Abstract: A drive mechanism for the movement of an object along an axis of motion comprises two clamping elements and a drive element disposed between the two clamping elements which enables a relative movement of the two clamping elements along the axis of motion. Each clamping element comprises a base body and two clamping jaws, wherein a piezo-actuator is disposed between the base body and at least one of the two clamping jaws, which can produce a clamping force acting on the object which is directed transversely to the axis of motion. The base bodies of the two clamping elements are connected by at least two expansible elements. The drive element comprises a further piezo-actuator, which enables the relative displacement of the two clamping elements along the axis of motion. The drive mechanism is suitable for application in a micro-valve.

Abstract: AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z?-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the ?Z?-edge of the vibrating portion. The first through-slot has a different width than the second through-slot.

Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

Abstract: The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer.

Abstract: The present disclosure provides a method of singulating a plurality of miniature ultrasound transducers from a wafer. The method includes receiving a wafer on which a plurality of miniature ultrasound transducers is formed. The miniature ultrasound transducers each include a transducer membrane containing a piezoelectric material. The method includes etching, from a front side of the wafer, a plurality of trenches into the wafer. Each trench at least partially encircles a respective one of the miniature ultrasound transducers in a top view. Each trench includes an approximately rounded segment. The method includes thinning the wafer from a back side opposite the front side. The thinning the wafer is performed such that the trenches are open to the back side. The method includes performing a dicing process to the wafer to separate the miniature ultrasound transducers from one another. The dicing process is performed without making crossing cuts in the wafer.

Abstract: A unit comprises a quartz crystal resonator having a base portion, and first and second vibrational arms, each of the first and second vibrational arms having opposite main surfaces. At least two grooves are formed in at least one of the opposite main surfaces of each of the first and second vibrational arms so that a distance in the width direction of the at least two grooves measured from an outer edge of the one of the at least two grooves to an outer edge of the other of the at least two grooves is less than 0.05 mm.

Abstract: The piezoelectric device (100) stores a piezoelectric vibrating piece (10) which vibrates whenever an electrical voltage is applied. The piezoelectric device comprises: a package lid (11) having a first peripheral surface (M1) which surrounds a plane surface in a predetermined width; and a package base (12) comprising a second peripheral surface (M2) bonded to the first peripheral surface of the package lid and a recess portion recessed from the second peripheral surface. The first peripheral surface of the package lid and the second peripheral surface of the package base are rough surfaces, respective metal films (AC1, AC2) are formed on each rough surface, and the package lid and the package base are bonded using a sealing material (LG) formed between the metal films.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A piezoelectric device includes an integrated circuit (IC) chip and a piezoelectric resonator element, a part of the piezoelectric resonator element being disposed so as to overlap with a part of the IC chip when viewed in plan. The IC chip includes: an inner pad disposed on an active face and in an area where is overlapped with the piezoelectric resonator when viewed in plan; an insulating layer formed on the active face; a relocation pad disposed on the insulating layer and in an area other than a part where is overlapped with the piezoelectric resonator element, the relocation pad being coupled to an end part of a first wire; and a second wire electrically coupling the inner pad and the relocation pad, the second wire having a relocation wire and a connector that penetrates the insulating layer, the relocation wire being disposed between the insulating layer and the active face.

Abstract: A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion.

Abstract: In a method for manufacturing a piezoelectric device while stably achieving strong bonding, a moisture-absorbing layer is formed on a bonding surface side of a piezoelectric single-crystal substrate. The moisture-absorbing layer is allowed to absorb moisture. A binder layer is formed on a bonding surface side of a supporting substrate. The moisture-absorbing layer is placed on the binder layer. A silica precursor in the binder layer is converted into silica through a hydrolysis reaction with moisture in the moisture-absorbing layer.

Abstract: A fitting structure for fitting a piezoelectric element to an actuator base that includes an opening that formed in the actuator base and accommodates the piezoelectric element, a receiver that inwardly protrudes from an inner circumferential edge of the opening and receives the piezoelectric element, a hole defined by an inner end of the receiver and communicates with the opening, a protrusion that protrudes from the inner end of the receiver onto the hole and faces the piezoelectric element through the hole, an adhesive part filled in a space defined by the piezoelectric element, the inner circumferential edge, and the receiver and is solidified in the space to adhere the piezoelectric element to the inner circumferential edge and the receiver, and a stopper formed on one of the receiver and protrusion and stops a capillary phenomenon of the adhesive between the piezoelectric element and the receiver and protrusion.

Abstract: Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.

Abstract: Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Abstract: A piezoelectric actuator and an injector for an internal combustion engine are proposed, the electromagnetic compatibility of which is significantly improved in comparison with conventional injectors. The actuator head and/or actuator foot is manufactured out of a ceramic material, thus reducing the capacitance of the electric capacitor that is formed between the electrical ground and the piezoelectric actuator. An advantage of the piezoelectric actuator according to the invention is that no additional components are required. The change from metallic materials to ceramic materials also increases the rigidity of the piezoelectric actuator since ceramic materials have a significantly higher modulus of elasticity than metals.

Abstract: A piezoelectric device has a plate-shaped substrate, a first frame defining a first concave portion at one surface of the substrate, a second frame defining a second concave portion at the other surface of the substrate, a first electrode member provided at one surface of the substrate, a second electrode member provided at the other surface of the substrate, a piezoelectric unit in which a first electrode section of the piezoelectric vibration plate is fixed to the first electrode member by a conductive binder, a cover sealing the first concave portion, and a temperature detection unit in which a second electrode section of the thermistor element is fixed to the second electrode member by a conductive joining material.

Abstract: Exemplary piezoelectric vibrating pieces have an excitation electrode and an extraction electrode having uniform thickness in the vibrating region to prevent unnecessary vibrations and degradation of vibration characteristics. An exemplary piezoelectric vibrating piece includes a vibrating portion having an excitation electrode of a first thickness (d1), an outer frame surrounding the vibrating portion with a gap therebetween, a joining portion connecting the vibrating portion and the outer frame, and an extraction electrode connected to the excitation electrode and extending on the vibrating portion, joining portion, and outer frame. The extraction electrode has the first thickness d1 throughout the vibrating portion and a second thickness (d2>d1) on the outer frame.

Abstract: In a composite substrate 10, a bonding surface 21 of a piezoelectric substrate 20 is an irregular surface which is partially planarized. The irregular surface which is partially planarized includes a plurality of protrusions 23, each having a flat portion 25 on the tip thereof. The piezoelectric substrate 20 and the supporting substrate 30 are directly bonded to each other at the flat portions 25. By forming the bonding surface 21 into an irregular surface (rough surface) and providing flat portions 25 at the same time, it is possible to secure a sufficient contact area between the piezoelectric substrate 20 and the supporting substrate 30. Accordingly, in the composite substrate in which the piezoelectric substrate 20 and the supporting substrate 30 are bonded to each other, the bonding surface 21 can be roughened and direct bonding can be performed.

Abstract: Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.

Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

Abstract: A mesa-shaped piezoelectric resonator element including a resonator section having a thicker thickness than a peripheral section on the board surface of a piezoelectric substrate formed in a rectangular shape, wherein, when the length of the long side of the piezoelectric substrate is x and the board thickness of the resonator section is t, etching depth y of a level-difference section is set to fulfill a relationship in the following equation, based on the board thickness t. y = - 1.

Abstract: A piezoelectric crystal unit includes a package including a concave portion; a piezoelectric element having a protruding electrode and disposed within the package; and an electrically conductive adhesive contained in the concave portion. The piezoelectric element is fixed to the package with the protruding electrode embedded in the concave portion of the package.

Abstract: There are provided a surface-mounted crystal oscillator and a manufacturing method thereof which can realize miniaturization, improve quality, reduce a manufacturing cost, and enhance productivity. According to the surface-mounted crystal oscillator and the manufacturing method thereof, through terminals and of AgPd are formed on wall surfaces of through holes formed at corner portions of a rectangular ceramic substrate, a metal electrode of a support electrode lower portion of AgPd which is connected to the through terminal and forms a lower layer of a support electrode is formed on a front side of the substrate, the support electrode which holds a crystal piece is formed on the support electrode lower layer portion by using Ag, and a cover is mounted on an insulating film formed on the inner side of the periphery of the substrate and effect airtight sealing.

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A method of producing a piezoelectric actuator includes a first electrode film forming process; a monomolecular film forming process; a pattering process of removing a monomolecular film having a rectangular shape; an application process of applying a precursor solution to the first electrode film exposed in the rectangular shape; a piezoelectric film forming process of converting the applied precursor solution into a piezoelectric film; and a second electrode film forming process. Materials of the precursor solution, the first electrode film, and the monomolecular film are adjusted so that the first electrode film is lyophilic and the monomolecular film is lyophobic to the precursor solution. The piezoelectric film forming process includes a drying and thermally decomposing process of drying and thermally decomposing the precursor solution; and a crystallizing process of crystallizing a thermally decomposed piezoelectric material.

Abstract: A method and apparatus for packaging a Surface Acoustic Wave (SAW) piezoelectric device into a SAW tagging device for use in a harsh environment is provided. An exemplary SAW tagging device comprises a SAW piezoelectric device within a header container. The header container is electrically connected to an antenna system that comprises an antenna substrate, a dielectric disk that may operate as an antenna reflector in combination with a metal base. The antenna system, antenna substrate, dielectric disk and header container are all contained within a cavity in the metal base. The SAW tagging device is completely encased in a chemical, temperature and environmentally resistive and durable material that is transparent to the operating radio frequency of the SAW piezoelectric device contained therein.

Abstract: A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.

Abstract: A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

Abstract: This disclosure provides systems, apparatus and techniques by which electromechanical resonators are implemented. In one aspect, by mechanically loading the resonator body in specific ways, multiple resonance modes are created within the resonator body resulting in wider bandwidths.

Abstract: An elastic wave device has the following elements: a piezoelectric substrate; an inter-digital transducer (IDT) electrode disposed on the piezoelectric substrate; internal electrodes disposed above the piezoelectric substrate and electrically connected to the IDT electrode; side walls disposed above the internal electrodes surrounding the IDT electrode; a cover disposed above the side walls so as to cover a space above the IDT electrode; an electrode base layer disposed on the internal electrodes outside the side walls; and connection electrodes disposed on the electrode base layer. Each connection electrode has a first connection electrode disposed on the electrode base layer, and a second connection electrode disposed on the first connection electrode. The horizontal sectional shape of the second connection electrode is non-circular.

Abstract: Providing a method for manufacturing a package capable of suppressing occurrence of a discharge phenomenon during the anodic bonding and achieving stable anodic bonding of the base board and the bonding film. Providing a method for manufacturing a package including: an alignment step where an inner surface of the lid board 50 is superimposed onto an inner surface of the base board 40, and an outer surface of the base board 40 is disposed on an electrode base portion 70 for anodic bonding; and an anodic bonding step where a bonding voltage is applied between the bonding film 35 and the electrode base portion 70 while heating them to a bonding temperature, whereby the bonding film 35 and the base board 40 are anodically bonded, wherein the anodic bonding step involves applying the bonding voltage in a state where the penetration electrodes 32, 33 are exposed to a void portion 73 formed in the electrode base portion 70.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.

Abstract: A method is provided for forming a piezoelectric ultrasonic transducer apparatus having a first electrode deposited on a dielectric layer disposed on a primary substrate. A piezoelectric material is deposited between the first electrode and a second electrode, to form a transducer device. At least the piezoelectric material is patterned such that a portion of the first electrode extends laterally outward therefrom. The primary substrate and the dielectric layer are etched to form a first via extending to the laterally outward portion of the first electrode, and a first conductive material is deposited to substantially fill the first via and form an electrically-conductive engagement with the laterally outward portion of the first electrode. The primary substrate is etched to define a second via extending therethrough, wherein the second via is laterally spaced apart from the first via. An associated method and apparatus are also provided.

Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.

Abstract: The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.

Abstract: A method of manufacturing an electronic device including an electronic element, a base substrate, and a lid member, includes joining the lid member to the sealing part by application of an energy beam so that a plate thickness of the lid member may be larger in a part joined to the sealing part than in a part located inside of the part in a plan view along the thickness direction.

Abstract: A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core.

Abstract: A manufacturing method for a Zinc Oxide (ZnO) piezoelectric thin-film with high C-axis orientation comprises the steps of providing a substrate having a base, a SiO2 layer and a Si3N4 layer; forming a bottom electrode layer on the Si3N4 layer; patterning the bottom electrode layer; sputtering a Zinc Oxide layer on the Si3N4 layer and the bottom electrode layer; forming a photoresist layer on the Si3N4 layer and the Zinc Oxide layer; patterning the photoresist layer to reveal the Zinc Oxide layer; forming a top electrode layer on the Zinc Oxide layer and the photoresist layer; removing the photoresist layer and the top electrode layer formed on the photoresist layer, and the top electrode layer formed on the Zinc Oxide layer can be remained; and patterning the Si3N4 layer to form a recess that reveals the base of the substrate.

Abstract: Provided is a piezoelectric sound generating device capable of obtaining a stable connection state of lead-out conductors constituted of a conductive resin layer. A piezoelectric sound generating device 10, wherein lead-out conductors 18a, 18b are so flatly formed as to extend from surface electrodes 11a, 11b1 of a piezoelectric element 11 exposed to first openings 13a1, 13b1 to terminal electrodes 15a, 15b of a terminal portion 15 exposed to second openings 13a2, 13b2 on one main surface side of a diaphragm 12, respectively. As a result, the surface electrode 11a1 of the piezoelectric element 11 and the terminal electrode 15a of the terminal portion 15, and also the surface electrode 11b1 and a surface electrode 11c of the piezoelectric element 11, and the terminal electrode 15b of the terminal portion 15 are conductively connected. Hence, poor connection caused by cracks or the like is not likely to occur in the lead-out conductors.

Abstract: A flexural mode resonator element includes: a vibration arm extending from a base end toward a tip; a base joined to the vibration arm at the base end; and supporting arms arranged on both sides of the base in a width direction perpendicular to an extending direction of the vibration arm and joined to the base, wherein the base has a reduced cross-section portion disposed along the extending direction of the vibration arm between a joint portion with the vibration arm and a joint portion with the supporting arms, and the reduced cross-section portion is disposed so as to satisfy a relationship 2×W1?L?6×W1 where L is the length of the reduced cross-section portion in the extending direction of the vibration arm, and W1 is the arm width of the vibration arm.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece, a base plate, which has a connecting electrode on one principal surface and a mounting terminal on another principal surface, in a rectangular shape, and a lid plate. The another principal surface of the base plate includes a pair of sides that face one another. At least the pair of sides has a level difference portion depressed toward the one principal surface side and a castellation passing through from the another principal surface to the one principal surface. A wiring electrode extracted from the mounting terminal to the one principal surface of the base plate is at a part of the level difference portion and the castellation. The wiring electrode and the mounting terminal include a metal film formed by sputtering or vacuum evaporation and an electroless plating film formed on the metal film by electroless plating.

Abstract: In a piezoelectric device and a method of manufacturing thereof, after an ion implanted portion is formed in a piezoelectric single crystal substrate by implantation of hydrogen ions, an interlayer of a metal is formed on a rear surface of the piezoelectric single crystal substrate. In addition, a support member is bonded to the piezoelectric single crystal substrate with the interlayer interposed therebetween. A composite piezoelectric body in which the ion implanted portion is formed is heated at about 450° C. to about 700° C. to oxidize the metal of the interlayer so as to decrease the conductivity thereof. Accordingly, the conductivity of the interlayer is decreased, so that a piezoelectric device having excellent resonance characteristics is provided.

Abstract: A layout arrangement and system consisting of a piezoactuator and a flexible circuit board, with at least one electrical and mechanical connection, produced by an electrically conducting adhesive, between a first connection contact on the circuit board and a second connection contact on the piezoactuator, wherein the connection is led through an opening in the flexible circuit board and wherein the surfaces of the connection contacts that are glued together have an essentially parallel and equally oriented normal vector, and a method for assembling and arranging the same.

Abstract: Piezoelectric vibrating devices have piezoelectric vibrating pieces of which the vibration frequency is measurable individually on a wafer scale, without being affected by adjacent piezoelectric devices on the wafer. An exemplary piezoelectric device includes a piezoelectric vibrating piece having excitation electrodes and respective extraction electrodes. The device includes a package base with two connecting electrodes facing the vibrating piece and connected to respective extraction electrodes. Two pairs of mounting terminals are situated on the outer surface of the package base. Also on the outer surface of the package base are two pairs of opposing castellations that are recessed toward the center of the package base. Edge-surface electrodes connect the first and second main surfaces of the base; one pair is connected to the connecting electrodes and the other pair is connected to respective mounting terminals.

Abstract: The present disclosure provides a manufacturing method of a quartz-crystal device, in which its lid and base is manufactured with smaller thermal expansion coefficient between AT-cut quartz-crystal wafer.

Abstract: A piezoelectric actuator comprises: a piezoelectric ceramic vibrator (2) which vibrates when a voltage is applied to electrodes; a first holder (3) which is joined to a panel (502) and supports one end portion of the piezoelectric ceramic vibrator (2); and a second holder (4) which is joined to the panel (502) and supports the other end portion of the piezoelectric ceramic vibrator (2). The vibrations generated in the piezoelectric ceramic vibrator (2) are transmitted to the panel (502) via the one end portion of the piezoelectric ceramic vibrator (2) and the first holder (3), and the relative movements of the other end portion of the piezoelectric ceramic vibrator (2) in the lengthwise and crosswise directions with respect to the panel (502) are constrained by the second holder (4).

Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: An ultrasonic oscillating device with a detachable ultrasonic oscillating assembly is mounted inside a case having a detachable lid and applied in a humidifier. The ultrasonic oscillating device has a circuit board, a supporting board, a connecting structure and the ultrasonic oscillating assembly. The detachable ultrasonic oscillating assembly is placed between the supporting board and the lid. The connecting structure is mounted on a bottom of the lid and electrically connected to the ultrasonic oscillating assembly and the circuit board. When the ultrasonic oscillating assembly is broken, users easily replace the broken ultrasonic oscillating assembly by the detachable ultrasonic oscillating assembly and the detachable lid of the case, so other unbroken parts remain useful.

Abstract: A vibration actuator includes an elastic body on which at least one projection is formed and a vibrating body including an electromechanical conversion device, and drives a driven member that is in contact with a contact portion of the projection by causing an end portion of the projection to perform an ellipsoidal movement in response to a combination of two vibration modes generated in the vibrating body when an alternating driving voltage is applied. The elastic body is formed integrally with the projection and a bonding portion between the projection and the electromechanical conversion device. A space is provided between the contact portion and the electromechanical conversion device to which the projection is bonded. The spring portion is provided between the bonding portion and the contact portion and causes the projection to exhibit a spring characteristic when the contact portion is pressed by the driven member.