Abstract: A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board.

Abstract: A terminal insertion machine (10) is disclosed that automatically actuates the insertion head (14) when the lower tooling (24) senses that the circuit board (26) is in proper alignment for receiving the tabs (166, 168) of the terminal (20). The lower tooling (24) includes a locating member (82) that senses the presents of two spaced holes (156, 158) in the circuit board (26) that are to receive tabs of the terminal and a rod (138) that senses the presence of the portion (162) of the circuit board (126) between the two holes (156, 158). A controller responds to a signal that the portion (162) of the circuit board is present and concurrently, that both holes (156, 158) are properly positioned. Upon receiving this signal the controller automatically actuates the insertion head (14) to insert the terminal 20 into the circuit board (26).

Abstract: A first printed board transferred from a prior process on an inlet conveyer is placed on a moving unit at a first switching position. The moving unit moves to a second switching position while mounting the first printed board with electronic components from a component feeding section. During this process, a second printed board stands by at the second switching position via the inlet conveyer, a transit path and an intermediate conveyer. At the second switching position, the second printed board is placed on the moving unit while shunting out the first printed board onto an outlet conveyer for transfer to a subsequent process. The moving unit moves to the first switching position while mounting the second printed board with the electronic components from the component feeding section.

Abstract: A component handling device that is adapted to provide determination of a component picked up by a pickup device by different recognition methods depending upon the size of the component picked up. One recognition method employs a light source and a receptor and is carried by the mounting head. The other device includes a fixed camera and the light source is carried either by the mounting head and/or fixed relative to the camera.

Abstract: An axial type electronic component inserting apparatus inserts into specified holes of a board an axial type electronic component having a pair of lead wires.

Abstract: The invention relates to a simple and economic optical system for mutually positioning SMD components having connecting leads and the corresponding pads on pad carrying members with the object of bringing the connecting leads and pads together in one plane through translation or rotation, of positioning them and fixing them. The optical system utilizes a beam splitter, so that it is possible to observe simultaneously with the human eye the spaces in front of and behind the beam splitter. For considerations of robustness the semi-transparent mirror used to this end is evaporated on a transparent substrate which has a finite thickness. A substrate having finite thickness leads to an apparent displacement of the space behind the substrate relative to the space in front of the substrate. The invention relates to the compensation of this displacement by the installation of a compensation plate having identical optical properties in the space over the semi-transparent mirror on the substrate.

Abstract: A pickup head 11 has a lower surface with absorbing holes 9 for picking up a plurality of soldering balls 1 from a soldering ball reservoir 15 by suction force of vacuum. Pickup head 11 mounts these soldering balls 1 on electrodes 5 formed on substrate 4 placed on a conveyor 8. Then, soldering balls 1 are transported below a camera 21. Camera 21 monitors the upper surface of substrate 4 to check whether each of electrodes 5 mounts a soldering ball 1. An absorbing head 31 mounts a supplemental soldering ball 1 on a faulty electrode 5 which lacks a soldering ball 1 to be mounted thereon when this faulty electrode 5 is detected by camera 21. After all of electrodes 5 mount soldering balls 1, substrate 4 is sent by conveyor 8 to a furnace 40 where each soldering ball 1 is heated and melted to form soldering bumps 1' on electrodes 5.

Abstract: There is disclosed an automatic electronic part-mounting apparatus in which acceleration, acting on electronic parts, suction-held respectively by mounting heads, is reduced, thereby enabling stable mounting of the electronic parts. Cam levers 10 are pivotally mounted through respective pivot shafts 9 on a rotary member 8 which is rotated at a constant speed by a roller gear cam 19. One end of the cam lever is engaged with a fixed cam 7 whereas the other end thereof is slidably mounted through cam followers on a follower lever 12 slidably mounted on annular rails 11 in a housing 6. One end of the follower lever 12 is slidably engaged with a cam follower, and the other end of the follower lever 12 is mounted on each mounting head 13. With this construction, the acceleration of the mounting head 13 can be reduced.

Abstract: A PC board is placed at a specified position by means of a positioning device, and an electronic component to be affixed to a side of the PC board is supplied to a parts holding device by means of a carrying head. The parts holding device holds the electronic component with terminal leads of the electronic component facing to a side of the PC board, and the parts holding device is moved towards the PC board to affix the terminal leads of the electronic component to the side of PC board. Thus, terminals of the electronic component such as connector, for example, may be automatically mounted to a side of a PC board.

Abstract: An electronic-component mounting system including supporting devices each of which supports and positions an object and is movable along a reference line, mounting units which are arranged along the reference line and each of which includes a mounting device which mounts an electronic component (EC) on the object, and a moving device which moves the mounting device in a three-dimensional space, each mounting unit having a mounting area in which the mounting device mounts the EC on the object, a feeding device which feeds the supporting devices along the reference line from the mounting area of a most upstream mounting unit to the mounting area of a most downstream mounting unit, a positioning error detector which detects an error of positioning of the object with respect to each supporting device located in a waiting area where each supporting device waits for being fed by the feeding device, and a control device which controls each mounting unit so that the mounting device of each mounting unit mounts the EC

Abstract: A work mounting apparatus comprises a nozzle head which repeatedly makes cycloid motion as a drum rotates while being held in a fixed orientation, a suction nozzle projecting downward from the nozzle head for receiving and mounting a work, and a liquid damper-type balancer for the nozzle head. The balancer contains a movable weight which relatively vibrates so as to cancel out vibration of the nozzle head.

Abstract: A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Abstract: An electronic parts-mounting apparatus includes an index unit which has an output shaft and is connected to a reduction gear for being driven thereby. A rotatable table is connected to the index unit and driven thereby into intermittent rotation. At least one camshaft is connected to the output shaft of the index unit. At least one cam rigidly mounted on the at least one camshaft is in contact with at least one cam follower associated therewith. The output shaft of the index unit is caused to rotate at a uniform rotational speed in which one rotation thereof corresponds to a plurality of repetition periods of intermittent rotation of the rotatable table.

Abstract: A press apparatus is described for forcefully pressing a connector (14, FIG. 1) against a circuit board (12) to press projections (34) of the connector into circuit board holes (22), which minimizes set up time. The press includes a pair of platforms (60, 62, FIG. 2) on which a circuit board with a connector thereon is laid, an upper tooling arrangement (102) mounted on a ram, and a lower tooling arrangement (100) mounted on a stationary base (78). When the ram is lowered, it causes the circuit board and the connector thereon to move down against the lower tooling arrangement, and then seat the connector. The force of the ram is transmitted through the connector and circuit board to the lower tooling arrangement, so in many cases the stroke of the ram does not have to be adjusted for the thickness of the particular circuit board or connector.

Abstract: A mounting apparatus mounts electronic parts on a substrate. The mounting apparatus includes an electronic part feeder having a moving table which moves along a moving path. The moving table moves a part cassette accommodating electronic parts to a pick up station. A transferring and mounting unit having a transferring and mounting head is also provided to move between the pick up station and the mounting station to retrieve the electronic part from a part pick up port of the part cassette at the pick up station. The transferring and mounting head has a nozzle for picking up an electronic part. The transferring and mounting head rotates the nozzle along a circular path. The moving path and the circular path intersect at two points at the pick up station. The pick up port of the part cassette is positioned at one of the intersecting points.

Abstract: An IC mounting tool including a substantially arched spring plate having two opposite ends bilaterally horizontally extended outwards and formed into two opposite horizontal bearing sections and then into two opposite vertical tip sections, and two movable pawls inserted through the in vertical sliding slots of the vertical tip sections, wherein when the IC mounting tool is used to install an IC in an IC connector, the movable pawls are forced upwards to receive the keys thereof in respective slots of the horizontal bearing sections; when the IC mounting tool is used to remove an IC from an IC connector, the key of each movable pawl is extended out of the respective vertical tip section and clamped on the bottom side of the IC permitting the IC to be removed out of the IC connector when the IC mounting tool is pulled upwards.

Abstract: An apparatus for automatically removing electronic components mounted on printed circuit boards has a lighting device for illuminating the printed circuit boards, an optical sensor, an image processing systems and various devices for removing the electronic components therefrom. The image processing system recognizes the coordinates of the contours and, preferably, also the types of components from the output signals supplied by the optical sensor and controls the device for removing the electronic components. Alternatively, the contours of the electronic components are recognized by infrared radiation. Additionally, a process is disclosed for removing the electronic components from printed circuit boards using the disclosed apparatus.

Abstract: A system for manufacturing a hybrid integrated circuit by mounting an IC and a chip component on a circuit substrate. The system comprises a bar code reader for reading the characteristic data of each IC shown previously thereon to indicate the characteristic thereof, and a selector for selecting an optimal chip component in accordance with the read characteristic of the IC, thereby achieving manufacture of a satisfactory hybrid integrated circuit having predetermined performance.

Abstract: In order that an air-core coil is sucked by a nozzle with its terminals being horizontal, the terminals of the air-core coil are brought into contact with horizontal regulating surface at the time of the suction or after the suction. The lower end surface of the nozzle is formed to be horizontal to serve as a regulating surface, and the upper surfaces of the terminals are brought into contact therewith. Alternatively, the upper surfaces or the undersurfaces of separately provided regulating plates serve as the regulating surfaces, and the undersurfaces of the upper surfaces of the terminals are brought into contact therewith.

Abstract: A system for manufacturing a hybrid integrated circuit by mounting an IC and a chip component on a circuit substrate. The system comprises a bar code reader for reading the characteristic data of each IC shown previously thereon to indicate the characteristic thereof, and a selector for selecting an optimal chip component in accordance with the read characteristic of the IC, thereby achieving manufacture of a satisfactory hybrid integrated circuit having predetermined performance.

Abstract: A circuit board is conveyed from a conveyor of a previous station to a conveying mechanism of a component-mounting station where components are applied to the circuit board. Then, the circuit board is delivered to a conveyor of a subsequent station. The conveying mechanism of the component-mounting station comprises a feed conveyor, an incoming conveyor disposed at one end of the feed conveyor, and an outgoing conveyor disposed at an opposite end of the feed conveyor. The incoming conveyor is laterally adjustable to become aligned with the conveyor of the previous station for receiving a circuit board therefrom, and then shift the circuit board laterally into alignment with the feed conveyor. The outgoing conveyor is likewise laterally adjustable to receive the circuit board from the feed conveyor and then shift the circuit board laterally into alignment with the conveyor of the subsequent station.

Abstract: A lifting mechanism is arranged between a cartridge main body and a reel support member. With the cartridge main body set in a parts mounter, the lifting mechanism allows the reel support member to be supported by the cartridge main body so that the reel support member can be pivoted upward at a predetermined pivoting angle (set position PA.fwdarw.bar code read position PB). While cartridges are kept placed in the parts mounter, a parts supply reel attached to a given cartridge is made to project from other reels. This enables a bar code reader to read the parts code of a label adhered on one side surface of that reel.

Abstract: An apparatus for rapidly and automatically handling packaged integrated circuits (ICs) during the loading or unloading of burn-in boards. The apparatus also segregates and offloads packaged ICs into a plurality of reservoirs for controlled delivery into suitable transport media on the basis of the level of functionality attained by each part during the burn-in process. The apparatus is computer controlled, with operator interface and an electronic control panel. The apparatus employs a linear induction motor drive system to rapidly, precisely and accurately move the ICs both between a loading/unloading location and a staging location, and at the staging location itself during the segregation and offloading steps. The system may be extended to operate in either the single or dual mode, employing two sorting and offloading components to unload a single device under test board.

Abstract: The present connector press-fitting apparatus comprises a press-fitting head, a press-fitting block, a cylinder, a positional detector, a pin detector, and a controller. The press-fitting head comes into contact with the connector, and attaches to and detaches from this connector. The press-fitting block supports the press-fitting head elastically. The cylinder is capable of moving the press-fitting block freely in a vertical direction, lowers the press-fitting block, and press-fits pins of the connector into a printed board which is arranged at a press-fitting position. The positional detector detects the displacement of the press-fitting head. The pin detector detects at least one pin lead end part projecting below the printed board in accordance with the press-fitting operation of the connector by means of the cylinder.

Abstract: Disclosed is apparatus for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During the production phase the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board.

Abstract: In an apparatus for mounting electronic components, punched out from film carriers to a substrate, there is disclosed an upper die for punching the electronic components through a hole formed in a lower die. A take out nozzle is located under the through hole for sucking the punched out electronic component from the hole in the lower die. A transfer nozzle is provided for receiving the electronic component from the take out nozzle and for transmitting the electronic component to a substrate mounted on a movable table. Before any leadwires of the component are bonded to the electrodes of the substrate, the table is finely positioned to property align the leadwires and the electrodes.

Abstract: A connector press-fitting apparatus for press-fitting a connector to a printed board has a storing mechanism for storing connectors; a positioning mechanism for maintaining, moving, and positioning a printed board; a press-fitting head having a surface with a channel opening facing a surface of the printed board and mounted to be accessible to and separable from the printed board maintained by the positioning mechanism; a head moving mechanism for moving the press-fitting head in relative to the printed board; a pressure-reducing mechanism for affixing a connector to the press-fitting head by reducing pressure of the above channel of the press-fitting head; a transporting portion for transporting connectors from the storing mechanism and delivering these connectors to the press-fitting head; and a pressure-receiving portion for supporting the printed board from a reverse face thereof at the time of press-fitting a connector to the printed board by the press-fitting mechanism.

Abstract: A carrier on a circuit board has inclined side planes canted at a predefined angle and a ledge. Flat components are placed on the carrier to rest on the inclined planes and the ledges and leads extending through holes in the circuit board. To correct the positions of misplaced components a guide having lower inner faces inclined at the same predefined angle is placed over the components, and a lift tool momentarily pushes up on the leads to position the components above the ledges so that when the lift tool is removed the guide will bias the components down against the ledges and the side planes.

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract: A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation.

Abstract: An automated pick-and-place apparatus for assembling a printed circuit board includes a housing portion for housing a plurality of electronic component dispensing mechanisms. A packaging portion is included in which selected component dispensing units are placed from which components are individually picked by a mounting device and mounted on the printed circuit board in predetermined locations. Each of the component dispensing units is provided with a data storage unit for reading and writing type and quantity information concerning the respective electronic components. A production manager determines the types and quantities of electronic components needed for production of a variety of printed circuit boards and generates a production schedule depending upon the type of board to be assembled. A control device controls operation of the mounting device, read write means and transfer means for controlling assembly of the printed circuit board in accordance with the production manager.

Abstract: A machine (50) is disclosed that assembles an electrical connector (10) to the edge (18) of a printed circuit board (12). The machine incorporates an actuating mechanism that requires only a single input motion to achieve a Variety of functional motions within the machine. The machine includes a carriage assembly (54) that moves substantially vertically within the frame of the machine to sense the thickness of the circuit board and then to align the centerline of the connector held on fixture (280) with the exact center plane (44) of the board. A slide member (140) then moves toward the connector, causing a pair of comb members (252, 254) to close into position in front of the moving connector. The solder tails (38,40) of the connector (10) then enter spaced slots (260) in the edges of the comb members for support and the connector housing engages the face (272) of the combs, pushing them toward the circuit board.

Abstract: An apparatus for removing an electronic device from a printed circuit board includes a board support for supporting the printed circuit board with the first main surface thereof directed upwardly and for vertically moving the printed circuit board; a lower heating device for applying heat from the second main surface side of the printed circuit board; an upper heating device for applying heat from the first main surface side of the printed circuit board; a withdrawal device disposed on the first main surface side of the printed circuit board for applying a force to withdraw the electronic device from the printed circuit board, the withdrawal device detecting the withdrawal of the electronic device; and a solder elimination device disposed on the first main surface side of the printed circuit board, the solder elimination device comprising a hood for covering that portion of the printed circuit board where the electronic device is mounted, and a pressure control device for increasing or decreasing a pressure w

Abstract: An apparatus for press-fitting a connector to a printed circuit board, comprising a magazine for accommodating a plurality of connectors (1) for the printed circuit board (8), the connectors (1) having a plurality of pins (1A) each with an outer diameter of an end portion (14) smaller than an outer diameter of an intermediate portion (11); a first transport mechanism (3) for moving a chuck (3A) used to releasably hold a connector (1); an alignment block (4) having alignment apertures (4A) each with a tapered entrance thereto and a diameter larger than the outer diameter of the end portion (14) and smaller than the outer diameter of the intermediate portion (11), provided so as to correspond to the locations of the pins (1A) of the connector (1); a second transport mechanism (5) for moving the alignment block (4) in a horizontal direction; a press head (6) for releasably holding the connector (1); a press (7) for moving the press head (6) in a vertical direction so as to press-fit a connector (1) attached ther

Abstract: A method of manufacturing a guide plate for use in a chip carrier socket or other electrical connector provides the precision required for close-center line spacing while minimizing the cost associated with production. A block of ceramic or the like is ground to the precise outside dimensions required. Grooves are then cut in the block of ceramic, and the ceramic is then sliced into respective guide plates. The guide plates are inserted into openings provided in the electrical connector an retained therein. The grooves are dimensioned to cooperate with contact pins of the electrical connector to precisely maintain the pins in position, whereby when a chip is positioned in the electrical connector, the pins will be in position to make an electrical connection with the pads of the chip.

Abstract: A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.

Abstract: Tool inserting an electronic component such as a microprocessor or other integrated circuit into and removing the same from a socket on a circuit board or the like. The tool has a reversible presser foot slidably mounted between a pair of side plates and adapted to be driven by a drive screw. The presser foot has a drive surface on one side thereof for engagement with an upper drive surface of the component and a pair of feet on an opposite side thereof for engagement with an upper surface of the circuit board. Hooks at the lower ends of the side plates are selectively engagable with either an under surface of the socket or an under surface of the component.

Abstract: The invention relates to mounting components having angled terminals, in particular connectors, on a printed circuit card. The mounting apparatus comprises a guide part for guiding the ends of the angled terminals. This part is in the form of a comb having teeth that delimit slots through which the terminals pass. The teeth are provided with orifices in alignment along a Y direction perpendicular to the X direction of the teeth. The orifices are designed to receive rods on a temporary basis.

Abstract: An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device supply section, means for driving the transfer head assembly in a predetermined direction, a first monitoring camera for checking the devices picked up by the transfer head assembly for its positional exactness, a substrate driving means for moving the substrate in a predetermined direction, and a second monitoring camera for checking the electrodes of the substrate for their positional exactness.

Abstract: First and second aligning portions each having a plurality of parallel downwardly sloped grooves, are inclinedly arranged to communicate with a chip box containing a plurality of chip parts at random. The chip box and the first aligning portion are supplied with vibration, to serially align the chip parts in the grooves of the first aligning portion. The chip parts are then received in the grooves of the second aligning portion. The first of the chip parts thus received in the second aligning portion are received in a plurality of receiving cavities provided in a separable portion respectively, so that the chip parts received in the receiving cavities are simultaneously discharged by a suction chuck.

Abstract: A cutting and forming device of a lead frame of a resin molded semi-finished semiconductor device makes use of a press mechanism having a speed deceleration function in the vicinity of a bottom dead point of a press ram. The device includes an upper die base and a lower die base, a stripper frame, a die, a feeder for lead frames, and a machine base. The feeder is mounted over the lower die base and fixed to the machine base. In order to reduce impact noise when the stripper frame and the feeder abut with each other, there is provided an air cylinder mounted on the machine base and a cam follower plate fixed to an underside of the lower die base as well as a cam plate slidably mounted on the machine base for horizontal movement by the air cylinder which is driven by a driving mechanism independent from that for the press ram. In an alternative arrangement, the air cylinder may be fixed to the lower die base and carry the feeder in such a way as to allow the feeder to move up and down through the air cylinder.

Abstract: A press for assembling an electrical connector (C) having tines (T) projecting therefrom, to a printed circuit board (PCB), comprises a press ram (40) which is pivotally mounted to the top of the forward end of a press frame (16). A ram (40) has, at its forward end, a connector holder (54) for receiving a connector (C) with the tines (T) of the connector (C) projecting from the holder (54). A ram (40) has a raised, connector loading position, in which the connector holder (54) projects obliquely downwardly towards the operator so that the operator can easily load the connector (C), which may be of microminiature size, into the holder (54). The ram (40) has a drive unit (36) for driving it from its loading position into a vertical position, in which the holder (54) projects towards a printed circuit board (PCB) on a support structure (14).

Abstract: A tape automated bonding feeder apparatus employs a vertical carrier extraction unit to successively supply electronic circuit components to an output station from which a component is seized for placement and attachment to a circuit board. The feeder apparatus, which may be mounted on a rollable cart, includes a generally rectilinear housing on a top plate of which one or more magazines are mounted. A magazine contains a stack of circuit component carriers. The bottom of the magazine has a carrier extraction unit which controllably allows an individual component carrier at the bottom of the stack to drop away onto an underlying carrier shuttle. The carrier shuttle is supported for movement between the magazine and a lead forming unit. The lead forming unit detaches a component from the carrier and forms the leads of the excised component for mounting the component to a circuit board.

Abstract: A work mounting apparatus or component mounting apparatus according to the present invention comprises a lower drum of a rotating drum, a head unit arranged on the outer periphery of the lower drum, a circular work head or component head attached to the head unit, and a suction nozzle protruding from the outer peripheral surface of the work head toward a workbench. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work or component, such as an electronic component from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench.

Abstract: An apparatus for inserting and extracting an integrated circuit package (IC) of the type having pins from terminals of a socket installed on a circuit board. The apparatus includes a package support member positioned between the package and socket, a cover attached over the package, and a socket support member between the socket and the circuit board to support the socket. The package support member has thru-holes to permit the package pins to extend through the member and engage terminals installed in the socket. The apparatus further includes an insertion/extraction member coupled to the package support member.

Abstract: A reusable transport and test tape which includes a plurality of insulated conductors adapted to receive and connect to the leads of the lead pack and to position the lead pack for reception of an integrated circuit for bonding of lead pack leads to the contact pads of the integrated circuit and to move the lead pack and integrated circuit into succeeding processing stations where the circuit is tested and packaged.

Abstract: A work or component mounting apparatus according to the present invention comprises a rotating drum arranged above a workbench and divided into upper and lower drums, a head unit detachably mounted to the lower drum of the rotating drum, a circular work head (or, in other words, a component head) attached to the head unit, a suction nozzle protruding from the outer peripheral surface of the work head toward the workbench, and a controller housed in the upper drum of the rotating drum for controlling the turning motion of the work head and the supply of suction pressure to the suction nozzle. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench.

Abstract: The inventive apparatus is to provide rapid, automatic separation, classification and operator assisted dispensation of integrated circuit assemblies from burn-in and device under test boards to which they are attached. The apparatus is computer controlled, with an electronic control panel, and is assembled to differentiate between and separate physically acceptable and unacceptable integrated circuit assemblies and deliver, by means of a suitable reservoir, the acceptable assemblies to appropriate carrier tubes for further processing or shipping. The system uses an indexing table to move an inverted device under test board across an array of assembly extraction fingers which remove attached integrated circuit assemblies from the sockets of the test board and drop them into a reservoir. The reservoir is slotted to receive the individual assemblies and dispense them into carrier tubes.

Abstract: An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a head portion for suctioning the component thereto and mounting the component on the board, an XY-robot for placing the head portion at an arbitrary position, a suction device for suctioning the component thereto, arranged at the head portion and vertically moving with respect to the head portion, and having a function of placing the component in a rotational direction thereof, a recognizing camera for recognizing the component and measuring an error amount of a position of the component before and after correction of the position of the component, and a controller for controlling the head portion, the XY-robot, and the camera.

Abstract: A method and apparatus is provided which allows simultaneous placement of electrical components on to a printed circuit board (PCB). Further, verification of the proper placement of these components on the PCB is provided such that an operator can immediately replace any components having pins which are bent, deformed, or the like. A press is included with moveable platens which receive a product specific assembly that is used in the manufacture of a particular type of PCB. For example, a PCB may require a number of electrical components, such as card connectors to be affixed thereto. This product specific assembly includes a top plate, pressure bar, which contacts the component being pressed into place, and an intermediate spring. A bottom plate is provided and includes a test block assembly. The test block serves to support the PCB receiving the electrical component and verifies the presence of each pin of the component in its respective via.