Abstract: Memory devices including a substrate supporting at least one semiconductor device thereon. The substrate includes an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures are located proximate to, and laterally outward from, the interface. The engagement structures extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier includes supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.

Abstract: A wireless transmitting device comprising a base, a circuit module, a supporting member and a casing is provided. The base comprises a main body and an extending portion integrally connected with the main body. The main body has a cavity. The circuit module is partially accommodated in the cavity. The supporting member props the circuit module and connects with the extending portion. The casing connects with the extending portion or the supporting member and covers the extending portion, the circuit module and the supporting member.

Abstract: A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

Abstract: An integral air conditioner is provided. An electric control box of the air conditioner is split into at least a first box body and a second box body. The first box body is arranged between a first fan shell and a middle partition plate. The second box body is arranged below the middle partition plate. A first fan has a first fan wheel and the first fan shell. Since the first fan wheel rotates around a shaft, the first fan shell generally has an arc-shaped edge. A gap is presented between a surface of the first fan shell and the middle partition plate. The electric control box is split into multiple box bodies and constructed to match the shape of the first fan shell. The first box body of the multiple box bodies is arranged in the gap between the first fan shell and the middle partition plate.

Abstract: Systems, methods, and apparatuses in accordance with embodiments of the invention can use a variety of computing devices to interact with and/or control a secure enclosure for a key fob. The secure enclosure may enclose the key fob, and includes a computing device, a locking mechanism, and at least one actuator. An actuator may control the locking mechanism. The actuator, when activated, may exert a force on a key fob secured within the secure enclosure, which may cause one of the buttons of the key fob to be depressed. The computing device controls the activation of the actuators. The computing device may have wireless communication capability that allows a user to wirelessly control the actuators of the computing device, for example, to lock or unlock the enclosure, or to depress a button of the key fob secured within the enclosure.

Abstract: Apparatuses, systems, and methods are described that provide improved networking communication systems and associated adapters. An example networking communication adapter includes an adapter housing defining a first end and a second end opposite the first end. The first end is configured to engage an Octal Small Form Factor Pluggable (OSFP) connector, and the second end is configured to receive a Quad Small Form Factor Pluggable Double Density (QSFP-DD) transceiver therein. The networking communication adapter further includes an inner connector positioned within the adapter housing. In an operational configuration in which the first end engages the OSFP connector and the second end receives the QSFP-DD transceiver, the inner connector operably connects the QSFP-DD transceiver with the OSFP connector such that signals may pass therebetween.

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Abstract: A notebook computer is provided. The notebook computer includes a first body, a second body, and a pivotally connection structure. The first body includes a first surface, and the first surface includes a wireless signal transmitting element. The second body includes a second surface, and the second surface includes a wireless signal receiving element. The pivotally connection structure connects with the first body and the second body. When the second body rotates relative to the first body through the pivotally connection structure, the second surface moves toward the first surface, so that the wireless signal receiving element is aligned with the wireless signal transmitting element.

Abstract: A jumper cable assembly includes: a plurality of jumper cables, each having a first end terminated in a first connector and a second end terminated in a second connector; and a first mounting structure, the first connectors being mounted in the first mounting structure in a fixed arrangement relative to each other, the arrangement matching an arrangement of connectors of one of an antenna and a piece of cellular equipment to facilitate installation of the jumper cable assembly.

Abstract: A display apparatus includes a fixing frame, a first display device, and a second display device. The first display device is disposed on the fixing frame, and includes a top portion, an upper electrical connector connected to the top portion, and an upper receiving groove located at the top portion. When the upper electrical connector is located in a storage position, the upper electrical connector is located in the upper receiving groove. The second display device is disposed on the fixing frame, and includes a bottom portion and a lower electrical connector electrically located at the bottom portion, wherein the lower electrical connector is electrically connected to the upper electrical connector.

Abstract: Apparatuses, systems, and methods are described that provide improved networking communication systems and associated adapters. An example networking communication adapter includes an adapter housing defining a first end and a second end opposite the first end. The first end is configured to engage an Octal Small Form Factor Pluggable (OSFP) connector, and the second end is configured to receive a Quad Small Form Factor Pluggable Double Density (QSFP-DD) transceiver therein. The networking communication adapter further includes an inner connector positioned within the adapter housing. In an operational configuration in which the first end engages the OSFP connector and the second end receives the QSFP-DD transceiver, the inner connector operably connects the QSFP-DD transceiver with the OSFP connector such that signals may pass therebetween.

Abstract: Methods and systems of assigning an appraiser to perform a task are provided. A request may be evaluated to identify elements corresponding to the request. The elements may be evaluated to determine the task having a task a task parameter, such as conducting an appraisal. The task may comprise accepting an appraisal order, contacting a property owner, setting up a meeting, identifying comparable properties, confirming an appraisal time, submitting the appraisal report, or submitting a satisfaction survey. An appraiser database may be assessed to identify a group of appraisers having appraiser characteristics corresponding to the task parameter. Appraisal scores may be determined for the appraisers within the group of appraisers. The task may be assigned to an appraiser within the group of appraisers based upon the appraisal scores. Responsive to the task being assigned to the appraiser, an assignment notification may be provided to the appraiser.

Abstract: A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.

Abstract: A riser bracket for supporting a riser board and a computer card inserted into the riser board is disclosed. The riser bracket includes a first riser bracket piece, a first latch, a second riser bracket piece, and a second latch. The computer card and the riser board are positioned on a motherboard. The first riser bracket piece is configured to be coupled to the riser board. The first latch is configured to the first riser bracket piece to a first mounting point of the motherboard, and to move between a latched position and an unlatched position. The second riser bracket piece is coupled to the first riser bracket piece. The second latch is configured to couple the second riser bracket piece to a second mounting point of the motherboard, and move between a latched position and an unlatched position.

Abstract: An objective lens main body and an objective lens system formed by the objective lens are provided. The objective lens main body includes a main frame for retaining optical functional elements and at least one adjustable, optical functional element that is retained adjustably thereon. The objective lens main body furthermore includes at least one adjustment drive arranged on the main frame for adjusting the adjustable functional element or at least one of the adjustable functional elements. In addition, the objective lens main body includes an electronics board attached indirectly or directly to the main frame that has at least one plug-in location for reversibly receiving a plug-in card, and a first controller that is configured as a plug-in card and inserted into the plug-in location or one of the plug-in locations and is set up for exchanging signals with an electrical module of the objective lens or an external unit.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.

Abstract: Various computer peripheral cards, devices, systems, methods, and software are provided herein. In one example, a storage apparatus includes a plurality of storage device connectors in a stacked arrangement, each configured to mate with associated storage devices and carry Peripheral Component Interconnect Express (PCIe) signaling for the associated storage devices. The storage apparatus also includes a PCIe switch circuit configured to communicatively couple the PCIe signaling of the plurality of storage device connectors and PCIe signaling of a host connector of the storage apparatus, where the PCIe switch circuit is configured to receive storage operations over the PCIe signaling of the host connector of the storage apparatus and transfer the storage operations for delivery over the PCIe signaling of selected ones of the plurality of storage device connectors.

Abstract: The disclosure includes a transaction card comprising a card body having a slot. A first portion of the slot is formed at a first angle, and a third portion of the slot is formed at a third angle. A card body may be fabricated by positioning the card body at a first angle with respect to a cutter, creating a first portion of a slot at the first angle by at least one of translating the card body across the cutter or translating the cutter across the card body, stopping the translating of the card body, rotating the card body to a third angle to create a second portion of the slot; and creating a third portion of the slot at the third angle by at least one of translating the card body across the cutter or translating the cutter across the card body.

Abstract: A wiring board includes a substrate, a connector on the substrate, and at least one monolithic ceramic capacitor including a pair of electrodes and mounted at a mounting angle on the substrate. The connector has an insertion-removal position at which a stress starts in insertion and removal of a counterpart connector into and from the connector. When a first line segment connects centers of the electrodes in a plan view, and a second line segment connects a center of the insertion-removal position and a center of the first line segment in the plan view, the mounting angle is an angle between the first line segment and the second line segment and is from 0 to 90 degrees. The mounting angle is from 0 to 5 degrees or from 85 to 90 degrees in an area within 10 mm from a periphery of the connector on the substrate.

Abstract: A fan-out semiconductor package including a redistribution line structure is provided. The fan-out semiconductor package includes a plurality of redistribution line insulating layers and a plurality of redistribution line patterns arranged on at least one of an upper surface and a lower surface of each of the plurality of redistribution line insulating layers; at least one semiconductor chip arranged on the redistribution line structure and occupying a footprint having a horizontal width that is less than a horizontal width of the redistribution line structure; and a molding member surrounding the at least one semiconductor chip on the redistribution line structure and having a horizontal width that is greater than the horizontal width of the redistribution line structure, wherein the plurality of redistribution line insulating layers have a cascade structure.

Abstract: A memory management method is provided according to an exemplary embodiment. The method includes: receiving a write command and determining whether a usage status of physical units associated to a storage area conforms to a first predetermined status; storing write data corresponding to the write command to at least one of physical units associated to a temporary area if the usage status of the physical units associated to the storage area conforms to the first predetermined status; associating the at least one physical unit storing the write data to the storage area; and allocating at least one logical unit to map the at least one physical unit associated to the storage area.

Abstract: Systems and methods for providing fraud prevention inserts in a chip pocket of a card are provided. A chip fraud prevention system includes a device including a chip and one or more fraud prevention inserts. The chip, and the fraud prevention inserts, may be at least partially encompassed in a chip pocket.

Abstract: The application is directed to various connector and sensor assemblies. In some embodiments, the connector and sensor assembly comprises a connector and a sensor assembly. The connector can have an opening that has a first surface and second surface that are opposite each other. The connector can have a plurality of retractable electrical connectors that extend from the first surface and a lock structure that is located on the second surface. The sensor assembly is comprised of a body portion and a proximal end. The proximal end has a top side and a bottom side. The top side includes a plurality of electrical contacts that is configured to interact with the plurality of retractable electrical connectors. The bottom side includes a key structure that is configured to interact with the lock structure in the connector.

Abstract: The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module are provided. This chip card module includes a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit is used to establish a connection between the antenna and conducting tracks of the module. The invention also relates to a method for fabricating an antenna support including such a connection unit. The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.

Abstract: A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.

Abstract: According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

Abstract: A plug-in device may include a circuit board, a first connecting piece stacked on the circuit board and a card tray stacked on the first connecting piece. The card tray may include a first mounting face facing the first connecting piece and a second mounting face away from the first connecting piece. The first mounting face may be configured to place a first chip card electrically connected to the circuit board through the first connecting piece. The second mounting face may be configured to place a second chip card electrically connected to the circuit board. A projection of the first mounting face along a direction perpendicular to the first mounting face may overlap that of the second mounting face. A terminal may include the above mentioned plug-in device.

Abstract: The present disclosure provides a board unit including: a circuit board; a connector portion that is mounted on the circuit board; and a case that houses the circuit board. The case includes: a lower case that has an upper opening; an upper cover that covers the upper opening of the lower case; and an opening portion that is formed in a side wall of the case so as to allow the connector portion to be fitted to a mating connector portion. The side wall includes: a step surface that extends outward from a lower region of the opening portion; and a plurality of vertical groove portions whose first ends are connected to the step surface and whose second ends are connected to a lower edge of the side wall.

Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Abstract: A printed circuit board accommodation casing includes: a support surface that abuts on a first planar portion of a printed circuit board; a side wall portion located outside in a planar direction of the printed circuit board, the first planar portion of which is abutted by the support surface; and an engagement protrusion formed on the side wall portion, in which a crushing margin, which is crushed against the first planar portion of the printed circuit board, is set on the engagement protrusion at a location where the support surface does not abut on the first planar portion of the printed circuit board.

Abstract: A TSV structure includes a substrate comprising at least a TSV opening formed therein, a conductive layer disposed in the TSV opening, and a bi-layered liner disposed in between the substrate and the conductive layer. More important, the bi-layered liner includes a first liner and a second liner, and a Young's modulus of the first liner is different from a Young's modulus of the second liner.

Abstract: Systems and methods of interconnecting electrical devices are provided. In one exemplary embodiment, an arrangement of interconnected electrical devices may include one or more first electrical devices with a first data flow and one or more second electrical devices with a second data flow. Further, the first electrical devices may be mirrored versions of the second electrical devices. Also, the first data flow may be substantially opposite to the second data flow.

Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.

Abstract: An electronic device lacking an internal power supply comprises electronic circuitry, an external power adapter having an input connector for receiving AC power from a conventional AC power outlet and for providing a low-voltage output signal to an output connector, and a first port electronically coupled to the electronic circuitry for receiving the low-voltage output signal from the output connector of the power adapter and for providing the low-voltage output signal to the electronic circuitry.

Abstract: A method for manufacturing a smart card includes: planting a solder ball on the secure chip solder pad of the main circuit board; according to the position of the secure chip solder pad on the main circuit board, milling out a groove on the substrate on which the main circuit board is packed, such that the solder ball on the secure chip solder pad is visible at the bottom of the groove; packing the secure chip module into the groove, and by use of the solder ball on the secure chip solder pad, mounting the secure chip module onto the main circuit board. The method is capable of improving the quality of the wiring of the main circuit board; and increasing the scalability of the smart card.

Abstract: The present invention relates to a front-maintained multilayer magnetic-attaching LED display screen with small pitch. The structure of the present invention includes a planar array driving board containing light emitting diodes, pads having fixed interval are arranged around the planar array driving board, and the planar array driving board is fixedly connected to a first mounting board of a central fixed iron board to form a module. The module and the second mounting board are magnetically attached to form an outer layer magnetic-attaching structure, and the second mounting board are magnetically attached to the box or mounting member to form an inner layer magnetic-attaching structure; the magnetic force of the outer layer magnetic-attaching is smaller than that of the inner layer magnetic-attaching structure; a module assembly including at least two modules is magnetically attached by the box body or the mounting member.

Abstract: An electronic device lacking an internal power supply comprises electronic circuitry, an external power adapter having an input connector for receiving AC power from a conventional AC power outlet and for providing a low-voltage output signal to an output connector, and a first port electronically coupled to the electronic circuitry for receiving the low-voltage output signal from the output connector of the power adapter and for providing the low-voltage output signal to the electronic circuitry.

Abstract: A fiber optic transceiver FPGA mezzanine card (FMC) is capable of operating in radiation environments. The fiber optic transceiver FMC may be used with radiation-hardened and non-hardened FPGAs. The FMC may enable high speed serial communications, such as gigabit Ethernet, PCI express, serial rapid IO, and/or other high speed serial protocols over the fiber.

Abstract: An electrical connector includes an insulative housing, a plurality of conductive terminals retained in the insulative housing and two grounding members. The insulative housing defines an upper sidewall, a lower sidewall and two end walls connected to both ends of the upper and lower sidewalls to form a mating cavity. Each grounding member defines a body portion fixed to the insulative housing and a plurality of contacting arms extending forward from the body portion. Each contacting arm defines a pair of wing portions located on both sides thereof, and the upper and lower sidewalls define a plurality of channels and a plurality of receiving slots. The wing portions are abutted against the bottom surfaces of the receiving slots to form a pre-pressure to the contacting arms.

Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.

Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.

Abstract: A flash drive structure includes an insulated base including an upper end, a first slot formed near the upper end, a lower end, two inclined guiding surfaces, a receiving space connected to the inclined guiding surfaces, a limiting tab disposed in the receiving space and two latches disposed on the two guiding inclined surfaces respectively; a circuit board including a surface, on which circuits and modules are mounted, and an extending portion, on which a plurality of interface elements are disposed, wherein the extending portion corresponds to the receiving space, the circuit board is mounted on a lateral surface of the insulated base through the extending portion positioned in the receiving space by the limiting tab; and a case having a hollow structure, housing the assembled insulated base and circuit board, wherein the case includes two notches configured to engage the latches.

Abstract: Described herein is a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be attached in a housing which may itself removably and selectively connect to components.

Abstract: Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.

Abstract: This document describes a bracket assembly for reinforcing connectors on printed circuit boards. In some aspects, an apparatus is described that includes a device chassis with a stopper feature, a printed circuit board (PCB) attached to the device chassis, and an extended connector assembly mounted to the PCB. The extended connector assembly includes a connector and a connector reinforcing bracket. The connector reinforcing bracket increases a length of the connector to reduce the magnitude of a bending moment induced in the PCB by a connector insertion force. The connector reinforcing bracket also limits deformation of the PCB caused by the connector insertion force.

Abstract: Apparatuses are provided for performing physical access control using various types of encoding technologies by removably incorporating modular encoder subassemblies. An access control apparatus includes access control electronics and at least one docking bay or slot for removably housing at least one modular encoder unit. The encoder unit can be removably house in the docking bay or slot of the access control apparatus and be removably linked, communicatively and/or physically, to the access control electronics when housed in the access control apparatus, and can interface with and write or read information to or from a credential. When removably housed in the docking bay or slot, the encoder unit can receive identity data from the access control electronics and bind the identity data to the credential.

Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.

Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

Abstract: Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes.