body (80).

Abstract: A method of mounting electronic components on a circuit substrate using an electronic component mounting device. The electronic component mounting device is operatively associated with (1) a component-supply table which includes a displaceable table and a plurality of component-supply units on the displaceable table and (2) a table displacing device which displaces the displaceable table in a desired direction and which positions the component-supply portion of each component-supply unit at a predetermined component-supply position. The electric component mounting device includes a plurality of component holders which are positioned at a component received position opposed to the component supply position. The method includes causing the component holder to receive, at the component receive position, an electric component from the component-supply portion of each component-supply unit which is positioned at the component-supply position.

Abstract: A method of transferring of integrated circuit devices into and/or out of a plurality of underlying sockets having contacts and mounted to a board, comprising the steps of (A) disposing a socket presser block across at least some of the plurality of sockets, the presser block defining a matrix of cutouts and ribs and being configured to assume a first position in which the presser block is movable and a second position in which the matrix of cutouts is adapted to align with the sockets, (B) placing the presser block in the first position and moving the presser block so the cutouts are aligned with the sockets, and (C) placing the presser block in the second position and transferring the devices into and/or out of the sockets.

Abstract: An apparatus and method are provided that increases the efficiency of material handling apparatus, such as those used to trim and form electrical leads on solid state electrical devices. The apparatus includes a plurality of rotatable pulleys, an endless belt capable of retaining devices to be processed that is disposed around the pulleys such that rotation of the pulleys will cause said belt to travel around said pulleys, and a plurality of paired tooling members, each of said paired tooling members having first and second tooling members disposed on opposing sides of the belt and directly opposing so as to cooperate and perform a tooling operation on the leads when reciprocated toward each other along a common axis. In a preferred embodiment, two horizontally aligned pulleys with vertical axes of rotation are used to rotate the belt in a horizontal plane.

Abstract: In a cable processing equipment a cable changer stands perpendicularly relative to a base plate, at which a straightening unit and a cable transport unit are arranged. The cable changer is movable upwardly or downwardly and consists of a frame with horizontal frame members and vertical frame members. Cable guides are arranged at the vertical frame members. Cable guides which are at the inlet side as seen in cable transport direction are provided with clamping/retracting units, and cable guides at the outlet side are provided with clamping units. The clamping/retracting units at the inlet side are switchable by means of a first actuating device arranged at the base plate. The clamping units at the outlet side are switchable by means of a second actuating device arranged at the base plate. Cables which are not at the moment transported in the cable transport direction, are clamped by the clamping/retracting units and the clamping units.

Abstract: An apparatus for mounting one or more electric components on a circuit substrate, the apparatus including a nozzle moving device which moves a suction nozzle having an end surface that applies a suction to an electric component and thereby holds the component, in a direction intersecting an axis line of the suction nozzle, and an elevating and lowering device which elevates and lowers the suction nozzle so that the suction nozzle performs at least one of sucking and holding the electric component and mounting the component on the circuit substrate, the elevating and lowering device including a movable member, and a connecting device which connects the movable member to the suction nozzle such that the suction nozzle continues moving while the movable member continues moving, the connecting device including a downward-movement control device which changes, while the apparatus performs an electric-component mounting operation, at least one of a position of an end of a downward movement of the suction nozzle cau

Abstract: A device for aligning a PC board (2) on a manual press (50) for insertion of an electronic component (1) into an insertion zone (z). The device comprises a manually operated X-Y table, to which the PC-board (2) is secured. The X-Y table comprises an X carriage (40) movable along an X-axis and a Y carriage (11) movable along a Y-axis. Respective correction carriages (21,25) are movably mounted to each of the X and Y carriages. Respective correction carriages have corresponding correction motors for moving each of the correction carriages relative to the X and Y carriages. Encoders (17,18) are respectively connected to the X and Y carriages for detecting a position of the X and Y carriages. The encoders are connected to control units for operating correction motors of the correction carriages in response to a signal from the encoders indicating the position of the X and Y carriages.

Abstract: A reworking device (10) for removing an electrical element (20) mounted on a motherboard (40) comprises a body portion (12), a pair of hooks (14) formed at two opposite ends of the body portion for engaging with a bottom surface of the element, and an elastic arm (16) formed at each of the two opposite ends of the body portion to lift up the element-when solders are reflown.

Abstract: A flash circuit board in a lens-fitted photo film unit includes a board part, and a battery contact part connected to the board part by solder. A part exchanging apparatus for the circuit board includes an eliminating unit, which melts the solder, and removes the battery contact part from the board part while the solder is melted. An assembling unit mounts an unused battery contact part on the board part. The unused battery contact part has an unused form of the first battery contact part. A soldering unit connects the unused battery contact part to the board part by use of solder.

Abstract: A mounter head is provided for a surface mounting apparatus which is capable of easily controlling a pitch of a mounting device as well as preventing backlash when the device is mounted on a printed circuit board. The mounter head includes a rack block having a rack for moving up and down by means of a pinion rotated by a driving source; a nozzle shaft installed at one side of the moving unit; a nozzle secured to the lower end of the nozzle shaft for sucking a device to be mounted; and a driving source installed corresponding to each nozzle shaft for rotating each nozzle.

Abstract: A component mounter which picks up components from two or more tape feeders aligned in a component feeder carriage, and mounts them a board. Suction nozzles for vacuum-holding components are disposed on the transfer head at a predetermined basic pitch in the X direction (tape feeders alignment direction) to form a nozzle line. Two or more nozzle lines are aligned in the Y direction (perpendicular to the X direction). These suction nozzles pick up two or more components from the tape feeders simultaneously, enabling to reduce the space required for installing the mounter and making the mounter more compact. Increased feasibility of simultaneous pickup of several components also improves mounting efficiency.

Abstract: A component pick and place apparatus includes a housing including; a rotatable frame and a plurality of pick-up and place heads mounted on the frame. The pick-up and place heads are rotatable from a first position to at least a second position, and includes a spindle which is movable from a retracted position to an extended position. A first actuator moves the spindle at the first position from the retracted position to the extended position for picking up or placing the component; and a second actuator moves a spindle so that when a pick-up and place head is at the second position a spindle is moved from the retracted position to the extended position for ascertaining the position of the picked-up component. This apparatus eliminates positional errors of the pick-up and place head spindle as it moves from its retracted position to its extended position when the component is placed.

Abstract: The invention provides a method of forming an electrical contact device and a pre-assembly for producing the electrical contact device. The electrical contact device is formed by providing a conducting frame and an insulating frame which is added to predetermined portions of the conducting frame to form the pre-assembly. A plurality of fine pitch electrical leads are disposed in parallel spaced apart relation and connected to each other by connecting strips. An insulating material is applied to the conducting frame to form the insulating frame. The insulating frame encapsulates portions of the electrical leads which extend from opposite sides of the center of the insulating frame retaining, therefore, the electrical leads in position and electrically isolated from one another. Portions of the conducting frame are then removed from the pre-assembly to obtain the electrical device.

Abstract: The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

Abstract: A piezoelectric element is mounted to a clinch lever for detecting stress-strain generated therein when cutting and clinching leads of an electronic component that has been inserted in corresponding holes formed in a circuit board substrate. A detected voltage d is compared to a threshold voltage s selected from a plurality of threshold voltages preset in the device. When the detected voltage d exceeds the threshold voltage s, the insertion detecting section outputs a signal indicating that the insertion of the leads in the holes has been performed normally.

Abstract: The substrates can be transported on a top transporting section (5) to component-fitting locations (6) of the component-fitting apparatus (1). Conveying sections (13) for substrates (4) which are to be routed past the component-fitting locations (6) are arranged on a number of conveying levels beneath the transporting section (5). This reduces the structural outlay for the component-fitting apparatuses.

Abstract: A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.

Abstract: A planarizing heat sink plate having a top portion and a bottom portion is provided. The heat sink plate includes a plurality of receiving means formed therethrough and operable to receive a module ejection device, and at least one removing means formed therethrough and operable to receive a driving device. Also included is at least one planarizing projection formed on the bottom portion and adapted to receive a radiographic sensor module. The at least one removing means is disposed between the plurality of receiving means, and the at least one planarizing projection corresponds to the at least one removing means. The heat sink plate is a multi-functional device that can aid in forming an efficient radiographic detector head comprising a plurality of radiographic sensor modules in the same plane, safely removing the radiographic sensor modules, and conducting heat away from the radiographic sensor modules.

Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.

Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with a solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.

Abstract: Apparatus having a mandrel, and a ring having an aperture therein, the ring being slidable over the mandrel. A multilead electronic component having electric leads extending therefrom is positioned atop the mandrel. The ring is pressed over the mandrel, bending the electric leads downward. When the ring is retracted, springback forces within the bent electric leads forces them against the inside of the ring; and the multilead electronic component is retained therewithin. The ring is then used, either manually or robotically, to position the component proximate a printed-circuit board with the electric leads aligned with connection apertures in the printed-circuit board. The multilead electronic component is pressed toward the printed-circuit board, forcing the leads through the connection apertures; and the ring is withdrawn for subsequent use.

Abstract: A conveyor apparatus for conveying, for instance, dies, comprising: an X-axis moving block movable in an X-axis direction that is a lead frame conveying direction, a Y-axis moving block installed on the X-axis moving block and moved in a Y-axis direction that is perpendicular to the X-axis direction, a nozzle holder installed on the Y-axis moving block so as to be movable upward and downward, a Z-axis guide rail installed on the X-axis moving block and has an inclined part that rises from a die pick-up position side toward a die bonding position side, a Z-axis moving plate moved upward and downward along the Z-axis guide rail and is connected to the nozzle holder, and a suction chucking nozzle that holds the dies by vacuum suction and is installed so as to be moved upward and downward on the nozzle holder and together with the nozzle holder.

Abstract: A linear guide comprises a support element and a carriage sliding on the support element. The carriage has two hollow cylinders sliding on an air bearing on the support element and a body arranged between them. The support element and the two hollow cylinders of the carriage are separated by a gap to which compressed air can be applied. A linear motor formed from a u-shaped stator and an armature is foreseen as drive mechanism for the carriage. During operation, heat dissipation occurs in the armature which heats the carriage. In order to maintain changes in the thickness of the gap within predetermined limits, the support element and/or those parts of the carriage whose temperature influence the thickness of the gap are heated to a predetermined temperature.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: The present invention relates to a surface mounting apparatus installed with a tray feeder in which a mounter is, at its one side, installed with a tape reel feeder and is, at its other side, installed with a tray feeder so that various semiconductor device can be, easily and rapidly, supplied.

Abstract: An electronic device mounting apparatus prevents an error at the setup time prior to startup of the apparatus and enables mounting of proper electronic devices without a mistake. A cartridge and a lane of a cartridge mounting rack have a cartridge side connector (upper electrode portion, connection plug, lower electrode portion) and a lane side connector (fixed plug) which are electrically connected when the cartridge is installed on the lane. An error detecting circuit is formed by employing these connectors as part thereof. The error detecting circuit determines whether or not the installation position of the cartridge is appropriate depending on the conductive state or non-conductive state from a power supply to a warning buzzer when the connectors are connected.

Abstract: A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards.

Abstract: Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

Abstract: In a method of producing a microgripper including a grip finger 100 which has a coupling portion 100g that commonly owns one ends of three V-shaped edges 100v on an open end side, other ends of the V-shaped edges 100v being connected to a case 14, and in which the coupling portion 100g is connected to a moving portion of a translational driving section 12, and the coupling portion 100g is pulled on the basis of translational movement, whereby displacement amounts of the tip ends of the V-shaped edges 100v are inwardly magnified more than an amount of the translational movement, the method comprises the steps of: in a state where the grip finger 100 has three edge portions 101a in which the V-shaped edges 100v having the coupling portion 100g are developed in a substantially flat plane, outwardly bending the edge portions 101a at a substantially center; and inwardly bending the edge portions 101a at a vicinity of the coupling portion 100g.

Abstract: There is provided a production line having a plurality of mounting apparatus of electronic components in which the overall production efficiency is sustained by an alternation scheme when a mounting apparatus has a long cycle time due to a high malfunction rate. At a predetermined timing, the rate of unsuccessful pick-up procedure for an electronic component is compared to a predetermined value. If the rate is higher than the value, CPU finds out if the mounting apparatus 2, or 3 is available as an alternate. When the alternate is the apparatus 2, CPU 10 changes the command parameter of the particular mounting procedure, stored in RAM 12, from “M” to “S”, and stops mounting the same component. In the mean time, the mounting apparatus 2 accepts the alternate request from the apparatus 1, changes the command parameter as required, and mounts the same component on a print circuit board.

Abstract: An electronic unit manufacturing apparatus includes: a cream solder printer for printing cream solder on one side of a printed-circuit board; a chip placement machine for placing a plane-mounted part on the printed-circuit board on which the cream solder is printed; a first reflow furnace for fixedly securing the plane-mounted part to the printed-circuit board; a solder application machine for applying a larger amount of cream solder than that printed by the cream solder printer in the vicinity of holes made in the one side of the printed-circuit board; and a second reflow furnace for inserting pins of a deformed part into the holes made in the printed-circuit board from an opposite side thereof and fixedly securing the pins of the deformed part to the printed-circuit board, wherein in the second reflow furnace. In the second reflow furnace, temperature on the opposite side of the printed-circuit board is set lower than temperature on the one side thereof.

Abstract: The safety device includes an opening/closing cover which isolates a takeout part and an accommodating part of a component feeder unit from each other and which has a sensor for detecting a closed state. The component feeder unit includes the component accommodating part, a feed-out part and the takeout part, and sensors for transmission through voids common to the plurality of set component feeder units. Upon a detection by any one of the sensors during the operation of the machine, the machine is halted. For replacement of the component feeder units, a changeover switch is pressed, by which the detecting function is paused for a specified time period. Thus, a safety device which allows the component feeder units to be replaced even during the operation of the machine can be obtained.