Abstract: A circuit device having superior mechanical strength at the interface between a circuit board and heat sink and superior efficiency for radiating heat from a circuit element to the heat sink through the circuit board. The circuit device includes the metal-based insulation board for installing the circuit element, and the heat sink, over which the insulation board is installed with a paste arranged therebetween. The insulation board has a projection arranged on the surface facing the heat sink along a peripheral portion. At least part of the projection contacts the heat sink through the paste layer.

Abstract: An apparatus for coupling a heat-generating device to a heat-removing device. The apparatus includes a thermally-conductive plate having a first side and a second side. The apparatus also includes a plurality of first channels that intersect with a plurality of second channels formed on at least one of the first side and the second side. The formation of the first channels and the second channels weaken the thermally-conductive plate. The apparatus further includes a plurality of protrusions formed by the intersection of the first channels and the second channels. The protrusions are deformable by coupling the thermally-conductive plate between the heat-generating device and the heat-removing device.

Abstract: An electrical connector with a heat dissipating device adapted to physically in contact with an electrical package disposed on a socket connector comprises a load plate having a substantially rectangular configuration defining a central opening having a first length and a first width and a heat plate having longitudinal sides and traversal ends. A heat plate has a heat pipe attached thereon and arranged such that the heat plate is disposed under the load plate, while the heat pipe is arranged above the load plate when rotated.

Abstract: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.

Abstract: According to one embodiment, a printed circuit board comprises a printed wiring board, circuit component, reinforcing plate and first and second fixing portion. The printed wiring board includes first and second areas. The first fixing portion is provided on a border line that defines the first and second areas. The first fixing portion can fix the reinforcing plate to both the first and second areas. The second fixing portion comprises a pair of elements arranged symmetrical with respect to the border line.

Abstract: A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover.

Abstract: Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditional or new technologies.

Abstract: The specification describes a lidded MCM IC plastic overmolded package with a chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Abstract: A display device includes a display panel for displaying an image, a chassis base for supporting the display panel and a heat dissipating plate at one side of the chassis base. The display device further includes a printed circuit board between the heat dissipating plate and the chassis base attached to the heat dissipating plate and electrically connected to the display panel, and a switch electrically connected to the printed circuit board to generate a signal for controlling the display panel, the switch being attached to the heat dissipating plate.

Abstract: Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.

Abstract: An electronic device with a clip and a plate of thermally conductive material is disclosed. A first surface of the plate is attached to a surface of the electronic device. The clip is arranged on a second surface of the plate. Two ends of the clip clasp the electronic device and the plate at opposed edges of the electronic device, pressing the plate to the electronic device.

Abstract: A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.

Abstract: A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreader includes a first segment mountable on the module to be in thermal communication with at least one electronic component mounted on the first side, and to be substantially thermally isolated from at least one electronic component mounted on the first side. The heat spreader further includes a second segment mountable on the module to be in thermal communication with the at least one electronic component mounted on the first side that is substantially thermally isolated from the first segment.

Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom

Abstract: A heat sink assembly for an add-on card includes a heat sink and a clip received in the heat sink. The heat sink includes a supporting plate and a first and a second heat absorbing plates extending downwardly from the supporting plate. The first and second heat absorbing plates sandwich first and second heat conductive plates and the add-on card therebetween. The supporting plate is located over and spaced from the add-on card. The clip includes a resisting member, first and second engaging members and first and second pressing members. The resisting member is received in the heat sink and abuts upwardly against the supporting plate of the heat sink. The first and second engaging members engage with the first and second heat absorbing plates, respectively. The pressing members abut downwardly against a clasp clasping the conductive plates and the add-on card together.

Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.

Abstract: A semiconductor device includes: a semiconductor element (106) having a surface on a positive electrode side and a surface on a negative electrode side; multiple conductors (13 to 15) bonded respectively to the surface on the positive electrode side and to the surface on the negative electrode side of the semiconductor element; a heat sink plate (11) disposed as intersecting a junction interface between the semiconductor element and each of the multiple conductors and configured to discharge heat of the semiconductor element; and an insulator (12) bonding the heat sink plate to the multiple conductors. The insulator includes a heat conductive insulator (16) disposed inside a portion facing all of the multiple conductors and a flexible insulator (17) disposed at a portion other than the heat conductive insulator.

Abstract: A system includes a housing and an electromagnetic coil within the housing. The electromagnetic coil is arranged in a coil stack. A thermal damper is positioned adjacent to the electromagnetic coil, and a thermal structural plate is positioned adjacent to the coil stack. The thermal damper manages temperature rise of the electromagnetic coil and the thermal structural plate provides cooling to the coil stack. In an embodiment, the system is used to launch projectiles.

Abstract: Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditional or new technologies.

Abstract: The present invention provides methods and systems for storage of data. In one aspect, the invention provides a data storage system that includes a plurality of storage devices, such as, disks, for storing data, and a controller that implements a policy for managing distribution of power to the storage devices, which are normally in a power-off mode. In particular, the controller can effect transition of a storage device from a power-off mode to a power-on mode upon receipt of a request for reading data from or writing data to that storage device. The controller further effects transition of a storage device from a power-on mode to a power-off mode if no read/write request is pending for that storage device and a selected time period, e.g., a few minutes, has elapsed since the last read/write request for that storage device. In another aspect, the present invention provides a data storage system that includes a plurality of cooling plates, each with one or more storage devices thermally coupled thereto.

Abstract: A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base.

Abstract: A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and an abutment surface. The spring plate includes at least one fixing section and a plurality of pressing sections extending from the fixing section. When the fixing section of the spring plate is fixed to the circuit board, each of the pressing sections applies a force to press the heat conducting plate towards the heat-generating element, so as to attach the abutment surface on the heat-generating element, and conduct heat generated by the heat-generating element to the heat conducting plate. Thus, a plurality of forces pressing the heat conducting plate downward is provided with a simple structure.

Abstract: A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract: A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.

Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

Abstract: The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by means of the cooling arrangement (23, 33, 43).

Abstract: A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.

Abstract: A card slot apparatus of a card and an electronic machine includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart from the card and a second position contacting the card. A moving unit moves the heat radiating unit to the second position while moving in an opposite direction to an inserting direction of the card in combination with an inserting operation of the card into the slot body. An elastic unit elastically urges the moving unit in a moving direction thereof. The heat radiating unit includes a heat sink, and an elastic member to press the heat sink when the heat sink is moved to the second position. The elastic unit elastically urges the moving unit in the moving direction thereof when the heat sink is moved to the second position.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: An electronic package device is disclosed including a microelectronic package and a heat sink positioned over the microelectronic package. A thermal interface element is positioned between the microelectronic package and the heat sink. The thermal interface element is elongated and has differing thicknesses along its length to enhance the dissipation of heat.

Abstract: An AC generator, referred to as an alternator, is mounted on an automotive vehicle for supplying electric power to an on-board battery and other electric loads. The alternator includes a rectifier device for rectifying alternating current to direct current. The rectifier is composed of a minus-side heat-radiating plate on which six minus-side rectifier elements are mounted and a plus-side heat-radiating plate on which six plus-side rectifier elements are mounted. Each rectifier is mounted on the heat-radiating plate in the same manner, i.e., by forcibly inserting the rectifier element into a mounting hole formed in the heat-radiating plate. A disc portion of the rectifier element has an outer peripheral surface on which knurls are formed. The outer peripheral surface having the knurls is tapered so that the disc portion is easily inserted into the mounting hole while establishing a firm grip and a good heat-conductive contact between the rectifier element and the heat-radiating surface.

Abstract: Discloses herein is a shielding and heat dissipation device comprising a conductive bracket (1) provided on a PCB around a shielded heat-generating electronic component, and electrically connected to a conductive layer of the PCB; a heat sink (2), which is arranged above the heat-generating electronic component (3) and is provided with a conductive surface electrically connected to the conductive bracket (1). With the conductive surface, which may be used to replace a top cover of a prior art shielding case, developed on the bottom or sidefaces of the heat sink, an effective shielding cavity is formed by conductively connecting the conductive surface of the heat sink to the other parts of the shielding case. That is to say, the conductive surface of the heat sink serves as a part of the shielding case, so that the heat sink may play a role in electromagnetic shielding as well as in dissipating heat sufficiently.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: A heat dissipation device includes a heat spreader (20), a heat pipe (30), a heat sink (40) and a cooling fan (50) for generating forced airflow to the heat sink. The heat pipe has an evaporating section (301) being thermally attached to the heat spreader and a condensing section (302). The heat sink has a fin assembly defining a plurality of channels (405) for the airflow flowing therethrough. Each of the channels has at least one portion with a width being gradually decreased along the flowing direction of the airflow. The channels (405) each are defined between two adjacent fins (401, 402), wherein at least one of the two adjacent fins is arc-shaped.

Abstract: A display device includes a display panel, a back light module, a heat dissipation plate and a heat pipe. The display panel has a display surface. The back light module is coupled to the display panel, and this back light module includes a control circuit board. The heat dissipation plate contacts the control circuit board. The heat pipe contacts the heat dissipation plate. The length direction of the heat pipe is not parallel with a horizontal direction, and it is also not perpendicular to the display surface.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.

Abstract: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a base attached to the heat dissipating plate, and at least one resilient sheet extending from an end of the base. The base and the resilient sheet define an included angle which is non-right angle so that the resilient sheet can snugly clip to the respective heat source.

Abstract: Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element.

Abstract: A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased life of the electronic components.

Abstract: The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate.

Abstract: The specification describes a lidded MCM IC plastic overmolded package with chimney-type heat sink. The lid is mechanically decoupled from the chimneys by a compliant conductive polymer plug.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: An auxiliary plate (10) is fixed to a rear plane of a housing for fixedly holding a lamp unit (6) having a plurality of lamps. In the auxiliary plate (10), a convex portion and a concave portion are combined. The convex portion has a space between the housing and itself, which is formed by protruding a sheet metal, and the concave portion contacts with the housing by denting the sheet metal. In the auxiliary plate 10, an area for mounting a board vulnerable to heat is formed with the convex portion and an air layer performs as heat insulation. The convex and concave portions are arrayed in a direction where heated air easily flows in another area. Thus, rigidity can be remarkably increased compared to a flat-shaped sheet metal, and heat generated by a backlight is effectively dissipated, as well as a temperature rise and an occurrence of a temperature gradient are suppressed.

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.

Abstract: A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening hole and a second connecting portion which has a positioning concave portion and a positioning protrusion. The heat-dissipating elements are assuredly assembled with each other through the engagement and fastening connection of the first connecting portion and the second connecting portion.

Abstract: A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.