With Baffle Patents (Class 361/679.51)
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Patent number: 8270154Abstract: A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity.Type: GrantFiled: January 27, 2009Date of Patent: September 18, 2012Assignee: Microsoft CorporationInventors: Brian Clark Andersen, Cheerei Cheng, Daniel G. Costello, Steven Solomon, Christian L. Belady, Jens Housley
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Patent number: 8248783Abstract: A heat dissipation system includes a computer case has a base plate and a back plate perpendicularly to the base plate, a heat sink, a first fan and an air duct. The heat sink is positioned in the computer case in contact with a first heat source. The first heat source and the back plate define a first air channel therebetween. The first fan is positioned in the computer case adjacent to a first side of the heat sink. The first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel. The air duct is positioned in the computer case adjacent to a second side of the heat sink. The heat sink heats the airflow from the first fan. The warm airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.Type: GrantFiled: December 4, 2009Date of Patent: August 21, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Guo-He Huang
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Patent number: 8248792Abstract: A container data center includes a movable container, two server systems having a cold aisle and two hot aisles, two fan apparatuses, an exchanger, and an air intake apparatus. The air intake apparatus includes a number of air intake elements each defining an air channel. The fan apparatuses are operable to transfer hot airflow in the hot aisles into the heat exchanger, and then the heat exchanger transforms the hot airflow into cold airflow and transfers the cold airflow into the cold aisle through the air intake apparatus. The air intake elements are connected together and cover the cold aisle. The air intake elements of the air intake apparatus are arranged in a āVā shape along an orientation toward the airflow of the cold aisle.Type: GrantFiled: September 30, 2010Date of Patent: August 21, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Chao-Ke Wei
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Patent number: 8243437Abstract: An electronic device includes a chassis having a bottom wall. A motherboard is disposed on the bottom wall. A riser card is perpendicularly connected to the motherboard. An airflow duct is located on the bottom wall of the chassis. A securing member is mounted to the airflow duct. The securing member includes a supporting piece secured to the airflow duct, and a securing piece is pivotally mounted to the supporting piece. The securing piece is engaged with the supporting piece to clamp an expansion card between the supporting piece and the securing piece.Type: GrantFiled: March 12, 2010Date of Patent: August 14, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yi-Lung Chou, Li-Ping Chen, Wen-Hu Lu, Ya-Ni Zhang
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Patent number: 8243434Abstract: An electronic device enclosure includes a chassis, a drive bracket, and an air duct. The drive bracket is secured to the chassis and defines a subspace for receiving a disk drive. The air duct is rotatably secured to the drive bracket, and rotatable between a first position, where the subspace is exposed, and a second position, where the subspace is covered by the air duct.Type: GrantFiled: September 15, 2010Date of Patent: August 14, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Yuan Xue
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Patent number: 8238093Abstract: A computer system includes a chassis, a motherboard, a heat sink, a duct and a fan. The chassis includes a chassis bottom wall. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The duct includes a guiding portion and a latch portion located on the guiding portion. The latch portion is secured to the chassis bottom wall. The guiding portion is adjacent to the heat sink to direct airflow to the heat sink. The fan is secured on the latch portion of the duct. The guiding portion of the duct is positioned between the heat sink and the fan.Type: GrantFiled: April 14, 2010Date of Patent: August 7, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chin-Wen Yeh, Zhen-Neng Lin, Yang Xiao
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Patent number: 8231335Abstract: In a first aspect, the present invention provides an air inlet cover (1) comprising a grille (2) having a plurality of radial elements (3) radiating from a center of said grille (2), each said radial element (3) comprising a vane (4) having a leading edge (5) for positioning further from a fan and a trailing edge (6) for positioning closer to a fan, the leading edge (5) of each said vane being offset from the respective trailing edge (6) thereof by substantially the same angular amount (?) for each said vane (4), whereby the vanes are pitched more steeply closer to the center of said grille (2) than remote from the center of said grille, and a circumferential element (7) comprising a bell-shaped mouth enclosing said vanes (4) and having a plurality of apertures (8) formed in a surface thereof, each respective one of said apertures (8) having a first edge (9) parallel to the pitch of a first respective vane closer to the center of said grille and a second edge (10) parallel to the pitch of a second, adjacent rType: GrantFiled: August 28, 2008Date of Patent: July 31, 2012Assignee: Black & Decker Inc.Inventor: David Barker
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Patent number: 8233278Abstract: A cabinet for a solar power inverter is described. A solar power inverter receives DC current from a solar panel and transforms the DC current into AC current. To cool the inverter equipment, an air inlet receives ambient air drawn into the cabinet by an air pressurizer. The ambient air is urged into a pressurized air plenum, from which two ports channel the air into at least two air paths to flow over the equipment in the cabinet. The equipment in the cabinet is arranged such that the air passes over more heat-sensitive equipment before reaching less heat-sensitive equipment. The equipment in the cabinet can be separated by grounded, metal walls to contain and diminish electromagnetic interference. The equipment may be accessed from a single, front side of the cabinet.Type: GrantFiled: November 11, 2009Date of Patent: July 31, 2012Assignee: Advanced Energy Industries, Inc.Inventors: Brian J. Hoffman, Steven G. Hummel, Jon Ronhaar, Andrew Olseene
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Patent number: 8233274Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.Type: GrantFiled: July 21, 2010Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: Matthew R. Archibald, Jerrod K. Buterbaugh
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Patent number: 8223492Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.Type: GrantFiled: June 18, 2010Date of Patent: July 17, 2012Assignee: Huawei Technologies Co., Ltd.Inventors: Shengqin Ji, Yuping Hong, Yongchao He
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Patent number: 8218317Abstract: A computer system is disclosed having an enclosure having a plurality of components. The computer system further includes a first chamber including a first set of cooling devices; and a second chamber including solely a set of components and a second set of cooling devices. The second chamber is located adjacent to the first chamber, and the set of components includes components not included in the first chamber. The set of components includes solely a plurality of storage components selected from the group consisting of a CD-ROM and a hard drive. Air flow is unidirectional from a front side of the enclosure to a rear side of the enclosure. Further, air flow is prevented from flowing between the first chamber and the second chamber by a solid separation mechanism there between. The first chamber has an air flow path independent of the air flow path of the second chamber.Type: GrantFiled: April 8, 2011Date of Patent: July 10, 2012Inventor: Panagiotis Tsakanikas
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Patent number: 8199486Abstract: A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.Type: GrantFiled: October 20, 2009Date of Patent: June 12, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chin-Hui Chen, Zh-Wei Jian
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Patent number: 8199500Abstract: In a heat radiation mechanism of an electronic apparatus, an opening allowing flow of air between a first duct side and a second duct side is formed on a portion mounted with a heating device of a circuit board in an air flow route constituted by a first duct and a second duct, and heat generated from the heating device is radiated from a first vent hole or a second vent hole through the air flow route.Type: GrantFiled: January 14, 2010Date of Patent: June 12, 2012Assignee: Funai Electric Co., Ltd.Inventor: Daisuke Yamagiwa
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Patent number: 8199501Abstract: An electronic equipment includes an air flow control unit that controls an air flow generated by an air blow. The electronic equipment includes an expanding unit that is disposed behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are cooling targets of the air blow, and expands a function of the electronic circuit of the main board. The expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the hollow structure casing. The air flow control unit has an opening part to allow the air flow to pass through and a blocking part to block the air flow, and supplies most of the air flow into the inside of the hollow structure casing of the expanding unit by the opening part and the blocking part, the blocking part including a vent.Type: GrantFiled: March 23, 2010Date of Patent: June 12, 2012Assignee: Sony CorporationInventors: Jun Sawai, Masatsugu Chiba, Munetoshi Miyahara, Toyokatsu Noguchi
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Patent number: 8154865Abstract: A computer includes an enclosure, at least one disk drive, a panel and a fan. The at least one disk drive is located in the enclosure. The panel is mounted to a side of the enclosure. The panel has different material relative to the enclosure. The fan is mounted to the panel. The vibration generated from fan is indirectly transferred to the at least one disk drive.Type: GrantFiled: January 28, 2010Date of Patent: April 10, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chung-Cheng Hsieh, Che-Yu Kuo, Chien-Fa Huang, Li-Ping Chen
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Patent number: 8130494Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.Type: GrantFiled: April 16, 2010Date of Patent: March 6, 2012Assignee: Ortronics, Inc.Inventors: Lars R. Larsen, Stewart A. Levesque
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Patent number: 8125778Abstract: A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.Type: GrantFiled: May 22, 2006Date of Patent: February 28, 2012Assignee: Kabushiki Kaisha KenwoodInventor: Toyokazu Miyoshi
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Patent number: 8089762Abstract: An apparatus, system, and method are disclosed for directing power supply airflow. A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.Type: GrantFiled: March 23, 2010Date of Patent: January 3, 2012Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Albert V. Makley, Timothy S. Farrow, William F. Martin-Otto, Marc R. Pamley
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Patent number: 8081453Abstract: A motherboard including an electronic component is provided. Airflow flows through the motherboard along a direction. An adhesive air guiding device including at least one air guiding surface facing the direction of the airflow is stuck to the electronic component, for guiding the airflow to flow over the electronic component.Type: GrantFiled: September 14, 2009Date of Patent: December 20, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Zheng-Heng Sun
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Patent number: 8081457Abstract: A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.Type: GrantFiled: November 3, 2009Date of Patent: December 20, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Zhi-Bin Guan
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Patent number: 8081444Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.Type: GrantFiled: January 30, 2010Date of Patent: December 20, 2011Assignees: Hong Fu Jin Precision Industry (Wuhan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Bo Xiao, Xiang-Kun Zeng, Zhi-Guo Zhang, Li-Fu Xu
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Patent number: 8050029Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.Type: GrantFiled: February 25, 2009Date of Patent: November 1, 2011Assignee: Google Inc.Inventors: Pascal C. Kam, Greg Imwalle
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Patent number: 8045328Abstract: A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.Type: GrantFiled: May 4, 2010Date of Patent: October 25, 2011Assignee: Chenbro Micom Co., Ltd.Inventor: Po-Ching Chen
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Patent number: 8014146Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.Type: GrantFiled: March 24, 2010Date of Patent: September 6, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yang Li, Shuang Fu
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Patent number: 8009417Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.Type: GrantFiled: August 28, 2009Date of Patent: August 30, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Tom J. Searby, Robert L. Crane
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Patent number: 7995345Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.Type: GrantFiled: September 3, 2010Date of Patent: August 9, 2011Assignee: Juniper Networks, Inc.Inventor: Tri Luong Nguyen
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Patent number: 7990700Abstract: An apparatus includes a side plate and a rear plate perpendicular to the side plate. A motherboard is mounted on the side plate. The motherboard has a heat source attached thereon. The rear plate defines a ventilation area. The ventilation and the heat source are located at different heights. A fan is mounted on the ventilation area. The fan inclines towards the plurality of expansion cards.Type: GrantFiled: July 24, 2009Date of Patent: August 2, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Lei Guo
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Publication number: 20110184568Abstract: A baffle is provided proximate an array of fans used to cool electronic components. The baffle may assume different orientations with respect to the array of fans.Type: ApplicationFiled: January 25, 2010Publication date: July 28, 2011Inventors: Mun Hoong Tai, Chee Kit John Chan, Su Nee Chin, Siang Aun Yeoh
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Patent number: 7986521Abstract: A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.Type: GrantFiled: May 13, 2009Date of Patent: July 26, 2011Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jui-Wen Hung, Ching-Bai Hwang, Jie Zhang
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Patent number: 7986526Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.Type: GrantFiled: February 25, 2010Date of Patent: July 26, 2011Assignee: International Business Machines CorporationInventors: Glendowlyn F. Howard, Matthew A. Nobile
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Patent number: 7983038Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.Type: GrantFiled: May 19, 2009Date of Patent: July 19, 2011Assignee: Ortronics, Inc.Inventors: Stewart A. Levesque, Lars R. Larsen
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Patent number: 7978469Abstract: A computer system including an enclosure having a plurality of components; a first chamber including a first set of components; and a second chamber including a second set of components, the second chamber located adjacent to the first chamber and the first set of components being different than the second set of components; wherein air flow is prevented from flowing between the first chamber and the second chamber; and wherein the first chamber includes a first set of cooling devices and the second chamber includes a second set of cooling devices.Type: GrantFiled: October 31, 2007Date of Patent: July 12, 2011Inventor: Panagiotis Tsakanikas
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Patent number: 7974094Abstract: An outdoor equipment cabinet includes a housing with an equipment compartment therein. An intake air vent and an exit air vent are formed in the housing. A fan is mounted within the housing for pulling air into the intake air vent, moving an air stream through the equipment compartment, and pushing air out of the exit air vent. A membrane is disposed adjacent the intake air vent. The membrane allows air to pass therethrough, but resists the passage of water and contaminants therethrough. In some embodiments, a baffling plate is disposed to direct the air stream within the equipment compartment, and/or the fan speed is controlled by a temperature sensor, and/or a clogging of the membrane is monitored and reported, and/or the intake air vent is located in a first door and the exit air vent is located in a second door of the cabinet.Type: GrantFiled: March 27, 2008Date of Patent: July 5, 2011Assignee: CommScope, Inc. of North CarolinaInventors: Mark Hendrix, Alan Skrepcinski
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Patent number: 7969728Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.Type: GrantFiled: March 6, 2009Date of Patent: June 28, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Dong-Bo Zheng, Meng Fu, Chun-Chi Chen
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Patent number: 7965503Abstract: A fan [36] and storage device [37] mounting assembly [1] for an electronic device comprises a base [2] having opposing front [4] and rear [5] walls. The rear wall [5] has a plurality of ventilation openings [11] provided therein. A support [16] has a fan [36] mount [32] arranged adjacent to the front wall [4] and substantially perpendicular thereto and a storage device [37] receiving opening [20] arranged between the fan mount [32] and the ventilation openings [11].Type: GrantFiled: June 27, 2007Date of Patent: June 21, 2011Assignee: Thomson LicensingInventors: Mark Alan Yoder, Brian Michael Scally
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Publication number: 20110141688Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.Type: ApplicationFiled: March 24, 2010Publication date: June 16, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, SHUANG FU
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Patent number: 7961462Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.Type: GrantFiled: May 28, 2009Date of Patent: June 14, 2011Assignee: Alcatel LucentInventor: Domhnaill Hernon
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Patent number: 7957133Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.Type: GrantFiled: May 29, 2008Date of Patent: June 7, 2011Assignee: Cisco Technology, Inc.Inventors: Christopher E. Zieman, Todd Mason
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Patent number: 7952869Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.Type: GrantFiled: June 2, 2009Date of Patent: May 31, 2011Assignee: Chatsworth Products, Inc.Inventors: Richard Evans Lewis, II, Dennis W. Vanlith, Daniel Alaniz, D. Brian Donowho
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Patent number: 7933119Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.Type: GrantFiled: July 31, 2009Date of Patent: April 26, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Andrew L. Wiltzius, Robert Lee Crane, Jonathan Shea Robinson, River Yao
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Patent number: 7929288Abstract: A computer includes an enclosure, a motherboard, at least one expansion card, a supporting bracket, and at least one first baffle plate and at least one second baffle plate. The at least one expansion card is inserted into the corresponding expansion slot. The bracket is located above and spaced from the motherboard by a spacing. The at least one first baffle plate and at least one second baffle plate are arranged along an extension direction of the supporting bracket and extending between the bracket and the motherboard. The at least one first baffle plate covers a part of the spacing between the bracket and the motherboard. The at least one second baffle plate covers another part of the spacing between the bracket and the motherboard. The at least one first baffle plate and the at least one second baffle plate define a plurality of through holes therein.Type: GrantFiled: December 30, 2009Date of Patent: April 19, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Xiao-Feng Ma, An-Gang Liang
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Patent number: 7929304Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.Type: GrantFiled: June 8, 2009Date of Patent: April 19, 2011Assignees: Hong-Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Liang-Liang Cao, Jeng-Da Wu, Yang Li
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Patent number: 7903415Abstract: An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation.Type: GrantFiled: April 15, 2009Date of Patent: March 8, 2011Assignee: Tai-Sol Electronics Co., Ltd.Inventors: Ko-Pin Liu, Yue-Ping Dai
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Publication number: 20110038121Abstract: A laptop computer stand includes a case having a top, a bottom, right and left sides, a front, and a back. The stand further includes a plurality of speakers disposed at right and left sides of the top, and an audio hub coupled to the speakers. The audio hub is configured to receive audio signals from a laptop computer coupled to the audio hub, and control the speakers to output audio from the audio signal. The stand further includes a cooling fan disposed in the body below the top. The top includes a top grate formed therein configured to output air blown by the fan, and the back includes a back grate configured to intake air blown out the top grate. The air blown by the fan is configured to circulate between the top of the stand and the bottom of a laptop computer positioned on the top of the stand.Type: ApplicationFiled: June 7, 2010Publication date: February 17, 2011Applicant: Logitech Europe S.A.Inventors: Alain Tabasso, Simone Chevalley, Patrick Monney
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Patent number: 7885066Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.Type: GrantFiled: July 17, 2008Date of Patent: February 8, 2011Assignee: Juniper Networks, Inc.Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker
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Publication number: 20100309625Abstract: A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.Type: ApplicationFiled: June 25, 2009Publication date: December 9, 2010Applicants: HONG FU JIN PRECISION INDUSTRY(ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: ZHENG-HENG SUN, XIAO-FENG MA
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Patent number: 7848101Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.Type: GrantFiled: January 30, 2008Date of Patent: December 7, 2010Assignee: General Electric CompanyInventors: Subhrajit Dey, Petrus Joannes Joseph Moeleker, Chellappa Balan
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Patent number: 7843685Abstract: A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.Type: GrantFiled: April 22, 2008Date of Patent: November 30, 2010Assignee: International Business Machines CorporationInventors: William Norris Beauchamp, Karl Klaus Dittus, Whitcomb Randolph Scott, III, Jean Jidong Xu
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Patent number: 7843683Abstract: Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.Type: GrantFiled: February 26, 2009Date of Patent: November 30, 2010Assignee: International Business Machines CorporationInventors: Edward S. Suffern, Takeshi Wagatsuma, Kenji Hidaka, Michihiro Okamoto
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Patent number: 7839631Abstract: A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.Type: GrantFiled: December 3, 2008Date of Patent: November 23, 2010Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Sheng-Hung Lee, Chien-Shun Lin, Li-Ping Chen