Abstract: A system for controlling temperature of an antenna module including a heat generating module, and a radome and an underbody cover that enclose the heat generating module. The system includes: a heat collecting unit mounted on inner surface of the antenna module; a heat discharging unit mounted on outer surface of the antenna module; and a heat transfer unit for transferring heat from the heat collecting unit to the heat discharging unit.

Abstract: An exemplary electronic device includes a cover, a motherboard and a driving module both disposed at an inner side of the cover, an electronic component fixed on the motherboard, and a fan duct mounted on the motherboard and covering the electronic component. The driving module has a rotating shaft for supportively driving an optical disk rotating. The fan duct guides hot air therein toward the driving module.

Abstract: The present invention relates to a cooling system. More particularly, the present invention relates to a cooling system for removing dust from air being drawn for cooling heat generation components of an electronic product, for improving convenience in maintenance or repair of the electronic product.

Abstract: In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.

Abstract: A container data center includes a container, a group of server systems located in the container; a hot aisle and a cold aisle formed at two opposite sides of one group of server systems, a fan apparatus located at a top of the hot aisle, a heat exchanger located adjacent to the fan apparatus and opposite to the hot aisle; a cold airflow buffering area formed at a top of the cold aisle, and blades located below the cold airflow buffering area. Fan apparatus draws in hot airflow from hot aisle into the heat exchanger. The heat exchanger transforms the hot airflow into cold airflow and exhausts the cold airflow into the cold aisle through the cold airflow buffering area and the blades. Swinging angles of the blades are adjusted according to wind speeds of the cold airflow through the blades to obtain a uniform flow.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

Abstract: A heat dissipation device includes a receiving body and a blower. The receiving body includes a recessed body. The recessed body includes a first sidewall, a second sidewall opposite to the first sidewall, and a bottom connecting the first sidewall to the second sidewall. The blower is arranged on the bottom. The blower includes a casing, an air supply pipeline communicating with the casing, and an air blocking plate between the casing and the air supply pipeline. Two opposite ends of the air blocking plate respectively contact with the first sidewall and the second sidewall, such that the recessed body is separated into a first recessed area and a second recessed area. The first recessed area receives the casing, and the second recessed area receives the air supply pipeline.

Abstract: An air duct includes a top panel and a blocking member rotatable secured to the top panel. A through hole is defined in the top panel, and a pair of clipping portions are located an edge of the through hole. The blocking member includes an operating portion and a blocking portion connected to the operating portion. The operating portion is located on an outside of the top panel, and the blocking portion is located on an inside of the top panel. The operating portion of the blocking member is passed through a bottom surface of the top panel through the through hole, extends to a top surface of the top panel, and engaged with the pair of clipping portions.

Abstract: According to one embodiment, a cooling unit includes a heat dissipating mechanism, a fan, and a movable cover. The heat dissipating mechanism is housed in a housing of an electronic device. The fan is housed in the housing, and generates an air flow that collides against the heat dissipating mechanism. The movable cover includes a sheet and a knob. The sheet serves as an openable and closable cover to cover an opening on a chamber formed between the fan and the heat dissipating mechanism from the outside. The knob is located on the sheet and protrudes outward.

Abstract: Various technologies for cooling a computer system are described. In accordance with one described embodiment, a fan assembly system for a computer comprises a fan operable for cooling the computer and a fan duct coupled with the fan. The fan duct comprises a number of attaching features. The fan is suspended at least one component of the computer. Moreover, the suspended fan enables air to flow between the fan and the component (e.g., a heatsink) to facilitate cooling of the component.

Abstract: In order to increase the flexibility of the positioning of a stacked computer system within a data center, a removable fan unit is positioned within the computer system. The removable fan unit includes a fan housing that supports a fan electrically connected to a connector extending from a side of the fan housing. The connector of the removable fan unit may be electrically connected to a computer system-side connector in a first orientation to move air through the computer system in a first direction. The connector or another connector of the removable fan unit may be electrically connected to another or the same computer system-side connector in a second orientation to move air through the computer system in a second direction.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: An electronic apparatus includes the following: a heat dissipation chamber that is formed by liquid tightly separating the inside of a main unit case with a partition, has an inlet air vent and an outlet air vent in the partition, and includes a heat dissipation portion; a cooling fan that is located in the heat dissipation chamber; an inlet that is provided in the main unit case to introduce outside air into the heat dissipation chamber through the inlet air vent; and an outlet that is provided in the main unit case to exhaust an air flow sent from the cooling fan to the outside through the outlet air vent. An air channel that extends from the inlet air vent through a side wall of the main unit case to communicate the heat dissipation chamber with the inlet is liquid tightly sealed from the internal space of the main unit case with a sealing wall.

Abstract: A fan fixing device for fixing fan units includes two parallel first sidewalls, two parallel second sidewalls, and a number of fixing members. Each first sidewall defines a number of vent ports and includes a vertical plate, a lower plate, and an L-shaped engagement member. The lower plate and the engagement member are positioned at opposite sides of the vertical plate. The second sidewalls are connected between the first sidewalls. The second sidewalls and the first sidewalls cooperatively form a receiving room. The fixing members engage with between the engagement members of the first sidewalls, the fixing member is configured for securing the fan units to the two first sidewalls in the receiving room.

Abstract: A dustproof structure for a laptop includes a gate, a motor and a controller. The laptop includes a shell having an air vent defined therein. The gate is movably mounted on the shell. The motor is mounted on the shell and connected to the gate. The controller is installed inside the laptop and configured for controlling the motor to drive the gate to open the air vent of the shell when the laptop is powered on, and to close the air vent of the shell when the laptop is being powered off.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: A mounting apparatus for a fan includes a plate and a frame. The plate includes a venting portion. A number of locking holes and an engaging hole are defined in the plate, surrounding the venting portion. The frame includes a main body and a resilient portion extending from a side of the main body. An airflow opening is defined in the main body aligned with the venting portion of the plate. A number of hooks extend from the main body, around the airflow opening, to be engaged in the corresponding locking holes of the plate. A bulge protrudes out from the resilient portion to be engaged in the engaging hole.

Abstract: An exemplary computer case includes an external shell, a circuit board received in the external shell, and a dehumidification device. The circuit board includes a PCI socket providing an auxiliary power supply when the computer shuts down but the computer case retains electrical connection with an external AC power source. The dehumidification device includes a dehumidification card received in the PCI socket for obtaining the auxiliary power supply therefrom and a remote device. The dehumidification card includes a fan for generating airflow to remove moisture from the computer case and a sensor detecting a humidity inside the computer case. The remote device includes a display unit for displaying the result. When the humidity exceeds a predetermined value, the computer is not powered up until the fan evacuates the excess moisture from the computer case and the humidity falls below the predetermined value.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.

Abstract: In a storage device accommodating a plurality of memory devices in a general-purpose chassis provided from both of the surface sides thereof, a cooling device is provided on the front of the memory devices. This cooling device is allowed to freely move to leave available the area in front of the memory devices, thereby enabling maintenance and replacement of the memory devices from the both surface sides of the chassis. With such a storage device of a type using a general-purpose chassis, and inserting therein a plurality of memory devices from the both surface sides thereof, even if a cooling device is located on the front of the chassis, the memory devices can be subjected to maintenance and replacement.

Abstract: The present disclosure is generally directed to efficiently cooling converter and inverter components of a drive system. Present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. The duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another. Further, the inverter section, converter section, and air inlet section are configured to roll into and out of a cabinet, which facilitates access to field wiring.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems having parallel cooling air duct channels dedicated to providing cooling air for a converter heat sink and an inverter heat sink, respectively. In particular, a first duct channel through an inverter duct and a converter duct is dedicated to providing cooling air to the converter heat sink without cooling the inverter heat sink, whereas a second duct channel through the inverter duct and the converter duct is dedicated to providing cooling air to the inverter heat sink without cooling the converter heat sink.

Abstract: A reversible air flow fan system is described. A fan tray assembly is coupled with a chassis and a removable fan and bracket assembly that is oriented in a first direction. This removable fan and bracket assembly is configured to be removable from the fan tray assembly and being recoupled with the fan tray assembly in a second direction opposite the first direction. An air duct is coupled with and enables the exchange of air between the removable fan and bracket assembly and a first surface of the chassis. A sensor coupled with the fan tray assembly is configured for coupling with at least one bracket of the removable fan and bracket assembly when the removable fan and bracket assembly is oriented in the first direction.

Abstract: A cooling system for rack mount electrical or electronic equipment comprises a hollow, box-shaped exhaust shelf having a vent on at least one end face thereof. The exhaust shelf may be configured for rack mounting. A side duct, open on its inner side, is mounted between the exhaust shelf and a top rail adapted to be mounted between a front post and an opposing rear post in a four-post rack mount enclosure. A plenum in the side duct is in fluid communication with the interior chamber of the exhaust shelf. A chassis having a side-facing exhaust for cooling air may be mounted on or over the exhaust shelf such that warm air exiting the chassis is collected in the plenum of the side duct and channeled into the exhaust shelf and out through the vent. In this way, the desired front-to-back cooling air flow within a rack mount enclosure may be maintained even if one or more individual chassis mounted in the enclosure have side cooling air exhausts.

Abstract: An air duct defines a first air vent and a second air vent at opposite ends thereof, respectively. The air duct includes a duct body and a movable plate. The duct body defines a through opening in a side thereof. The through hole intercommunicates an interior and an exterior of the air duct. The movable plate is mounted on the side of the duct body adjacent to the through opening. By moving the movable plate, the through opening can be changed between an open state and a closed state freely. An electronic device incorporating the air duct is also provided.

Abstract: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.

Abstract: A system for thermal management of electronic equipment. The system can include a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet. Additionally, the system can include a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor; an exhaust channel, wherein at least a portion of the exhaust channel is in proximity to the cabinet outlet. Furthermore, the system can include a plurality of flexible barriers forming a thermal curtain for directing air exiting the outlet of the cabinet to the exhaust channel, and wherein a position of the barriers is adjustable.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.

Abstract: An electric device includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to faceopening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: A heatsink device includes an insulating board having at least one periphery, a first face and a second face, at least two conductive plates mounted on at least one of the first face and the second face of the insulating board, and at least one heat source mounted on the insulating board and having two conducting poles conducted with the at least two conductive plates. Thus, the at least two conductive plates are directly connected with the two conducting poles of the at least one heat source so that the at least two conductive plates can carry away the heat produced by the at least one heat source so as to provide a heatsink effect to the at least one heat source.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A storage unit includes: a storage section containing an information processing apparatus; an intake section allowing intake of a cooling medium into the information processing apparatus for cooling the information processing apparatus; a discharge section receiving the cooling medium discharged from the information processing apparatus; a cooling medium flow generating section configured to control intake and discharge of the cooling medium; a partition section isolating the intake section and the discharge section from each other; an aperture formed in the partition section; a detector section configured to detect an inflow of the cooling medium, discharged from the discharge section, through the aperture; and a controller section configured to control the cooling medium flow generating section in accordance with a result of the detection of the detector section.

Abstract: A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity.

Abstract: An air duct installed in a chassis is configured to have a heat dissipating device mounted thereon during shipping. The heat dissipating device defining a number of mounting holes corresponding to a number of fixing members extending from a surface of the air duct to accomplish the mounting. Thereby, the heat dissipating device may be conveniently and securely packaged and transported with the air duct and chassis.

Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.

Abstract: A waste heat recycling device includes an air-duct, a fan and a retaining mechanism. The air-duct is connected to a heat air. The fan communicates with the air-duct. The retaining mechanism clasps the air-duct and retains the fan. The retaining mechanism includes a clip and a support ring. An edge of the air-duct is sandwiched between the clip and the support ring.

Abstract: An electronic device includes a chassis having a bottom wall. A motherboard is disposed on the bottom wall. A riser card is perpendicularly connected to the motherboard. An airflow duct is located on the bottom wall of the chassis. A securing member is mounted to the airflow duct. The securing member includes a supporting piece secured to the airflow duct, and a securing piece is pivotally mounted to the supporting piece. The securing piece is engaged with the supporting piece to clamp an expansion card between the supporting piece and the securing piece.

Abstract: An electronic device enclosure includes a chassis, a drive bracket, and an air duct. The drive bracket is secured to the chassis and defines a subspace for receiving a disk drive. The air duct is rotatably secured to the drive bracket, and rotatable between a first position, where the subspace is exposed, and a second position, where the subspace is covered by the air duct.

Abstract: A computer system includes a chassis, a motherboard, a heat sink, a duct and a fan. The chassis includes a chassis bottom wall. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The duct includes a guiding portion and a latch portion located on the guiding portion. The latch portion is secured to the chassis bottom wall. The guiding portion is adjacent to the heat sink to direct airflow to the heat sink. The fan is secured on the latch portion of the duct. The guiding portion of the duct is positioned between the heat sink and the fan.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: A power supply including a housing, a sliding member, a plurality of terminals and a fan module is provided. The housing has an opening and an inner sidewall. The sliding member is disposed on the inner sidewall of the housing. The sliding member has at least one fixing slot parallel to the inner sidewall. The terminals are disposed on the sliding member and can slidably move parallel to the inner sidewall. The fan module is mounted in the housing from the opening. A terminal connector is disposed on an outer sidewall of the fan module and located on a moving direction of the terminals, so that the terminal connector can be electrically connected to the terminals.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: Provided is an electronic apparatus capable of also supplying sufficient air flow to a heat generating device other than the heat sink. An electronic apparatus includes: a cooling unit (10) including a heat sink (13), and a cooling fan (15) for generating air flow for receiving heat of the heat sink (13); an upper wall member (40) connected to the cooling unit (10) so as to form an outer wall defining an air passage continuous with the cooling unit (10); and a power circuit (17) arranged in the air passage and serving as an object to be cooled.

Abstract: An exemplary computer enclosure includes a chassis, a mounting frame, two air-guiding members, and a fan. The chassis includes a first side panel, a second side panel, and a ventilation area defining ventilation through holes. The mounting frame is fixed to the chassis and faces the ventilation through holes. The mounting frame is configured for receiving electronic components. The two air-guiding members respectively connect two opposite sides of the mounting frame to the chassis. The two air-guiding members incline relative to the mounting frame and the chassis to form an air passage. The fan is configured for exhausting air passing through the ventilation through holes and the mounting frame. The two air-guiding members and the first and second side panels cooperatively surround the ventilation area to allow the air to enter the chassis from the ventilation area and allow all of the air to pass through the mounting frame.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.

Abstract: An electronic device includes a fan including a frame, an enclosure, and many fixing members engaged with the enclosure to fix the fan in the enclosure. The frame includes many mounting holes positioned in corners of the frame, respectively. The enclosure includes many sidewalls and many fixing members corresponding to the mounting holes. Each fixing member includes a base, a fixing portion extending from a top surface of the base, an angle shaped clasping portion extending from a sidewall of the base. Each base includes a locating block received in a corresponding locating member, and at least one fixing arms abuts against the corresponding locating member. Each fixing portion extends through the locating member and is received in a corresponding mounting hole. Each clasping portion extends through the corresponding locating member and clasps an inner wall of the corresponding mounting hole.