Abstract: The present disclosure relates to a test head for electrical testing of a test specimen, in particular a wafer, having at least two guide plates, which are spaced apart by means of at least one spacer and have guide holes distributed over the surfaces thereof, in which test contact pins for physical contact with the test specimen are guided in a sliding manner. Provision is made for the spacer to be formed by a multiplicity of point supports arranged in a manner distributed over the surfaces of the guide plates and secured on the guide plates.

Abstract: A power supply detection apparatus including a base, a couple of longitudinal motion mechanisms, a couple of lateral motion mechanisms, a couple of pin bases and a couple of vertical motion mechanisms is provided. Each lateral motion mechanism is movably arranged on the corresponding longitudinal motion mechanism and thereby driven to move horizontally. Each pin base is driven to move horizontally by the corresponding lateral motion mechanism and a probe is arranged on each pin base. The probe and the perpendicular lateral motion mechanism are moved along respective directions perpendicular with each other. Each vertical motion mechanism is arranged on the corresponding pin base for driving the probe to move vertically. The probes can be thereby moved to automatically detect an electric power status of an electronic component on a circuit board of a power supply.

Abstract: The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

Abstract: The device for checking electronic cards includes a base in which conductive nails are arranged pointing upwards, and a cover, also fitted with nails pointing downwards in the closed cover position. The cover is mobile in horizontal translation between an open position and an intermediate position. The device can also include a vertical translation mechanism capable of bringing the nails arranged in the cover closer to the nails arranged in the base so as to allow contact of the nails on the two faces of an electronic card. The invention also relates to a method of opening and a method of closing such a device.

Abstract: A probe card includes a frame-shaped wiring substrate having interlayer insulation layers and a wiring layer that are alternately stacked. A cavity is defined in a central portion of the wiring substrate. A first insulation layer is arranged in the cavity so that a frame-shaped clearance exists between an outer side surface of the first insulation layer and an inner side surface of the wiring substrate as viewed from above. The cavity is filled with a second insulation layer. A contact terminal projecting from a lower surface of the first insulation layer is electrically connected to the wiring layer by a conductive wire. Elasticity of the second insulation layer is smaller than elasticity of each interlayer insulation layer.

Abstract: The present invention relates to a pogo pin including a probe part and an elastic part, and more particularly, to a probe-connection-type pogo pin including a cylindrical upper probe part, an elastic part, and a cylindrical lower probe part, which are made in one body, to transmit electrical signals between semiconductor wafers, LCD modules, semiconductor packages, electronic parts such as a variety of sockets, etc. Accordingly, it is possible to reduce the manufacturing process and the manufacturing cost, reduce the outside diameter of the pogo pin by making the elastic part formed to surround the cylindrical lower probe part, and reduce the loss and distortion of electrical signal by allowing the upper probe part and the lower probe part to come in surface contact with each other.

Abstract: Embodiments described herein generally relate to methods and apparatuses for ensuring the integrity of probe card assemblies and verifying that probe cards are ready for testing. In one embodiment, an apparatus includes a stage that allows stable and precise movement of a sensor. The stage includes a first support, a second support, and a sensor carrier. A plurality of lifting devices is coupled to the second support and the sensor carrier, providing a more stable and precise movement for the sensor carrier. Methods for identifying objects other than the probes disposed on a surface of a probe card and to determine whether the probe card is ready for use are disclosed.

Abstract: A method for personalizing a SIM card may include loading the SIM card on a conveyor belt of a production machine, programming the SIM card, and unloading the programmed SIM card from the conveyor belt. If the intermediate result is wrong, the method may check an intermediate result of the programming and re-program the SIM card.

Abstract: An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module.

Abstract: A fixture for probing circuit boards and microcircuits. A guide plate provides indexing for positioning a probe assembly in one or two dimensions. The guide plate has two opposed mounting sides connected by one or two indexing sides and is mounted to the test unit by screws. The indexing sides and, optionally, the mounting sides have column mounting holes and column markings. A bridge mounts to the indexing sides with its column pointer aligned with the desired column marking. The bridge has row mounting holes and row markings. The probe assembly mounts to the bridge with its row pointer aligned with the desired row marking. Optionally, the bridge is part of the probe assembly and without row indexing elements to be used in one dimension. The probe assembly has a terminator platform and connector plate with electrical cable assemblies extending therebetween.

Abstract: The invention relates to a printed circuit board (10), with conductor tracks (11, 11a), which are arranged at least on a surface of the printed circuit board (10) and serve for the electrical contacting of components, and with at least one testing zone (12), which is formed by a portion of the conductor track (11) and serves for the electrical contacting of a testing element (20), in particular a testing head, wherein the surface of the printed circuit board (10) is provided with a protective layer (14), which is formed in the testing zone (12) such that it is interrupted in the region of a contact zone (15), and wherein the contact zone (15) is provided with a layer (18), which establishes an electrical contacting of the testing element (20) with the layer (18). According to the invention, it is provided that the contact zone (15) is arranged at least partially at a lateral distance from the edges of the conductor track (11) in the region of the testing zone (12).

Abstract: The invention relates to a tester apparatus of the kind including a portable supporting structure for removably holding and testing a substrate carrying a microelectronic circuit. An interface on the stationary structure is connected to the first interface when the portable structure is held by the stationary structure and is disconnected from the first interface when the portable supporting structure is removed from the stationary structure. An electrical tester is connected through the interfaces so that signals may be transmitted between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

Abstract: First and second pin groups are each formed from a plurality of pins associated with specific nets. Pins in the first pin group are to be wired to pins in the second pin group according to their associated nets. A candidate selection unit selects a set of pair candidates each specifying a first pair of pins in the first pin group and a second pair of pins in the second pin group. The first and second pairs of pins are associated with the same pair of nets, and their respective distances are within a specified range. A pair determination unit determines which pins in the first and second pin groups are to be wired in pairs, based on the pair candidates selected by the candidate selection unit.

Abstract: A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). The elastomer is precompressed from its natural rest state between a top (22) plate and a bottom (70). Pre compression improves the resilient response of the pins. The pin crows (40) are maintained relatively coplanar by the engagement of at least one flang (44a-b) against an up-stop surface 90 of plate 20, thereby insuring coplanarity of the crowns. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.

Abstract: A system and a method for capacitive testing a component (including a packaged component) are disclosed. An embodiment of a test head comprises a holding unit configured to pick-up, hold and release the component, an electrode configured to receive a capacitive signal from the component and a preamplifier configured to amplify the capacitive signal.

Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

Abstract: A method for testing a semiconductor wafer comprises providing a semiconductor wafer. The semiconductor wafer comprises a protruding annular rim, a first redistribution structure disposed on the front side of the semiconductor wafer, a second redistribution structure disposed on the rear side of the semiconductor wafer within the protruding annular rim and a plurality of vias extending from the front side to the rear side. A first probe is contacted to the first redistribution structure on the front side and a second probe is contacted to the second redistribution structure on the rear side. The first probe is in contact with the first redistribution structure and the second probe is in contact with the second redistribution structure at the same time.

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.

Abstract: A magnetic sensor device includes a plurality of electrical wires, a magnetic sensor chip, and a magnet. The magnet is formed from a material composition of a polymer and magnetic particles and attached to at least one of the electrical wires.

Abstract: A test machine and a test method for a Light Emitting Diode (LED) backlight driver and a manufacturing method for a monitor power board The test machine has a switch-controlled LED-light-bar load that is coupled to an LED backlight driver on a monitor power board. The switch-controlled LED-light-bar load includes a plurality of light bars and a plurality of switches. Each light bar has a plurality of the LEDs which are connected in series. Each switch is connected in parallel to a portion of the LEDs of one light bar such that an effective amount of the LEDs of each light bar is adjustable. The switches are controlled according to a monitor specification that the monitor power board is adapted to.

Abstract: The disclosed technology provides a detection apparatus and its operating method. The disclosed technology provides a detection apparatus, comprising: a test chamber, an exchange chamber, and a communicating mechanism, which is provided between the test chamber and the exchange chamber and capable of rendering the test chamber and the exchange chamber separated from or communicated with each other; wherein transmission devices are positioned within the test chamber and the exchange chamber, respectively, and the transmission devices are adapted to convey a probe frame from the test chamber to the exchange chamber or from the exchange chamber to the test chamber.

Abstract: Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.

Abstract: An automated electronics circuit test cassette assembly is provided for mating with a test platform. The platform comprises a platform common signal interface and a vacuum manifold having a combined registration and vacuum port coupler. The cassette assembly includes a cassette common signal interface providing electrical communication with the platform common signal interface and an alignment bushing providing combined registration and vacuum communication with the vacuum port coupler. A pattern of test probes mimic a test pattern on a printed circuit assembly (PCA), extending upwards from a probe support substrate and optionally downward from a clamshell probe substrate. The PCA is supported by a PCA support substrate floating above the test probe support substrate. The clamshell test substrate provides a vacuum seal above the PCA support substrate.

Abstract: An electrode and wiring can be provided on an FPC board without restriction by a through hole. A probe card in which an FPC board of a probe assembly is fixed to the main board side by a clamp mechanism is provided. The clamp mechanism is provided with a fixing ring fixed to the main board side and on which the FPC board is mounted and a rotating ring screwed into the fixing ring and pressing a peripheral edge portion of the FPC board. In the fixing ring, a pressing ring pressed by screwing of the rotating ring for pressing the peripheral edge portion of the FPC board to the main board side is provided.

Abstract: A method provides testing of an electronic circuit test system that includes a test fixture having headed and headless test probes, a shorting plate and a test probe verification plate with apertures. A probe verification test includes: moving the test probe verification plate and the shorting plate into position, where the shorting plate engages any test probe that extends through an aperture of the verification plate; and transmitting an electrical signal to each of the test probes. The electricity flow associated with each of the test probes is analyzed to determine if any of the headless test probes have an open circuit. In response to detecting an open circuit: one or more of the headless test probes are indicated as (a) defective in the test fixture or (b) missing from the test fixture; and the specific locations in the test fixture of the defective or missing test probes are identified.

Abstract: A positioning apparatus includes a support structure, a positioning structure, and a fixture for retaining MEMS devices. A shaft spans between the support structure and the positioning structure, and is configured to rotate about a first axis relative to the support structure in order to rotate the positioning structure and the fixture about the first axis. The positioning structure includes a pair of beams spaced apart by a third beam. Another shaft spans between the pair of beams and is configured to rotate about a second axis relative to the positioning structure in order to rotate the fixture about the second axis. Methodology entails installing the positioning apparatus into a chamber, orienting the fixture into various positions, and obtaining output signals from the MEMS devices to determine functionality of the MEMS devices.

Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.

Abstract: The invention relates to a module for exchanging an approximately planar interface unit in a testing system for testing semiconductor elements. The module includes a base element, a holder, and guide elements. The guide elements are embodied so that the interface unit can be moved by means of a linear, translatory movement from an end position into an intermediate position and from the intermediate position into a removal position that is situated outside the testing system. The mechanism includes a lever mechanism that is controlled by a sliding guide and is supported so that it can move crosswise to the linear translation movement of the holder.

Abstract: The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion (21) adapted to receive therein an IC (5) having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet (25) pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad (26) formed on a front surface thereof and a socket side pad (27) formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion (21) is provided with a retaining latch (23) protruding therefrom toward above the IC (5) when the IC (5) is received in the inner peripheral wall (22) of the frame portion (21).

Abstract: An automation testing system for testing a motherboard includes a frame, a first jig plate, a second jig plate, a platform, a first driving mechanism, a second driving mechanism and a console computer. The frame includes a track, a debug docking board is detachably disposed on the first jig plate for docking with the motherboard, the platform is slidably installed on the track and disposed between the first jig plate and the second jig plate, and the platform is for holding the motherboard. The console computer controls the first driving mechanism to drive the platform to move in a first direction along the track, and controls the second driving mechanism to drive the second jig plate to move in a second direction perpendicular to the first direction.

Abstract: Multi-stage in circuit test of a circuit board has support to reduce strain placed on the circuit board during each test stage. A shuttle plate is disposed between a load plate that supports a circuit board under test and a probe plate that directs test probes towards the circuit board. The shuttle board slides between different positions with each position establishing the distance between the circuit board and the test probes. For instance, in a first position, the shuttle plate aligns intermediary members to rest between the load plate and shuttle plate to keep the probes spaced by a first distance from the circuit board so that only some test probes contact the circuit board. In a second position, the shuttle plate aligns the intermediary members with blind vias to bring the shuttle plate and load plate proximate each other so that all test probes contact the circuit board.

Abstract: A retention arrangement that includes one or more templates for securing and aligning probes for testing a device under test.

Abstract: A method of assembling a probe head for a probe card interface is disclosed. The probe head includes a plurality of alignment plates, wherein each of the alignment plates includes a set of holes. The plurality of alignment plates are stacked so that each of the alignment plates is adjacent to at least one other alignment plate and a set of holes in each of the alignment plates is aligned with a corresponding set of holes in each of the remaining alignment plates. A set of probe wires is then inserted through the set of holes, respectively, in each of the plurality of alignment plates. After the set of probe wires are inserted, the plurality of alignment plates are spaced so that none of the plurality of alignment plates is adjacent to another alignment plate. One or more multi-piece spacers may be used to space the alignment plates.

Abstract: The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes are biased upwardly through the retainer by an elastomeric block having a similar array of slots. The elastomer is then capped at its bottom by a second or lower retainer with like slots to form a sandwich with the elastomer therebetween. The bottom ends of the probes are group by probe height. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and take continue the circuits to a probe card where test signals originate.

Abstract: A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided.

Abstract: A method and apparatus for high volume testing of logic devices with package-on-package (POP) memory. The apparatus includes a handler arm, compound nest attached to the handler arm, swing arm and a socketed assembly that facilitates alignment. In the method, a logic device is first installed in a compound nest. The compound nest is them attached to a handler arm. The compound nest is then aligned with a socketed assembly using a swing arm. Fine tuning of the alignment may be performed using guide pins and shoulder screws.

Abstract: An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.

Abstract: A method provides testing of an electronic circuit test system that includes a test fixture having headed and headless test probes, a shorting plate and a test probe verification plate with apertures. A probe verification test includes: moving the test probe verification plate and the shorting plate into position, where the shorting plate engages any test probe that extends through an aperture of the verification plate; and transmitting an electrical signal to each of the test probes. The electricity flow associated with each of the test probes is analyzed to determine if any of the headless test probes have an open circuit. In response to detecting an open circuit: one or more of the headless test probes are indicated as (a) defective in the test fixture or (b) missing from the test fixture; and the specific locations in the test fixture of the defective or missing test probes are identified.

Abstract: A parallelism adjusting device and a parallelism adjusting method capable of adjusting the parallelism between the surface of a semiconductor and the surface of an electrode by reducing the load on the semiconductor and capable of shortening the cycle time by increasing the operating speed. A probe device of adjusting the parallelism between the surface and the surface of a contact body that is in contact with the surface to press the surface and apply a current is configured to include a pressing body assembly that presses the contact body with a predetermined pressing force until the surface and the surface come into contact with each other to adjust the parallelism and, after that, presses the contact body with a pressing force that is stronger than the predetermined pressing force.

Abstract: A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips.

Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.

Abstract: A dual-stage fixture for a circuit tester includes a slide plate that can be slid between at least a first position and a second position. In the first position, an upper stripper plate is spring-loaded, and a full set of test probes, including both long-stroke and short-stroke probes, can contact the circuit board or UUT (unit under test). In the second position, the upper stripper plate becomes fixed in position, and only the long-stroke probes can contact the circuit board. The fixed positioning of the upper stripper plate prevents the short-stroke probes from contacting the circuit board even when there is unbalanced loading of probe pressure between the top and bottom of the circuit board, thereby preventing transient signals from interfering with testing. In addition, a vacuum is applied in this position during a non-powered test.

Abstract: The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.

Abstract: There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed.

Abstract: A cross-bar unit for a test apparatus for circuit boards having at least one cross-bar spanning a test field in which a circuit board to be tested may be placed, and is configured to hold positioning units for test fingers in a linearly traversable manner so that the test fingers are able to scan at least part of the test field. The cross-bar unit is configured to hold at least two linear guides, independent of one another, for guiding in each case at least one of the positioning units.

Abstract: An apparatus for testing of a plurality of electronic devices on a flexible substrate is described. The apparatus includes at least two rollers (110) configured for guiding the flexible substrate (10) into a testing area along transport direction, at least one prober (122) configured for electrically contacting one or more of the electronic devices, at least one probing support (124) configured for supporting a portion of the flexible substrate during electrical contact with the at least one prober, and a test device for functional testing of one or more of the electronic devices.

Abstract: A high accuracy electrical test interconnect method employs a tester interface transfer block to enable the transfer of electrical contact from less accurate tester resource probes to target probes which are contained in the tester interface transfer block and can be positioned with high accuracy using the three dimensional printing to enable reliable contact with smaller test pads. The target probes can directly contact the tester resource probes or a transfer plate can be interposed between the target probes and the tester resource probes to allow positional adjustment of the target probes relative to the tester resource probes. This invention also includes the use of specialized shape target probes that can contact circuit board objects, such as vertical conductive surfaces and irregular shape test pads that have not been accessible with traditional methods.

Abstract: Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized.

Abstract: Provided is a micro contact element which is capable of coping with the miniaturization and greater complexity of substrates or boards, which is simplified due to a reduction in the number of components, and which creates sufficient contact pressure and stroke. Also provided is an inspection jig using this contact element. An inspection contact element having the contact pressure and amount of contraction required to carry out an inspection is formed by using notch parts respectively formed in two conductive cylindrical members having different outer and inner diameters so that the notch parts can function as elastic parts, and combining the two cylindrical members in such a way that the elastic parts are arranged in parallel or in series.

Abstract: Assemblies include a substrate, such as a printed circuit board, with a first array of contact pads disposed thereon; a guide ring structure disposed on the substrate and at least partially surrounding the first array of contact pads; a translator socket disposed on the first array of contact pads, the translator socket adapted to receive the tester side of a translated wafer; a thermally conductive, conformal, heat spreading cushion adapted to be disposed over the backside of a wafer; a cover plate adapted to fit over the first array of contact pads, align with the guide ring structure, contain within it the various components disposed over the first array of contact pads, and removably attach to the substrate; and a bolster plate adapted to removably attach to a second side of the substrate.