Abstract: A device for assembling a magnet assembly for a voice coil motor for a data storage device. The device including a base, spacer nests and first and second assembly blocks for supporting plates for assembly of the magnet assembly. The first and second assembly blocks including nest bases having an x-y axis and including x-y datum members. The plates are biased toward x-y datum members via clamps operably coupled to the nest base. Retainer members are operably coupled to the assembly blocks and aligned relative to the nest base to retain plate relative to nest base for assembly. The assembly blocks are movably coupled to the base to operate between a retracted position and an advanced assembly position. In the advanced assembly position, the first and second assembly blocks being aligned with the spacer nest supporting spacers for assembling the magnet assembly.

Abstract: An electronic components mounting machine comprising an actuator(7), whereby electronic components are mounted on a substrate, a camera(5) whereby coordinates of recognition marks formed on the substrate at four places at least, are detected, a controller(6) whereby actuator(7) is controlled, a mounting data table(9) wherein information on mounting coordinates and mounting angles of electronic components to be mounted is stored, and a correction data table(10) wherein information on correction values to be applied to the mounting coordinates and mounting angles in reference to the substrate, on which the electronic components are mounted, is stored, and characterized in that the correction data table(10) stores information on correction values for each respective cell, which is formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of recognition marks detected by the camera(5), thus enabling to mount each respective electronic compone

Abstract: An elongate electrical resistance heating element of coiled material is secured to a support of insulating material by means of staples driven into the support. A jig is employed having an elongate slot open to a face of the jig for receiving the heating element. A movable elongate base member is provided in and co-operating with the slot, the base member having projections extending in a direction towards the face of the jig, the projections being arranged in predetermined spaced relationship along the base member. Grooves are provided at opposite sides of the slot for receiving staples, bridge members first, into the elongate slot from the face of the jig with the legs of the staples slidably received in the grooves. The grooves are positioned such that the bridge members of the staples are contactable by the projections on the base member.

Abstract: An IC leadframe processing system for use in an IC manufacturing system, whereby IC leadframes of different types can be subjected to various lead machining processes by a single processing system without a need of various types of cutting and bending dies. The topmost leadframe is separated by a separating device one by one from a stack of leadframes stored, each having a plurality of IC chips connected thereto. The leadframe is cut into each individual packaged IC by a leadframe cutting device. Lead wires of each packaged IC are subjected to pinch cutting, dam cutting and end cutting by a cutting die and then bent into a Z shape by a bending machine.

Abstract: An electronic component supplying apparatus including a frame member, component supplying units each including a movable member movable along a reference line, first drive sections each provided on a corresponding one of the movable members of the units, a second drive section provided on the frame member, first control devices each provided on the corresponding one movable member, a power source, a second control device provided stationarily relative to the frame member, a supplying device which includes a first supplying section provided on the frame member and second supplying sections each provided on the corresponding one movable member, has no wire connection between the first supplying section and the each second supplying section, and supplies the electric energy from the power source to the each first control device, while permitting the one movable member to be moved along the reference line, and a transmitting device which includes a first transmitting section provided on the frame member and secon

Abstract: An apparatus for manufacturing a multilayer carrier for electronic components. Individual layers have a printed wire pattern applied thereto by a dispenser with the required holes being made by a perforator. The apparatus manipulates the individual layers so that the final multilayer is obtained automatically. The dispenser and perforator are positioned one over the other so that a compact high accuracy arrangement is obtained. This apparatus is particularly suitable for processing layers of green ceramic.

Abstract: A component mounting apparatus for automatically mounting components on a circuit board includes a mounting unit for picking up a component from a component pickup location and mounting it at a mounting location. The mounting table can be driven to the pickup location and can removably secure a cassette table that can support a plurality of components that are to be mounted on the circuit board. A cassette table can be removable clamped to the mounting table. A carrier cart can transport the cassette table to a position for attachment to the mounting table. The carrier cart can be appropriately aligned and secured relative to the mounting table to enable the cassette table to be removably attached to the mounting table.

Abstract: There is disclosed an electronic parts mounting method in which it is possible to avoid a pick-up mistake for electronic parts (chips) in simultaneously picking up the chips respectively stored in juxtaposed parts feeders by a plurality of nozzles provided to a transfer head. Nozzle position data of first, second and third nozzles 9a, 9b and 9c are beforehand obtained by a first camera, and pick-up positions of the chips in parts feeders 4 are obtained by a second camera. After picking up respectively the chips in the parts feeders 4 by the nozzles 9a to 9c it is judged whether or not there would be caused the pick-up mistake. When it is judged there is caused no pick-up mistake, a transfer head is moved to a position above a board and each of the chips is mounted to the board.

Abstract: The invention relates to a device and to a machine connecting connection elements into housings of connectors. The device includes; a body (17) which can be moved in the direction of said connector; 4 an insertion tool (18) which is associated, via removable link-age means (22), with said body and is provided with means (23) for gripping said connection element to be introduced; and means (26) for controlling the opening or closure of said gripping means.

Abstract: A seating tool 10 for installing connectors on a circuit board comprises a base plate 12, an alignment plate 40 and fasteners 60 to fasten them together at respective fastening locations. The alignment plate 40 has at least two connector alignment surfaces 42, 44 at different locations thereon and a set of at least two fastening locations 46, 48 associated with a respective alignment surface for securing the alignment plate 40 to the base plate 12 in at least two orientations relative to the base plate 12 to accommodate board-mounting of differing connectors having different dimensions of the posts from the front faces of the connectors.

Abstract: To position a wire-connected terminal TW and cope with a multitude of kinds of wire-connected terminals TW, a block 30 is provided for each wire-connected terminal TW. The block 30 includes recesses 34, 37 for detachably accommodating the wire-connected terminal TW. A part of the accommodated wire-connected terminal TW is exposed such that it can be gripped by hands 51, 52. The block 30 also includes a positioning means 38 for positioning the terminal TW accommodated in the recesses 34, 37 with respect to the hands 51, 52. Since the terminal TW is securely positioned in a transferring step of transferring the wire-connected terminal TW to the hands 51, 52, the succeeding step performed by the hands 51, 52 can be securely performed.

Abstract: Connector mounting jigs for simultaneously positioning and mounting a plurality of electrical connectors on a printed circuit board include a base member, and at least two sets of pairs of synthetic resin posts extending from one surface of and formed integrally with the base member for frictional engagement of respective corners of a cavity of each connector to support respective connectors in a predetermined positional relationship to each other.

Abstract: To effect accurate positioning and avoid interference of a terminal fitting with a wire guide member. By lifting and lowering guide members 112, 113 formed with Y-shaped wire guide slots 112F, 113F, respectively, a wire W is brought to a terminal mounting position. The wire W and the terminal fitting mounted on the wire W will not interfere with the guide members 112, 113, and the wire W can be more accurately positioned by the Y-shaped wire guide slots 112F, 113F.

Abstract: Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements.

Abstract: The present invention provides a differential pressure apparatus that transports a component to a receptacle and activates a positive air flow that nutates component about the receptacle until properly aligned so that a negative air flow or gravity forces engagement of the aligned component into the receptacle. The present invention also provides a method of assembling a connector assembly using a differential pressure apparatus.

Abstract: A mounting apparatus includes two stages each, a carrier which carries two printed boards to respective stages and parts feeders located on both sides of the carrier. The mounting apparatus further includes two heads driven by two-dimensional linear motor system, each of which is arranged to mount electronic components onto the respective board. Since two boards are treated at the same time, large throughput is obtained. Further, since one board is treated by one head, the tangle of the cables does not occur.

Abstract: A method for supporting a printed board. Includes a first step of conveying to a specified position by a conveying a printed board having a first reference hole and a second reference hole device a for setting a position and posture thereof. A second step stops the conveyed printed board at the specified position with a stop member. A third step inserts a first reference pin provided at the specified position into the first reference hole of the stopped printed board. A fourth step inserts a second reference pin into the second reference hole of the printed board. The second reference pin is movable in parallel to a mounting surface of the printed board and in any arbitrary direction relative to the first reference pin. A fifth step pinches the printed board to hold the position and posture thereof of a holding device with the first reference pin and the second reference pin both inserted.

Abstract: An apparatus for rapidly and automatically handling packaged integrated circuits (ICs) during the loading or unloading of burn-in boards. The apparatus also segregates and offloads packaged ICs into a plurality of reservoirs for controlled delivery into suitable transport media on the basis of the level of functionality attained by each part during the burn-in process. The apparatus is computer controlled, with operator interface and an electronic control panel. The apparatus employs a linear induction motor drive system to rapidly, precisely and accurately move the ICs both between a loading/unloading location and a staging location, and at the staging location itself during the segregation and offloading steps. The system may be extended to operate in either the single or dual mode, employing two sorting and offloading components to unload a single device under test board.

Abstract: An apparatus and a method for mounting a chip make it possible to accomplish quick chip mounting and also to mount multiple different chips on substrates. Three heads are provided around a center rod of a head assembly; they horizontally rotate around the center rod. When the heads rotate horizontally, they are turned 180 degrees vertically by a first bevel gear and a second bevel gear. A nozzle of one of the heads picks up a flip chip from a wafer sheet and rotates 180 degrees horizontally to transfer the flip chip to a transferring head, during which it vertically inverts 180 degrees so as to vertically invert the flip chip. The transferring head receives the flip chip from the head and mounts it on a substrate. According to the type of chips to be mounted, the heads and the transferring head are equipped with nozzles best suited for the type of chips.

Abstract: An indicator system (1) having a plurality of hoppers (2) for supplying electrical components (20) to respective dispensing locations. There are actuators (9) associated with the hoppers (2), the actuators (9) being movable during the dispensing. There is a sensor (13) selectively actuatable by some of the actuators (9) when the components (20) in one of the hoppers (2) are below a desired number or threshold level. The system (1) also has a visual indicator (14) coupled to the sensor (13) to provide a warning signal indicative of when the components (20) in one of the hoppers (2) are below the desired number.

Abstract: A fixture for making laminated integrated circuit devices from layers of integrated circuits includes a base and at least two side body portions for substantially enclosing the sides of the laminating integrated circuit layers. The side body portions have inside surfaces for engaging the layers of integrated circuits so as to hold the layers in a desired alignment during curing. Structure is provided for retaining the side body portions in position so as to hold the layers in the desired alignment.

Abstract: An automated component placement apparatus for use in populating circuit boards with electronic components. The apparatus includes a plurality of toolheads for picking up and placing components, a plurality of component feeders, a transport means to move PC boards between PC board assembly areas for placement of components, and a plurality of gantry systems for moving the toolheads between the component supply stations and PC board assembly areas. A plurality of programmable controllers actuates both the toolheads to grip or release components and the gantry systems to move the toolheads between the component supply stations and PC board assembly areas.

Abstract: An insertion tool for inserting substrates having contacts disposed at their distal ends into a connection device and a method of use. The tool of the present invention is useful with any size substrate and contact, but is particularly useful for wires or fiber optic cable having small diameters with insufficient rigidity to withstand the connection force required to insert the contact into the connection device. The tool includes a pusher arm which engages the contact and forces the contact into the connection device. As the contact is inserted, the pusher arm is also inserted into the connection device and is subsequently removed from the connection device.

Abstract: An electronic component preprocessing assembly comprises a press pin plate having a surface from which at least one press pin depends, a load plate having at least one loading aperture spatially aligned with and sized to receive the press pin, a pin holder plate having a surface from which at least one orienting pin depends, and a carrier plate having at least one component passageway spatially aligned with and sized to receive the orienting pin. The load plate and the carrier plate are spatially aligned so that an electronic component initially placed in the loading aperture can travel to the component passageway while captured within a predetermined distance between the press pin and the orienting pin. The predetermined distance is preferably sufficient to prevent unnecessary pressure on the component captured therein while orienting the component in a preferred orientation during transfer.

Abstract: A surface mount machine has a fixed X-axis comprising a straight beam rigidly mounted in the machine chassis along which one or several wagons move(s), each one carrying at least one component pick-up device. Below the X-beam for the X-axis there are component feeders which are organized in groups and which are accessible by the pick-up devices and at least two Y-axes provided by linear bearings, which are rigidly mounted in the machine chassis. Y-wagons for carrying printed circuit boards move along the Y-axes. As there are at least two PCB carrying Y-axes, it can be arranged that at least one of them presents a PCB on which the pick-up devices can place components. The time during which the pick-up devices must be idle during PCB unload and load will thereby be dramatically reduced.

Abstract: A terminal is inserted randomly into a specially arranged housing with terminal receiving chambers arranged in staggered fashion, the terminal inserting method to a specially arranged housing 2 in which it allows leading electric wires 9 from the specially arranged housing 2 where terminal receiving chambers are arranged in the staggered fashion to push aside by a guide claw 3, wherein the guide claw 3 is entered along the bulkheads 5, 6 extending rectilinearly between columns of the terminal receiving chambers 1.sub.1, 1.sub.2, 1.sub.3 of the specially arranged housing 2. An entering direction of the guide claw 3 is harmonized with the extending direction of the rectilinear bulkheads 5, 6 by 90.degree.-turn-over of the specially arranged housing 2.

Abstract: A permanent magnet rotor for an electronically commutated motor (ECM) has a core, a plurality of magnetizable elements spaced around the core, and a thin-walled retaining shell which has been stretched around the core and magnetizable elements to hold the elements in position. The rotor is made by an inventive method which involves axially aligning the core and surrounding magnetizable elements with the retaining shell, and cold-pressing the retaining shell over the core and elements to sandwich the elements between the shell and core. The core and magnetizable elements serve as a mandrel about which the shell is reformed in a cold working operation. Other aspects of the invention include the fixturing apparatus used to align the core and magnetizable elements with the retaining shell, and apparatus which is used to evenly space the magnetizable elements around the core and hold the elements in position during at least a portion of the cold-pressing operation.

Abstract: A pressing unit 9 pressing the back surface of a flexible circuit board 8 having a case and a plurality of plate-like pressing members 23 which are accommodated in the case while being superposed on each other. Each pressing member 23 has a base portion 23a, a pressing portion 23b, and a spring portion 23c integrally connecting them. The pressing portion 23b is extended along a direction of arrangement of connecting terminals 4 arranged on electric components. The pressing member 23 presses the back surface of the flexible circuit board 8 by utilizing the elasticity of the spring portion 23c, and therefore can bring the connecting terminals 4 of the electric components and connecting terminals 11 of the flexible circuit board 8 into contact with each other by a generally equal contact pressure.

Abstract: An apparatus (40) is disclosed for crimping a terminal (12) onto a wire (10) thereby forming a crimped wire assembly (32). The apparatus includes an upper die form tool (78) and a mating lower deep crimping nest (74) for performing the crimping operation. A terminal feed unit (86) is provided for feeding a strip (24) of terminals along a feed path (180) and positioning each terminal, in turn, in crimping position between the mating tooling. A lifting arm (134) is provided for separating the crimped wire assembly (32) from the deep crimping nest (74). The arm is pivotally attached to the apparatus and includes a first end having a camming surface (160, 162) arranged to engage the crimped wire assembly, and upon pivoting of the arm, the camming surface cams the crimped wire assembly (32) out of the deep crimping nest (74) in a direction (178) substantially perpendicular to the feed path (180) and then moves the wire assembly (32) in a direction along the feed path.

Abstract: A tool for batch processing the definition of air bearing surfaces on rows comprising a plurality of sliders is disclosed. The tool has a main body member having a length defining a y-axis direction, a width defining an x-axis direction, and a thickness defining a z-axis direction. The main body member has a top surface defining an upwardly facing z-axis base surface. The main body also defines a y-axis alignment reference surface, and an x-axis alignment reference surface. The rows are positioned on the tool for processing, where the upper surface of the platform engages the lower surface of the plurality of rows to provide proper z-axis positioning on the tool. The y-axis alignment reference engages one longitudinal side of an anchor row to provide proper y-axis positioning, and the x-axis alignment reference surface abuts the second end of the plurality of rows to provide proper x-axis positioning. The top surfaces of the rows lie in a common plane.

Abstract: A component-mounting apparatus includes a component supply mechanism for supplying components to be mounted on a circuit board, a circuit board positioning device for placing in position the circuit board on which the components are to be mounted, and a mounting head for taking out one of the components at a predetermined component take-out position of the component supply mechanism, thus mounting the component on the circuit board.

Abstract: A wire harness bundling apparatus includes carrier means for carrying harness wires sequentially, shifting means responsive to the amount of the harness wires carried for shifting the harness wires to an apparatus guide means, tape feeding means placed so as to permit the tape to traverse the harness wire pathway between the guide means. The tape is wound around a bundle of harness wires and upper and lower melting-and-pinching means melts and pinches portions of the tape on opposite sides of the harness wire bundle. A drive means drives the upper and lower melting-and-pinching means together to actuate a severing knife placed between the forward and rearward sides of the binding tape.

Abstract: A fixture having an open ended housing cavity defined by an inwardly inclined wall, and including at least one moveable segment having an inwardly facing wall which defines one wall of a stack cavity configured for receiving a plurality of circuits chips positioned one over another for bonding together in a stack configuration, and an outwardly facing wall of the segment is inclined at the angle of the inclined wall of the housing and arranged in mating relation therewith such that when the segment is moved in one direction along the inclined wall of the housing, it will be urged inwardly to align the circuit chips within the stack cavity, and when urged in an opposite direction it can move outwardly to expand the stack cavity for loading and unloading.

Abstract: A first printed board transferred from a prior process on an inlet conveyer is placed on a moving unit at a first switching position. The moving unit moves to a second switching position while mounting the first printed board with electronic components from a component feeding section. During this process, a second printed board stands by at the second switching position via the inlet conveyer, a transit path and an intermediate conveyer. At the second switching position, the second printed board is placed on the moving unit while shunting out the first printed board onto an outlet conveyer for transfer to a subsequent process. The moving unit moves to the first switching position while mounting the second printed board with the electronic components from the component feeding section.

Abstract: A method for mounting components, includes a first step for feeding to a component feed unit a plurality of stacked-in-stages trays on which components are accommodated, a second step for taking out the components of a Top-stage tray sequentially one by one to mount them onto a board, and a third step for, when the components on the tray are exhausted, removing the empty top-stage tray, and then returning to the second step. An apparatus for mounting Components includes a component feed unit for feeding a plurality of stacked-in-stages trays on which components are accommodated, and a pickup device which can selectively hold either a component pickup nozzle or a tray transfer nozzle. The pickup device is movable between the component feed unit and a specified position of a substrate or between the component feed unit and a tray removal box. A nozzle replacement unit is provided for performing replacement of the pickup nozzle and the tray Transfer nozzle.

Abstract: A method of inserting terminal in which a problem that time for search varies with relative position between the wires and the connector is eliminated, and the position of the connector housing can flexibly be determined. The method of inserting terminal according to the present invention comprises the steps of: correcting a relative position of a terminal insertion head against a connector housing while two positions on front end portion on an engagement side of the connector housing being image-processed by a television camera; and inserting a terminal with wire from a rear portion of the connector housing by using the terminal insertion head.

Abstract: An electronic-component mounting system including a plurality of mounting units which are arranged along a reference line contained in a reference plane, each of the mounting units including (a) a mounting device which mounts at least one electronic component on an object and (b) a moving device which moves the mounting device along the reference plane and in a direction perpendicular to the reference plane, the moving device moving the mounting device within a first range which at least partly overlaps, along the reference line, a second range within which the mounting device of at least one adjacent mounting unit of the plurality of mounting units which is adjacent to the each mounting unit is moved by the moving device of the adjacent mounting unit, the mounting device of the each mounting unit mounting the electronic component on the object within the first range, the mounting device of the adjacent mounting unit mounting at least one electronic component on the object within the second range.

Abstract: An apparatus for assembling an electronic component, such as a ladder-type filter, having at least one element being held between terminal plates under pressure and stored in a case. First, the terminal plates are inserted in a cavity of a base so as to align the terminal plates along a direction of thickness thereof. Then, the element is inserted between the terminal plates in the cavity, and a spring plate is inserted in the cavity at an outside of one of the terminal plates. Thereafter, all parts inserted in the cavity are compressed by a presser along the direction of thickness so that an overall thickness of the parts is smaller than an inner size of the case. Then, the case is set on the base, and all parts are inserted from the cavity into the case simultaneously. Electrode surfaces of the element are not damaged since they are not in sliding contact with the terminal plates, and working efficiency is improved by this compressed insertion.

Abstract: A feeding system for feeding blank contacts to a crimping device for crimping the contacts onto ends of lead wires. The contact feed system includes a bowl, and a scoop for removing contacts from the bowl. The scoop is preferably mounted on the end of a rotating arm so that the scoop describes the locus of a circumference of a vertical circle when the arm rotates. Contacts fall, under gravity, from the scoop, when it is near the apogee of travel, onto an angled chute that guides the contacts into a space between two parallel contact orienting rails. The contacts are stacked between the supporting contact orienting rails and a shuttle gate controlledly carries a single contact at a time into a drop tube that feeds the contact to a crimping device for crimping onto an end of a wire lead.

Abstract: A method of automatically inserting terminals with wires into desired terminals accommodating cavities in a connector housing after putting neighboring wires aside, and a wire sweeping arm and a driving device for the sweeping arm. The method includes the steps of: grasping the terminal with wire by terminal supporting hands and wire supporting hands; moving the wire sweeping arm in the direction that the wire sweeping arm sweep wires which are already accommodated in neighboring terminal accommodating cavities, the wire sweeping arm being disposed between the terminal accommodating cavities and the terminal supporting hands so as to move back and forth; moving the wire supporting hands and the terminal supporting hands toward the connector housing to insert the terminal with wire into the terminal accommodating cavity.

Abstract: An improved device recognizing method and apparatus for an SMD mounter which are capable of more accurately mounting a device on a PCB (Printed circuit Board) by controlling the position of a device based on a deformation error and a position determining accuracy error, which include a work head slidably arranged on the X-axis table for holding a device and mounting the same, a work position recognizing camera attached to the work head for recognizing a work position on which a device is mounted, a device detection camera attached to an SMD mounter main body below the X-Y table for detecting the deviated amount between the center of the device held by the work head and the center of the work head, a checking position recognizer attached to the device detection camera and detected by the work position recognizing camera, an eyesight recognizer connected with the work position recognizing camera and the device detection camera for recognizing the position detected by each camera, and a position controller conne

Abstract: A loading method and a system therefor for guiding a magnetic head onto a magnetic disk medium using a guiding jig. The guiding jig has a first guiding surface that is parallel to the recording surface of the magnetic disk medium when positioned next to the edge of the disk, and a second guiding surface that is inclined with respect to the first guiding surface. The magnetic head slides on the second guiding surface to the first guiding surface, and then onto the recording surface of the magnetic disk.

Abstract: A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.

Abstract: A terminal feed mechanism (16) is provided for an applicator (10) for attaching terminals (198) to electrical conductors. The feed mechanism (16) includes first, second, and third pivoting links (34, 36, and 38, respectively), the first and second of which are pivotally coupled by means of gear teeth (52, 54). The second and third links (36, 38) are coupled by an adjustable slide member (84) that is in sliding engagement with the third link (38). The position of the slide member with respect to the third link governs the length of the feed stroke. A feed finger (170) that engages and advances the strip (196) of terminals (198) is carried by another adjusting mechanism (46) that independently controls the feed end point of the feed finger (170).

Abstract: A rotation regulating mechanism (43) is disposed on a terminal chuck (41) for holding a wired terminal (T). The rotation regulating mechanism (43) is arranged to regulate the rotation of the wired terminal (T), allowing an operation of inserting the wired terminal (T). Even if the terminal chuck (41) has to receive a wired terminal (T) from a terminal positioning device (30) having an inverting function, the rotation or positional shift of the wired terminal (T) can be regulated.

Abstract: A method of manufacturing a wiring harness includes the processes of 1) making plural kinds of electric wires each having a predetermined length (w1, w2, w3, . . . ) for each kind in lots (L1, L2, L3, . . . ) each having several tens to several hundreds wires, the plural kinds of wires constituting a wiring harness and including terminal-equipped wires with one end or both ends connected with a terminal(s) and terminal-free wires with both ends connected to no terminal; 2) temporarily holding groups of wires thus made (L1, L2, L3, . . . ) in predetermined wire holders (H1, H2, H3, . . . ) in the order of lots; and 3) wire arrangement of forming a set of wires for the wiring harness with the groups of wires constituting the wiring harness intensively hung on one or more wire clamps in such a manner that one wire w1 is taken out from the wire holder H1 to lock its one or both ends to predetermined one or two wire clips of the wire clamp provided with plural wire clips, and subsequently, the wires (w2, w3, . . .

Abstract: A multiwire cable connection apparatus reduces the mutual entangling of wires 4 and prevents damage of the insulation of the wires when pressure connected to 5 contacts 8 of a connector 6. A wire-controlling member 210, which extends along the longitudinal direction of the connector 6 is located between an end 2a of a multiwire cable 2 and a back surface 6d of the pressure contact type connector 6. Since the space wherein wires 4 cross each other by the transfer after the identification of wires 4 is restricted to the space between the multiwire cable 2 and the wire-controlling member 210, wires 4 are pressure connected to the assigned contacts 8 without crossing each other in the space between the connector 6 and the wire-controlling member 210. Therefore, the wires 4 do not engage with the connector 6 over the time from the wire identification to the transfer to the assigned contacts 8, and no damage is caused to the insulation of the wires.

Abstract: A circuit board fabrication apparatus and method having a vibratory feeder tray is disclosed. The feeder tray is preferably of low mass and horizontally-disposed and has multiple grooves which closely fit electronic parts, and hollowed-out bottom portions, generally below the rails separating the grooves. The hollow portions significantly contribute to low mass. Almost 50% of the mass of the tray's top plate may be removed. The parts are picked up one at a time and placed at precise positions on circuit board substrates by the rotating nozzles of a pick-and-place turret. An electromagnetic coil operating below the grooves of the feeder tray smoothly and continuously advances the parts in the grooves to the region in which they are picked up by the nozzles. Additionally, a slider table supporting the vibratory feeder tray positions each groove of the feeder tray in turn at the uptake point of the turret.

Abstract: A mounting device for mounting a harness applicator, such as a clip or a protector, to a wire harness positioned on a common base plate. A limit-switch for sensing the presence of the clip is incorporated in the mounting device. The limit-switch produces a completion signal when the clip is mounted on the harness W. An informing unit lights the lamp for informing a completion of the mounting in response to the completion signal.

Abstract: A work mounting apparatus comprises a nozzle head which repeatedly makes cycloid motion as a drum rotates while being held in a fixed orientation, a suction nozzle projecting downward from the nozzle head for receiving and mounting a work, and a liquid damper-type balancer for the nozzle head. The balancer contains a movable weight which relatively vibrates so as to cancel out vibration of the nozzle head.