Abstract: An apparatus configured for insertion into a sensor port of a flow cell is described herein. The apparatus includes an insert body, a sensor located in the cavity of the insert body, and an insert body holding nut and a sensor holding nut threaded to the interior surface of the sensor port.

Abstract: A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit.

Abstract: An actuator includes a drive beam; a lower electrode formed on the drive beam; a piezoelectric element provided on the lower electrode; an upper electrode provided on the piezoelectric element; an upper wiring connecting the upper electrode and a wiring for supplying a voltage to the upper electrode; and an insulating part providing electrical insulation between the upper electrode and the lower electrode and formed under the upper wiring such that it covers an end of the lower electrode. The insulating part includes insulating extension parts extended on opposite sides of the upper wiring in a width direction of the upper wiring.

Abstract: A piezoelectric element is provided with an element body, which has a pair of principal faces opposed to each other and an end face extending in a direction in which the pair of principal faces are opposed to each other, so as to connect the pair of principal faces, and which is comprised of a piezoelectric ceramic material; a pair of electrodes arranged respectively on the pair of principal faces; and a resin covering an entire area of the end face and arranged so as to make contact with the pair of electrodes. The resin has two edges in the aforementioned direction projecting outward in the aforementioned direction from the respective electrodes.

Abstract: A piezoelectric vibrating device and a piezoelectric vibrating piece including an excitation unit, a framing portion and a connecting portion are provided. The excitation unit includes a first side extending in a first direction and a second side extending in a second direction. The connecting portion has a thickness of a first thickness in a third direction perpendicular to the first direction and the second direction. The excitation unit includes a first region, a second region and a third region. The pair of excitation electrodes are disposed on the first region. The second region with the first thickness is directly connected to the connecting portion. The third region is disposed between the first region and the second region. The third region has a thickness in the third direction of a second thickness. The second region has a thickness in the third direction that is thicker than the second thickness.

Abstract: Provided is an oscillator including a piezoelectric vibrator (10), a vibration member (20) that constrains the piezoelectric vibrator (10) on one surface thereof, an elastic member (40) that is provided on one surface of the vibration member (20) or the other surface opposite to one surface and provided so as to be located between edges of the piezoelectric vibrator (10) and the vibration member (20) when seen in a plan view, a fixing member (42) that is provided on one surface or the other surface of the vibration member (20) and provided so as to be located between the piezoelectric vibrator (10) and the elastic member (40) when seen in a plan view, and a supporting member (30) that supports the vibration member (20) through the elastic member (40) and the fixing member (42).

Abstract: An oscillation device which contributes to the demand for downsizing/miniaturization and commercial production, and provides highly reliable oscillation frequency is provided. The oscillation device includes a base substrate provided with an oscillation member, a lid member that contains the oscillation member in a cavity, an adhesion layer that has a first melting point and connects the base substrate with the lid member, and a metal layer that has a second melting point higher than the first melting point and covers the base substrate, the adhesion layer and the lid member.

Abstract: A fabrication method of an acoustic wave device includes: forming acoustic wave elements on a first substrate; forming protrusion electrodes and seal rings on the first substrate simultaneously by an electrolytic plating method, the protrusion electrodes being electrically connected to the acoustic wave elements, each of the seal rings surrounding related acoustic wave elements out of the acoustic wave elements and related protrusion electrodes out of the protrusion electrodes electrically connected to the related acoustic wave elements; and cutting a plating power-supply line used in the electrolytic plating method in a step of dividing the first substrate into pieces each including a corresponding one of the seal rings so as to electrically separate the related acoustic wave elements from the corresponding one of the seal rings.

Abstract: An electronic device includes: a first-member that includes a through-hole; a second-member that includes a connection-hole and that is in contact with the first-member in a state where the through-hole and the connection-hole are in communication with each other; a first-locking-surface that is formed on the first-member while extending radially outside of the through-hole and that faces a side opposite to the connection-hole-side; a second-locking-surface that is formed in the second-member while extending radially outside of the connection-hole and that faces a side opposite to the through-hole-side; and an adhesive-portion including a shaft-portion with which the through-hole and the connection-hole are filled, a first-large-diameter portion that is formed at an end of the shaft-portion and secured to the first-locking-surface, and a second-large-diameter portion that is formed at the other end of the shaft-portion and secured to the second-locking-surface.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: An electronic device includes a substrate; a first thin-film element formed on the substrate and having a lower electrode, a first upper electrode and a first thin-film part disposed between the lower electrode and the first upper electrode; and a second thin-film element formed on the substrate and having the lower electrode, a second upper electrode and a second thin-film part disposed between the lower electrode and the second upper electrode. Film thicknesses of the first and second thin-film parts are different from each other. The first thin-film part is formed by applying a precursor solution using a printing method to form a first precursor thin-film and imparting energy to the first precursor thin-film, and the second thin-film part is formed by applying the precursor solution using the printing method to form a second precursor thin-film and imparting energy to the second precursor thin-film.

Abstract: Embodiments of the invention provide a piezoelectric actuator module, which includes a multilayer part comprising a multilayer piezoelectric material part and an electrode part connected to the multilayer piezoelectric material part, and a support layer coupled with the multilayer part. The piezoelectric actuator module further includes a support part displaceably supporting the support layer. The multilayer piezoelectric material part is poled in the same direction, and the multilayer part is configured to expand or contract when voltages in anti-phase are applied to the electrode part.

Abstract: A parking sensor device has a casing, a front cover, a sensor module and an assembling clamp. The casing has two first hooking elements. The front cover is mounted on the casing. The sensor module is mounted in the casing and the front cover. The assembling clamp detachably engages the casing and has two second hooking elements. The second hooking elements selectively hook the first hooking elements of the casing respectively. The casing and the assembling clamp are engaged quickly with each other, thereby facilitating the easy fabrication of the parking sensor device and improving the convenience of maintenance of the parking sensor device.

Abstract: A crystal device is provided, in which a peeling of a bonding material is prevented by using the bonding material having a thermal expansion coefficient which is between the coefficients in a first direction and a second direction of a bonding surface of a crystal element. A crystal device includes a rectangular crystal element formed with a crystal material that includes an excitation part and a frame surrounding the excitation part. The device further includes a rectangular base bonded to a principal surface of the frame, and a lid bonded to another principal surface of the frame; and the frame, the base and the lid have edges respectively along a first direction and a second direction intersecting with the first direction. The bonding material is applied having a thermal expansion coefficient that is between the coefficients in the first direction and second direction of the crystal element.

Abstract: In a method for manufacturing at least one mechanical-electrical energy conversion system including multiple individual parts, and a mechanical-electrical energy conversion, multiple different individual parts are positioned in an assembly device and joined in joining areas assigned to the individual parts in the assembly device, the individual parts including at least one piezoelectric element, one support structure and one seismic mass.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z? axis is provided in a tip section of the piezoelectric substrate.

Abstract: A piezoelectric vibrating piece includes an excitation unit in a rectangular shape, a framing portion, a connecting portion, and a protrusion. The excitation unit includes a pair of excitation electrodes on the pair of principal surfaces, a first side that extends in a first direction, and a second side that extends in a second direction. The second side is longer than the first side. The second direction is perpendicular to the first direction. The connecting portion connects the first side of the excitation unit to the framing portion. The connecting portion is thinner than the framing portion. The protrusion protrudes in the thickness direction in at least one of the connecting portion and a region between the connecting portion and the excitation electrode. The length of the protrusion in the first direction is equal to or longer than a length of the connecting portion in the first direction.

Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.

Abstract: A piezoelectric device capable of adjusting shape/position of connection electrodes is provided to accommodate a first or second oscillating plate (piezoelectric). The second oscillating plate is shorter than the first oscillating plate, each oscillating plate includes an excitation and an extraction electrodes. The extraction electrode is electrically connected with a connection electrode via conductive adhesive agent in a package. The package includes a carrier section, carrying the first or the second oscillating plate thereon. The connection electrode is disposed on at least a portion of a surface of the carrier section. When the extraction electrode of the first oscillating plate is electrically connected with the connection electrode, the excitation electrode on one side of the first oscillating plate is not electrically connected with the connection electrode on the other side. The extraction electrodes of the second oscillating plate can be electrically connected with the connection electrodes.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A resonator includes: a package; a support section that is provided on a surface of the package; and a vibration element in which an attachment section, which is disposed between an outer edge of a vibration substrate, in which excitation electrodes are provided on main surfaces thereof, and an outer edge of the excitation electrode, is attached to the support section through a conductive adhesive. The attachment section is disposed in a region S obtained by rotating a virtual line which connects the center of the vibration element and one end of the vibration element, in a range of ?35° to +35° of a rotation angle ? about the center, and an attachment area becomes 0.7 mm2 or more.

Abstract: Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.

Abstract: A mesa-type quartz-crystal vibrating piece includes a vibrator in a quadrangular shape with both main surfaces, a pair of excitation electrodes on both the main surfaces, a thin portion outside of the quadrangular shape, and a pair of extraction electrodes. The thin portion has a thickness thinner than a thickness of the vibrator. The pair of extraction electrodes are extracted from the excitation electrodes to a predetermined direction. A center of a first length in the predetermined direction of the excitation electrode is decentered from a center of a second length in the predetermined direction. The second length includes a length of the vibrator and a length of the thin portion. The center of the first length is decentered toward an opposite side of the extraction electrode by 25 ?m to 65 ?m.

Abstract: A piezoelectric device, in which one of a first plate, a second plate, and an adhesive agent is colored for confirming a bonding status of the adhesive agent, and a manufacturing method thereof, are provided. A piezoelectric device includes a piezoelectric vibrating piece that vibrates by applying a voltage; a first plate and a second plate formed of glass and seal the piezoelectric vibrating piece; and an adhesive agent which bonds the first plate with the second plate, wherein one of the first plate, the second plate, and the adhesive agent is colored.

Abstract: A piezoelectric device is provided with a rectangular crystal piece having driving electrodes on front and back main faces thereof, and a base member having two electrode pads near one short side of the crystal piece. The crystal piece is supported on the base member by two support portions near one short side thereof, and by an auxiliary support portion on the other short side thereof. A position of the auxiliary support portion relative to the other short side, where L is a distance between two short sides, and H is a distance from the other short side to a peripheral edge of the auxiliary support portion nearest to the other short side, is set to a position at which the distance H stays in a range of distances in which a maximum tensile stress acting on the auxiliary support portion and a maximum von Mises stress of the crystal piece are within predetermined ranges.

Abstract: A vibrating reed includes a vibrating body (a base portion, a vibrating arm, and a detection arm) and a support portion that supports the vibrating body via a plate-like coupling portion. In both principal surfaces of the coupling portion, grooves (a first groove and a second groove) are disposed. The first groove arranged in one of the principal surfaces of the coupling portion and the second groove arranged in the other principal surface are arranged at positions different from each other in plan view.

Abstract: A composite substrate 10 includes a supporting substrate 12 and a piezoelectric substrate 14 which are bonded to each other. In this embodiment, the supporting substrate 12 and the piezoelectric substrate 14 are bonded to each other by an adhesive layer 16. In the composite substrate 10, since the supporting substrate 12 is composed of a translucent alumina ceramic, alignment is easily performed during FCB compared with the case where the supporting substrate is composed of an opaque ceramic. Furthermore, preferably, the linear transmittance and the total light transmittance from the front of the supporting substrate 12 in the visible light range (360 to 750 nm) are 10% or more and 70% or more, respectively.

Abstract: A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.

Abstract: A piezoelectric vibrating piece includes a first extraction electrode and a second extraction electrode. The first extraction electrode is extracted from an excitation electrode formed on one principal surface to a framing portion via one principal surface of a connecting portion. The second extraction electrode is extracted from the extraction electrode formed on another principal surface to the framing portion via another principal surface of the connecting portion, a side surface of the connecting portion, and the one principal surface of the connecting portion. A distance between a first side and a second side at the framing portion is larger than a distance between the first side and the second side at the connecting portion. The first side is a side of the first extraction electrode at the second extraction electrode side. The second side is a side of the second extraction electrode at the first extraction electrode side.

Abstract: A composite substrate 10 includes a piezoelectric substrate 12 and a support layer 14 bonded to the piezoelectric substrate 12. The support layer 14 is made of a material having no crystalline anisotropy in a bonded surface thereof and has a smaller thickness than the piezoelectric substrate 12. The piezoelectric substrate 12 and the support layer 14 are bonded together with an adhesive layer 16 therebetween. The composite substrate 10 has a total thickness of 180 ?m or less. The base thickness ratio Tr=t2/(t1+t2) is 0.1 to 0.4, where t1 is the thickness of the piezoelectric substrate 12, and t2 is the thickness of the support layer 14. The thickness t1 is 100 ?m or less. The thickness t2 is 50 ?m or less.

Abstract: A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece with a pair of excitation electrodes, a base plate, and a non-conductive bonding material. The base includes a pair of castellations that are hollowed into a side face from the mounting surface to the bonding surface. The pair of castellations include a first surface and a second surface. The first surface extends outward from the mounting surface toward the bonding surface side. The second surface extends outward from the bonding surface toward the mounting surface side. The second surface has a smaller area than an area of the first surface. A wiring electrode is disposed on the first surface, the second surface, and a side face of the bonding material. The wiring electrode is of a same electrode layer as the external electrode. The wiring electrode extends from the external electrode to the extraction electrodes.

Abstract: An oscillator device includes: a structural layer extending over a first side of a semiconductor substrate; a semiconductor cap set on the structural layer; a coupling region extending between and hermetically sealing the structural layer and the cap and forming a cavity within the oscillator device; first and second conductive paths extending between the substrate and the structural layer; first and second conductive pads housed in the cavity and electrically coupled to first terminal portions of the first and second conductive paths by first and second connection regions, respectively, which extend through and are insulated from the structural layer; a piezoelectric resonator having first and second ends electrically coupled, respectively, to the first and second conductive pads, and extending in the cavity; and third and fourth conductive pads positioned outside the cavity and electrically coupled to second terminal portions of the first and second conductive paths.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.

Abstract: An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering the a side surface of the terminal (15). The terminal (15) comprises, in a first region in the height direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).

Abstract: A transducer includes a preload adapter having a sleeve portion and an end and a housing including a seating portion and a shaft portion that extends from the seating portion. The transducer also includes a piezoelectric element contained at least partially within a chamber that is at least partially defined by the sleeve portion and shaft portion and a diaphragm coupled to an external side of the end such that motion of the piezoelectric element causes motion of the diaphragm.

Abstract: A piezoelectric resonating element includes a piezoelectric substrate that includes a rectangular vibrating section and a thick section integrally formed with the vibrating section, excitation electrodes, and lead electrodes. The thick section includes a first thick section and a second thick section of which one end is formed continuous to the first thick section. The first thick section includes a first inclined section of which the thickness changes and a first thick section main body of a quadrangle column shape, and at least one slit is provided in the first thick section.

Abstract: A piezoelectric vibrator element includes a vibrating portion that excites thickness-shear vibration, and a peripheral portion that is disposed on the periphery of the vibrating portion and has a thickness thinner than the vibrating portion, the vibrating portion and the peripheral portion being formed in a piezoelectric substrate. A buffering portion and a mount portion are sequentially connected to the peripheral portion. The buffering portion includes a slit formed between the mount portion and the peripheral portion. The mount portion has notches which are formed at both end portions in a direction orthogonal to an arrangement direction of the mount portion, the buffering portion, and the peripheral portion.

Abstract: Disclosed herein are a piezoelectric actuator module and a method of manufacturing the same. The piezoelectric actuator module includes: a plate; a piezoelectric element disposed on the plate and having a through-hole formed therein; and a feeding wire inserted into the through-hole to apply an external voltage to the piezoelectric element.

Abstract: A GT-cut crystal resonator that can be provided with a support portion having a small and simple configuration without adverse effect on vibration characteristics includes: a crystal plate formed in an elliptical shape with a major axis and a minor axis respectively corresponding to vibration directions of two longitudinal vibration modes orthogonal to each other in a GT-cut; and a support portion that supports the crystal plate, the support portion being connected to a position on an outer periphery of the crystal plate where a minimum vibration displacement is obtained when the two longitudinal vibration modes are coupled.

Abstract: A piezoelectric element includes a substrate having a first surface with a predetermined orientation; a lower electrode layered on the first surface of the substrate; a piezoelectric thin film layered on the lower electrode and having a piezoelectric body; and an upper electrode layered on the piezoelectric thin film. A voltage is to be impressed between the lower electrode and the upper electrode to deform the piezoelectric thin film. The piezoelectric thin film is epitaxially grown on the lower electrode using a physical vapor deposition or a chemical vapor deposition.

Abstract: A piezoelectric vibrating piece includes an excitation unit in a rectangular shape, a framing portion, and a connecting portion. The excitation unit includes two principal surfaces, a pair of excitation electrodes on the principal surfaces, a first side extending in a first direction, and a second side extending in a second direction. The second side is longer than the first side, and is perpendicular to the first direction. The framing portion surrounds the excitation unit. The connecting portion connects the excitation unit to the framing portion. The connecting portion has a third side which is connected to the first side and extends in the first direction and a fourth side which is connected to the framing portion and extends in the first direction. A thickness of the connecting portion is thinner than that of the framing portion. The third side has a different length from that of the fourth side.

Abstract: A low-profile vibration device capable of generation of great vibration and a portable terminal employing the vibration device. The vibration device includes: a support body; a vibration member supported so that its periphery is connected to the support body, the vibration member having a first portion which is connected to the support body, and a second portion which is located inside the first portion and is not connected to the support body; and a vibration element whose one surface in a first direction is connected to one main surface of the second portion in the vibration member, bending vibration of the vibration element in the first direction whose amplitudes vary along a second direction perpendicular to the first direction being caused by electrical signal input.

Abstract: A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.

Abstract: A surface mount type quartz crystal device according to a first aspect of the disclosure includes a ceramic package, a pedestal blank, a quartz-crystal vibrating piece. The pedestal blank is placed within the ceramic package via a conductive adhesive. The quartz-crystal vibrating piece is placed on the pedestal blank. The conductive adhesive is formed along an outer peripheral side of the pedestal blank so as to avoid overlap with the excitation electrode viewed in a normal direction of the excitation electrode. The pedestal blank is formed to avoid a region where a distance from the quartz-crystal vibrating piece is equal to or smaller than a size of a clearance between the pedestal blank and the quartz-crystal vibrating piece at the outer peripheral side, in a region where the excitation electrode faces at the pedestal blank side viewed in the normal direction.

Abstract: A piezoelectric vibrating piece includes a vibrating portion, a framing portion, and a connecting portion. The framing portion surrounds the vibrating portion. The connecting portion connects the vibrating portion and the framing portion. The connecting portion includes an inclined surface disposed on at least one of a front surface and a back surface of the connecting portion. A boundary between the inclined surface and a flat surface is established in a middle region that is away from a connecting region of the connecting portion and the vibrating portion, and is away from a connecting region of the connecting portion and the framing portion.

Abstract: Disclosed herein is a piezoelectric vibration module including a vibration plate that is surrounded by an upper case and a lower case, and includes a first stopper capable of preventing direct collision between a piezoelectric element and an internal constituent member, for example, an upper plate while vibrating linearly therein. In particular, the piezoelectric vibration module may further include a second stopper in the lower case.

Abstract: A resonator element includes a base section, a pair of vibrating arms projecting toward the same side from the base section, and disposed side by side in a predetermined direction, a support arm projecting from the base section toward the same side as the pair of vibrating arms, disposed between the pair of vibrating arms, and having a recessed portion disposed on one principal surface, and a first electrically-conductive pad and a second electrically-conductive pad disposed side by side across the recessed portion.

Abstract: The present invention provides piezoelectric surface mount devices in which the area of the mounting terminals is reduced, leading to reduction of manufacturing cost. A piezoelectric device comprises a package base (120) including a bottom surface having a long edge and a short edge and a pair of mounting terminals formed on respective short edges of the package base. The pair of mounting terminals are separated by a predetermined longitudinal distance (X3) and are arranged as close as possible to the longitudinal center line of the package base. The predetermined distance is sufficient to prevent electrical short when mounting the piezoelectric device onto the printed substrate. The maximum width (Z2) of each mounting terminal measured in a direction parallel with the short edges of the package base is less than one half the width of the short edge (Z1).

Abstract: An acoustic resonator structure comprises a substrate having a trench, a conductive pattern formed in the trench, a pillar formed within the trench, and an acoustic resonator supported at a central location by the pillar and suspended over the trench.