Abstract: A linear electro-polymer motor includes a fixed member, a linear shaft having an axis, a polymer actuator, and a bias member. The polymer actuator includes a first end fixedly connected to the linear shaft and a second end fixedly connected to the fixed member. The bias member includes a first end fixedly connected to the linear shaft and a second end fixedly connected to the fixed member. The polymer actuator changes length after receipt of voltage to linearly move the linear shaft along the axis.

Abstract: Methods are disclosed for manufacturing piezoelectric vibrating devices that do not acquire unwanted gas or water vapor inside their respective packages during manufacture and that attain such end by methods suitable for mass-production. An exemplary manufacturing method includes preparing a piezoelectric wafer having multiple piezoelectric frames; on the piezoelectric wafer defining at least one first through-hole per frame; preparing a base wafer having multiple package bases alignable with the frames; on the base wafer defining at least one second through-hole; preparing a lid wafer having multiple package lids alignable with the frames; applying a sealing material between a first main surface of each frame and an inner main surface of the base wafer, and between a second main surface of each frame and an inner main surface of the lid wafer; and thereby bonding the three wafers together to form multiple packaged piezoelectric devices.

Abstract: A piezoelectric ultrasound transducer array connected to a planar electronic component, the planar electronic component having one or more through hole adapted to receive a conducting element to provide an electrical connection which extends through the planar electronic component.

Abstract: The present invention discloses an atomization structure comprising a carrier, a cover plate, a piezoelectric driving device and an atomization piece. The carrier includes at least one first support portion, the cover plate comprises at least one second support portion, and the carrier is covered by the plate covers. The piezoelectric driving device is disposed between the carrier and the cover plate, the atomization piece is clamped by one end of the piezoelectric driving device. The actuating effect of the piezoelectric driving device would not be absorbed but kept by point contacting the first support portions and the second support portions to clamp and support the piezoelectric driving device.

Abstract: There is provided a piezoelectric thin film element, comprising: a substrate 1; and a piezoelectric thin film 3 having an alkali niobium oxide-based perovskite structure represented by a composition formula (K1-xNax)yNbO3 provided on the substrate 1, wherein a carbon concentration of the piezoelectric thin film 3 is 2×1019/cm3 or less, or a hydrogen concentration of the piezoelectric thin film 3 is 4×1019/cm3 or less.

Abstract: The quartz crystal device of a first aspect comprises a quartz crystal element having an vibrating portion which vibrates when a voltage is applied and a frame portion which surrounds the periphery of the vibrating portion, the quartz crystal element being formed of an AT-cut quartz crystal material specified by the X-axis, the Y?-axis and the Z?-axis; a base which is bonded to one main surface of the frame portion, the base being formed of a Z-cut quartz crystal material specified by the X-axis, the Y-axis and the Z-axis; and a lid which is bonded to other main surface of the frame portion, the frame portion being formed of the Z-cut quartz crystal material. The Z?-axis of the quartz crystal element is coincident with the X-axis or the Y-axis of the base and the lid.

Abstract: Methods are provided for manufacturing piezoelectric devices. In an exemplary method, a base wafer is prepared that defines an array of multiple bases. Between each base on the wafer is a through-hole defined in respective parts by the respective edge surfaces of adjacent bases. A piezoelectric wafer is prepared that defines an array of multiple piezoelectric frames each having a piezoelectric vibrating piece and a surrounding frame portion. The vibrating piece includes an excitation electrode and extraction electrode. The extraction electrode extends to the through-hole. An adhesive is applied to a surface of the frame portion including a surface of the extraction electrode. The adhesive bonds the piezoelectric wafer to the base wafer. Excess adhesive is removed from the through-hole to expose a portion of the extraction electrode in the through-hole.

Abstract: Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a holder having a pair fastening holes, a piezoelectric vibrator having a first though holes, a terminal with a second though hole mounted on the piezoelectric vibrator and electrically connected to the piezoelectric vibrator, and a pair of fixing portions fixing the terminal and the piezoelectric vibrator on the holder though the second though hole of the terminal, a first though holes of the piezoelectric vibrator and the fastening holes of the holder. The fixing portions fix the terminal and piezoelectric vibrator on the holder, which makes the assembling process much easier.

Abstract: A piezoelectric component manufacturing method is provided. The method includes preparing an integrated piezoelectric substrate, and forming comb-shaped electrodes and wiring electrodes having element wiring connecting to the comb-shape electrodes on a primary surface of the piezoelectric substrate, forming an SiO2 layer, performing a characteristics inspection on the piezoelectric substrate and marking defective piezoelectric elements, coating said SiO2 layer surface with photosensitive resin, and then exposing and developing to form an insulating layer.

Abstract: A piezoelectric vibration element includes a piezoelectric substrate including a thin vibration region and a thick section integrated along three sides excluding one side of the vibration region, excitation electrodes respectively arranged on the front and rear surfaces of the vibration region, and lead electrodes. The thick section includes a first thick section and a second thick section arranged to be opposed to each other across the vibration region and a third thick section connected between proximal ends of the first and second thick sections. The second thick section includes an inclined section connected to the one side of the vibration region, a second thick section main body connected to the other side of the inclined section, and at least one slit for stress relaxation.

Abstract: Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a base defining a receiving space, a piezoelectricity vibrator suspended in the receiving space and being capable of vibrating in the receiving space, a pair of contacts partially accommodated in the base and electrically connected to the piezoelectricity vibrator, and a transmitting mass located above the piezoelectricity vibrator with a lower side abutting against the piezoelectricity vibrator.

Abstract: Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a main board defining a mounting surface, a vibration unit mounted on the mounting surface of the main board, the vibration unit being capable of vibrating along a direction parallel to the mounting surface and defining at least two fastening portions at two distal ends thereof. At least two screws are provided to fix the vibration unit on the main board through the fastening portions along a direction perpendicular to the mounting surface.

Abstract: Provided is a small piezoelectric power generator applied to a wireless sensor network system of a tire pressure monitoring system (TPMS) for monitoring an internal environment of a tire such as variation in air pressure in the tire. In particular, when the system, in which air pressure, temperature and acceleration sensors are mounted, installed in the tire is operated in the TPMS for an automobile, a small piezoelectric power generator for the TPMS can be used as a power source in place of a conventional battery. The piezoelectric power generator includes a substrate having an electrode for transmitting power to the exterior, a metal plate formed on the substrate, and a piezoelectric body disposed on the metal plate and transmitting the power generated by a piezoelectric material to the electrode.

Abstract: In an exemplary method for making crystal vibrating devices, four wafers are provided: a crystal wafer, a base wafer, a first-lid wafer, and a second-lid wafer. The crystal wafer defines multiple crystal vibrating pieces including respective frames and respective electrodes formed on both main surfaces thereof. The base wafer defines multiple base plates bondable to one main surface of respective frames. The first-lid wafer defines multiple first lids bondable to the other main surface of the respective frames. Each first lid defines a void registrable with respective electrodes. The second-lid wafer is sized similarly to and bondable to the first-lid wafer so as to sealably close the voids. In a first bonding step the crystal wafer is bonded to the base wafer and first-lid wafer. In a subsequent adjustment step the thickness of at least one electrode per each crystal vibrating piece is adjusted to adjust the vibrational frequency of the respective vibrating portion.

Abstract: An object is to provide a crystal device in which an influence due to an electroconductive adhesive is reduced, and vibration characteristics of a crystal piece are favorably maintained.

Abstract: Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials 20, 21 having different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Abstract: There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; on the back surface of the ceramic base, mount terminals connected to the through terminals are formed; and an insulating film projected especially in a corner portion direction is formed at such a position as to face the opening end face of a metal cover.

Abstract: This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, a sacrificial layer is deposited on an insulating substrate. A lower electrode layer is formed proximate the sacrificial layer. A piezoelectric layer is deposited on the lower electrode layer. An upper electrode layer is formed on the piezoelectric layer. At least a portion of the sacrificial layer is removed to define a cavity such that at least a portion of the lower electrode layer is spaced apart from the insulating substrate.

Abstract: A flexural mode resonator element includes: a vibration arm extending from a base end toward a tip; a base joined to the vibration arm at the base end; and supporting arms arranged on both sides of the base in a width direction perpendicular to an extending direction of the vibration arm and joined to the base, wherein the base has a reduced cross-section portion disposed along the extending direction of the vibration arm between a joint portion with the vibration arm and a joint portion with the supporting arms, and the reduced cross-section portion is disposed so as to satisfy a relationship 2×W1?L?6×W1 where L is the length of the reduced cross-section portion in the extending direction of the vibration arm, and W1 is the arm width of the vibration arm.

Abstract: An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.

Abstract: A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of individual transducer elements to grounds in the third layer of the circuit. The vias extend through the first and second layers to the third layer of the circuit. When the flexible circuit is diced during the assembly of the transducer system, no cuts are made in the third layer of the circuit. As a result, a common ground connection is maintained by way of the grounds in the third layer of the circuit. Thus, no subsequent operation of reconnecting the common ground electrode is required.

Abstract: A dual-frequency ultrasound transducer, comprising a piezo-electric element bonded to a substrate, has two resonant vibration modes: a low frequency mechanical bending resonance mode and a relatively high frequency thickness resonance mode. The low frequency bending resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a low frequency oscillating component. The high frequency thickness resonance mode occurs when the piezo-electric element is excited, in use, by a voltage which includes a relatively high frequency oscillating component. The transducer may include a mounting arrangement, such as a support ring securing the periphery of the substrate to an underlying base layer that enhances the depth of penetration and focus of the ultrasound.

Abstract: A pressure transducer for high-pressure measurements comprising a housing and a piezoelectric resonator located in the housing, wherein the resonator comprises double rotation cut piezoelectric material configured or designed for vibrating in the fundamental tone of dual modes of the fast and slow thickness-shear vibrations.

Abstract: A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.

Abstract: The present disclosure is directed to a MEMS resonant structure, provided with a substrate of semiconductor material; a mobile mass suspended above the substrate and anchored to the substrate by constraint elements to be free to oscillate at a resonance frequency; and a fixed-electrode structure capacitively coupled to the mobile mass to form a capacitor with a capacitance that varies as a function of the oscillation of the mobile mass; the fixed-electrode structure arranged on a top surface of the substrate, and the constraint elements being configured in such a way that the mobile mass oscillates, in use, in a vertical direction, transverse to the top surface of the substrate, keeping substantially parallel to the top surface.

Abstract: A compound membrane (100) for an acoustic device (200), the compound membrane (100) comprising a first layer (101) and a second layer (102), wherein a value of Young's modulus of the second layer (102) does not vary more than essentially 30% in a temperature range between essentially ?20° C. and essentially +85° C.

Abstract: The present invention reduces the value of a bonding width L of a base substrate and a lid substrate in each piezoelectric vibrator. A plurality of lid substrates 3 each including a recess portion 3a are formed and a bonding film is formed on a wafer for lid substrate 50. The wafer for base substrate 40 is opposed and anodic-bonded to the wafer for lid substrate 50 to produce a wafer unit 60 including a plurality of piezoelectric vibrators 1. Then, a microgroove 813 is formed by applying laser along a cutting line for each of the piezoelectric vibrators 1 on the side of the wafer for lid substrate 50, and a sharp pressing blade 830 is pressed on the opposite side, thereby performing sequential cutting.

Abstract: A piezoelectric device, in which one of a first plate, a second plate, and an adhesive agent is colored for confirming a bonding status of the adhesive agent, and a manufacturing method thereof, are provided. A piezoelectric device includes a piezoelectric vibrating piece that vibrates by applying a voltage; a first plate and a second plate formed of glass and seal the piezoelectric vibrating piece; and an adhesive agent which bonds the first plate with the second plate, wherein one of the first plate, the second plate, and the adhesive agent is colored.

Abstract: A portable electronic device includes: a housing, a power pack received in the housing, and an actuator disposed between the power pack and a component of the portable electronic device, the component being in a fixed position relative to the housing, wherein the actuator imparts a force on the power pack to move the power pack relative to the housing.

Abstract: A package inner peripheral face 13 of a base 4 is made up of a vertical face 14 and a horizontal face 15, and electrode pads 7 (71 to 78) are formed on the vertical face vertical face 14 of the base 4. The electrode pads 71 to 78 are formed on the vertical face 14 of the base 4 including an intersection line 17 at which the vertical face 14 and the horizontal face 15 intersect; for example, electrode pads 74 and 75 that serve as hetero electrodes are formed adjacently. The distance between the electrode pads 74 and 75 that are adjacent along the intersection line 17 of the vertical face 14 of the base 4 is longer than the shortest distance between the electrode pads 74 and 75 that are adjacent on the vertical face 14 of the base 4.

Abstract: A piezoelectric element is manufactured in a method including forming an adhesion layer of zirconium above a zirconium oxide insulating film, forming a first electrode above the adhesion layer, forming a piezoelectric layer of a complex oxide containing bismuth above the first electrode, and forming a second electrode above the piezoelectric layer.

Abstract: A piezoelectric resonator element includes: a resonating arm extending in a first direction and cantilever-supported; a base portion cantilever-supporting the resonating arm; and an excitation electrode allowing the resonating arm to perform flexural vibration in a second direction that is orthogonal to the first direction. In the piezoelectric resonator element, the resonating arm includes an adjusting part adjusting rigidity with respect to a bend in a third direction that is orthogonal to the first and second directions.

Abstract: Quartz-crystal devices are disclosed, of which the CI value is reduced by adjusting the shortest distance between an edge of electrically conductive adhesive and an edge of the excitation electrode. The device has a quartz-crystal plate having long-edges and short-edges. Excitation electrodes are on first and second surfaces of the plate. Conductive pads are electrically connected to respective excitation electrodes and extend to the short-edge of the quartz-crystal plate. A package having a pair of external mounting terminals and respective connecting electrodes are situated on opposing sides of the mounting terminals for making electrical connections to the mounting terminals. An electrically conductive adhesive bonds the connecting terminals and respective conductive pads together, and the quartz-crystal plate onto the package. The shortest distance between an edge of the adhesive and an edge of the excitation electrode is 10%-15% the length of the quartz-crystal plate in the long-edge direction.

Abstract: An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.

Abstract: In a piezoelectric device and a method of manufacturing thereof, after an ion implanted portion is formed in a piezoelectric single crystal substrate by implantation of hydrogen ions, an interlayer of a metal is formed on a rear surface of the piezoelectric single crystal substrate. In addition, a support member is bonded to the piezoelectric single crystal substrate with the interlayer interposed therebetween. A composite piezoelectric body in which the ion implanted portion is formed is heated at about 450° C. to about 700° C. to oxidize the metal of the interlayer so as to decrease the conductivity thereof. Accordingly, the conductivity of the interlayer is decreased, so that a piezoelectric device having excellent resonance characteristics is provided.

Abstract: An ultrasonic transducer that improves workability of a housing, suppresses variations in resonant frequency, and has stable characteristics is constructed. The ultrasonic transducer includes a bottomed circular cylindrical housing and a piezoelectric element provided at substantially a center of a bottom of the housing. The bottom of the housing has a slope portion that gradually becomes thinner from a position at which the piezoelectric element is provided toward an inner wall surface of the housing, and a flat portion that extends from an outer edge of the slope portion to the inner wall surface of the housing while maintaining a thickness of the outer edge of the slope portion.

Abstract: An object of the present invention is to economically manufacture a piezoelectric component having superior molding pressure resistance and reduced height.

Abstract: A compact micromanipulator system has a micromanipulator element that cause movement of a tool attached to the micromanipulator element. The micromanipulator element is attached to a support structure, which in turn is attached to a sliding base in a hinged manner to allow sliding and/or tipping of the micromanipulator element away from the normal operating position of the micromanipulator element.

Abstract: A vibrating device includes: a package having an internal space; and a vibrating reed housed in the internal space of the package, wherein the package has a porous portion formed of a communication hole communicating between the internal space and the outside and a porous body buried in the communication hole, and a metal film closing the internal space is arranged on the outside side of the porous portion.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: A piezoelectric oscillator part capable of suppressing oscillation that leaks from a piezoelectric oscillator to a substrate side is obtained. The piezoelectric oscillator part has a piezoelectric oscillator held on a substrate by first and second conductive holding members. The first conductive holding member is arranged proximal to a first end of the substrate. A terminal electrode connected to the first conductive holding member is arranged proximal to a second end of the substrate opposite the first end. The first conductive holding member and the terminal electrode are electrically connected by a wiring electrode.

Abstract: A vibratory device includes an elastic plate and a piezoelectric diaphragm. The elastic plate includes a fixable portion, a vibratory portion, and a connection portion. The fixable portion is fixed to a fixation member. The vibratory portion is spaced away from a fixable surface of the fixable portion that faces the fixation member and arranged substantially in parallel with the fixable surface. The connection portion connects a first end of the fixable portion in its planar direction and a first end of the vibratory portion in its planar direction. The piezoelectric diaphragm is disposed on a surface of the vibratory portion that is adjacent to the fixable portion. In a direction N normal to the surface of the vibratory portion adjacent to the fixable portion, at least part of the second piezoelectric diaphragm does not overlap the fixable portion.

Abstract: A oscillator include: a vibrator that vibrates in a thickness shear vibration mode; a first adsorption film formed in a first region in a first surface of the vibrator; a second adsorption film formed in a second region in a second surface of the vibrator opposing to the first surface; and a substrate with a surface on which the vibrator is erected, wherein the vibrator contacts the substrate in a third surface that is different from the first surface and the second surface.

Abstract: A piezoelectric device capable of adjusting shape/position of connection electrodes is provided to accommodate a first or second oscillating plate (piezoelectric). The second oscillating plate is shorter than the first oscillating plate, each oscillating plate includes an excitation and an extraction electrodes. The extraction electrode is electrically connected with a connection electrode via conductive adhesive agent in a package. The package includes a carrier section, carrying the first or the second oscillating plate thereon. The connection electrode is disposed on at least a portion of a surface of the carrier section. When the extraction electrode of the first oscillating plate is electrically connected with the connection electrode, the excitation electrode on one side of the first oscillating plate is not electrically connected with the connection electrode on the other side. The extraction electrodes of the second oscillating plate can be electrically connected with the connection electrodes.

Abstract: A dynamic three-degree-of-freedom actuator/transducer element comprising at least three piezoceramic actuators and force sensors, as integrated stacks, which are preloaded in the housing by a low-stiffness tension bar, and are constrained, by means of a flexible shell, against shear force and torsion moment, whereby the element, when powered by external voltage source, this actuator/transducer is able to generate a dynamical axial force and displacement and dynamical bending and moment in the two principal tilt degrees of freedom around two orthogonal axes perpendicular to the principal displacement and when subjected to an axial force or a tilting moment, the transducer is able to generate charges that are proportional to the said exerted force and moments.

Abstract: A piezoelectric thin-film resonator includes a substrate, a lower electrode provided on the substrate, a piezoelectric film provided on the substrate and the lower electrode, an upper electrode provided on the piezoelectric film, and an additional pattern, a cavity being formed between the lower electrode and the substrate in a resonance portion in which the lower electrode and the upper electrode face each other through the piezoelectric film, the additional pattern being provided in a position that is on the lower electrode and includes an interface between the resonance portion and a non-resonance portion.

Abstract: The present invention provides piezoelectric surface mount devices in which the area of the mounting terminals is reduced, leading to reduction of manufacturing cost. A piezoelectric device comprises a package base (120) including a bottom surface having a long edge and a short edge and a pair of mounting terminals formed on respective short edges of the package base. The pair of mounting terminals are separated by a predetermined longitudinal distance (X3) and are arranged as close as possible to the longitudinal center line of the package base. The predetermined distance is sufficient to prevent electrical short when mounting the piezoelectric device onto the printed substrate. The maximum width (Z2) of each mounting terminal measured in a direction parallel with the short edges of the package base is less than one half the width of the short edge (Z1).

Abstract: An arrangement consisting of a piezoactuator and a printed circuit board that are connected by at least one adhesive connection, with at least one electrical connection created by an electrically conductive adhesive between a first connection contact on the printed circuit board and between a second connection contact on the piezoactuator, whereby the connection contacts face in the same direction and the adhesive connection takes place through an opening in one of the components.

Abstract: A transducer array assembly includes a support structure having a plurality of predetermined openings therein for accommodating transducer components. Flexible circuits are embedded in the support structure. Each flexible circuit has first ends being positioned in the support structure predetermined openings. Terminal blocks are joined to the second ends. Transducer elements are positioned in the support structure predetermined openings and placed in electrical communication with the flexible circuit first ends. A polymer material is provided surrounding the transducer elements, said support structure, and said flexible circuit first ends. There is also provided a method for manufacturing the transducer array.

Abstract: In some embodiments, an apparatus and system includes a substrate including outer surfaces, one of the outer surfaces defining a first plurality of electrical contacts, one of the outer surfaces adapted to be mounted to a circuit board and defining a second plurality of electrical contacts adapted to be electrically connected to the circuit board; an integrated circuit die mounted to one of the outer surfaces, and a crystal oscillator mounted to one of the outer surfaces and electrically connected to the integrated circuit die.