Abstract: A manipulator system comprising a column unit and a carriage supported by the column unit and configured to move along a desired axis of translation. A marker is provided on the column unit along the axis of translation. A sensor is associated with the carriage and configured to sense a position along the marker. A position display unit is configured to receive a position signal from the sensor and display a current position of the carriage along the axis of translation. In another aspect, the column unit defines at least one slot. A lock assembly is attached to the carriage and includes a tang axially moveable between an unlocked position wherein the tang is disengaged from the at least one slot and a locked position wherein the tang is engaged in the at least one slot.

Abstract: An electronic device pushing apparatus includes a pushing unit which has: a plurality of pushers which contact DUTs; and base plate on which the plurality of pushers are provided. A rigidity of the base plate is set to a rigidity which is lower relative to the rigidity of a spacing frame of the HIFIX.

Abstract: An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member.

Abstract: A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

Abstract: A re-configurable test socket system and test socket architecture are described involving a combination of particular micro elements and re-useable macro elements that can be reused and reconfigured for testing a wide variety of different semiconductor and integrated circuit (IC) DUT packages having different shapes, sizes, and terminal configurations.

Abstract: An apparatus for supporting a load includes pneumatic units and couplers coupled to opposite sides of the load. The couplers move the load parallel to a first axis responsive to actuation of the pneumatic units. At least one of the couplers rotate the load about a second axis orthogonal to the first axis. The load is compliant along the first axis and about the second axis At least one of the pneumatic units provides compliance along the first axis and about the second axis.

Abstract: A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral sideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

Abstract: A system for making electrical contact between a transmit/receive module and a testing device for the transmission of high-frequency signals includes a mechanically guided, frame-shaped contacting unit having a plurality of contact elements for contacting the TR module. The contacting unit surrounds the T/R module and is positioned relative to the T/R module such that the contact with the T/R module is established in one operation via the contact elements. A line substrate, which is arranged on the contacting unit and electrically connected with it, is constructed as a shielded triplate line by which the high-frequency signals can be conducted to the testing device.