Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: A server rack system includes a rack, servers, and a heat-dissipating wall. The rack has guiding rails, a front end, and a rear end opposite to the front end. The servers slidably configured on the guiding rails and in the rack are adapted for being moved into or out of the rack from the front end. The heat-dissipating wall is pivoted to the rear end and adapted for being folded against or unfolded away from the rear end. The heat-dissipating wall includes a fan wall. Fans lie on the fan wall. The fans are adapted for sucking cool air, such that the cool air enters the rack from the front end and passes through the servers. Heat exchange between the cool air and the servers is carried out to generate hot air that flows out of the rack through the heat-dissipating wall to dissipate heat of the servers.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A cellular cooling part includes a number at least one movable part, that can be the removable flap or movable cover for a fan. The fan, for example, can be moved or opened to expose it. A flap can also be opened. In addition, different covering structures can be used.

Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A fan module is detachably mounted in a chassis. The chassis includes a sidewall defining a locking slot. The fan module includes a bracket including a base plate defining a first through slot, a fan fixed to the base plate, a fan duct fixed to the base plate beside the fan, and a locking member. The fan duct includes a side plate defining a second through slot. The locking member is fixed to the fan duct. The locking member includes a locking portion extending through the second through slot of the fan duct and the first through slot of the bracket to lock into the locking slot of the chassis.

Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Abstract: A notebook computer cooling pad capable of temperature detection and fan-speed adjustment is equipped with heat-dissipating fans, a control panel and plural movably deposited temperature sensors, so that when a notebook computer is placed on the notebook computer cooling pad, a user may be informed of real-time temperature readings related to different locations of the notebook computer and use the use the fan-speed adjusting button to adjust a rotational speed of the heat-dissipating fans.

Abstract: An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

Abstract: A server and a heat dissipation method adapted for the server are provided. The method includes: sensing temperatures of two temperature sensors. Recognizing the two temperature sensors, determining a temperature difference between the two temperature sensors and obtaining a comparison result. Selecting one stored table according to the comparison result and acquiring fan running data recorded in the table. In addition, controlling the at least one fan to rotate according to the acquired fan running data. When a motherboard of the server is in one installation direction, the server selects corresponding fan running data and controls the at least one fan to rotate according to the two temperatures of the two temperature sensors installed at the two opposite ends of the motherboard. Therefore, the server can get a good heat dissipation effect in two installation directions of the motherboard.

Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

Abstract: A wiring structure for an electronic apparatus has a structure in which a first wiring path where a first harness that is used for transmitting a primary power is wired and a second wiring path where a second harness that is used for transmitting a secondary power is wired are formed, and a structure related to the first wiring path is formed so that, in a case where the first harness is wired, the first harness is integrated with the structure related to the first wiring path.

Abstract: An electric power converter includes a cooler and an electronic circuit. The cooler includes a heat sink, a cooling fan, and a wind tunnel. A plurality of radiator fins are provided on a heat-sink base in the heat sink. The cooling fan is configured to feed cooling air through the plurality of radiator fins. The wind tunnel covers the plurality of radiator fins and the cooling fan. The electronic circuit includes a plurality of rectifiers and a plurality of input terminals. The plurality of rectifiers are provided on a side of the heat-sink base opposite to the plurality of radiator fins and are arranged side by side in a longitudinal direction of the heat-sink base. The plurality of input terminals are connected to the plurality of rectifiers with band-shaped conductors and are provided on a side of the plurality of rectifiers opposite to the heat sink.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: A server system includes a rack, a server disposed in the rack, an electronic device and a power supply disposed in the rack. The rack includes a first side and a second side opposite to each other, two first brackets, two second brackets and two lateral rails. Each first brackets, disposed at the first side, includes a heat-dissipation part. Each heat-dissipation part includes at least one ventilating perforation. The second brackets are disposed at the second side. The electronic device is disposed between the lateral rails and at the first side. The power supply is disposed between the two lateral rails and at the second side and includes a main body and at least one fan. The main body includes a plurality of through openings facing the ventilating perforations. The at least one fan draws airstreams from the ventilating perforations via the through openings.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: A media device includes at least one piezoelectric fan selectively located to draw or urge air past one or more electrical components, such as an integrated circuit chip. Preferably, the piezoelectric fan is located within a channel milled or otherwise formed in the chip, however the fan may be located proximate the channel yet in fluid communication therewith. The piezoelectric fan operates to convectively cool the electrical component and may also prevent heat that has been generated by the electrical component from moving toward another electrical component within the media device. Thus, the configuration and location of the piezoelectric fan may advantageously cool one component while preventing heat energy from building up around one or more other components mounted nearby.

Abstract: A storage server rack system includes a rack and multiple storage servers assembled inside the rack. The rack includes an integrated power module and a fan wall. The integrated power module distributes a power to the storage servers. The fan wall is disposed by a side of the storage servers for dissipating heat. Each storage server includes a case, an electrical connection module, a motherboard and multiple storage units. The case has a first lateral side and a second lateral side disposed oppositely to each other. The electrical connection module is disposed on the first lateral side and connected to the integrated power module. The motherboard is disposed inside a first heat dissipation space in the case and electrically connected to the electrical connection module. The storage units are disposed outside the first heat dissipation space in the case and electrically connected to the electrical connection module.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.

Abstract: A heat exchange apparatus is provided and includes an external structure to support an airflow cooled computing device, first and second doors, each of which includes a heat transfer surface, sequentially coupled to the external structure downstream from the computing device, a water supply system fluidly coupled to a water supply and to the heat transfer surfaces of the first and second doors to thereby supply water to the heat transfer surfaces, first and second valves coupled to the water supply system for association with the first and second doors, respectively, and an exhaust system, disposed proximate to the external structure, configured to recycle the cooled airflow downstream from the first and second doors for repeated cooling of the computing device.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: A fan assembly for a computing device is disclosed. The device can include an impeller having a number of blades and a motor for turning the blades. The motor can turn the blades via a magnetic interaction between the impeller and the motor. A fluid dynamic thrust bearing can be used to control a position of the impeller relative to the motor. In particular, the impeller can be configured to rotate around an axis and the thrust bearing can be used to control movement of the impeller in a direction aligned with the rotational axis. In one embodiment, the thrust bearing can be configured to stabilize the impeller when vibratory forces act upon the fan assembly. More particularly, parameters associated with the thrust bearing can be selected to counteract vibratory forces emitted by a speaker system.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case housing the circuit board, the circuit board oriented in a substantially vertical direction, a vertical inner wall surface of the case formed opposite the non-mounting surface of said circuit board, the vertical inner wall and the non-mounting surface of said circuit board defining a substantially vertical air ventilation path, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: A fixing assembly for a fan module is combined in a housing and includes at least one fixing base and at least one bottom pad. The fixing base has an accommodating space and a plurality of positioning portions in the accommodating space. The positioning portions are provided in pairs and symmetrical to each other. The locations of the positioning portions are designed for positioning various sizes of heat-dissipating fans. The bottom pad is configured to support the bottom of the fixing base. By this structure, various sizes of fan modules can be positioned in the housing.

Abstract: An apparatus and article is disclosed for separating intake air from exhaust air. The apparatus discloses an intake port, coupled to conduct intake air; an exhaust port, coupled to conduct exhaust air; and an air-curtain port, coupled to conduct air-curtain air to separate at least a portion of the intake air conducted by the intake port from the exhaust air conducted by the exhaust port. The article discloses a ductwork shell article, having an intake vent, an intake chamber, an exhaust vent, an exhaust chamber, an air-curtain vent, and an air-curtain chamber; wherein: the air-curtain vent is in part located between the exhaust vent and the intake vent.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: An air duct includes a top plate, two side plates extending from two lateral sides of the top plate, a baffle plate extending from the top plate and located between the side plates, and a torsion spring connected between the top plate and the baffle plate. The top plate and the side plates cooperatively define an air passage in the air duct. The baffle plate includes a first end pivotally connected with the top plate and an opposite second end. The second end of the baffle plate is rotatable relative to the top plate. The torsion spring includes two arms abutting against the top plate and the baffle plate, respectively. When the baffle plate is rotated relative to the top plate under an external force, the torsion spring resists such force.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: A container data center includes a container, a number of rack servers arranged in the container, and an air-conditioning device arranged in the container. The air-conditioning device defines a vent. A fan module is mounted in the vent, for blowing cooling air generated by the air-conditioning device to the rack servers.

Abstract: A container data center includes a container, a number of rack servers arranged in the container, and a cooling room. Each rack server includes a fan module attached to a first side of the rack server, and defines an opening in a second side of the rack server facing the cooling room. The fan module operates to draw air from the rack server, then the cool air in the cooling room flows into the rack server to cool the rack server.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path.

Abstract: A bade computer system comprises side-by-side computer blades (44, 144), a connectivity module (50, 150, 350) extending across and connected to each of the plurality of side-by-side computer blades (44, 144) along the ends of the computer blades (44, 144) and at least one first power supply-fan unit (46, 146) extending perpendicular to the first axis and directly connected to each of the first plurality of side-by-side computer blades (44, 144) along ends of the plurality of side-by-side computer blades (44, 144) such that the at least one power supply-fan unit (46, 146) draws air across the first plurality of side-by-side computer blades (44, 144) and into the first connectivity module (50, 150, 350).

Abstract: The docking station (10) comprises a casing (11) presenting an air inlet (12) and a cooled air outlet (13) and housing a refrigeration system (30) for cooling an air flow which is caused to pass through the interior of the casing (11), from the air inlet (12) to the cooled air outlet (13). The refrigeration system (30) comprises: a compressor (31) pumping refrigerant fluid through a refrigeration circuit comprising a condenser (32) and an evaporator (33) and, preferably, a ventilation means (34) producing said air flow which is conducted through the evaporator (33) to be cooled thereby and released, through said cooled air outlet (13), to the interior of a computer (20) seated against the docking station (10).

Abstract: An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.

Abstract: An information processing apparatus allows an operator to extract temperature adjustment electrical components accommodated in two holders through a single extraction port when changing the temperature adjustment electrical components. A second holder shares a transfer pathway between an accommodation position of a first holder and an opening portion of a chassis. When the second holder moves in the direction of the opening portion, the first holder is accordingly pushed and moved. Next, the first holder is fixed to a rotating member and is moved to a position above the chassis. After the second holder is discharged to the outside of the chassis, the first holder is returned to the original position.

Abstract: A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure.

Abstract: A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate.

Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

Abstract: A power converter is installed in a casing attached beneath the floor of an electric vehicle. The power converter includes a capacitor unit and a power semiconductor module housed in a hermetically sealed part of the casing closed by a cover for closing an access port, and a cooler installed in an exposed part, the cooler cooling heat generated from the power semiconductor module. The power converter includes a bus bar that electrically connects the power semiconductor module and the capacitor unit, and a conductive bar that electrically connects the capacitor unit and the bus bar. The conductive bar is drawn from the upper surface of the capacitor unit, and is bent into a crank.

Abstract: An electronics cooling system comprises a tubular fan duct and an electronics housing. The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes. The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space. A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment. The electronics cooling system further comprises three electronics mounts within the interior space. A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct. A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct. A third electronics mount is located immediately adjacent to the bleed hole, on the housing.