Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: One embodiment of a method of providing ventilation to electronic equipment comprises receiving exhaust air flow from first electronic equipment positioned next to a ventilation structure; directing the exhaust air flow out of exhaust fan assembly of the ventilation structure; receiving cold air from an intake fan assembly of the ventilation structure; and directing the cold air to an intake vent of second electronic equipment positioned next to the ventilation structure.

Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.

Abstract: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot.

Abstract: An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board.

Abstract: An electronic apparatus includes a first chamber in which a heat generator is arranged and a second chamber separated with a partition from the first chamber. The electronic apparatus is provided with a first cabinet having the partition and an isolation wall that encloses to seal the first chamber, a second cabinet enclosing the second chamber and having an intake port and an exhaust port, a thermoconductive member arranged in the first chamber and connected thermally to the heat generator and to the partition, a heat collecting-radiating member arranged in the second chamber and connected thermally to the partition, and an air blower arranged in the second chamber so as to circulate the air in the second chamber.

Abstract: A computer chassis is provided. The computer chassis includes a housing having a first closed compartment with a first heat sink having a first heat dissipating surface formed on one side of the first closed compartment; and a second closed compartment having a second heat sink with a second heat dissipating surface formed on one side of the second closed compartment. The first and second compartments are substantially isolated from air flow within the housing. The housing, the first closed compartment and the second closed compartment are configured to define an air passage way between the housing, the first heat dissipating surface and the second heat dissipating surface. This air passage way forms a chimney effect that aids in cooling and promotes natural air convection.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: An electronic apparatus includes a heat dissipating module mounted at a position interposed between a shield plate and a main circuit board and air sent from a fan through a heat dissipating fin is discharged from an air vent, wherein the heat dissipating module includes the heat dissipating fin in contact with the heat generating electronic component; the fan sending the air; and a base body supporting the fan and the heat dissipating fin at a position closer to a side of the shield plate than a position of the fan, and having a slope between the fan and the heat dissipating fin for guiding the air sent from the fan to the heat dissipating fin, wherein the shield plate includes a cut and raised piece which faces the slope and obliquely guides the air sent from the fan to the heat dissipating fin along the slope.

Abstract: A mounting apparatus includes a first bracket and a second bracket. Two guides are located on the first bracket. A locking block is located on the first bracket between the two guides. The second bracket receives a first fan. Two sliding portions are located on the second bracket and engaged with the two guides. A latch is resiliently deformable and located on the second bracket between the two sliding portions. A plurality of receiving holes is defined in the latch. The second bracket is slidable between the two guides relative to the first bracket. The locking block is can engage in the plurality of receiving holes to secure the first bracket to the second bracket in a plurality of positions.

Abstract: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at least one connector in the plurality of connectors such that, when all of the set of processing module sides are coupled together, the modular processing module is formed. The modular processing module comprises an exterior connection to a power source and a communication system and at least one heatsink that couples to at least a portion of the plurality of processing nodes on one of the processing module sides and is designed such that, when a set of heatsinks in the modular processing module are installed, an empty space is left in a center of the modular processing module.

Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A plenum provides cooled air to an inlet of an enclosure. An electronics assembly within the enclosure includes temperature sensors. Each of a plurality of position variable flow restrictors is positioned to control flow of the cooled air to a portion of the electronics assembly. A controller individually positions each flow restrictor based on temperature measurements provided by the temperature sensors associated with the portion of the electronics assembly for which cooled air is provided via the flow restrictor.

Abstract: A portable air cooled data center can include interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans can pull external air over the outer heat pipe assembly. A first transducer can monitor inner air temperature within the data center, a second transducer can monitor the outer heat pipe assembly, and a third transducer can be secured proximate to a fin side of the heat sink. A controller can be connected to the transducers, fans, and a power supply. Computer instructions can be used to monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.

Abstract: A computer case includes outer panels forming an internal space sized and shaped to accommodate at least a motherboard, a plug-in card and a hard drive; and an inner panel arranged in the internal space and which physically forms a separate lower section of the internal space from an upper section of the internal space, wherein the upper section is arranged above the lower section of the internal space such that the upper section of the internal space accommodates the motherboard and the plug-in card and the lower section of the internal space accommodates the hard drive.

Abstract: A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.

Abstract: A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.

Abstract: A laptop computer user thermal isolation apparatus is provided for inhibiting the transfer of waste heat from internal heat generating components to a user. The thermal isolation apparatus includes a casing substantially enclosing the heat generating components, the casing including at least one panel having a sealed enclosed cavity disposed between the heat generating components and an outer surface of the casing.

Abstract: A heat dissipating apparatus comprises a base, an air duct, and a cooling fan. The base comprises a first cooling portion and a second cooling portion. The air duct covers the first cooling portion, and defines an air inlet and an air outlet. The cooling fan is secured to the first cooling portion, and located below the air inlet. A blocking board is secured between the first cooling portion and the second cooling portion to prevent air flowing from the first cooling portion to the second cooling portion.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: A fan includes, an impeller having propeller-shaped blades, a motor disposed inside of a hub to rotationally drive the impeller centered on the rotation axis, a tubular air duct forming an air passage on a periphery of the blades of the impeller and the rotation axis, wherein the rotation axis penetrates the inside of the air duct, and an exhaust outlet larger than an outer diameter of a rotation trajectory of the blades is formed on one end of the air duct, and an air flow guiding plate blocking an opening on an other end of the air duct in the rotation axis direction, a suction inlet through which the rotation axis passes being formed in approximately the center of the air flow guiding plate, wherein the blades are closer to the air flow guiding plate than the air duct.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another.

Abstract: A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel.

Abstract: A supplementary cooling system is provided for cooling a computing system. An apparatus may comprise a computing system and a docking system. The computing system has a cooling area and a fan area which is partionable from the cooling area. The docking system has a fan and an airflow outlet which is operably connected to the fan.

Abstract: A heat exchange device includes a housing, an internal circulating fan, an external circulating fan and a heat exchange unit. The internal and external circulating fans and the heat exchange unit are disposed in the housing. The internal and external circulating fans are disposed at the same side relative to the heat exchange unit. A closed-type electronic apparatus including the heat exchange device is also disclosed.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: A computer case includes a housing, a first dust screen and a second dust screen. The housing defines two openings at opposite ends of the housing. The first dust screen and the second dust screen each include a piece of nonwoven fabric and a bracket, and are respectively covered on the two openings. The nonwoven fabric is covered on the bracket. The bracket includes a rim and a plurality of reinforcement ribs connected to an inner side surface of the rim.

Abstract: Silencing equipment provided with one or more flow channels through which cooling air flows has a flow channel forming member that forms the flow channel, and an acoustic absorbent member that is fixed to the flow channel forming member. A resonance type silencer is formed on a wall surface of the flow channel by providing a cavity for the resonance type silencer in the acoustic absorbent member and an aperture for the resonance type silencer in a portion of the flow channel forming member. The resonance type silencer sets a frequency of noise necessary to be reduced based on a peak frequency of noise generated by a fan. The silencing equipment further has a slide member which slides by a slide mechanism to adjust the area of the top of the aperture. The silencing equipment for electronic devices capable of cooling heat generating sections thereof with air has a small and simple structure and can improve a silencing effect by blowing air.

Abstract: A container data center includes a container, servers, a monitoring device, a cooling system, and a controller. The container is divided into first regions and a second region which are separated from each other. The servers are received in the respective first regions. The monitoring device is for monitoring the servers and received in the second region. The cooling system includes a first generator for generating a first cool airflow, a second generator for generating a second cool airflow for the second region, an air pipe connecting the first regions and directing the first cool airflow to the first regions, and valves arranged in the air pipe. Each valve is positioned between each two adjacent first regions. The controller controls the first generator, the valves and the second generator.

Abstract: A system includes a rack, one or more computer systems mounted in the rack, and two or more alternating current (AC) fans mounted in the rack. The AC fans move air through the computer systems mounted in the rack. At least one of the AC fans can move air through at least two of the computer systems mounted in the rack.

Abstract: An electronic assembly includes an electronic device and a solar shield coupled to the electronic device. The solar shield has an attachment portion which attaches to the electronic device, and a shield portion coupled to the attachment portion. The shield portion prevents direct sunlight from substantially reaching a section of the electronic device. The shield portion defines (i) at least a portion of an air intake, (ii) at least a portion of an air exhaust, and (iii) at least a portion of an air passageway which extends from the air intake to the air exhaust. The air passageway overlies the section of the electronic device enabling ambient air adjacent the air intake to form natural convective airflow into the air intake and out the air exhaust through the air passageway to carry away heat from the section of the electronic device during electronic operation of the electronic device.

Abstract: A cooling system for a mobile computing device configured to drive two devices, a fan and an alert device. The fan cools components of the mobile computing device by exchanging air between an inner cavity of the mobile computing device and an outer environment surrounding the mobile computing device. The alert device produces an alert, e.g., a vibration, for the mobile computing device. The cooling system includes a motor operably connected to a first device (either the fan or the alert device) and operably connected via a clutch to a second device (either the fan or the alert device). The clutch allows the second device to be selectively activated depending on a speed or rotational direction of a drive shaft of the motor.

Abstract: A container data center system includes a plurality of container data centers and a dissipation system. Each container data center includes a container and a number of servers arranged in the container. The containers of the container data centers communicate with each other. The heat dissipation system includes a refrigerating device configured for generating cooling air to one of the containers.

Abstract: In a computer system, airflow through first and second cooling regions are normally separated by a chassis wall, and are independently controlled by respective first and second fan modules. The internal chassis wall includes a bypass opening that is normally blocked by the second fan module. In response to removal of the second fan module, the bypass opening is unblocked, to fluidly couple the two cooling regions. A redundant fan module is optionally included in fluid communication with the first cooling region, to either generate airflow through the first cooling region in response to failure or removal of the first fan module, or to supplement the airflow capacity of the first fan module in response to removal of the second fan module.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.

Abstract: Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.

Abstract: A dust-free and anti-vibration industrial computer. The industrial computer has a case sealed from the outside, a heat diffusion fin assembly mounted on the outer surface of the case, and a circulation pipe for allowing a heat generating component and at least a heat diffusion fin to be communicated with each other, or a heat pipe for transferring heat between the heat generating component and the heat diffusion fin. The heat generating component can be cooled in a state in which dust is prevented from being produced within the case.

Abstract: A data center includes a row of one or more racks. Computer systems are mounted in the racks. A cold aisle is on a first side of the rack row and a hot aisle is on the second side of the rack row. An air handling system moves air from the cold aisle on the first side of the row of racks through computer systems in at least one of the racks and exhausts air from the computer systems into the hot aisle on the second side of the row of racks. The computer systems include input/output connectors, power input connectors, and power supply air inlets on the first side (cold-aisle side) of the row. One or more power rack power distribution units are provided on the first side (cold-aisle side) of the row.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.

Abstract: A computer system includes a display, a computer case securing the display, a fan assembly and a cover. A motherboard is attached to the computer case. A chip, a heat dissipating device, and a system fan are located on the motherboard. The fan assembly includes a securing plate and a fan attached to the securing plate. The securing plate covers the plurality of the memory cards. The cover defines a plurality of air intakes and a plurality of air outlets. The plurality of air intakes, the fan, the heat dissipating device, the chip, the system fan and the plurality of air outlets together form an air path for moving air therethrough.

Abstract: An exemplary heat dissipating system includes a case, a motherboard, an air conducting guide dividing the motherboard into a first area and a second area, a group of first fans, and a group of second fans. The group of first fans and the group of second fans draw cool air into the first area and the second area from different directions for dissipating heat generated by electronic components on the motherboard.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: An electronic device includes: a chassis for housing an electronic unit; and a hold member capable of holding to a fan unit blowing air toward the electronic unit and attachable to and detachable from a plurality of positions of the chassis.

Abstract: In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.

Abstract: A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.

Abstract: A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing nodes of the fan support so that a user can push the pushing nodes to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad.

Abstract: A computer enclosure includes an enclosure, an air conduction member mounted in the enclosure to guide airflow, and a data storage device mounted to a top of the air conduction member.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.