Abstract: Components (62-65) are consecutively taken out from a plurality of component feeders (52) which supply a multiplicity of components to a component feeding position (52a) in succession, transferred to a prescribed assembling position (54a, 154a, 157a), and assembled into a product (61), which is then transferred to and held in each of a multiplicity of holding recesses provided in a product storing means (53, 153). This method allows the components to be assembled into a product by a component assembling apparatus of compact and simple construction, as well as permits the assembled product to be held and carried in the holding recesses of the product storing means to the next step of the process.

Abstract: A method and device for feeding an electronic component are provided by which extensive shutdown of the electronic component mounting device due to lack of components is prevented, thereby enhancing the operation rate. The device has a feeder section designating unit (32) for designating a desired one of feeder sections (22), and a feeder section controller (31) for forcibly moving the feeder section which is currently feeding electronic components to a retracted position when the other feeder section has been designated by the feeder section designating unit (32) and for moving the designated feeder section which has been in a standby state to a predetermined component feeding position, by which a long-time pause of the electronic component mounting device caused by exhaustion of components is prevented and the operation rate is enhanced.

Abstract: A tube feeder for feeding a plurality of components to a pick and place machine includes an elongated channel having a first end and a second end; the first end of the channel arranged so as to receive a component from a source of the component; the second end of the channel having a pick-up location; and the pick-up location including an elevated zone on which the component can pivot.

Abstract: An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of contact pins disposed on the socket body in substantially equally adjacent arrangement, each of the contact pins having one end to be connected to a terminal of the IC package and another end to be connected to the printed board, and an interval widening member provided for the socket body for widening a pitch interval between the other ends of adjacent contact pins so as to provide a predetermined distance therebetween.

Abstract: The present invention relates to an improved leadframe and method of attaching leads of a leadframe to contact pads on a carrier. The leadframe includes resilient engaging means or fingers for engaging the carrier and for exerting forces on the carrier to thereby support the carrier and accurately position and align the contact pads on the carrier with the leads. This invention overcomes the expense and inaccuracies of known leadframe designs and techniques in attaching leads to carrier contact pads using such things as fixtures for positioning the leadframe and carrier, visual alignment procedures and retaining tabs.

Abstract: An optical fiber cable (12) is installed within an enclosure (14) a duct by pushing the cable into the duct via a motorized pushing mechanism (38). As the optical fiber cable enters the enclosure, the image of interior of the enclosure is focused by a lens (22) onto a first end of the optical cable for transmission to the opposite end in which is optical registration with a television camera (24). The television camera captures the image of the enclosure interior for display on a monitor (26) to enable installation personnel to observe any possible narrowing of the enclosure that could impede fiber installation. Upon detecting such a restriction or obstruction narrowing the enclosure, the installation personnel actuate a pair of fingers (28a, 28b) carried by a casing (18) circumscribing the forward end of the optical fiber cable to push outwardly against the interior of the enclosure to reduce the narrowing and facilitate installation of the cable in the enclosure.

Abstract: A method, apparatus, and a disk file for adjusting the height of a set of load/unload lift cams with respect to the axial height of an associated stack of disks. The method steps comprise supporting load/unload lift cams with an adjustment tool, measuring the relative height of the load/unload lift cams with respect to the stack of disks in the axial direction with a non-contact transducer, and fixing the load/unload lift cams at a registered height with respect to the stack of disks.

Abstract: The apparatus for manufacturing a wiring substitute comprises a transporter having a circuit where a sheet is circulated; a screen printer for printing a conductive paste on the sheet; a counter for counting the number of times to print the conductive paste on the sheet; and a distributor for ejecting the sheet from the circuit when the counted number reaches a preset number. Thus, the conductive pillars having uniform properties can be formed automatically on the conductive foil with high productivity.

Abstract: This invention relates to a method of manufacturing an ultrasonic transducer. First, a plurality of printed boards in each of which a plurality of leads are formed in a line are stacked. The end portions of the leads protrude from each printed board. These lead end portions are inserted into a plurality of lead holes of an alignment jig. The plurality of printed boards are buried in the back surface of this alignment jig, and a backing layer is formed by resin molding. After that, the alignment jig is removed from the surface of the backing layer, and the surface of the backing layer is flattened. Since the end portions of the leads are exposed to this flattened surface of the backing layer, discrete electrodes formed on the back surfaces of transducer elements are electrically connected to these lead end portions. The accuracy of lead arrangement is thus improved by the use of the alignment jig. This reduces alignment errors of leads with respect to the discrete electrodes of the transducer elements.

Abstract: In a mounting system including a loading station having a transport conveyer for conveying printed circuit boards, a mounting machine for fabricating circuit devices by attaching electronic assemblies on printed circuit boards supplied thereto from said loading station, and an unloading station having a transport conveyor for conveying circuit devices supplied thereto from the mounting machine, the loading station includes a discriminating device for discriminating the kind or type of printed circuit boards and for generating a discrimination signal for instructing the kind or type of the printed circuit board. A mounting process in the mounting machine is selectively set by the discrimination signal from the discriminating device. According to this mounting system, even when many kinds of circuit devices are fabricated by many kinds of printed circuit boards, mounting processes can be successively carried out by one mounting line.

Abstract: A component alignment and transfer apparatus is disclosed which includes an accumulator for accumulating and aligning a plurality of components and a transfer head for transferring the accumulated and aligned components from the accumulator to a collection receptacle. The transfer head includes a scissor mechanism having a plurality of sections, with each section including a pair of scissor arms intersecting at a pivot point and a suction pickup. The plurality of sections are pivotally connected to form an elongated transfer head movable between a first position having a first spacing between suction pickups and a second position having a second spacing between suction pickups. An actuator is connected to move the suction pickups between the first position and the second position.

Abstract: In a component placement machine, a placement head (4) is driven by a linear motor (5). The stationary part (7) of the motor is attached to the machine frame (1) on which a PCB (8) is attached. The movable part (6) of the motor is connected to a slide (2) on which the placement head (4) is attached. During driving the placement head, reactive forces of the motor generate vibrations in the stationary part (7) of the motor and thus in the machine frame (20). This causes inaccuracies during the placement of components (9) on the PCB (8). To diminish this problem, the reactive forces are intercepted in a separate force frame (10) which is dynamically disconnected from the machine frame (1).

Abstract: In detecting a boundary line between areas different in light reflectance, it has so far been impossible to specify the boundary line at a distance shorter than the arrangement pitch of photodetectors (pixels) arranged in the camera. In the present invention, luminance variations near the boundary line between areas different in light reflectance are derivated. Further, in unit blocks G corresponding to pixels and arranged in a direction (Y direction) in which the boundary line extends, derivated values of luminance for each row of unit blocks are added and then a variation curve of the added values of derivated luminance values in unit block rows is drawn to specify a peak position thereof and also specify the position of the boundary line X0. Thus, it is possible to specify the position of the boundary line with a high accuracy at a distance shorter than the unit block pitch.

Abstract: The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: An electronic-component mounting system, including a printed-circuit-board supporting device which positions and supports a printed circuit board, a movable table which is movable, relative to the printed-circuit-board supporting device, in at least one of an X direction and a Y direction which are perpendicular to each other and cooperate with each other to define an X-Y plane parallel to a board-support plane on which the printed circuit board is supported by the supporting device, an electronic-component supplying device which is mounted on the movable table and which includes a component-supply portion from which electronic components are supplied one by one, and an electronic-component mounting device which is mounted on the movable table together with the electronic-component supplying device and which receives the electronic components one by one from the component-supply portion of the supplying device and mounts at least one of the electronic components on the printed circuit board positioned and sup

Abstract: An assembly jig for assembling a phase-modulation-type optical fiber gyro has a reel support area for supporting a fiber coil reel with an elongate optical fiber wound therearound and a coupler reel with optical fibers from a coupler wound therearound, the fiber coil reel and the coupler reel being rotatably supported on a base plate of the assembly jig through a support shaft. The assembly jig also has a chip support base disposed on the base plate for temporarily supporting thereon the optical IC chip optically connected to the optical fibers, a package housing support base disposed on the base plate for supporting a package housing of a package to encase the optical IC chip therein and substantially packaging the optical IC chip with the package housing, and a lid support base disposed on the base plate for supporting a lid to cover the package housing. The assembly jig allows the optical fiber gyro to be assembly easily at a reduced cost.

Abstract: A test fixture for assembling and electrical testing of magnetic head includes a fixed baseplate, a cage, and an X-Y positioner that is adjustably mounted on the baseplate. The cage is formed of a flat, thin, elongated arm and is secured at its rear end to the X-Y positioner. The forward end of the cage extends into a notched section that surrounds part of the slider. A stationary mounting block supports and retains the suspension in a fixed position relative to the slider. In another embodiment, the rear end of the cage is secured to the stationary mounting block and the X-Y positioner supports the suspension.

Abstract: The present invention is directed to a crimping machine having a hopper assembly for receiving loose bulk quantities of elongated components and supplying them aligned end-to-end and in random orientation to a feeder device. The feeder device receives the components in an inlet chute and feeds each of the components one-at-time having a desired orientation to an outlet chute. The feeder device includes a rotatable disk having a central chamber therein adapted to receive each of the components, and includes a releasable gate. The disk and gate function independently, as required, between the inlet chute and the outlet chute, to sequentially release (or invert and release) each of the components one-at-a-time and having a desired orientation for utilization, to a crimping assembly.

Abstract: An electronic component mounting device permits recognition of an electronic component for precise mounting. A recognizing device includes a line camera having a one-dimensional CCD array, a shutter camera having a shutter function, and a device for selecting either the line camera or the shutter camera depending on the size or shape of the electronic components. The electronic components are recognized by image data obtained by a selected one of the cameras while the electronic component is moving along a movement path of a mounting head towards a mounting location.

Abstract: An apparatus (10) for aligning device interconnections, which includes a structure (20) having at least one reference plane (38, 39). The structure (20) further includes a number of device bays (22). The apparatus (10) also includes at least one interconnect assembly (40), and at least one clamp (71) for locking the interconnect assembly (40) in fixed spatial relation to the reference plane (38). A clamp release (72) is provided for releasing the clamp (71) so that the interconnect assembly (40) is free to move with respect to the reference plane (40). A positioning guide (98) is provided for positioning the interconnect assembly (40) at an appropriate location with respect to the at least one reference plane (38, 39) for proper alignment while the clamp (71) is released, before again being clamped in a fixed position with respect to the reference plane (38). A method for aligning device interconnections is also disclosed.

Abstract: To avoid damage to carrier substrates in a device for mechanically aligning carrier substrates for electronic circuits, the carrier substrates having two main surfaces and a peripheral surface and being supplied to a horizontal fixture of the device, centering elements being forced to engage on the peripheral surface of the carrier substrates to align the carrier substrates in the horizontal fixture, it is proposed that at least two centering elements be mounted rotationally and displaceably in the axial direction on at least two first shafts that are oriented in parallel with one another and in parallel with the horizontal fixture. The centering elements engage on sections of the peripheral surface of the carrier substrate disposed opposite one another in a first direction, and at least two further centering elements engage with stop faces at sections of the peripheral surface of the carrier substrate disposed opposite one another in a second direction running perpendicularly to the first direction.

Abstract: A fixture for aligning the leads of SMT components with the corresponding pads of the printed circuit board, which is to receive such components, before soldering the leads to the pads. The fixture includes clamps for applying forces directly to the leads of the SMT components, alone or in conjunction with the clamping forces which are traditionally applied to the body of the component, the applied forces sufficient to seat the leads on the corresponding pads. In a preferred embodiment, the forces are applied by providing the fixture with a series of rocker-type clamps, each having an edge for engaging the several leads associated with a particular SMT component to be joined to the printed circuit board. The clamp is preferably constructed of a non-wettable material so that the edge of the clamp will not be wet by the molten solder during the soldering procedure, and the edge is preferably thin so that the clamping surface in contact with a particular lead is minimized.

Abstract: A platform and method for leveling the upper surface of a printed circuit board placed upon a work table. The platform comprises a substantially flat plate, the plate having a fastener for planerly securing the printed circuit board thereto, and at least one support having a length between a first end and a second end, the second end of the at least one support attached to the plate, and wherein the length of the at least one support is selected such that an angle between the plate and the work table compensates for any angular displacement of the printed circuit board relative to the plate. The method comprises fastening the printed circuit board to a platform, securing the platform to the work table, and angularly adjusting the upper surface of the printed circuit board by altering an angle between the platform and the work table.

Abstract: By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

Abstract: An electronic component taken out from a component storage section by a transfer head is held by suction, transferred and inspected as to whether it is good or defective by a good/defective component inspecting device. Thereafter, the electronic component is delivered to an alignment suction nozzle on a component alignment section. The sequence of the above-operations is then repeated, whereby the electronic components inspected and then aligned in the order of mounting can be supplied to a mounting head. Therefore, a mount time for the electronic components in a mount process is greatly shortened, so that productivity is expected to be improved. The electronic components can also be inspected before being aligned in the order of mounting, which further enhances mount efficiency.

Abstract: To effect accurate positioning and avoid interference of a terminal fitting with a wire guide member. By lifting and lowering guide members 112, 113 formed with Y-shaped wire guide slots 112F, 113F, respectively, a wire W is brought to a terminal mounting position. The wire W and the terminal fitting mounted on the wire W will not interfere with the guide members 112, 113, and the wire W can be more accurately positioned by the Y-shaped wire guide slots 112F, 113F.

Abstract: A disk drive recording device comprises at least two platters for storing magnetic recording data and a spindle motor rotating at high speed for mounting the platters. The disk drive is assembled by using pushing devices to push the platters toward the center of the spindle motor in respective directions to bring a portion of an inside circumference of a concentric center hole of each of the platters in contact with an outer circumference of the spindle motor so that the center of gravity of each platter coincides with a center axis of the spindle motor.

Abstract: A component conveying device is provided in which a lead component and a second component behind the lead component can be reliably separated and the lead component can be readily extracted with reduced error. The device includes a guide groove 6 for guiding and aligning the components P in a single line. A blade 5 is provided which moves back and forth in the groove. The components P are conveyed forward by moving the blade 5 forward at a low speed and then moving the blade backward in a high speed. A first stopper 31 holds a second component at the distal end of the device. A second stopper 41 stops the lead component P1 from moving back and forth, and a shutter 43 includes a magnet 49 for attracting the lead component. The second stopper is provided at a distal end portion of the guide groove 6.

Abstract: The invention relates to an insertion/extraction tool for inserting and extracting printed circuit boards from a card cage. The invention uses fewer parts than the prior art and reduces bending stress on the printed circuit board by simultaneously applying the insertion or extraction force to both sides of the plane of the printed circuit board.

Abstract: An apparatus for merging magnetized magnet segments to form a composite magnet for assembly in a voice coil motor for a disc drive. The apparatus includes first and second magnet segment nests for removably supporting magnetized magnet segments for assembly. The magnet segment nests are supported for operation between first and second positions. In the first position, the first and second magnet segment nests are spaced and in the second position, the first and second magnet segment nests are located in close proximity to merge first and second magnet segments.

Abstract: An apparatus for guiding a circuit board into an electronic chassis includes a circuit board guide having an end portion. An insertion guide member is positioned adjacent to the end portion of the circuit board guide to guide the circuit board into the electronic chassis and to prevent the circuit board from contacting the end portion of the circuit board guide.

Abstract: An alignment tool for analyzing head suspension structures to minimize misalignments between a flexure and a load beam of the head suspension. The tool includes a pain of pins that are inserted in apertures of the head suspension structures. That is, alignment tool engages a proximal perimeter edge of a distal alignment aperture on one of the load beam and the flexure and a proximal perimeter edge of a elongated alignment aperture or the other of the load beam and the flexure to provide longitudinal tension between the structures during the attachment of the structures.

Abstract: A bandolier splice assembly 10 includes at least two bandoliers 20 connected by a splice member 30. Each bandolier 20 includes a bandolier strip with electrical contacts 20 secured at regular intervals by retaining sections 23. The splice member 30 is inserted into the trailing end of a first bandolier and into the leading edge of a second bandolier so that the electrical contacts 24 can be continuously fed to an assembly machine or operating station without any down time for changing bandoliers 20. The flat splice member 30 includes resilient legs 33 separated from the remaining body of the splice member 30 by slots. Each leg 33 includes a tooth 37 with inclined camming surface 38 for deflecting the flexible leg 33 and a gripping surface 39 to engage endmost retaining sections 23. A splice stop member 36 positions the two bandoliers 20 relative to each other so that the electrical contacts continue to spaced on the same regular intervals for sequential input to an operational station or machine.

Abstract: This invention provides an electronic component sucking method in which the movement of a component supply table (15) can be increased without increasing tact time, thereby improving the mounting efficiency of electronic components (2, 4). According to this invention, the movement disabled period of the component supply table (15) is set on the basis of the height of an electronic component (2, 4) in order that the interlock time for a low electronic component (4) can be set to be shorter and the movement enabled period of the component supply table (15) can be set to be longer. Therefore, a low electronic component (4) can have a shorter tact time, thereby improving the overall mounting efficiency of electronic components.

Abstract: A component supply apparatus includes a rectangular cross-sectional component passage which can house a plurality of chip components in a longitudinal direction, and at a first side surface of the tip of this component passage a rectangular-shaped component discharge opening is formed, and at a second side surface opposing the first side surface of the tip of the component passage a rectangular-shaped pusher insertion opening is formed. Inserting the pusher into the component passage through the pusher insertion opening enables a forefront electronic component to be pushed by the pusher and be discharged outside from the component discharge opening in a predetermined direction.

Abstract: A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects.

Abstract: A universal fixture has an alignment surface which temporarily holds a heat sink for installation of a plurality of electrical devices on its working surfaces. The fixture rotates about an axis to place an alignment surface in a first or second mounting position corresponding to a generally vertical orientation of the alignment surface. This corresponds to a horizontal position of the opposite first and second sides of the heat sink temporarily mounted thereon. Double rows of openings in the rotatable alignment member are universal in the sense they are configured to accept connection pins of the common packages to be clamped against the opposite sides of the heat sink. This permits one fixture to accommodate a variety of devices and arrangements. A unique standoff device supports smaller packages above the alignment surface to permit clamping across larger and smaller electrical devices without the necessity of attempting to manipulate and hold the devices by hand during the clamping operation.

Abstract: An apparatus for mounting electronic components includes a moving rail for moving a substrate back and forth, a plurality of part feeders disposed along a side of the moving rail, a plurality of transfer head guide rails installed in a direction orthogonal to a moving direction of the substrate along the moving rail, and a plurality of transfer heads fitted to each of the transfer head guide rails for picking up, transferring and mounting onto the substrate the electronic components from the part feeders while moving along the transfer head guide rails. In a method of mounting electronic components, the electronic components are picked up from part feeders disposed along a side of the moving rail by a nozzle of the transfer head which moves along the transfer head guide rail disposed orthogonally to the moving rail, transferred and loaded onto a substrate while the substrate is moved along the moving rail.

Abstract: Disclosed is a method of releasably attaching a ribbon cable to a hardware device. In one embodiment, the method comprises attaching the ribbon cable to a ribbon cable connector having an internal retaining mechanism, coupling the ribbon cable connector to a mating connector on the hardware device, and actuating the internal retaining mechanism so that the internal retaining mechanism engages the mating connector to thereby inhibit the mating connector from uncoupling from the hardware device. The method allows a user to easily and securely attach a ribbon cable to a hardware device.

Abstract: An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.

Abstract: A clamp assembly holds an integrated lead suspension during assembly. The clamp assembly has a number of features for precisely positioning the integrated lead suspension while transducer heads are being mechanically and electrically connected to it. The clamp assembly works in conjunction with a stationary platform which restricts movement of the suspension in three directions. The clamp assembly includes upper and lower support plates which compensate for lateral misalignment, and a pair of clamps which independently isolate the suspension and slider while compensating for rotational misalignment.

Abstract: A fixture for making laminated integrated circuit devices from layers of integrated circuits comprises a base having support structure for at least two side body portions. The side body portions are adapted to be held in position by the support structure and project outwardly from the base in an orientation for substantially enclosing a plurality of the integrated circuit layers in a desired alignment for subsequent lamination to one another. The support structure enables the side body portions to be spaced from one another and have only one degree of freedom of movement toward and away from one another, enough to accommodate some dimensional differences between the plurality of integrated circuit layers. A retainer holds the side body portions in a fixed relative position providing the desired alignment for the subsequent lamination. The retainer biases the side body portions toward one another.

Abstract: An apparatus and method for fabrication and testing of a magnichanical sensor for proper operation in detecting the presence of a snap ring during manufacture of an object having the snap ring for clasping a bearing. The magnichanical sensor is comprised of a magnetic field generator and a magnetic switch that are properly aligned on a sensor circuit board. The present invention adjusts a second position of the magnetic switch with respect to a first position of the magnetic field generator on the sensor circuit board. The present invention includes an indicator assembly coupled to the magnetic switch for indicating when the second position of the magnetic switch is properly aligned with respect to the first position of the magnetic field generator on the sensor circuit board. The second position of the magnetic switch with respect to the first position of the magnetic field generator is adjusted for proper alignment for both situations when the snap ring is present and when the snap ring is not present.

Abstract: A component feeding device located on a rear side of an apparatus body includes a component feed table circulation path within a vertical plane, and a plurality of movers as well as table lifting mechanisms for moving independently a plurality of component feed tables placed within the circulation path. By this arrangement, the component feeding device does not need to be upsized even if the number of components is increased. Also by this arrangement a speedup of component feeding is achieved. By providing a component exchanging device for pulling out a component feed table from a takeout position of the circulation path and transferring it up to an exchange position on a front side of the apparatus body, it is possible to carry out the exchange of the component feed tables on the front side of the apparatus body.

Abstract: A system for performing an operation for a circuit substrate, including a plurality of main conveyors each of which conveys, positions, and supports a circuit substrate, the plurality of main conveyors being arranged in a direction perpendicular to a circuit-substrate conveying direction in which the each main conveyor conveys the circuit substrate, an operation performing device which performs at least one operation for the circuit substrate positioned and supported by the each main conveyor, at least one of (a) a carry-in conveyor which conveys the circuit substrate to the each main conveyor and loads the circuit substrate thereon, and (b) a carry-out conveyor which loads the circuit substrate off the each main conveyor and conveys the circuit substrate away therefrom, and a conveyor shifting device which selectively shifts the at least one of the carry-in conveyor and the carry-out conveyor to one of a plurality of shift positions at each of which the one conveyor is aligned with a corresponding one of the

Abstract: For mounting a connector (2) to a board (1) with the use of a clip (3), a mounting apparatus (5) includes a board holder (51) for holding the board to extend in a first direction, a clip holder (53) for holding the clip to be opposite to the board in the first direction, and a connector holder (52) for holding the connector between the board and the clip. The clip holder is movable relative to the board holder in the first direction. The connector holder is movable relative to the board holder and to the clip holder in the first direction and is turnable around a predetermined axis extending in a second direction perpendicular to the first direction. The connector holder has a holder angle controlled around the predetermined axis in accordance with relative movement between the connector holder and the clip holder in the first direction.

Abstract: A component mounting apparatus having first and second supply areas juxtaposed to the working area so that components may be selected from either supply area while replacement is being made of spent components at the other supply area.

Abstract: A wire harness handling and storage system particularly suitable for use in connection with automated harness making machines includes a harness unloading mechanism that unloads a completed wire harness from the harness-making machine and a storage cart that receives a plurality of completed wire harnesses in a plurality of storage racks maintained at different elevations on the storage cart. The handling and storage system is adaptable to handle both short wire harnesses about 6 inches in length) to longer wire harnesses (about 10 feet in length) without tangling or damage to connectors applied to the wires of the wire harnesses. For unloading and placing the longer wire harnesses, a gripping mechanism is provided that picks up the wire harnesses and places on the storage cart in a controlled movement. The unloading and gripping mechanisms are linked with a controller knows the length of the storage areas of the cart for proper, high-density loading thereof.

Abstract: An apparatus for automatically connecting prepared wires to a connector (plug or socket) is described. The prepared wires have a terminal on at least one end. A connector holder is provided for holding the connector in position. A chuck is provided for taking a prepared wire from a storage case. The wire is transferred to a rotator for correcting the rotational angle of the wire and its associated terminal. The wire is gripped by another chuck, which inserts it into the connector.

Abstract: A device for manufacturing a rotor for an electric machine, for example, a permanent-magnet excited rotor for a high-speed a.c. machine, the rotor including an inner part constituting a rotor body and an outer part including a capsule tube which, when the rotor is completed, surrounds the rotor body with a shrinkage fit, the device including a counter-support (6) for fixing one of the first and second parts of the rotor in the vertical direction, and a guide channel (7) through which the other of the two parts moves due to gravity against the fixed part.