Abstract: A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.

Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.

Abstract: A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.

Abstract: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.

Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.

Abstract: The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: In a disk array apparatus, by taking note of a first sound of a specific frequency which is a noise element of original sounds generated from a fan, a second sound whose phase is inverted to that of the first sound is generated by a structure of a cooling air flow path passing through the fan, and the second sound is synthesized with the first sound on the cooling air flow path, thereby reducing the noise. For example, an exhaust duct is located on a fan unit in an upper part of the apparatus, two flow paths extending to an exhaust port are formed in an internal structure of the exhaust duct, and the two flow paths are designed so that the difference in the flow path length therebetween becomes equivalent to half wavelength of the specific frequency.

Abstract: Apparatus and methods for thermal conditioning equipment. In a preferred embodiment, an equipment enclosure comprises a body, a wall, a fluid port, and a fixture. The body defines an outer plenum and an inner chamber in the latter of which the fixture retains the equipment. The wall, which is between the outer plenum and the inner chamber, isolates the thermally conditioned first fluid from a second fluid in the inner chamber. Since the wall is thermally conductive it allows heat to be transferred between the outer plenum and the inner chamber. The fluid port is in communication with the outer plenum to allow the thermally conditioned first fluid to flow into the outer plenum. Baffle plates are also provided to distribute flow of the second fluid to the equipment.

Abstract: A computing system and method of operating a computing system is provided.

Abstract: A disk array apparatus includes a plurality of disk drives arranged in at least one disk drive line in a direction of an airflow, at least one shield plate, a housing containing the disk drives and the at least one shield plate therein, and flow passages arranged between an upper surface of the disk drives and an inner wall of the housing for enabling the airflow to pass through. The at least one shield plate is arranged between at least two of the disk drives of the at least one disk drive line for controlling the airflow on a downstream side of the flow passages.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.

Abstract: An airflow damper Is provided, the airflow damper includes a resilient body having a fixed end and a free end. In a default state, the free end extends to restrict airflow. In a device accommodation state, the free end flattens to accommodate a device.

Abstract: A heat-dissipating device includes a heat sink, a heat-dissipating fan, and a first air guide hood. The heat sink includes a base, and a plurality of interconnected heat-dissipating fins provided on the base. Each adjacent pair of the heat-dissipating fins defines an air channel therebetween. The heat-dissipating fan is disposed at a rear side of the heat sink to provide a heat-dissipating air current to the heat sink such that the air current flows from the rear side of the heat sink through the air channels and out through a front side of the heat sink. The first air guide hood is disposed at one of left and right sides of the heat sink and is located in front of the heat-dissipating fan to guide a portion of the air current provided by the heat-dissipating fan to the outside through one side of the heat sink.

Abstract: An electronic device. The electronic device comprises a heat source, a housing having an inlet and an outlet, a fan disposed in the housing and selectively rotating at a first speed and a second speed higher than the first speed to generate air flow in the housing to cool the heat source, and a plurality of louvers disposed on the housing, having adjustable angles and selectively positioned at a first angle and a second angle. When the louvers are positioned at the first angle, the fan rotates at the first speed, and when the louvers are at the second angle, the fan rotates at the second speed.

Abstract: A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot.

Abstract: An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism.

Abstract: The invention provides a temperature control device for a disk drive unit, the temperature control device includes a housing for connection to a carrier for a disk drive unit; an air flow generator arranged in the housing for providing a flow of air to a disk drive unit in a connected carrier; and, an air flow control device arranged at the side of the air flow generator and selectively configurable to control the air flow path whereby the temperature of air flowing to the disk drive unit can be controlled.

Abstract: An air baffle with an integrated expansion card attachment is disposed in a computer for receiving an expansion card having a handle attached thereto. The air baffle includes a first wall including a first guide and a second guide projecting from a side surface of the first wall. The first guide a second guide form a transverse space therebetween. The air baffle includes a second wall parallel to the first wall disposed a distance from the first wall approximately equal to a width of the expansion card. The second wall includes a snap retainer having a projected portion thereof. The transverse space formed between the first and second guides of the first wall has a size approximately equal to a thickness of the expansion card such that a first end of the expansion card is firmly held by the first guide and the second guide when the expansion card is inserted into the transverse space.

Abstract: A pyramidal case for computer, with a square base includes a support on a box, with a rectangular rear section and a trapezoidal front section, which dissipates the heat with greater efficiency and effectiveness, through obliged paths of the air flows which amplify the natural thermodynamics of the warm air masses. The study and the coercion of the air flows, applied to this invention, allow a greater dissipation of the heat with respect to any other existing case, which bases the cooling on directional air flows towards each component, but that inside the case itself, become chaotic and poorly efficient in the management of the whole generated heat.

Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.

Abstract: The present invention discloses a wind direction-adjustable heat-dissipation fan module, which is arranged inside a computer and provides heat-dissipation air current for electronic devices inside the computer. The wind direction-adjustable heat-dissipation fan module of the present invention comprises a support unit arranged inside the computer. An electric fan is pivotally coupled to the support unit, and the electric fan can have a rotation trip with respect to the support unit. According to the layout of the electronic devices inside the computer, the electric fan can be rotated pivotally with respect to the support unit to adjust the angle of the wind outlet. The present invention can solve the incapability of the conventional heat-dissipation fan to adjust the angle thereof, which causes inferior heat-dissipation inside a computer.

Abstract: A chassis panel for a computerized device includes ventilation elements that visually obscure electronic components disposed within an associated chassis and that minimize airflow resistance. Each ventilation element includes a first angled ventilation portion having openings that provides limited visual access to the electronic components disposed within the chassis. Each ventilation element also includes a second angled ventilation portion having openings that provide no visual access to the electronic components disposed within the chassis. As such, the ventilation elements visually obscure the electronic components disposed within the chassis without the need for additional materials such as screens, mesh, or foam. Also, the openings of the first and second ventilation portions provide the chassis panel with a relatively large free area ratio, such as between about 42% and 48% or greater depending on hole pitch values and opening sizes.