Abstract: Various embodiments are provided for scalable graphical processing unit (GPU) functionality in electronic gaming machines (EGMs). The EGM may include a base component to house an enclosed master gaming controller (MGC). The enclosed MGC may have one or more graphics card expansion ports located externally to the enclosed MGC. The EGM may include a display device, supported by the base component, to display one or more images of one or more games. The EGM may include a graphics accelerator component housed within the display device to enhance one or more images associated with one or more games on the display device.

Abstract: An information handling system includes an enclosure having a front portion and a rear portion. An exhaust duct is located in between a first central processing unit and a first set of downstream components within the rear portion. The exhaust duct directs first airflow from the first central processing unit out of the information handling system without the first airflow reaching an inlet of the first set of downstream components. A first top cover is attached to the rear portion. The first top cover includes a first hole cut above the exhaust duct. The first hole enables the first airflow to escape from the rear portion.

Abstract: Provided is a high-capacity SSD that has the same form factor as 3.5-inch hard disk drives and has a structure where memory cards, such as standard M.2 SSDs, M.3 SSDs or nonstandard full-scale SSDs, are inserted in a horizontal sliding manner into an exterior having the same size as a 3.5-inch hard disk drive, and are provided in a multi-stage arrangement in the vertical direction. The SSD multiplier provides a high-capacity SSD case structure having a novel structure where a vertical backplane board is placed at a fixed position such that the case does not need to be disassembled even when an SSD memory card is replaced with another SSD memory card having a different length. Further provided is a case structure which can handle the various sizes of SSD memory cards that are used, where individual SSD memory cards have vibration resistance characteristics against external vibrations in XYZ-axis directions.

Abstract: A remote-controlled data center floor tile of a raised floor plenum is adjustable by a remote control system to selectively direct air supplied from the raised floor plenum to cool particular rack computing systems in a data center. Floor tiles can include one or more remote-controlled flow control elements that can be independently adjusted to different particular configurations to direct air to one or more specific targets. A remote control system can independently adjust various flow control elements configurations in a network of various floor tiles to manage environmental conditions in a data center, including mitigating localized temperature hotspots at particular portions of a rack computing system. Hotspot mitigation can involve responding to detection of a hotspot at a target location by configuring one or more flow control elements to direct air supplied from the raised floor plenum to supply additional air to cool the target location.

Abstract: Techniques for operating a data center include providing at least one fan coil unit operable to circulate a cooling airflow to a human-occupiable workspace of the data center; providing a plurality of computer racks arranged in one or more rows in the human-occupiable workspace; forming one or more warm air aisles between the one or more rows of the plurality of computer racks that are in fluid communication with an inlet of the fan coil unit through a warm air plenum, and also with an outlet of the fan coil unit through the human-occupiable workspace and the plurality of computer racks arranged in one or more rows; adjusting the associated electrical power density of one or more of the plurality of computer racks; and based on the adjustment, adjusting a characteristic of the data center.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: A heat exchanger assembly for an electronic image assembly placed within a housing where ambient air surrounds the exterior of the housing and a rear plate may be placed behind a backlight to create a channel. An ambient air fan may be placed between two portions of a heat exchanger to force ambient air through the heat exchanger. The fan may also be positioned to also force ambient air through the channel. A circulating gas fan may also be placed within the housing to force circulating gas through at least one portion of the heat exchanger.

Abstract: A controller including a case provided with at least one opened surface, a cover opening and closing the at least one opened surface, and a circuit board provided within the case and provided with a heating unit. The cover includes a cover body and a heat radiation unit in which at least a portion of the inner surface of the cover body is concave toward the circuit board so as to be closely adhered to the heating unit for the purpose of heat radiation. Thereby, heat within the controller may be effectively radiated and the lifespan of electrical devices may be extended.

Abstract: An air containment system (22) is configured to span an aisle (12) formed by two rows of racks (14,16) or by one row of racks (14) and a wall (56) to form a ceiling. The air containment system (22) includes a frame structure (24) configured to be supported by the two rows of racks (14,16) or by the one row of racks (14) and the wall (56). The air containment system (22) further includes at least one ceiling panel (30) releasably supported by the frame structure (24), and a lock assembly (64) coupled to the frame structure (24) and configured to release the at least one ceiling panel (30) upon detecting a predetermined condition. Embodiments of the air containment system (22) and methods for releasing ceiling panels (30) are further disclosed.

Abstract: An electronic device includes a case having an exhaust vent, an electronic component, a radiation component including radiation fins adjacent to the exhaust vent and formed of first plates disposed parallel to one another to form first air channels, the radiation component radiating the heat received from the electronic component to air passing through the first air channels, a fan disposed at a position having a space from the radiation fins to send air toward the radiation fins, a dust filter including second plates disposed parallel to one another to form second air channels and disposed in the space between the radiation fins and the fan to transfer the air to the radiation fins while capturing dust. The dust filter is removable and the second plates have a shape to be inserted in the first air channels so as to push the dust out of the first air channels.

Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating component, a vent operably interposed between the second inlet and the heat generating component and a controller coupled to the fan and the vent to respectively control operations thereof. The cooling and noise-reduction apparatus includes a ducting element configured to flexibly and fluidly couple the second inlet with the central air conditioning system.

Abstract: An electronic device includes a main body, two air guiding plates, and a cover. The main body includes a bottom plate and two side plates extending up from opposite sides of the bottom plate. A number of mounting tabs extend from an inner side of each side plate, arranged in a row. A circuit board is supported on the bottom plate, and includes a number of electronic components located between the two rows of mounting tabs. A cutout is defined in a top of each mounting tab. A number of hooking slots are defined in a bottom of each air guiding plate. Top walls of the hooking slots of each air guiding plate are respectively supported by bottom walls of the cutouts of the corresponding row of mounting tabs. The cover is covered on a top of the main body and abuts tops of the air guiding plates.

Abstract: A system for use with a computing rack that prolongs operation of computing devices mounted within the rack by preventing or at least limiting the circulation of airflow (e.g., hot airflow) through empty receiving bays of the rack upon removal of computing devices from the receiving bays. In one arrangement, the system includes a plurality of airflow restriction devices (e.g., baffle plates) movably secured adjacent respective receiving bays of the cabinet. Each airflow restriction device is automatically movable between a deployed position to restrict airflow through respective receiving bay in the absence of a computing device in the receiving bay and a refracted position to allow for mounting of a computing device in the receiving bay (e.g., so that the computing device can exhaust hot air out of the rear portion of the receiving bay).

Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip.

Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

Abstract: A deflection device and an electronic device are disclosed. The deflection device is located in the electronic device for guiding airflow generated by a fan device to at least one electronic component. The deflection device includes a first fixed part and a plurality of strip structures. The first fixed part is used for fixing the deflection device in a suitable position. One end of each of the strip structures is connected to the first fixed part and able to undergo compression deformation independently such that forms a first shape when not compressed or a second shape when compressed. When the deflection device is fixed in a suitable position of the electronic device and close to the electronic component, the shape of the at least one strip structure is changed from a first shape to a second shape for guiding the airflow to the electronic component.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: A memory cooling duct can include: a front end and a back end; a top that includes a fan mount disposed between the front end and the back end; a front end vent; a front edge, a back edge and opposing side edges that define a rectangular bottom opening; and a flexible lever at the front end that includes a locking surface for locking the memory cooling duct over a rectangular array of memory sockets. Various other apparatuses, systems, methods, etc., are also disclosed.

Abstract: Flow diversion apparatuses and methods are provided. A flow diversion apparatus can include a vent configured to permit the flow of a fluid therethrough. The apparatus can also include an electronic device capable of a range of motion across at least a portion of the vent disposed proximate at least a portion of the vent. The apparatus can include a shutter disposed proximate at least a portion of the vent opposite the electronic device. The shutter can be capable of a range of motion across at least a portion of the vent in conjunction with the electronic device. The shutter can prevent at least a portion of the fluid flowing through the vent from impinging on the electronic device.

Abstract: An expansion apparatus suitable for an electronic apparatus is provided. The expansion apparatus includes a base, a supporter and an airflow guiding structure. The base has a first fan disposed therein. The supporter is pivoted to the base along a rotating axis and has a cooling channel. The cooling channel has a first port and a second port opposite to the first port. When the electronic apparatus is assembled to the supporter, the second port of the cooling channel faces to the electronic apparatus. The airflow guiding structure is disposed between the supporter and the base movably. When the supporter is pivoted relative to the base to an expanded state, an active airflow generated by the first fan is guided by the airflow guiding structure to pass through the base and the electronic apparatus. An electronic equipment including the expansion apparatus is also provided.

Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Abstract: This air intake mechanism is configured of a first louver (23), a second louver (30), and an axial fan (33). The first louver (23) is an annular opening between an outer circular section (25), which is concentric to the rotating axis (rotation center) of the axial fan (33), and an inner circular section (27), which is concentric to the outer circular section (25). The second louver (30) is configured of a plurality of linear slits (30a), which are parallel to each other. The opening width (d2) of each of the slits (30a) that constitutes the second louver (30) is smaller than the opening width (d1) of the first louver (23).

Abstract: Methods, apparatuses, and computer program products for modifying the spatial orientation of a thermal acoustic panel of a computing enclosure rack are provided. Embodiments include receiving, by a configuration controller, a configuration preference from a user; identifying, by the configuration controller, a spatial orientation configuration corresponding to the configuration preference received from the user; and coordinating, by the configuration controller, movement of the thermal acoustic panel relative to a body of the computing enclosure rack in accordance with the identified spatial orientation configuration.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.

Abstract: A data center that houses an electronic device, the data center includes a plurality of air-current-supply-sections that supply an air current to the electronic device, a plurality of shields that are provided for the air-current-supply-sections to shield corresponding air-current-supply-sections, and a control section that acquires status information indicative of a status of the electronic device from the electronic device, controls a flow rate of the air current supplied from each of the air-current-supply-sections in accordance with the acquired status information, checks the air-current-supply-sections to locate an air-current-supply-section whose air current flow rate is not higher than a predetermined value, checks the shields to locate a shield corresponding to the air-current-supply-section whose air current flow rate is not higher than the predetermined value, and causes the located shield to shield the located air-current-supply-section.

Abstract: First and second units are mounted on a rear side of a housing of a storage system. Either of the first and second units includes a fan. The rear side of the housing includes an upper-tier portion defining an upper-tier opening, and a lower-tier portion defining a lower-tier opening, and the housing further includes a boundary portion that is a boundary between the upper-tier portion and the lower-tier portion, and a shutter unit. The boundary portion includes a first through hole that is a through hole connecting an upper-tier passage and a lower-tier passage. When the fan is operating, if the first unit is removed from the upper-tier portion, the shutter unit blocks the upper-tier passage, and if the second unit is removed from the lower-tier portion, the shutter unit blocks the lower-tier passage.

Abstract: In a data center including hot and cold aisles, the flow rate of airflow from the cold aisle through servers to the hot aisle depends on the flow resistance of different servers. As servers may have different cooling needs, an airflow throttling mechanism is coupled to each server to individually adjust the flow resistance through each server based on the amount of cooling airflow needed by a server. Hence, servers use the amount of cooling airflow they need, reducing the overall airflow needs, which reduces the central fan requirements, of the data center.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A rack-mounted server system includes a rack, a number of server units mounted in the rack adjacent to a front end of the rack, a fan module, and a number of power units located beside the server units. The rack includes a back wall defining an air outlet aligned with the server units. The fan module is fixed to the back wall and fitted in the air outlet. The power units are arranged in front of the fan module. An air-guide plate is mounted in the rack between the fan module and the power units to guide a part of the airflow generated by the fan module to flow through the power units.

Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.

Abstract: An electronic device includes an air dam module. The air dam module includes a frame defining a vent, a first rotating member, a second rotating member, and two third rotating members. The first rotating member is rotatably connected to a surface bounding the vent, to vertically block a lower half of the vent by its gravity. The second rotating member is rotatably connected to the surface bounding the vent. The third rotating members are rotatably connected to opposite ends of the second rotating member. The second and third rotating members vertically block an upper half of the vent by their gravities.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: An apparatus on which a fan can be mounted, including a casing; a plurality of cooling fan units arranged in line on a lower portion of the casing and capable of being inserted into and removed from the casing on an individual basis; and a plurality of plate members disposed above the line in which the cooling fan units are arranged and above a gap between the cooling fan units, the plate members extending in a direction to which an upper surface of each of the cooling fan units is substantially perpendicular and in which the cooling fan unit is inserted into and removed from the casing, wherein each of the plate members is supported so as to be able to pivot about its lower end portion toward both directions.

Abstract: A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.

Abstract: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air through the server away from temperature sensitive devices. The baffle may include an inlet that receives hot air and an outlet through which hot air may exit. One or more fans may be used to direct air through the baffle. For example, the baffle may direct heat from the baffle inlet to the baffle outlet, directing heat away from temperature sensitive devices within the server.

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Abstract: The invention in at least one embodiment includes a system that includes a chassis having a frame present within a housing where the frame includes at least two plates having a base and two grills running widthwise along and on opposite ends of the base, a plurality of walls between the at least two plates, and at least one baffle running between the plates at an angle to the plates; at least one power supply; and a plurality of fans electrically connected to the at least one power supply; wherein there are at least two air flow paths through the chassis that pass through at least one fan and pass at least one baffle through a duct defined by the housing and the frame. In at least one embodiment, the chassis receives at least one storage drive.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: An air duct includes a top wall and a blocking plate. The top wall includes a limiting block, a resilient arm, and a pair of hooks. A latching slot is defined between the pair of hooks. The blocking plate is rotatably secured to the top panel and includes a body and a shaft connected to the body. The shaft is rotatably engaged in the latching slot. The limiting block and the resilient arm abut two opposite surfaces of the body and block the body preventing the blocking plate from rotating relative to the top wall. The blocking plate is adapted to abut an electronic component and guide airflow towards the electronic component.

Abstract: A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.

Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.

Abstract: The cooling system includes: a frame; a plurality of electronic devices disposed in the frame and operating or functioning independently from each other; fans disposed in the frame and supplying cooling air to the electronic devices; a temperature acquiring portion for acquiring the temperature of the cooling air; an air-flow resistance adjusting portion for adjusting the air-flow resistance to the cooling air; and a controller for controlling the fans and the each air-flow resistance adjusting portion. The controller determines each target cooling air volume required for cooling each electronic device to a predetermined temperature based on temperature information acquired by the temperature acquiring portion and heat generation information on each electronic device, controls each air-flow resistance adjusting portion to set the volume of cooling air to each target cooling air volume, and performs the drive control of the fans to set the volume of cooling air to the minimum necessary.

Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Abstract: A computer system includes a computer case, a receiving tray, and a bracket. The computer case includes a front plate with a plurality of air intakes and a first side plate. The receiving tray includes a retaining wall. The bracket includes a first mounting plate and a second mounting plate. A plurality of first through hole is defined in the first mounting plate, and a plurality of second through hole is defined in the second mounting plate. The airflow guiding duct includes a first guiding plate and a second guiding plate. The first guiding plate is located between the front plate and the first mounting plate, the second guiding plate is located between the bracket and the first side plate; the plurality of air intakes, the airflow guiding duct, the plurality of first through hole second through hole together form a path for the air to flow.

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.