Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 9647359
    Abstract: An electronic device that accommodates a plurality of cards is provided. The electronic device includes a first contact area connected to a first card among the plurality of cards and a second contact area selectively connected to one of a second card or a third card among the plurality of cards.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: May 9, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung Cho, Yong Sang Yun, John Gy Lee, Beom Ju Kim
  • Patent number: 9569702
    Abstract: A card reader may include a card insertion part which is formed with an insertion port for the card; and a conveying passage for the card which is connected with the insertion port. The card insertion part may include a shutter member disposed on a rear side with respect to the insertion port is movable between a closed position an open position; and a protruding member which is attached to the shutter member and is protruded from the shutter member to an insertion port side. An insertion port side of the protruding member may be formed with a card abutting face. A distance between the insertion port and the card abutting face in a conveying direction of the card may be set to be shorter than a width in the short widthwise direction of the card.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: February 14, 2017
    Assignee: NIDEC SANKYO CORPORATION
    Inventors: Kazutoshi Ishikawa, Kazunori Takahashi, Jo Tanaka
  • Patent number: 9520663
    Abstract: A connector for fixing and electrically connecting a flat cable includes a base body and a first inspection window. The base body includes a bottom part and a top part which are opposite to each other. The bottom part and the top part together form a flat-cable slot and an inserting opening. The flat-cable slot and the inserting opening are communicated with each other. The first inspection window extends through two surfaces of the top part which are opposite to each other. The first inspection window communicated with the flat-cable slot. A portion of the flat-cable slot away from the inserting opening is exposed in the first inspection window, and a position of the flat cable in the flat-cable slot is inspectable through the first inspection window.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: December 13, 2016
    Assignee: WISTRON CORP.
    Inventor: Hung-Sheng Chen
  • Patent number: 9507973
    Abstract: An apparatus with the middle structure being layered between the first outer structure and the second outer structure. The operational circuitry includes a plurality of pockets for subscriber identity module cards, the pockets being arranged in two parallel rows in a planar fashion. The pockets of each row are placed next to each other and include open sides capable of receiving the subscriber identity module cards. The open sides of the pockets of different rows face in opposite directions. The middle structure includes a plurality of holes in rows for transferring subscriber identity module cards therethrough to the pockets or from the pockets, the holes of the middle structure of different rows facing in opposite directions, and the holes being on the open sides of the pockets.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: November 29, 2016
    Assignee: UROS TECHNOLOGY S.À R.L.
    Inventors: Marko Nousiainen, Ilkka Rahikainen
  • Patent number: 9496635
    Abstract: A memory card identification device, a host device using the memory card, and a memory card are provided. The memory card identification device includes: a card socket comprising a single card slot through which at least two kinds of memory cards can be inserted and a target port disposed to be in contact with any one kind of a target memory card based on an external characteristic difference between different kinds of memory cards; and a card type detector configured to determine a type of a memory card inserted in the card socket by using a contact state signal of the target port.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: November 15, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-bum Lee, Seok-heon Lee, Sung-hoon Lee
  • Patent number: 9467186
    Abstract: A card holder for holding a card includes a card holder body for providing a support plane for supporting the card; and a plurality of inlaid pieces, wherein each of the plurality of inlaid pieces is pivotally mounted on the card holder body, and is structured to be rotated to a first position perpendicular to the support plane or a second position not higher than the support plane.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: October 11, 2016
    Assignee: Xiaomi Inc.
    Inventors: Fenghui Wu, Kesheng Yan, Shasha Shi, Shaojie Wang
  • Patent number: 9468116
    Abstract: An apparatus and associated methodology contemplating an enclosure configured to securely contain a circuit board. The enclosure has a cover defining a flange operably extending substantially parallel to the circuit board in direct contact with the circuit board. The enclosure also has a body extending from the flange that is operably separated from the circuit board. A connecting member has opposing planar sides operably pressing to contain the flange against the circuit board in supporting the circuit board within the enclosure.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: October 11, 2016
    Assignee: Seagate Technology LLC
    Inventor: William G. Voss
  • Patent number: 9418036
    Abstract: The present invention provides a data terminal with a connection structure of a universal serial bus (USB) interface. The structure includes: a USB interface, a guide rail element, an elastic element, and a limit element; a protrusion is disposed on at least one side of the USB interface; the guide rail element includes two vertical faces disposed opposite each other; the USB interface is located in an accommodating space formed by the two vertical faces; a guide rail is disposed on each vertical face in a hollow manner; the protrusion on the USB interface extends out of the accommodating space from the guide rail; and in the two vertical faces, a connection terminal is disposed on an outer side of at least a first vertical face.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: August 16, 2016
    Assignee: Huawei Device Co., Ltd.
    Inventors: Jian Xiao, Bin Zeng
  • Patent number: 9414510
    Abstract: An electronic card connector includes a tray, at least one latching member, a push rod and an ejection assembly. The tray defines a defined space for accommodating an electronic card and at least one notch. Each latching member comprises at least one fixing portion fixed to a housing and a bulge. Each bulge receives in one of the at least one notch to detachably engage the tray with the housing. The push rod includes a first hook. The ejection assembly includes a connecting rod having a second hook and an expansion bracket rotatably coupled to the connecting rod and resisting the tray. When the second hook is engaged with the first hook, the tray is engaged with the housing. When the first hook is disengaged from the second hook, the tray is driven to disengage from the housing by an elastic restoring force of the expansion bracket.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: August 9, 2016
    Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.
    Inventor: Qian Lei
  • Patent number: 9367712
    Abstract: A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: June 14, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Lee J. Smith, Jeffrey Alan Miks, Curtis Michael Zwenger, Barry Michael Miles
  • Patent number: 9351418
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: May 24, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi Mitsuhashi, Hirofumi Katami
  • Patent number: 9320163
    Abstract: Disclosed is a portable downloader comprising a pen-shaped housing and a circuit board provided inside of the pen-shaped housing. Provided at one end of the circuit board is a micro-universal serial bus (MUSB) port. Connected to the circuit board are a ground wire and two data wires. Each data wire is connected to a probe at the other end. Provided at the end of the pen-shaped housing corresponding to the MUSB port is a socket. Provided at the other end are two position-fixing holes. The two probes penetrate the position-fixing holes. The MUSB port connects to a computer universal serial bus (USB) port through a USB-MUSB computer extension wire. The portable downloader uses USB power supply with no need for an external power supply, and supports hot plug. The downloader uses the two probes as the C2 port, and is convenient to transmit data to C2 slave devices. The downloader is of a pen-shaped packaging, and is therefore easy to carry.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: April 19, 2016
    Assignee: WUHAN TELECOMMUNICATION DEVICES CO., LTD.
    Inventors: Liuyu Zhang, Beili Song, Tao Yuan
  • Patent number: 9274569
    Abstract: The instant disclosure relates to a memory module comprising a PCB and a detachable assembly. The PCB has a terminal portion and a free portion away from the terminal portion. The detachable assembly includes a plurality of metal members disposed on the free portion of the PCB. Thereby, user can averagely force the metal members to install or detach the memory module from a memory slot of a computer system to prevent the interference of outer ESD to affect the normal function of PCB.
    Type: Grant
    Filed: April 13, 2013
    Date of Patent: March 1, 2016
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventor: Yujen Yang
  • Patent number: 9259936
    Abstract: A circuit board holder holding a circuit board which is not fixed to a liquid container containing an ink and stores information relating to the ink includes a support portion configured to have an inclined surface supporting the circuit board. The circuit board supported by the support portion is inclined to a horizontal direction.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 16, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Takeshi Iwamuro, Hidetoshi Kodama
  • Patent number: 9257377
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 9, 2016
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Patent number: 9218953
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: December 22, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Patent number: 9196509
    Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. A plurality of semiconductor die comprising a copper column disposed over the active surface of each semiconductor die is provided. An embedded die panel is formed by disposing an encapsulant around each of the plurality of semiconductor die. A true position and rotation of each semiconductor die within the embedded die panel is measured. A unit-specific pattern is formed to align with the true position of each semiconductor die in the embedded die panel. The unit-specific pattern as a fan-out structure disposed over the semiconductor die, over the encapsulant, and coupled to the copper columns. A fan-in redistribution layer (RDL) can extend over the active surface of each semiconductor die such that the copper columns formed over the fan-in RDLs. The unit-specific pattern can be directly coupled to the copper columns.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: November 24, 2015
    Assignee: DECA Technologies Inc
    Inventors: Christopher M. Scanlan, Timothy L. Olson
  • Patent number: 9198314
    Abstract: A USB memory stick includes housing having a frame hole, a tray providing a fastening structure, and a memory attached to the tray and mounted with the tray in the housing. The memory includes a mating fastening structure fastened to the fastening structure of the tray, a stepped bottom wall formed of a plurality of steps rising one behind another, a plurality of vertical clearance compensation spring leaves respectively disposed corresponding to the steps, and a mating locating block forced into engagement with the frame hole of the housing.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 24, 2015
    Assignee: HO E SCREW & HARDWARE CO., LTD.
    Inventor: Joseph Huang
  • Patent number: 9148255
    Abstract: A detection signal output device includes connector terminals adapted to be connected by a cable to an external device. Fixed contacts are spaced apart from the connector terminals and output information indicating detector states. An integrated circuit includes a box-shaped package having different first and second side surfaces. First IC terminals are arranged on the first side surface and electrically connected to the fixed contacts. Second IC terminals are arranged on the second side surface and electrically connected to the connector terminals. The integrated circuit generates an information signal, in accordance with information indicating the detector states obtained through the first IC terminals, and outputs the information signal from one of the second IC terminals. The fixed contacts are arranged in correspondence with the first side surface, and the connector terminals are arranged in correspondence with the second side surface.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: September 29, 2015
    Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Osamu Inagaki, Shinichi Yoshida, Eijiro Hirose
  • Patent number: 9141902
    Abstract: A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: September 22, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Kristof Bothe, Juergen Hoegerl, Andreas Karl, Andreas Mueller-Hipper, Peter Scherl, Peter Stampka, Uwe Wagner
  • Patent number: 9136661
    Abstract: A storage device including a storage module and a sheath member is provided. The storage module has a substrate, a first terminal set and a second terminal set, and the first and the second terminal sets are disposed on opposite sides of the substrate. The sheath member has an opening and a third terminal set. A portion of the third terminal set is exposed out of the sheath member. At least a portion of the storage module is sheathed into the sheath member, and the first terminal set is exposed out of the sheath member through the opening. The second terminal set is electrically connected to the third terminal set, and an connection interface is formed by the first terminal set exposed out of the sheath member and the portion of the third terminal set exposed out of the sheath member.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 15, 2015
    Assignee: PHISON ELECTRONICS CORP.
    Inventor: Wei-Hung Lin
  • Patent number: 9101066
    Abstract: An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: August 4, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Isao Azumi, Koji Hashimoto
  • Patent number: 9073149
    Abstract: A method of fixing a functional component (2) in a housing (4). During a first step, a first housing portion (1) is prepared in which a functional component (2), to be fixed, is arranged in a provisional fixing position. During a second step, a second housing portion (3) is brought into contact with the first housing portion (1) so that the functional component (2) is arranged in a joining direction (X) between the housing portions (1, 3). During a third step, material from at least one of the housing portions (1, 3) is melted in such manner that the functional component (2), located between the housing portions (1, 3), is gripped in position when a material-integral bond is formed between the housing portions (1, 3).
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: July 7, 2015
    Assignee: ZF Friedrichshafen AG
    Inventor: Dirk Raschke
  • Patent number: 9048557
    Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: June 2, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JinTae Kang, Kisun Kim, Dongyang Lee, Doil Kong, Sunghoon Lee
  • Patent number: 9030830
    Abstract: A containing case suitable to be installed at an electronic device includes a main body, a cover and an elastic locking element. The cover is pivoted at the main body and has a protrusion portion, in which a side of the protrusion portion has a locking surface and the other side of the protrusion portion has a guiding slope. The elastic locking element is movably disposed at the main body and has a locking portion. When the cover is closed to the main body and drives the protrusion portion to apply force onto the elastic locking element, the elastic locking element is elastically deformed and the locking portion moves along the guiding slope and then crosses the protrusion portion to reach the locking surface so that the cover is locked at the main body by the locking portion.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: May 12, 2015
    Assignee: Wistron Corporation
    Inventors: Po-Yuan Hsu, Hsing-Wang Chang, Tsung-Hsien Chen, Chia-Cheng Su, Ping-Feng Liao
  • Publication number: 20150103498
    Abstract: Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 16, 2015
    Inventors: Keunhyuk Lee, Oseob Jeon, Joon-seo Son, Seungwon Im
  • Publication number: 20150098194
    Abstract: An apparatus and corresponding memory card holder wherein the apparatus includes: a casing configured to enable a plurality of memory cards to be removably inserted into the casing; contact pads located within the casing configured to enable an electrical connection to be established between the contact pads and at least one memory card when the plurality of memory cards are inserted within the casing; and at least one mounting portion configured to enable the apparatus to be mounted on a circuit board such that a first portion of the apparatus is positioned above the circuit board and a second portion of the apparatus is positioned below the circuit board.
    Type: Application
    Filed: May 4, 2012
    Publication date: April 9, 2015
    Inventors: Bocheng Hou, Shixiang Wu, Henrik Franck, Morten Rolighed Christensen, Han Tao, Yuk Fung Chan
  • Patent number: 8998620
    Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: April 7, 2015
    Assignee: Super Talent Technology, Corp.
    Inventors: Jim Chin-Nan Ni, Nan Nan, Abraham C. Ma
  • Patent number: 8994230
    Abstract: An electrical circuit for bi-directional power control between two devices, including a mobile communication card, an electronic device that connects to the communication card, the electronic device being either (i) a host device that operates independently of the communication card and also interoperates with the communication card, or (ii) a jacket for the communication card, wherein the jacket is a passive device that does not operate independently of the communication card, and circuitry connecting the mobile communication card with the electronic device, including a device on/off button operative to power the electronic device on and off, and a switch, wherein the circuitry uses a single connection line connecting the communication card, the electronic device, the device on/off button, and the switch, to enable the electronic device to automatically power the communication card on and off using the switch, in response to the electronic device being respectively powered on and off.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: March 31, 2015
    Assignee: Google Inc.
    Inventors: Itay Sherman, Eran Miller
  • Patent number: 8995118
    Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: March 31, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: JinTae Kang, Kisun Kim, Dongyang Lee, Doil Kong, Sunghoon Lee
  • Publication number: 20150077944
    Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
    Type: Application
    Filed: November 25, 2014
    Publication date: March 19, 2015
    Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
  • Patent number: 8982567
    Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: March 17, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyo-Jae Bang, Dogeun Kim, Hongkyun Kim, Youngbok Jeon
  • Patent number: 8982551
    Abstract: An electronic device includes an electronic module and an electronic module fixing structure that includes a main body, a position-limiting component slideably disposed on the main body along a first direction, at least one positioning component slideably disposed on the main body along a second direction, and at least one first elastic component. The position-limiting component has a position-limiting portion. The first elastic component is connected between the main body and the positioning component. The position-limiting component resists an elastic force of the first elastic component to limit the positioning component to be at a first position. When the electronic module moves into the main body, the electronic module pushes the position-limiting component to drive the position-limiting portion to move away from the positioning component, and the positioning component moves to a second position by the elastic force of the first elastic component to position the electronic module.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 17, 2015
    Assignee: Wistron Corporation
    Inventor: Star-Wh Zhou
  • Patent number: 8976533
    Abstract: A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: March 10, 2015
    Assignee: Phison Electronics Corp.
    Inventors: Wei-Hung Lin, Hung-I Chung
  • Patent number: 8976521
    Abstract: A surface contact card holder includes a housing and a tray assembly. The housing includes a receiving frame and defining a receiving hole. The tray assembly includes a tray and a cover. The tray is slidable and receivable in the receiving frame from the receiving hole, the tray is configured for carrying a surface contact card therein. The cover is pivotally attached to the tray and covering the receiving hole. The cover includes a first end and a second end. When the first end of the cover is pressed to pivot the cover, the second end of the cover moves out of the receiving hole, the tray is slid out of the receiving frame to allow insertion and removal of the surface contact card from the housing.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: March 10, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Zhen-Lin Liu, Wen-Ze Liu
  • Patent number: 8971045
    Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.
    Type: Grant
    Filed: December 30, 2012
    Date of Patent: March 3, 2015
    Assignee: NETLIST, Inc.
    Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
  • Patent number: 8971051
    Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: March 3, 2015
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Hua-Xiang Liang
  • Patent number: 8950681
    Abstract: UICC apparatus and related methods are disclosed herein. An example UICC apparatus includes a carrier and a first UICC defined by a first punch-out feature formed in the carrier. The first punch-out feature is configured to remain attached to the carrier when the first UICC is removed from the carrier.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: February 10, 2015
    Assignee: Blackberry Limited
    Inventors: James Randolph Winter Lepp, Jean-Philippe Paul Cormier, Johanna Lisa Dwyer
  • Patent number: 8947883
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: February 3, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Patent number: 8947945
    Abstract: A memory card includes a control chip, a buffer, a NAND gate, and an inverter. The memory card has a first surface and a second surface opposite to the first surface. A first group of conductive pins is located on the first surface, and connected to the buffer through a first channel. A second group of conductive pins is located on the second surface, and connected to the buffer through a second channel. An order of pins of the first group of conductive pins located on the first surface from left to right is the same as an order of pins of the second group of conductive pins located on the second. The buffer is electrically connected to the control chip. Data can be transmitted between the first group of conductive pins or the second group of conductive pins and the control chip through the buffer.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: February 3, 2015
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Song Ma, Wei Pang
  • Patent number: 8946568
    Abstract: There is provided an electronic component enclosure. The electronic component enclosure includes: an upper enclosure and a lower enclosure. The upper enclosure includes: an upper plate portion; an upper sidewall portion extending from a periphery of the upper plate portion; and a hook member extending from the upper sidewall portion. The lower enclosure is engaged with the upper enclosure, and includes: a lower plate portion; a lower sidewall portion extending from a periphery of the lower plate portion; and a reception member extending from the lower sidewall portion and engaging with the hook member.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: February 3, 2015
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Min Shong Tan
  • Patent number: 8937811
    Abstract: A chip card holding mechanism includes a tray, a supporting plate, an unlocking member, a driving arm, and an elastic member. The unlocking member includes a base body, an unlocking block formed on the base body, and a rotation portion protruding from the base body. The supporting plate defines a first sliding groove, and forms a first block. The driving arm defines a second sliding groove, and forms a second block positioned thereon. The first block is received in the second sliding groove, and the second block is received in the first sliding groove. The elastic member is compressed between the first block and the second block. The rotation of the rotation portion is capable of driving the unlocking block to rotate, thereby releasing the elastic member.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: January 20, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Hua-Yong Wang
  • Patent number: 8934260
    Abstract: Provided is an electronic equipment cabinet capable of detecting a storage state of a circuit board unit by using a smaller number of switches than circuit board units. The electronic equipment cabinet, which stores a plurality of circuit board units inserted and extracted in the same direction, includes a plurality of slots for storing the circuit board units, a plurality of cover members for covering the slots, and a switch for detecting closing of all the slots. The cover members, which are provided by a plurality of types having an installation order restricting mechanism for preventing closing of the slots, except for when the cover members are installed according to a preset installation order, includes a driving member located in a final-installation cover member that is installed last and configured to drive the switch.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: January 13, 2015
    Assignee: NEC Display Solutions, Ltd.
    Inventor: Komei Tanaka
  • Patent number: 8934256
    Abstract: One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body (101), an internal circuit (301), an external connector (102), and a main body connector (103). The external connector (102) is provided on an edge (202) positioned on an opening side (201) of a card slot (21) in a state in which the card device is inserted into the card slot (21), and is adapted to be supplied with power from an external power supply. The main body connector (103) is provided on the innermost side of a card slot (200) in a state in which the card device is inserted into the card slot (200), and is supplied with power from a main body device.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: January 13, 2015
    Assignee: NEC Corporation
    Inventor: Motohiro Mukouyama
  • Patent number: 8908378
    Abstract: A solid state drive is disclosed. The solid state drive includes a circuit board having opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the circuit board of the solid state drive, and the plurality of semiconductor chips of the solid state drive include at least one memory chip that is at least substantially encapsulated in a resin. An in-line memory module-type form factor circuit board is also disclosed. The in-line memory module-type form factor circuit board has opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the in-line memory module-type form factor circuit board, and these semiconductor chips include at least one memory chip that is at least substantially encapsulated in a resin.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: December 9, 2014
    Assignee: Conversant Intellectual Property Management Inc.
    Inventor: Jin-Ki Kim
  • Patent number: 8902602
    Abstract: An ejection mechanism includes a top cover, a bottom cover having a first sidewall and a second sidewall, and a sliding assembly. The sliding assembly includes a sliding block and an elastic rod. The sliding block defines a containing groove which is divided into an insertion rail and an ejection rail. The sliding block is configured to move back and force between the first and second sidewalls. A first distal end of the elastic rod is fixed in a fixing hole of the first sidewall. When the card is inserted into the ejection mechanism, the second distal end slides along the insertion rail until the second distal end is locked in a joint of the insertion and ejection rails. When the second distal end of the elastic rod disengages from the locked position by an external force, the second distal end slides in the ejection rail.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: December 2, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Hua-Yong Wang
  • Patent number: 8901439
    Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 2, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: Chee Keong Chin, Yu Feng Feng, Guo Qiang Shen
  • Patent number: 8897021
    Abstract: A method for manufacturing a plurality of plug-in cards (25) from a card body (6), preferably on a standard sized, ISO 7810, ID1 type, the method comprising the steps of defining said plug-in cards (25) on the card body (6) and making at least one score line (19) on the card body to define the same plurality of similar plug-in support cards (33) each comprising a single plug-in card.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: November 25, 2014
    Assignee: Oberthur Technologies UK Limited
    Inventor: David K. A. Hatch
  • Patent number: 8885336
    Abstract: A mounting structure adapted for mounting an expansion card within a computer enclosure and configured to directly absorb and conduct heat from a heat source (such as an IC chip) on the card to the ambient atmosphere surrounding the enclosure. The mounting structure includes a mounting bracket, a heat sink adapted to contact a surface of the heat source on the expansion card, an extension interconnecting the heat sink and the mounting bracket, one or more features for conducting heat from the heat sink to the mounting bracket, and one or more features associated with the mounting bracket for dissipating heat from the mounting structure to the ambient atmosphere surrounding the enclosure.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: November 11, 2014
    Assignee: OCZ Storage Solutions Inc.
    Inventors: Dokyun Kim, Karl Reinke
  • Patent number: 8872025
    Abstract: A waterproof structure of an electronic unit includes a case that defines a housing portion housing a first terminal, and a connector that includes an insulating body attached to the case. The connector includes a second terminal that is supported by the insulating body and connects a conductor end portion of a cable to the first terminal. The insulating body includes a wall portion that partitions a part of the housing portion by covering an open portion of the case. The insulating body includes a cable lead-in portion that defines a cable lead-in hole for leading the cable into the case and is joined to the wall portion. A potting resin is filled in a space between the inner periphery of the cable lead-in hole and the outer periphery of the cable and the housing portion and cured.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Jtekt Corporation
    Inventors: Toshio Tamai, Takahiro Sanada