Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.

Abstract: An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.

Abstract: A rack-mounted server system includes a rack, a number of server units mounted in the rack adjacent to a front end of the rack, a fan module, and a number of power units located beside the server units. The rack includes a back wall defining an air outlet aligned with the server units. The fan module is fixed to the back wall and fitted in the air outlet. The power units are arranged in front of the fan module. An air-guide plate is mounted in the rack between the fan module and the power units to guide a part of the airflow generated by the fan module to flow through the power units.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.

Abstract: A computer host includes a casing, a number of fans, at least two temperature sensors, and a controller. The casing includes a top portion and a bottom portion. The bottom portion includes a first sidewall, a second sidewall, a third sidewall, and a forth sidewall. The at least two temperature sensors are positioned on the first sidewall and one or more of the other sidewalls and the top portion to sense the local temperature. The controller stores a threshold value, and when the temperature difference between the first sidewall on the one hand and the temperature of any one of the other sidewalls or the top portion is less than the threshold value, the controller turns off at least one fan.

Abstract: An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.

Abstract: A heat dissipation device includes a heat sink and a fan duct. The fan duct includes a cover and a baffle. The cover includes a top plate, a first sidewall and a second sidewall respectively extending from opposite sides of the top plate. The baffle is located between the first sidewall and the second sidewall of the cover and pivotally contacts the first and second sidewalls. The baffle forms an angle with the top plate and is rotatable relative to the first and second sidewalls to adjust the angle between the baffle and the top plate.

Abstract: An electronics cooling system comprises a tubular fan duct and an electronics housing. The fan duct includes has a fan duct casing containing a fan with rotor blades and stator vanes. The electronics housing is mounted directly on the tubular fan duct, such that the electronics housing and the fan duct casing together enclose an interior space. A cooling airflow path extends from a high-pressure region of the tubular fan duct, through an inlet hole into the interior space, and out a bleed hole into a surrounding environment. The electronics cooling system further comprises three electronics mounts within the interior space. A first electronics mount is located immediately adjacent to the inlet hole, on the fan duct. A second electronics mount is located immediately radially outward of the stator vanes, on the fan duct. A third electronics mount is located immediately adjacent to the bleed hole, on the housing.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: One embodiment of a method of providing ventilation to electronic equipment comprises receiving exhaust air flow from first electronic equipment positioned next to a ventilation structure; directing the exhaust air flow out of exhaust fan assembly of the ventilation structure; receiving cold air from an intake fan assembly of the ventilation structure; and directing the cold air to an intake vent of second electronic equipment positioned next to the ventilation structure.

Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.

Abstract: An electronic device includes a display, a cover, and a blocking board. The display defines a rear side. A motherboard and a first cooling assembly are secured to the rear side of the display, and a second cooling assembly is secured to the motherboard. The cover is secured to the rear side for coving the rear side, and defines a number of air inlets and air outlets. The blocking board is secured to a side of the motherboard, and located between the first cooling assembly and the second cooling assembly. A first air path is defined by the air inlet, the display, the first cooling assembly, and the air outlet, and a second air path is defined by the air inlet, the motherboard, the second cooling assembly, and the air outlet. The first air path and the second air path are divided by the blocking board.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.

Abstract: A rack-mount server system includes a cabinet, a number of server units mounted in the cabinet, and a number of fan modules. Each fan module cools one or a group of server units. Each fan module includes a mounting bracket fixed to the cabinet, a number of fans attached to the mounting bracket, an air flap, and a control box to control the power supply to the fans. The mounting bracket defines an air passage dedicated to each fan, through which air from the fan is guided to the one or a group of server units. Each mounting bracket defines a cutout, through which the air passages of two neighboring fans communicate with each other. The air flap may be slid closed or slid open to redirect or gather a cooling airflow as required, depending on the distribution of server units within the cabinet.

Abstract: A computer case includes outer panels forming an internal space sized and shaped to accommodate at least a motherboard, a plug-in card and a hard drive; and an inner panel arranged in the internal space and which physically forms a separate lower section of the internal space from an upper section of the internal space, wherein the upper section is arranged above the lower section of the internal space such that the upper section of the internal space accommodates the motherboard and the plug-in card and the lower section of the internal space accommodates the hard drive.

Abstract: Administering computing system resources in a computing system, the computing system comprising at least one slot adapted to receive an electrical component having a set of pins, the slot configured to couple pins of the electrical component to the computing system, installed within the slot a presence detectable baffle, the presence detectable baffle comprising a passive chassis having a form factor consistent with the electrical component and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component, including: identifying, by a system manager, the presence detectable baffle; and managing, by the system manager, computing system operating attributes in dependence upon presence detectable baffle attributes.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: A supplementary cooling system is provided for cooling a computing system. An apparatus may comprise a computing system and a docking system. The computing system has a cooling area and a fan area which is partionable from the cooling area. The docking system has a fan and an airflow outlet which is operably connected to the fan.

Abstract: A container data center includes a container and a number of information processing systems arranged in two rows. The container includes a top wall, a bottom wall opposite to the top wall, and opposite sidewalls connected between the top wall, the bottom wall, and a raised floor supporting the information processing systems. Each of the sidewalls defines an outlet and an intake respectively to above and below the raised floor. Two groups of the fans respectively are mounted in the air outtake holes of the container. Two air ducts are respectively arranged between the sidewalls and the rows of the data processing systems. Air outside the container flows into the container through the intake to cool the information processing systems, and is guided to the corresponding outlets by the air ducts to be exhausted out of the container by the fans.

Abstract: Administering computing system resources in a computing system, the computing system comprising at least one slot adapted to receive an electrical component having a set of pins, the slot configured to couple pins of the electrical component to the computing system, installed within the slot a presence detectable baffle, the presence detectable baffle comprising a passive chassis having a form factor consistent with the electrical component and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component, including: identifying, by a system manager, the presence detectable baffle; and managing, by the system manager, computing system operating attributes in dependence upon presence detectable baffle attributes.

Abstract: An airflow guide member includes a base, a top plate, and at least one resilient plate. Two rows of stop tabs are formed on a top surface of the base respectively adjacent to front and rear sides of the base. Two rows of stop tabs are formed on a bottom surface of the top plate respectively adjacent to front and rear sides of the top plate. A slot is bounded by every two adjacent stop tabs. Front ends of a top and a bottom of each resilient plate are selectively inserted into two slots respectively at the front sides of the top plate and the base, and rear ends of the top and the bottom of each resilient plate are selectively inserted into two slots respectively at the rear sides of the top plate and the base. The resilient plate can be adjusted to direct air to different directions.

Abstract: Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compartments can be arranged in tiers with the computer modules in each successive tier being positioned closer together than the computer modules in the tier directly below. The computer cabinet can also include one or more shrouds, flow restrictors, and/or sidewalls that further control the direction and/or speed of the cooling air flow through the cabinet.

Abstract: An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: An electronic equipment cabinet includes a chassis and a fan coupled thereto. The fan is configured to move an airstream through the chassis. A plenum is coupled to the chassis and has a first opening in a first side located to receive the airstream, and a second opening in an adjacent second side. An airflow diverter is located within the plenum. The airflow diverter has a surface oriented to redirect the airstream between the first opening and the second opening.

Abstract: A system for cooling an environment housing a plurality of electronic equipment in one or more cabinets is disclosed, the system comprising a remote cooling unit(s) adapted to provide relatively cool air into the environment, an exhaust associated with each cabinet, the exhaust being provided with variable airflow means; the remote unit being adapted to receive exhausted air, and; sensor means adapted to determine cooling demand and alter the output of the remote cooling unit(s) accordingly. Schemes for using the system are described.

Abstract: A container data center includes a container, a group of server systems located in the container; a hot aisle and a cold aisle formed at two opposite sides of one group of server systems, a fan apparatus located at a top of the hot aisle, a heat exchanger located adjacent to the fan apparatus and opposite to the hot aisle; a cold airflow buffering area formed at a top of the cold aisle, and blades located below the cold airflow buffering area. Fan apparatus draws in hot airflow from hot aisle into the heat exchanger. The heat exchanger transforms the hot airflow into cold airflow and exhausts the cold airflow into the cold aisle through the cold airflow buffering area and the blades. Swinging angles of the blades are adjusted according to wind speeds of the cold airflow through the blades to obtain a uniform flow.

Abstract: In order to increase the flexibility of the positioning of a stacked computer system within a data center, a removable fan unit is positioned within the computer system. The removable fan unit includes a fan housing that supports a fan electrically connected to a connector extending from a side of the fan housing. The connector of the removable fan unit may be electrically connected to a computer system-side connector in a first orientation to move air through the computer system in a first direction. The connector or another connector of the removable fan unit may be electrically connected to another or the same computer system-side connector in a second orientation to move air through the computer system in a second direction.

Abstract: This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.

Abstract: An enclosure includes a bracket with a bottom wall, a circuit board mounted to the bottom wall but spaced from the bottom wall, an electronic element mounted to the circuit board, a fan arranged on the bottom wall and facing the space between the circuit board and the bottom wall, and a guiding member attached to the circuit board to block the space between the circuit board and the bottom wall.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.

Abstract: A fan assembly is provided. The fan assembly includes a fan, and a shroud having a motor mounting portion on which a fan motor of the fan is mounted. One or more coupling units are provided at a lower side of the shroud, and on a planar surface of an apparatus, and one or more vibration preventing members are interposed between the coupling units. Because the fan and the motor mounted thereto cause vibration and noise to the fan assembly in the apparatus, the vibration preventing members are interposed between the coupling units of the shroud and the apparatus to reduce the amount of vibration and noise transmitted from the fan and the motor to the apparatus.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges.

Abstract: A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.

Abstract: A system for thermal management of electronic equipment. The system can include a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet. Additionally, the system can include a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor; an exhaust channel, wherein at least a portion of the exhaust channel is in proximity to the cabinet outlet. Furthermore, the system can include a plurality of flexible barriers forming a thermal curtain for directing air exiting the outlet of the cabinet to the exhaust channel, and wherein a position of the barriers is adjustable.

Abstract: A plasma display device is provided with a chassis supporting a PDP on its front surface, circuit boards located within a specific region of the back surface of the chassis, a back cover including an edge portion covering the outside of the specific region of the back surface of the chassis and a projecting portion accommodating the plurality of the circuit boards, and a fan arranged inside a space defined by the projecting portion. The peripheral wall of the projecting portion is provided with a plurality of air inlets and a plurality of air outlets.

Abstract: An electric device includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to faceopening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: A storage unit includes: a storage section containing an information processing apparatus; an intake section allowing intake of a cooling medium into the information processing apparatus for cooling the information processing apparatus; a discharge section receiving the cooling medium discharged from the information processing apparatus; a cooling medium flow generating section configured to control intake and discharge of the cooling medium; a partition section isolating the intake section and the discharge section from each other; an aperture formed in the partition section; a detector section configured to detect an inflow of the cooling medium, discharged from the discharge section, through the aperture; and a controller section configured to control the cooling medium flow generating section in accordance with a result of the detection of the detector section.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: An electronic device that includes a cabinet having a top face, an undersurface, and a side that completely surrounds the top face and the undersurface by connecting the outer edge of the top face and the outer edge of the undersurface together; and an electronic part disposed inside the cabinet, wherein the cabinet has an exhaust hole provided in the undersurface of the cabinet, at a position distant from the side of the cabinet; a fan disposed inside the cabinet, which blows air inside the cabinet from the exhaust hole; and at least one protrusion disposed at the back of the undersurface of the cabinet, protruding from the undersurface of the cabinet and holding the cabinet placed on a flat plate in a state of being lifted.