Means To Align And Advance Work Part Patents (Class 29/759)
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Patent number: 6792675Abstract: The present invention relates to an apparatus that proactively ensures alignment (parallelism) of the connectors on the circuit board during the solder assembly of the connectors to the circuit board. The apparatus includes an alignment fixture that has been specifically designed to ensure parallelism of straddle-mounted connectors during the solder reflow assembly process. The fixture has connector slots and a circuit board slot. The slots help to detect whether the connectors meet the X- and Y-axis alignment requirements after the insertion process (after the connectors have been placed onto the circuit board). That is, if the X- and Y-axis alignment specifications are met, the circuit board with its attached connectors can be completely fitted into the slots of the alignment fixture.Type: GrantFiled: January 15, 2002Date of Patent: September 21, 2004Assignee: Sun Microsystems, Inc.Inventor: Camnhung T. Tran
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Patent number: 6792676Abstract: An electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. A parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera are performed concurrently. Thereby, the number of electronic parts per mount turn can be increased, the tact time can be shortened, and the electronic parts can be efficiently taken out and mounted on the board.Type: GrantFiled: August 6, 2002Date of Patent: September 21, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Haji, Wataru Hidese
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Patent number: 6748648Abstract: In a component placement machine, a placement head (4) is driven by a linear motor (5). The stationary part (7) of the motor is attached to the machine frame (1) on which a PCB (8) is attached. The movable part (6) of the motor is connected to a slide (2) on which the placement head (4) is attached. During driving the placement bead, reactive forces of the motor generate vibrations in the stationary part (7) of the motor and thus in the machine frame (20). This causes inaccuracies during the placement of components (9) on the PCB (8). To diminish this problem, the reactive forces are intercepted in a separate force frame (10) which is dynamically disconnected from the machine frame (1).Type: GrantFiled: July 6, 2001Date of Patent: June 15, 2004Assignee: Koninklijke Philips Electronics N.V.Inventor: Johannes Hubertus Antonius Van De Rijdt
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Patent number: 6748649Abstract: A holding head includes an axially driveable shaft having a nozzle at one end of the shaft for holding a component, a motor for driving the shaft in an axial direction in response to power supplied to the motor, and a detecting device for detecting movement of the shall in the axial direction. A method of operating the component holding head comprises using the detecting device to detect movement of the shaft in the axial direction resulting from the shaft being driven by the motor, and controlling power supplied to the motor in response to the movement of the shaft as detected by the detecting device such that the distance that the shaft is driven by the motor in the axial direction is controlled.Type: GrantFiled: December 21, 2001Date of Patent: June 15, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Akira Kabeshita, Satoshi Shida, Makoto Sueki
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Patent number: 6739043Abstract: An electronic component taken out from a component storage section by a transfer head is held by suction, transferred and inspected as to whether it is good or defective by a good/defective component inspecting device. Thereafter, the electronic component is delivered to an alignment suction nozzle on a component alignment section. The sequence of the above-operations is then repeated, whereby the electronic components inspected and then aligned in the order of mounting can be supplied to a mounting head. Therefore, a mount time for the electronic components in a mount process is greatly shortened, so that productivity is expected to be improved. The electronic components can also be inspected before being aligned in the order of mounting, which further enhances mount efficiency.Type: GrantFiled: August 16, 2002Date of Patent: May 25, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Tokio Shirakawa
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Patent number: 6733912Abstract: A first fixture of a transportable fixture apparatus incorporates a substantially porous first region adapted to receive one or more porous and/or non-porous first material layers, such as fuel cell layers, and to facilitate formation of a vacuum between the first fixture and the first material layers. A second fixture incorporates a substantially porous second region adapted to receive one or more porous and/or non-porous second material layers and to facilitate formation of a vacuum between the second fixture and the second material layers. A stop arrangement protrudes from one or both of the first and second fixtures, and is situated peripheral to the first and second material layers when the first and second fixtures are brought into contact. The stop arrangement defines a cavity adapted to effect compression of the first and second material layers when the first and second fixtures are brought into contact.Type: GrantFiled: April 3, 2002Date of Patent: May 11, 2004Assignee: 3M Innovative Properties CompanyInventor: John Russell Mlinar
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Patent number: 6722027Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member. The support is readily compressed to allow placement into or onto a space defined by surfaces of a positioning device, and the support expands upon its release to fill the space. When the support is left in the positioning device during a change over to a different circuit board, the support will automatically adjust to any width-wise adjustment in the space between the surfaces of the positioning device.Type: GrantFiled: February 7, 2001Date of Patent: April 20, 2004Assignee: Micron Technology, Inc.Inventors: Mark V. Peckham, Tony Teitenberg
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Patent number: 6718627Abstract: The present invention discloses a back-up plate up/down apparatus in which a back-up plate is ascended or descended without rocking, maintaining a parallel state. The back-up plate up/down apparatus includes a base plate; guide blocks installed with a constant distance to the base plate; a first driving cylinder installed between the guide blocks; fixed blocks installed with a constant distance to both ends of the base plate and having rotating shafts inserted to both ends thereof; rotating links, in which the rotating shaft is inserted to an end thereof and a connecting member is connected to the other end thereof; a second driving cylinder connected to the connecting members by means of a rod; holders fixed at rods of other connecting members slidably and for fixing the back-up plate; and sensors installed to the holders with a constant distance.Type: GrantFiled: November 19, 2002Date of Patent: April 13, 2004Assignee: Mirae CorporationInventor: Hyo Won Kim
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Patent number: 6698091Abstract: A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane.Type: GrantFiled: December 29, 2000Date of Patent: March 2, 2004Assignee: Cisco Technology, Inc.Inventors: Matthew L. Heston, James T. Theodoras, II
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Patent number: 6691401Abstract: A device for mounting components using mounting heads having a plurality of suction nozzles that provide a plurality of component pickups, positions or mounting operating positions. The mounting heads are positioned on a rotating table that is cooperatively positioned adjacent a component supply table having a plurality of component feeder members. The control unit can rotate the rotating table to position a mounting head at a component supply position and further position one of the plurality of suction nozzles to a first, second and third section operating position for picking up a component from a component feeder. The relative movement of the component supply table and the positioning of first and second suction operating positions relative to our reference point where the edge of the rotating table contacts the line of movement of the component supply table can increase the pickup speed of components.Type: GrantFiled: January 25, 2001Date of Patent: February 17, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kanji Hata, Shiro Oji, Shigetoshi Negishi, Makito Seno
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Patent number: 6691400Abstract: A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction.Type: GrantFiled: December 6, 1996Date of Patent: February 17, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shigetoshi Negishi, Takeshi Nishiguchi, Mikio Yasuda, Takashi Munezane, Manabu Morioka, Takayoshi Kado, Takaharu Fuji, Noboru Furuta
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Patent number: 6687981Abstract: An apparatus is provided to assist a user in aligning and sizing a plurality of spaced-apart channels to be formed in a cleat connected to a power generator housing so as to secure a plurality of leads extending from a power generator through the housing. The apparatus includes a main member to which secondary members removably and movingly connect to align with the leads. Channel sizers connect to the secondary members to register the diameter of each lead. The apparatus first aligns with and registers the diameter of each lead and is then positioned adjacent the housing to assist the user in correctly spacing and forming holes in a support structure such as a cleat. Related methods are also provided for aligning and sizing channels to be formed in a cleat or other support structure to secure the leads extending from the power generator through the housing.Type: GrantFiled: August 14, 2001Date of Patent: February 10, 2004Assignee: Siemens Westinghouse Power CorporationInventor: Michael D. Hook
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Patent number: 6681480Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: GrantFiled: February 26, 1999Date of Patent: January 27, 2004Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
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Patent number: 6643921Abstract: A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.Type: GrantFiled: June 5, 2001Date of Patent: November 11, 2003Assignee: Fuji Machine Mfg. Co., Ltd.Inventors: Koichi Asai, Seigo Kodama, Shinsuke Suhara
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Patent number: 6643907Abstract: In a medium fixing method of fixing one or a plurality of mediums on a shaft while the one or plurality of mediums each having a circular opening portion in a substantially center are stacked and the shaft is inserted into the opening portions, the mediums are fixed to the shaft while the mediums into which the shaft is inserted are guided with a fluid.Type: GrantFiled: February 12, 2003Date of Patent: November 11, 2003Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Hagiwara, Hiroshi Watanabe, Shojiro Yamazaki
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Patent number: 6640423Abstract: An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.Type: GrantFiled: July 18, 2000Date of Patent: November 4, 2003Assignee: Endwave CorporationInventors: Edwin F. Johnson, Gerd R. Ley, Douglas G. Lockie, Clifford A. Mohwinkel
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Patent number: 6640431Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.Type: GrantFiled: February 10, 2000Date of Patent: November 4, 2003Assignee: Fuji Machine Mfg. Co., Ltd.Inventors: Minoru Yoriki, Mitsuo Imai, Jiro Kodama, Kimihiko Yasuda
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Patent number: 6625856Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. A plurality of leads end portions are inserted into a plurality of lead holes of an alignment jig. A backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.Type: GrantFiled: July 25, 2001Date of Patent: September 30, 2003Assignee: Kabushiki Kaisha ToshibaInventor: Satoru Tezuka
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Patent number: 6612026Abstract: A process and system for mounting terminals with electric wires in cavities of connector housings. Press-connecting terminals are initially loaded in cavities arranged in an upper surface of a connector jig and electric wires are press-connected on the terminals in the jigs. Then, the terminals with electric wires are transferred from the connector jig to cavities arranged in a lower surface of a inserting jig by pins arranged to contact and push the terminals from below in the transfer direction. Then, the terminals are loaded from the inserting jig to cavities of connector housings from the back by blades arranged to contact and push the terminals from one end in the inserting directing.Type: GrantFiled: February 25, 2000Date of Patent: September 2, 2003Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Koji Fujita, Yoshinobu Ota, Junichi Shirakawa, Kenji Hashimoto
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Patent number: 6594887Abstract: A component installing device comprises: a tray component supply section (8) having a plurality of conjointly provided tray component supply mechanisms (7) for moving selected trays (4) from a storage position (5) to a component supply position (6), according to need, thereby providing the components (2) accommodated therein for use; and a cassette component supply section (13) having a plurality of mutually aligned component supply cassettes (12) for carrying components in a tape cassette or a bulk cassette, and transporting said components to a component supply position (11), one at a time, thereby providing said components for use.Type: GrantFiled: May 10, 2000Date of Patent: July 22, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Akira Kabeshita, Naoyuki Kitamura, Yoshihiro Yoshida, Mamoru Inoue, Kazuo Mori
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Patent number: 6584670Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with a solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.Type: GrantFiled: May 16, 2001Date of Patent: July 1, 2003Inventor: Larry J. Costa
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Patent number: 6578257Abstract: A media rework tool for discs and/or a spindle motor carrying a disc pack is disclosed that has a slider plate mounted on a base for lateral movement between a retracted position and an extended position. The slider plate holds a spindle motor with a disc pack mounted on it, and moves between the two positions. The tool includes a gripper assembly having a plurality of opposing arms for grasping predetermined discs within a disc pack on the spindle motor when the slider plate is in the retracted position. The gripper assembly raises the predetermined discs and any intermediate spacer rings upward for temporary storage on a media guide to allow the remainder of the disc pack to be reworked, such as for replacement of a defective disc or spindle motor when the slider plate is laterally moved to the extended position. Following reworking of the remainder of the disc pack, the spindle motor is returned to its centered position relative to the media guide and the gripper assembly.Type: GrantFiled: December 30, 1999Date of Patent: June 17, 2003Assignee: Seagate Technology LLCInventor: Keng Meng Albert Wang
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Patent number: 6568069Abstract: An apparatus for assembling components on printed circuit boards has a central region having two linear guides proceeding parallel in close proximity to one another, and carriages being displaceable on these guides. Each of the carriages has a transverse beam projecting outwardly therefrom, on which a processing head is movable, and the beams of the carriages on one side of the longitudinal guides extend in an opposite direction to the beams of the other side. The two separate processing locations are provided independently served by one or the other of the carriages. Thus, a high processing capacity is obtained.Type: GrantFiled: February 24, 1997Date of Patent: May 27, 2003Assignee: Siemens AktiengesellschaftInventors: Johann Melf, Hugo Goller
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Patent number: 6557234Abstract: In a medium fixing method of fixing one or a plurality of mediums on a shaft while the one or plurality of mediums each having a circular opening portion in a substantially center are stacked and the shaft is inserted into the opening portions, the mediums are fixed to the shaft while the mediums into which the shaft is inserted are guided with a fluid.Type: GrantFiled: September 25, 2000Date of Patent: May 6, 2003Assignee: Canon Kabushiki KaishaInventors: Hiroyuki Hagiwara, Hiroshi Watanabe, Shojiro Yamazaki
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Patent number: 6557246Abstract: A part mounting system requires a relatively small floor space for installation. A bonding apparatus (50) includes a temporary-bonding unit (51) that bonds a plurality of FPCs to which ACFs are attached, respectively, successively to a glass substrate positioned by an aligning apparatus (40), and a permanent-bonding unit (52) that bonds the plurality of FPCs temporarily bonded to the glass substrate simultaneously by heating. Each of the temporary-bonding unit (51) and the permanent-bonding unit (52) has a pair of pressing devices respectively for pressing the glass substrate and the FPC from above and from below the glass substrate. Each pressing device is capable of selectively applying either a bonding pressure or a backup pressure to the glass substrate and the electronic part.Type: GrantFiled: July 30, 2001Date of Patent: May 6, 2003Assignee: Shibaura Mechatronics CorporationInventor: Shinichi Ogimoto
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Patent number: 6550134Abstract: An electric-component transferring apparatus including a component holder which holds an electric component, a shaft member whose lower end portion supports the component holder, a movable member having a support hole which supports the shaft member such that the shaft member is rotatable about an axis line relative to the movable member and is movable relative to the movable member in an axial direction parallel to the axis line, a moving device which moves the movable member in a direction intersecting the axis line of the shaft member, a piston which is supported by the shaft member such that the piston is not movable relative to the shaft member in the axial direction of the shaft member, the support hole including a portion defining a cylinder bore which cooperates with the piston to provide an air-pressure-operated cylinder device, a driven wheel which is substantially integral with the shaft member, and a drive wheel which is supported by the movable member such that the drive wheel is meshed with theType: GrantFiled: January 8, 2001Date of Patent: April 22, 2003Assignee: Fuji Machine Mfg. Co., Ltd.Inventors: Koichi Asai, Kazufumi Suga
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Publication number: 20030051338Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.Type: ApplicationFiled: September 19, 2001Publication date: March 20, 2003Applicant: International Business Machines CorporationInventors: Todd H. Buley, Roger Lam, Daniel O'Connor, Charles Hampton Perry
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Patent number: 6519838Abstract: A component mounting apparatus includes a board transfer section for carrying in circuit boards to a component mounting position and carrying out the circuit board after component-mounting operation. A component feed section is provided for feeding, to a specified position, a component to be mounted onto the circuit board, and a component mounting section is provided for loading a suction nozzle matching the component to be mounted, sucking up the component from the component feed section and moving the component to the mounting position, and mounting the component on a specified site of the circuit board. A controller is provided for controlling operations of the individual sections is order to execute a productional operation of component-mounting onto the circuit boards.Type: GrantFiled: February 29, 2000Date of Patent: February 18, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Okuda, Hiroshi Uchiyama, Hiroshi Furuya, Yoshihiro Mimura
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Patent number: 6516512Abstract: A jig for attachment and detachment comprises a frame. When the jig is set on the surface of a printed circuit board, a connector on the printed circuit board can be received in a connector receptacle opening defined at the lower end of the jig. The frame is designed to stand on the surface of the printed circuit board surrounding the connector. An electronic component can thereafter be inserted in an insertion opening defined at the upper end of the frame. The inserted electronic component is guided, by a guide passage defined in the frame, from the insertion opening toward the connector receptacle opening. The guided electronic component is received on the connector. The guide passage serves to allow the input/output pin of the electronic component to reliably enter the socket of the connector without any interference. An operator is released from careful observation for alignment of the electronic component with the connector with his own eyes.Type: GrantFiled: March 24, 2000Date of Patent: February 11, 2003Assignee: Fujitsu LimitedInventor: Katsutoshi Yamauchi
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Publication number: 20020194727Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.Type: ApplicationFiled: February 4, 2002Publication date: December 26, 2002Applicant: MIRAE CORPORATIONInventors: Jae Hyuk Cho, Sang Won Lee, Dong Suh Lee
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Patent number: 6490784Abstract: An automatic electronic component-mounting apparatus is provided. A nut member is slidably arranged between a pair of rails. A head-lifting/lowering member is lowered and lifted with respect to the main block via the pair of rails and the nut member. A mounting head is attached to the head-lifting/lowering member. The head-lifting/lowering member is lowered and lifted to cause the mounting head to pick up an electronic chip component and then mount the electronic chip component on a printed circuit board. The head-lifting/lowering member is formed of a metal-ceramic composite material produced by combining a ceramic reinforcing material with a metal.Type: GrantFiled: January 24, 2000Date of Patent: December 10, 2002Assignee: Sanyo Electric Co., Ltd.Inventors: Yoshinori Kano, Yoshinao Usui, Takahiro Nagata
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Patent number: 6487772Abstract: A process for combining micro-coaxial cables and pins by riveting, it comprises the steps of: (1) a micro-coaxial cable is cut and stripped at the desired areas thereof to form a pin riveting segment and a grounding plate connecting segment after a desired length of the cable is obtained by cutting; (2) the pin riveting segment on the cut and stripped micro-coaxial cable is sent to a riveting apparatus to proceed to combination of the cable and the pin; (3) a plurality of such cables and pins having been riveted are placed in a plastic housing to form a bus; (4) the grounding plate connecting segments on the cables and pins are welded to a grounding plate; and (5) the bus is tidied to be neat. Thereby, the micro-coaxial cables can be combined with the pins in a way of mass production, the combined structure of them is firmer.Type: GrantFiled: May 26, 2000Date of Patent: December 3, 2002Inventor: Robert Chuang
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Patent number: 6481097Abstract: A tool (1) to insert a plurality of elongated flexible electric conductors (4) into the slots (3) of an elongated flexible insulating housing (2). The tool (1) has a passage (13) through which the housing (2) and conductors (4) move to have the conductors (4) urged into the slot (3). The passage (13) is bordered by a plurality of ramps (10) which engages the conductors (4) to urge them into the slot (3).Type: GrantFiled: March 21, 2001Date of Patent: November 19, 2002Assignee: Pupbest Pty Ltd.Inventor: John Ashton Sinclair
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Publication number: 20020166227Abstract: The present invention relates to a guide tool, the said guide tool is capable of assisting one end of a coaxial cable to be coupled to an end connector; it comprises of a body installed with a guide mechanism therein, the said guide mechanism possesses a guide tube for guiding the cable central conductors of different regulations; the said guide tube can move along the direction of the axle line by the elastic element for rapidly and precisely inserting the central conductor and the dielectric into the columnar member of the end connector and further becomes the best auxiliary tool.Type: ApplicationFiled: May 9, 2001Publication date: November 14, 2002Inventors: Michael Holland, Chi-Fu Chang
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Patent number: 6467157Abstract: An apparatus is provided for constructing a segmented annular permanent magnet from a predetermined number of previously magnetized segments of predetermined shape and size comprising a rotateable carrousel, at least two of a plurality of removable ferromagnetic segments, an introducing means and a removing means.Type: GrantFiled: January 26, 2000Date of Patent: October 22, 2002Assignee: Odin Technologies, Ltd.Inventors: Avinoam Livni, Yoav Katz
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Publication number: 20020148111Abstract: A printed circuit board support including a first member having a planar upper surface for supporting a printed circuit board. At least one second member is movably coupled to a first side of the first member and movable toward and away from the side of the movable member, and a bias source biases the second member in a direction away from the first member.Type: ApplicationFiled: June 7, 2002Publication date: October 17, 2002Inventors: Mark V. Peckham, Tony Teitenberg
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Patent number: 6463653Abstract: An electronic component pick and place machine is provided. The pick and place machine comprises a pick station, first and second pick heads, a component alignment detector and a controller. The pick station is connected to a component feed source. The first pick head has access to the pick station and a component transfer area and the second pick head has access to the component transfer area and a component mounting position. The component alignment detector is furthermore directed toward the component transfer area. The controller is coupled to the feed source, the first pick head, the second pick head and the detector, the controller containing instructions which, when executed, cause the controller to compare the detected component alignment with a known component alignment and control the feed source, the first pick head, and the second pick head in response to the comparison.Type: GrantFiled: December 17, 1999Date of Patent: October 15, 2002Assignee: Micron Technology, Inc.Inventors: Darryl L. Gamel, Kreg W. Hines
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Publication number: 20020144395Abstract: An apparatus and a method for equipping plug housings with fitted-out cables includes an equipping installation downstream of a fitting-out installation and introduces each fitted-out cable end into a first or second plug housing according to an installation sequence. A feeder unit takes a cable loop from a transfer unit moved from the fitting-out installation and transfers the leading cable end to a transfer station and the trailing cable end either to a rotatable store unit or, to the transfer station when it is free. An equipping unit takes over the cable ends in succession at the second transfer station and introduces the cable ends into designed cells of the corresponding plug housings.Type: ApplicationFiled: April 1, 2002Publication date: October 10, 2002Inventor: Louis Soriano
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Patent number: 6453541Abstract: A method and an apparatus for centering a disc drive assembly are disclosed. The assembly includes a rotational hub of a spindle motor, several annular spacer elements, and several disc platters loosely assembled into a disc pack. The rotational hub, each of the discs, and each of the spacer elements are centered respectively using a corresponding set of three springs as points of contact. The alignment and positioning of the springs are precisely controlled. Once centered, a retaining nut is fastened to a threaded portion of the spindle motor to firmly clamp the disc pack together before withdrawing the springs. Hub centering springs, disc centering springs, and spacer element springs are all adapted to provide the three points of contact for each component of the disc pack.Type: GrantFiled: February 22, 2001Date of Patent: September 24, 2002Assignee: International Business Machines CorporationInventors: Duncan Guthrie, Soon How Lee, Ricky Chong Ho Tan
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Patent number: 6453532Abstract: An apparatus and method of aligning a disc drive printed circuit board connector with a corresponding receptacle in a disc drive slot in a test fixture includes a pair of tapered guide members on opposite ends of the connector which are angled toward the pins of the connector so that the connector is centered within the receptacle as the connector is inserted into the receptacle in the test fixture. The receptacle may be mounted for lateral movement within the slot of the test fixture to move relative to the connector as the guide members slide within the receptacle to align the pins and sockets before the pins enter the sockets within the receptacle.Type: GrantFiled: January 31, 2000Date of Patent: September 24, 2002Assignee: Seagate Technology LLCInventors: Michael Alan Maiers, Robert Terry Haas
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Patent number: 6446333Abstract: A component mounting method for picking up components with a mounting head having multiple suction nozzles, and mounting these components on a mounting target after recognition. Components picked up integrally move against a component recognizer disposed on a movement route of the head for scanning and recognizing each component. During scanning, the slowest speed in scanning speeds required for recognizing each component is used. This eliminates a approaching time needed for switching speed during scanning of each component, thus reducing the total recognition time to improve mounting efficiency.Type: GrantFiled: July 31, 2000Date of Patent: September 10, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiro Kashiwagi, Kazuhide Nagao
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Patent number: 6427317Abstract: Disclosed is a method for assembling a device including a base and a main board assembly in a hard disk drive including an actuator having a magnetic head; a base having a spindle motor mounted thereon, the spindle motor rotating at high speed a disk on which the magnetic head is suspended to conduct data writing and reading; and a main board assembly assembled to a lower surface of the base. The device comprises a guide section for establishing a vertical assembling position of the base and the main board assembly and for allowing the main board assembly to be capable of a sliding movement to a predetermined location on the base; a stopper section for stopping the sliding movement of the main board assembly on the base; and a locker for locking the main board assembly stopped by the stopper section to the base in a vertical direction.Type: GrantFiled: September 16, 1999Date of Patent: August 6, 2002Assignee: Samsung Electronics Co., Ltd.Inventor: Byung-Gyou Choi
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Patent number: 6427318Abstract: An apparatus for assembling a disc storage system includes a base having a number of subassemblies. A disc pack subassembly is mounted on the base and is configured to support a disc pack and an actuator subassembly is mounted on the base and is configured to support an actuator assembly. A drive mechanism merges the disc pack subassembly together with the actuator subassembly whereby transducer heads in the actuator subassembly are positioned on disc surfaces of the disc pack. At least one of the subassemblies is releasably mounted to the base and the subassembly can be replaced for assembly differing disc storage systems or upon failure of the subassembly.Type: GrantFiled: September 30, 1999Date of Patent: August 6, 2002Assignee: Seagate Technology LLCInventors: Michael W. Pfeiffer, Eric D. Johnson, Donald L. Compton
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Patent number: 6425178Abstract: A module integrated circuit (IC) carrier is used to move module ICs through a testing machine. The module IC carrier has a housing with a pair of installation elements installed parallel to one another in a receiving space of the housing. A plurality of holding members are installed on each of the installation elements. Each holding member on one of the installation elements faces a corresponding holding member on the other of the installation elements. Module ICs are held between corresponding pairs of the holding members. The holding elements can be biased towards each other to help hold the module ICs. Each holding element may include a rotator with a grooved edge which helps to hold a module IC, and which allows the module ICs to be easily inserted into and removed from the carrier.Type: GrantFiled: October 28, 1999Date of Patent: July 30, 2002Assignee: Mirae CorporationInventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
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Patent number: 6425706Abstract: An apparatus for securing an object to a surface comprises a mounting cover having a first surface and a pair of sidewalls depending away from the first surface. The sidewalls are in a facing spaced relationship and secured to a second surface. At least two securement members are secured to the first surface between the pair of sidewalls. The securement members are configured to define a receiving area. Each securement member has a pair of engagement members secured within at least a pair of openings in the first surface. Each pair of engagement members include an upper surface. The upper surfaces of the pairs of engagement members are flush with respect to the first surface. An actuating member having a first portion, and a second portion depending away from said first portion, is configured to be slidably engaged in the receiving area. The second portion has a pair of engagement openings for slidably receiving a pair of guide members mounted to the object.Type: GrantFiled: December 20, 2001Date of Patent: July 30, 2002Assignee: International Business Machines CorporationInventors: David J. Jalanti, Edward Furey
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Patent number: 6421911Abstract: An apparatus for providing automatic alignment of a circuit board within a chassis includes a housing member having an end wall portion. The end wall portion includes a plurality of openings formed therein for receiving a plurality of connectors. The end wall portion further includes a first raised portion and a second raised portion to provide automatic alignment of the circuit board within the chassis.Type: GrantFiled: November 30, 1999Date of Patent: July 23, 2002Assignee: 3Com CorporationInventors: Chad E. Misner, Michael J. Giovannoni
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Publication number: 20020092157Abstract: According to the present invention, a control device and a circuit board moving device controlled in operation by the control device for holding a circuit board are provided, whereby the circuit board moving device is moved to bring a component mount position on the circuit board closest to a recognition device after the circuit board moving device is moved to bring the component mount position closest to a component feed position. In the state, a circuit board mark formed on the circuit board is detected, thereby recognizing a position of the circuit board. A transfer distance for the component by a component hold device from the recognition device to the component mount position is thus shortened, enabling high-speed mounting with higher accuracy.Type: ApplicationFiled: February 27, 2002Publication date: July 18, 2002Inventors: Noriaki Yoshida, Makoto Sueki, Koji Odera, Yoshihiro Yoshida, Osamu Okuda, Naoyuki Kitamura, Akira Kabeshita
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Patent number: 6401327Abstract: A magnet assembly including spacers having chamfered posts insertable in post holes of opposed spaced backirons. For assembly, chamfered posts are inserted into post holes on a first backiron. A second backiron is supported above the first backiron by an assembly slide to retain the second backiron against the magnetic attraction between the first and second backirons for preassembly alignment of the post holes relative to spacer posts. The assembly slide is withdrawn from the second backiron so that the second backiron is attracted toward the first backiron and spacer posts are inserted into post holes on the second backiron. A method for assembling a magnet assembly using an assembly slide to support a second backiron above a first backiron and withdrawing the slide from the second backiron to assemble components.Type: GrantFiled: June 2, 2000Date of Patent: June 11, 2002Assignee: Seagate Technology LLCInventors: Terry R. Fahley, Paul L. Johnson, David L. Duvick
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Patent number: 6393694Abstract: A gripping device for positioning a component (47) on a substrate, comprising three fingers (1, 2, 3) arranged in a triangle (7), and a drive device for moving the fingers along parallel paths (4, 5, 6) relative to each other to grip or release a component. A middle finger (2) is movable in opposite directions with respect to the outer fingers (1, 3).Type: GrantFiled: February 22, 2000Date of Patent: May 28, 2002Assignee: Koninklijke Philips Electronics N.V.Inventor: Cornelis J. G. Roovers
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Patent number: 6393689Abstract: A system for fitting pins into a connector, wherein the pins are formed by portions including an end portion of a continuous wire, which portions are arranged one after another and linked together by and separable at frangible regions. The continuous wire is fed to a first unit which advances the wire and guides the end portion of the wire in a rectilinear direction of advance toward a second unit. The second unit is mounted on a rotary shaft perpendicular to this rectilinear direction and rotated so that the end portion of the continuous wire is introduced into the second unit by the first unit and then the second unit is further rotated to cause separation of the end portion from the continuous wire by bending. The second unit then inserts the separated portion into the connector.Type: GrantFiled: January 6, 2000Date of Patent: May 28, 2002Assignee: S. M. ContactInventor: Christophe Roshardt