Abstract: A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the heat. The refrigeration device is capable of refrigerating a coolant. The thermal connector is in contact with the cold plate. The pipe connects the thermal connector to the refrigeration device so that the coolant is capable of flowing out of the refrigeration device to the thermal connector and back to the refrigeration device.

Abstract: An electronic apparatus includes a housing, first and second circuit boards disposed in the housing in such a way that the first and second circuit boards are stacked on each other, and a pump block disposed between the first and second circuit boards, the pump block abutting a first electronic part mounted on the first circuit board and a second electronic part mounted on the second circuit board, the pump block sucking air outside the housing and discharging the air out of the housing.

Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.

Abstract: A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.

Abstract: According to one embodiment, a sensor-securing apparatus has a frame having a sensor-mount region to hold an image sensor that generates heat while operating. The frame has a first adhesive-applying hole and a plurality of second adhesive-applying holes. The first adhesive-applying hole opens in the sensor-mount region and faces the center part of the image sensor. The second adhesive-applying holes are smaller than the first adhesive-applying hole, open in the sensor-mount region and are arranged around the first adhesive-applying hole. Adhesive is filled in the first adhesive-applying hole and the second adhesive-applying holes. The adhesive secures the image sensor to the frame.

Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.

Abstract: A cooling or heat transfer apparatus and method is disclosed for cooling an electronic device. The apparatus includes a heat producing electronic device which may include an electronic circuit card with many heat sources. A heat transfer device is connected to the heat producing electronic device which is thermally communicating with the heat producing device for transferring heat from the heat producing device to the heat transfer device. A heat conduit is connected to the heat transfer device and thermally communicating with the heat transfer device for transferring heat to the heat conduit from the heat transfer device. A cooling housing is connected to the heat conduit and the cooling housing thermally communicating with the heat conduit for transferring heat to the cooling housing from the heat conduit. The apparatus enables the replacement of circuit cards in the field because it eliminates the need to apply thermal-interface materials.

Abstract: According to embodiments, there is provided an electronic component unit, including: a circuit board including: a heat generating element that generates a heat; and a bonding metal foil layer formed on a face thereof; a heat transfer board including: a board body having a thermal conductivity higher than that of the circuit board; an insulative layer formed on a first face of the board body; and a heat transfer metal foil layer formed to cover the insulative layer; and a heat sink, wherein the circuit board is assembled with the heat sink via the heat transfer board such that (1) the heat transfer metal foil layer is soldered to the bonding metal foil layer and (2) the second face of the board body is superimposed on the heat sink.

Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.

Abstract: An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are mounted, and the second chassis accommodating low heat generating and low heat resistance parts. Because of this structure, the first chassis and the second chassis are thermally isolated, and the surface area of the apparatus is increased, thereby improving the cooling efficiency of the apparatus.

Abstract: A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes.

Abstract: A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

Abstract: A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed along the plurality of memory circuits. Finally, the system may include a heat pipe, a vapor chamber, or a combination thereof, extending along the heat spreader. In another embodiment, a system may include a heat spreader configured to mount to an in-line memory module, and an evaporative cooling system at least substantially contained within dimensions of the heat spreader.

Abstract: A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.

Abstract: A cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.

Abstract: A fuel cell stack having an improved sealing structure of a cooling plate in which the cooling plates therein each have a coolant flow channel through which a coolant flows to remove heat from the fuel cell stack and a groove that surrounds the coolant flow channel, and a sealing member disposed in the groove to prevent coolant leakage. The sealing member has a compression rate of 18 to 30%, as the compression rate being ((a thickness of the sealing member?a height of the groove)/the thickness of the sealing member)×100. Such a fuel cell stack may maintain operation for a long time without the need of supplementing the coolant.

Abstract: The present invention provides an electronic control unit which is capable of suppressing harmful effects caused by liquid while suppressing increase in the size thereof. The electronic control unit includes an electronic component in which a circuit element coated with an anti-splash agent is implemented, a casing, and a liquid discharge portion. The casing includes a base on which the electronic component is mounted, a cover which is connected to the base in the state where the electronic component is covered with the cover, and a connector which electrically connects the electronic component to the outside. The liquid discharge portion includes a flow passage in which liquid which has intruded into an internal space in the casing formed by the base, the cover and the connector for housing the electronic component flows, and an opening portion which discharges the liquid to the outside of the internal space via the flow passage.

Abstract: An electronic device with improved heat dissipation properties comprises metallic housing. A base circuit board may be positioned within the housing in a plane parallel to the backside. Multiple connectors for coupling cassettes to the base circuit board may be positioned about the periphery of the base circuit board such that multiple cassettes may be positioned adjacent to each side of the housing. Each cassette includes a printed circuit board with a plurality of heat generating components coupled to the printed circuit board and having a thickness extending towards the side of the housing. The cassette includes a metallic housing with a heat dissipation structure contacting: i) the side of the housing; and ii) each heat generating component. Each of at least two heat generating components have different thicknesses and the heat dissipation structure had different thicknesses between the side of the housing and each heat generating component.

Abstract: A system for cooling an electronic device having a heat-generating component includes a passive cooling device having a cooling ability designed to expire after a predetermined amount of heat is absorbed from the heat-generating component and an active cooling device configured to at least one of dissipate heat generated by the heat-generating component and cool the passive cooling device, when the active cooling device is activated. The system also includes a controller configured to activate the active cooling device after a determination that a predetermined threshold condition has occurred, wherein the predetermined threshold condition is selected to occur after the passive cooling device cooling ability has substantially expired, to thereby substantially minimize power consumption of the active cooling device in cooling the heat-generating component.

Abstract: A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.

Abstract: The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

Abstract: There is provided a heat dissipating device. An exemplary heat dissipating device comprises a thermally conductive plate that is adapted to be disposed adjacent to at least one heat generating device. The thermally conductive plate has surface features configured to promote turbulent airflow over the thermally conductive plate, the thickness of the surface features being approximately equal to or less than the thickness of the plate.

Abstract: A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components that generate heat. Thermal conductors or mesas contact the electrical components to conduct heat from the components to the environment. Rather than create single purpose housings with cast thermal conductors, the improved housing uses heat sink plates which can easily be swapped out to accommodate a variety of electronic circuit boards that might be needed within a general purpose housing. Together with faster turnaround time to create a new design for a housing, lower manufacturing and inventory costs result.

Abstract: An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the cantilevers and the islands. Heat from the islands vaporizes the fluid filling the spaces between the cantilevers and the islands to transfer the heat away from the islands while driving the cantilevers into oscillation. The apparatus may also include a casing configured to surround the islands and the fluidic network to create a vapor chamber, where the vapor chamber is configured to retain the vaporized fluid. The islands and the fluidic network could be formed in a single substrate, or the islands could be separate and attached together by a binder located within the channels of the fluidic network.

Abstract: A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

Abstract: A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.

Abstract: A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Abstract: A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: A LED array cooling system including a LED array and a substrate attached to the LED array wherein the LED array includes a plurality of walls that at least in part define a plurality of passages through the LED array.

Abstract: A heat dissipation device includes a heat sink, a heat absorbing plate, a heat pipe thermally connecting the heat sink and the absorbing plate, a pressing plate secured to the heat absorbing plate and pressing an end of the heat pipe to the heat absorbing plate, and a plurality of fasteners extending through the pressing plate to secure the end of the heat pipe, the heat absorbing plate and the pressing plate to a printed circuit board. Each of the fasteners includes a connecting portion extending through the pressing plate, a first operating portion extending from the connecting portion, and a second operating portion formed at an end face of the first operating portion. The first and second operating portions are configured to be operated by different tools.

Abstract: Techniques for a land grid array (LGA) socket loading mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and an LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.

Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.

Abstract: A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is attached to an internal side of the heat dissipating plate, and the second surface of the uniform temperature plate is attached to the memory module. At least one heat dissipating body is installed on the memory module and clamped between the two heat dissipating plates and the two uniform temperature plates. The heat dissipating body includes a base and heat dissipating fins extended from the base. The base forms a straight section attached onto the second surface of the uniform temperature plate. The two heat dissipating plates are clamped and fixed by fixing elements. The structure of the invention can improve the heat dissipating effect of the memory module.

Abstract: A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a heat guide; wherein at least a groove is provided on each of the plurality of heat fins according to the quantity of said heat guide for passing the dissipation part of each said at least a heat guide, a cavity is opened on said aluminum casting for said copper base plate housing, and at least a trough is formed on the top surfaces of said copper base plate and said aluminum casting for placing the heat conduction part of each said at least a heat guide, and said copper base plate is placed against the heat source to transfer the heat through said base to said heat guide and then to said heat sink, so that the heat can be dissipated rapidly through said plurality of heat fins. In addition, the weight of the heat sink assembly is decreased, further more, the manufacturing costs reduced.

Abstract: A temperature control unit for an electronic component and a handler apparatus, which are excellent in responsibility during cooling and heating, is obtained. The temperature control unit for an electronic component includes a cooling cycle device having a refrigerant passage circulating through a compressor, a condenser, an expander, and an evaporator; a thermally conductive block having an outer surface capable of coming in contact with the electronic component that is an object to be temperature-controlled, where an inner surface corresponding to the outer surface is placed opposite to the outer surface so as to be brought in contact with or apart from the evaporator; at least one first heater for heating the thermally conductive block; and a compressed air feeding circuit for feeding compressed air between facing surfaces of the evaporator and the thermally conductive block to part them.

Abstract: A heat-dissipated fastener including a heat-dissipated plate, an elastic frame and a heat sink module is provided. The elastic frame includes a sheet element, multiple connecting ribs and multiple attaching portions. Two elastic arms extend from two corresponding sides of the sheet element, respectively. The attaching portions are located below the sheet element and attached to the heat-dissipated plate. The connecting ribs are connected to the attaching portion and the sheet element, and an accommodating space is formed by the connecting ribs, the sheet element and the heat-dissipated plate to accommodate the heat sink module. When the heat-dissipated plate is attached to the heat source and the elastic arms are bent and fixed to the circuit board of the heat source, the connecting ribs exert force on the heat-dissipated plate vertically, respectively.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.

Abstract: A heat sink assembly for an add-on card includes a heat sink and a clip received in the heat sink. The heat sink includes a supporting plate and a first and a second heat absorbing plates extending downwardly from the supporting plate. The first and second heat absorbing plates sandwich first and second heat conductive plates and the add-on card therebetween. The supporting plate is located over and spaced from the add-on card. The clip includes a resisting member, first and second engaging members and first and second pressing members. The resisting member is received in the heat sink and abuts upwardly against the supporting plate of the heat sink. The first and second engaging members engage with the first and second heat absorbing plates, respectively. The pressing members abut downwardly against a clasp clasping the conductive plates and the add-on card together.

Abstract: An electrical connector assembly includes an electrical connector and a heat dissipate device disposed upon the electrical connector. The heat dissipate device includes a heat plate, a heat pipe secured on the heat plate and a load plate located between the heat plate and the heat pipe. The load plate has retention sections engaging with the heat plate for positioning the heat plate on the load plate in three directions.

Abstract: The invention relates to a cooling body for power electronic modules or for semiconductor elements having a flat metal heat dissipation plate, wherein the heat dissipation plate on the side facing the power electronic module or the semiconductor element comprises a surface structured in the manner of a matrix and having protruding elevations, wherein the heat dissipation plate and surface structured in the manner of a matrix are made out of one piece.

Abstract: A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.

Abstract: A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.

Abstract: Devices and systems are for adapting a mobile computing device, such as a handheld radio frequency identification (“RFID”) reader, with a grounded metallic housing substrate without impacting the performance of the device. The device includes a heat generating component, and a heat sink in thermal contact with the heat generating component, the heat sink including at least one thermally conductive material. The system includes a mobile computing device including a heat generating component, and a heat sink in thermal contact with the heat generating component, the heat sink including at least one thermally conductive material.

Abstract: The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate.

Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.

Abstract: A printed circuit board (PCB) assembly is disclosed. The PCB assembly includes a first PCB, a second PCB and a land grid array (LGA). The first PCB includes signal interconnects for transmitting logic signals and power interconnects for transmitting power signals. In contrast, the second PCB includes only power interconnects for transmitting power signals exclusively. The second PCB also has significantly less vias than the first PCB. The second PCB is connected to the first PCB via the LGA.

Abstract: A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.