Abstract: A stacked integrated circuit assembly and method of fabricating the same are disclosed. The assembly includes a plurality of insulating substrate layers each supporting one or more embedded integrated circuit chips. The substrates each incorporate substantially identical conductive patterns formed on the insulating layer surface and/or on an insulating film that covers the substrate. A plurality of apertures are then formed which intersect the patterns, followed by insertion of IC chips into the apertures. The insulating layer is then cut to form a plurality of segments which are subsequently stacked vertically to form a module.

Abstract: Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.

Abstract: A method and apparatus for equipping micropacks on a substrate wherein the micropacks are supplied on a band from a supply reel and are cut from the band in a cut-out device. As the micropack is cut, a suction pipette or suction head of a positioning device engages the micropack as it is cut so that the orientation of the cut micropack is always known. The method and apparatus may include a bending or shaping of the external contacts of the micropack prior to the micropack being cut from the band.

Abstract: A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.

Abstract: A coupling plate with a plurality of electric coupling points comprises, in a preferred embodiment, a pair of plane plates (10, 12), between which there is provided an electrically insulating carrier layer (11), on which a pattern of electrically conducting areas (21-26) is provided. In the preferred embodiment, an electric coupling point is provided for each mechanical coupling stud (15) projecting from the upper side of the top plate (10). The studs (15) are hollow and flush with projections (19) on the lower plate (12) so that punched parts of the electrically conducting areas (20, 22, 24, 26) are just moved into the hollow coupling studs by means of the projections (19) on the lower plate (12), thus making the conducting areas accessible through cuts (16) in the coupling studs (15). The invention also concerns a method of producing such a plate and a board consisting of a plurality of interconnected plates of said type.

Abstract: A TAB (Tape Automated Bonding) process uses single-layer tapes to form a semiconductor structure. Beam leads on a metal tape are "inner-lead bonded" to a chip. Each chip site on a specially-formed plastic tape has a central portion and a peripheral portion which are bonded to the chip so that the central portion forms a protective cover over the chip and the peripheral portion acts as a support for the beam leads during probe testing, excising and forming operations, etc. The bottom surface of the chip preferably remains uncovered so that it can, if appropriate, be electrically connected to ground or another potential.

Abstract: A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.

Abstract: An encapsulated die package (20) is shown in which a semiconductor die is connected in a die-attach aperture of a copper foil tape (11). Die contact pads (31) are bonded to the inner ends (31a) of interconnected finger contacts (13) on the tape. Finger contacts etched in the foil include splayed out portions (15) extending to probe ends (19). Interconnect cross-links (16) initially connect the finger contacts and the tape edges and function as dam bars in subsequent encapsulation steps. The die and die bonds are mold encapsulated to form the die package (20) and a carrier frame (17) is simultaneously molded around and spaced from the periphery of package (20). The probe ends are exposed within a slot (34) in the frame or extend from the ends of the frame so that probe tips can be pressed thereon to test the die and its bonds. Prior to testing, the interconnects exposed in the annulus between the package and the carrier are blanked out so that each finger leading from a die contact pad becomes discrete, i.e.

Abstract: A connector assembly for an anti-skid hydraulic braking system comprises a bulkhead connector extending through an aperture in a sidewall of the brake fluid reservoir, a connector harness mounted along the inside of the reservoir sidewalls extending from the bulkhead connector to three solenoid assemblies mounted on the reservoir floor, and a solenoid connector one each solenoid assembly in engagement with the connector harness. The solenoids extend through floor apertures into the master cylinder to respective hydraulic lines extending to brake cylinders in the wheels, one of the solenoids handling both rear wheels. The bulkhead connector mates with a connector outside the reservoir which is terminated to a wire harness connected to the on-board microprocessor to relay current to the solenoids when data from individual wheel speed sensors is processed to determine that a particular wheel is about to skid.

Abstract: A strip of electrically insulating foil (15) is subdivided into successive foil parts (23) separated by folding lines (21) and folded against each other along the folding lines. Each foil part has on one of its major surfaces a conductor track (25) which forms a curved meander-like line extending in a number of pole-forming curves (33) connected by connection members (31). The conductor tracks (25) on the foil parts (23) are connected together by connection tracks (27). The curves (33) cooperate with the connection tracks (27) and the connection members (31) to form coils arranged in a circle. The winding is particularly suitable as a stator winding for a flat direct current motor.

Abstract: A lead frame that is suited for use on array types of integrated circuit packages to provide a high degree of compliance for absorbing mechanical stress induced by thermal changes includes a series of individual terminal elements that are connected in a strip form by means of break tabs disposed between adjacent elements. Each terminal element provides two spaced, generally parallel mounting surfaces that are resiliently connected to one another by means of an integral intermediate section. While the terminal elements are interconnected in strip form, one of the mounting surfaces of each element can be bonded to an associated attachment region on the semiconductor substrate. After all of the terminals of the strip have been so bonded, the break tabs between adjacent terminals can be removed to thereby separate the terminals from one another. The package which then results contains discrete compliant terminals which are suitable for subsequent surface attachment to the printed circuit board.

Abstract: The present invention is a method for packaging and protecting an integrated circuit chip on a carrier tape. A carrier tape comprising at least two bonded layers (one layer being made of an electrically conductive material) includes small flat leads in the conductive layer. A carrier bridge or frame of nonconductive material is bonded to one surface of the leads and is connected to a nonconductive layer (or a part of) the tape. The electrical pads of an integrated circuit are bonded to the respective leads of the tape simultaneously. The leads are cut at a predetermined length from the chip and outside of the frame. The lead ends are bent to form a nest. A planar base is adehered to the surface of the chip having the electrical pads. The leads are then bent over the base to secure the base on the tape and provide electrical contact points to the chip. The chip is coated with a suitable material and to provide insulation and encapsulation of the entire packaging structure.

Abstract: The invention relates to microcircuit cards, used for electronic transactions or other purposes, and concerns a process for mass producing electronic modules to be used in these cards and the modules obtained according to this process. According to the invention, there are fabricated, on the one hand, a metal grid with a plurality of openings into which there penetrate tongues attached to the frame of this grid and intended to form the modules' contact areas, and, on the other hand, pellets of plastics material which have a generally flat front face, a rear face in which there is a hollow and, between this hollow and the front face, windows so arranged that they can be positioned opposite the grid tongues.

Abstract: A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP.

Abstract: An apparatus (24) for gripping a multilead article (18) and inserting the leads (20--20) thereof into corresponding apertures (22) in a printed circuit board (12) comprises a plate (26) underlying a block (30) spring biased thereagainst. The block (30) has a pair of parallel, spaced-apart jaws (38, 40) mounted to opposite sides thereof so as to depend below the plate. At least one jaw (40) is movable towards or away from the other to capture the article (18) therebetween. The jaws (38, 40) each have one of a pair of opposing combs (50) thereon, each comb having spaced-apart slots (52) therein for seating each of the leads of the article captured between the jaws. To insert the article (18), the gripping apparatus (24) is moved by a robot arm (29) to a predetermined location above the circuit board (12) so that each slot (52) in each comb (50) is aligned with a corresponding aperture (22).

Abstract: An electrical connection between two semiconductor devices employs a coplanar microstrap waveguide comprising a plurality of thin straps of conductive metal embedded in a polyimide substrate and dimensioned to exhibit the properties of a coplanar waveguide. The waveguide structure provides the proper impedance matching between the two devices and enables them to handle signals having frequencies in the gigahertz range.

Abstract: A system for automatically inserting the leads of electrical components into circuit boards is disclosed. In the preferred embodiment, an electrical component is acquired by the robot. The leads of the component have been trimmed and preformed such that they are substantially parallel with respect to each other with the leads differing in length. The robot positions the component at a fixed location relative to the axis of the robot and within the view of an optical sensor such as a TV camera. The sensor determines the location of each of the leads relative to a fixed location. A first rotary motion rotates the component about a selected axis of the robot through a predetermined angle and a second measurement is made. A second rotation positions the component 180.degree. from the original position and a third measurement is made.

Abstract: The present invention relates to an apparatus and method for rapidly and accurately inserting axial lead components such as capacitors and resistors or the like into printed circuit boards mounted in an X-Y PC board positioning device. In accordance with the invention a plurality of magazines each of which contain a multiplicity of the components are loaded into a receiver chute of the apparatus. The apparatus functions, responsive to a signal from the PC positioning device, to remove an individual component from a magazine, deflect the leads to a position at right angles to the body of the component and insert the thus formed leads accurately into spaced apertures of the PC board which have been maneuvered by the X-Y apparatus to a component receiver station. The device includes means for automatically removing exhausted magazines and replacing the same with filled magazines.

Abstract: A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.

Abstract: A multilamp photoflash array and fabrication process is provided wherein electrically conductive leads of a plurality of flashlamps are embedded in and wrapped about the ends of a plastic reflector unit which is, in turn, affixed to a circuit board to provide contact between the bent leads and a printed circuit on the circuit board.

Abstract: An electronic component lead straightening device and method for conditioning, or reconditioning, electronic devices having an elongated body portion of possible different sizes and materials, and a plurality of metal leads extending from opposite edges of the body portion. The leads, for appropriate use of the electronic component in a circuit, such as a printed circuit on a mounting board, requires their disposition at a preferred predetermined angle to the body, and in substantial parallel mutual relationship, one to another.

Abstract: An electrical connector assembly (10) and method of making wherein the connector does not require a separate contact but comprises end strands (52) of a multistranded electrical conductor (wire 50). The strands (52) are formed into a loop (56) having overlapping portions (57) and the overlapping portions are secured together by a weld. The forward portion of the strands (52) are straightened into axial alignment and the ends (53) of each strand cut and provided with angled end surfaces (54). The conductor (wire) so prepared is inserted into a molded housing (20) having two mating halves (30, 40), at least one of which is provided with a channel (33) including a loop cavity (62) and a projection (60). The loop (56) of the conductor is mounted over the projection and the two connector halves secured together to complete the connector assembly.

Abstract: A method for the manufacture of a radiant electrical heater, intended more particularly for heating glass ceramic hotplates, comprises so inserting or pressing helical heating resistors in helical slots in a support, such that the support or the heater coils themselves are deformed and consequently fixed to the support. The coils penetrate the wall or bottom areas of the slot or are otherwise secured by parts of the support by positive engagement. An apparatus for performing the method has a tool with ribs which deforms the support or heater coils for positive engagement.A radiant heater is obtained, whose support has partly overlapping deformations in the slot area of the heater coils.

Abstract: A circuit board assembly and method of making wherein the assembly includes a dielectric substrate, at least one radiation sensitive switch, and at least one conductive member in electrical contact with the switch. Portions of the switch and the conductive member are die-stamped into the dielectric substrate to achieve the contact without serving the switch material.

Abstract: This is directed to an electronic circuit apparatus using a flexible printed wiring board having a conductive leaf formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is formed on the periphery of the flexible base material. An electronic parts is mounted and connected to the circuit conductive leaf. Since the flexible base material is extremely thin and flexible, the electronic circuit apparatus can be constructed smaller and thinner.

Abstract: An apparatus for inserting electric components, which have a plurality of lead wires arranged in two rows in an approximately same direction, into a circuit board, characterized in that the automatic apparatus has a taking-out chuck unit provided with a pair of forming levers for spreading the tip ends of the lead wires arranged in the two rows, a driving source for the taking-out chuck unit, an insertion chuck unit for receiving and retaining the electric components from the taking-out chuck unit to insert them into the circuit board, and a component feed portion for feeding the electric components, in a given order, to the components taking-out position for the taking-out chuck unit.

Abstract: An apparatus is provided for individually selecting a number of dual in-line (DIP) components and sequentially inserting them into a printed circuit board. The apparatus has a basic mode of operation, under a program control, and comprises a shuttle assembly and a component insertion assembly. In operation, the shuttle assembly transfers a component from a selected one of a plurality of magazines to an unload station. At the unload station, the shuttle assembly loads the insertion assembly which rotates to a vertical position for insertion of the component in a printed circuit board. The printed circuit board is mounted on an X-Y positioning system controlled by a tape reader or a computer which also determines the automatic sequencing of the shuttle assembly.

Abstract: An electronic watch module and method of manufacturing the module. The module is formed from a flexible film by forming a set of appropriately located, sized and shaped component openings in the film, forming a second set of terminal lead bonding openings for the components, securing a metallic foil to said film, removing portions of said foil to form a pattern of interconnection leads for said components leaving portions over said bonding openings, locating the components in the respective openings with the component leads in registry with their respective interconnection leads, and bonding the foil leads to the component leads through the bonding openings.

Abstract: A method of inserting electronic components to a printed circuit board including steps of (a) holding a pair of lead wires of an electronic component by a chuck, which is open-and closable in a perpendicular direction to a plane including the pair of lead wires, with an inter-lead-wire distance identical to the distance between the lead wire inserting holes in the printed circuit board; (b) inserting thus held lead wires into targeted lead wire inserting holes; and (c) applying a clinching treatment to the lead wires protruded to the back side of the printed circuited board, wherein an electronic component is, regardless of the size of the inter-lead-wire distance, held by a chuck such that one of the lead wires is located at a certain preset base position biased to either side of the chucking surface of the chuck, and the printed circuit board and the chuck are relatively positioned, when the lead wires held by the chuck are about to be inserted, such that already inserted (planted) components are positioned