Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract: An electronic device assembly structure comprises two electronic devices and a fastening unit. Each electronic device includes a body and an electric connection module. The body has at least one opening formed thereon. The electric connection module is located in the body. The fastening unit fastens the two electronic devices together in an integrated manner. The electric connection modules of the two electronic devices form electric connection through the opening.

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.

Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.

Abstract: A chip card holding mechanism includes a tray, a supporting plate, an unlocking member, a driving arm, and an elastic member. The unlocking member includes a base body, an unlocking block formed on the base body, and a rotation portion protruding from the base body. The supporting plate defines a first sliding groove, and forms a first block. The driving arm defines a second sliding groove, and forms a second block positioned thereon. The first block is received in the second sliding groove, and the second block is received in the first sliding groove. The elastic member is compressed between the first block and the second block. The rotation of the rotation portion is capable of driving the unlocking block to rotate, thereby releasing the elastic member.

Abstract: A motherboard assembly includes a motherboard and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) module with a circuit board. The motherboard includes an expansion slot and a storage device interface. An edge connector is set on a bottom edge of the circuit board to be detachably engaged in the expansion slot, and a notch is set on a bottom edge of the circuit board to engage in a protrusion of the expansion slot. A SATA connector of the circuit board is connected to the storage device interface of the motherboard.

Abstract: An interface module is provided. The interface module includes a substrate and a flexible print circuit board. The substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side. The flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.

Abstract: The optoelectronic device includes a sleeve, an optical subassembly, an electrical connector, and a substrate. The sleeve includes a longitudinal axis, and the sleeve is mountable to a bulkhead. The substrate forms a plane. The substrate is attached to the optical subassembly and to the electrical connector. The substrate includes electrical signal conditioning components mounted thereon. The electrical signal conditioning components electrically connect the optical subassembly to the electrical connector. The substrate is mounted to the sleeve, and the plane of the substrate is substantially perpendicular to the longitudinal axis of the sleeve.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: A circuit board assembly includes a circuit board, a fixing device, and a color-changing layer. The fixing device is capable of holding and securing the circuit board and includes a main body and a cover. The cover is rotatably hinged to the main body. The color-changing layer is located on either or both of the circuit board and cover. When the circuit board is assembled at a predetermined position of the fixing device and is secured on the main body by the cover, the cover exerts a pressure to form protruding points on the color-changing layer at the positions corresponding to the elastic contacts, the color-changing generates an electric field and changes color, which is easily and quickly verifiable by a worker.

Abstract: Portable electronic devices may have sealed connectors. A sealed connector may be formed using a multi-shot insert molding process. The sealed connector may include contacts. A first shot of thermoplastic may be injected to form a contact housing that is molded around the contacts. The contact housing may be encased in a metal shell. A second shot of thermoplastic material may be inserted to form a connector housing that is molded around the contact housing. An elastomeric sealing member may be integrated into the connector housing. A sealed connector formed in this way may be fitted into a device housing of an electronic device. The sealed connector may prevent ingress of liquid, dirt, or other undesirable debris that may enter into the device through the connector port. A flex circuit within the device may have solder pads that may be soldered to corresponding contacts in the connector.

Abstract: A miniature fiber radio transceiver is disclosed that has an elongated form factor. In some embodiments, the form factor has the dimensions of one half of a millimeter by one half of a millimeter by fifty millimeters to give the transceiver an elongated shape similar to the shape of a single strand of hair. The miniature fiber radio transceiver may also include an energy source in the form of a piezoelectric fiber composite transducer having a plurality of elongated elastic piezoelectric fibers embedded in a composite material. The piezoelectric fibers can scavenge electrical energy from mechanical energy to generate charge pulses that provide the electrical energy for the operation of the transceiver.

Abstract: An improved power distribution network for an integrated circuit package that reduces the number of power supply pins that are used in the pin array and achieves better operating performance. In a preferred embodiment, the ratio of power supply pins to input/output (I/O) pins is in the range of approximately 1 to 24 to approximately 1 to 52. In this embodiment, the integrated circuit package comprises a substrate, an integrated circuit mounted on the substrate, a first decoupling capacitor mounted on the substrate, and a second decoupling capacitor formed in the integrated circuit. The package is formed by coupling a power supply pin to both the first and second capacitors by a low frequency path and a DC path, respectively, and the first and second capacitors are coupled by a high frequency path.

Abstract: A card may include a magnetic stripe emulator having a coil with magnetic or non-magnetic material located inside and/or outside of the coil. A shield may be located adjacent to the magnetic emulator that may include a magnetic or a non-magnetic material. The shield may attract magnetic flux lines generated by the magnetic stripe emulator to reduce a magnitude of an electromagnetic field generated on one side of the card as compared to a magnitude of an electromagnetic field generated on another side of the card. A shield may be laminated between layers of a card or may be fixed on a surface of a card.

Abstract: A solid state drive is disclosed. The solid state drive includes a circuit board having opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the circuit board of the solid state drive, and the plurality of semiconductor chips of the solid state drive include at least one memory chip that is at least substantially encapsulated in a resin. An in-line memory module-type form factor circuit board is also disclosed. The in-line memory module-type form factor circuit board has opposing first and second surfaces. A plurality of semiconductor chips are attached to the first surface of the in-line memory module-type form factor circuit board, and these semiconductor chips include at least one memory chip that is at least substantially encapsulated in a resin.

Abstract: A chip card holder is used for assembling a chip card. The chip card holder includes a housing and a latching cover. The housing includes a top wall and a sidewall connected to the top wall. The top wall defines a receiving slot, and the chip card is exposed from the receiving slot. The sidewall defines an opening communicating with the receiving slot. The latching cover is rotatably assembled to the housing to cover the opening.

Abstract: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.

Abstract: Provided is a memory card. The memory card includes interconnection terminals for electric connection with an external electronic machine. The interconnection terminals may be spaced from the front side of the memory card by a distance greater than the lengths of the interconnection terminals. Alternatively, the memory card may include other interconnection terminals between its front side and the former interconnection terminals. The former and latter interconnection terminals may be used for electric connection with different kinds of electronic machines.

Abstract: Disclosed is a portable electronic apparatus including a main body formed with an opening on a surface thereof; a plurality of connection ports disposed to be exposed through an opening of the main body; a door disposed on the opening to be rotated between a first configuration that covers the connection ports and a second configuration that opens the connection ports; a moving mechanism formed to move the connection ports in a direction to be protruded from the opening when the door is rotated to the second configuration, and configured to be operated in conjunction with being pressed of the door; and a locking mechanism formed such that the connection ports are locked in the second configuration in conjunction with the rotation of the door to limit the movement of the connection ports in a direction to be inserted into the opening.

Abstract: Even in a location where, for example, a notch section is formed, sufficient rigidity is secured. For this purpose, in reinforcing structure of a front case, a horizontal hemming-bent section 18 formed by folding work is disposed not only in a notch section 9, but also in regions near neighborhood regions 15 and 16. As a result, in the neighborhood regions 15 and 16 of the notch section 9, there is formed a location in which the horizontal hemming-bent section 18 overlaps with a sidewall section 7 along a side end edge to thereby provide reinforcement. Hence, also in the notch section 9, sufficient rigidity is secured.

Abstract: A multi-standard flash-memory-card carrier includes a carrier chassis and bay to accept flash-memory cards. Embodiments provide flexible hinges or covers allowing use of the card within the chassis or release there from, and adaptable chassis to include additional flash-memory storage within the chassis and data transfer through connected wires within the flexible hinge. All micro and standard flash-memory cards can be carried in the disclosed flash-memory-card carrier, and all embodiments of the carrier can be sized for easy placement in plastic sleeves for credit cards in a person's wallet.

Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Abstract: A multi-memory media adapter to read a plurality of different types of memory media cards via contact pins. A controller maps signals to the contact pins depending upon the type of memory media card.

Abstract: The present invention discloses a connector and a wireless modem, and the present invention relates to the field of electronic products. The connector includes a printed circuit board (PCB). One surface of the PCB is disposed with USB pins, and the other surface is disposed with smart card pins. A frame is disposed outside the PCB, and the frame is configured to bear the PCB. The frame and the USB pins form a USB connector. The frame and the PCB surface disposed with the smart card pins form a cavity, and a smart card is inserted into the cavity to form a smart card connector. The wireless modem includes the connector. As a result, a data card product adopting the present invention may effectively economize its volume, and materials of two card holders may be generally reduced. Thus, the cost of a data card product may be lowered.

Abstract: An electromagnetic wave suppression material is fixed to a case of a communication module. The electromagnetic wave suppression material suppresses radiation of electromagnetic waves by coming into contact with a cage that is a module insertion portion of a chassis when the communication module is inserted into the cage. A piezoelectric element is provided on the case, and located between the case and the electromagnetic wave suppression material. When the communication module is inserted into the cage, the controller applies a voltage to the piezoelectric element to stretch it by the applied voltage, thereby increasing contact pressure between the cage and the electromagnetic wave suppression material.

Abstract: The present invention relates to a folding structure comprising a storage device with an electronic component at least and a plurality of metal contacts and is configured with electronic component(s), metal contacts, and a plug board or a folding kit to embody the present invention's space effectively used and saved, match the present product's design requirements for lightness, thinness, shortness, and smallness, and integrate with other relevant products to become a combinational product with both multiple functions and its shape advantageous to lightness, thinness, shortness, and smallness.

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract: Provided are a pin module and a universal serial bus (USB) device. The USB device includes: a substrate including a first side and a second side, the second side opposite to the first side; at least one memory chip mounted on the first side of the substrate; at least one controller chip mounted on the first side of the substrate; a plurality of first planar electrodes formed on the second side of the substrate; a plurality of second planar electrodes formed on the second side of the substrate; and a sealing material housing the memory chip, the controller chip, the first planar electrodes, and the second planar electrodes, wherein the sealing material exposes one sides of the first planar electrodes and the second planar electrodes.

Abstract: An integrated circuit card includes a laminate, solder bumps, a die and a package. The laminate includes a core board sandwiched between two conductive layers. The conductive layers are connected to each other with solder bumps filled in apertures defined in the core board. The die is provided on one of the conductive layers. The package is provided on the die and an area of the conductive layer around the die.

Abstract: A portable storage device includes a case, a USB plug, a sliding button, a delete button, a controller and a memory module. The delete button is electrically coupled with the controller. Data stored in the device can be deleted through operation of the delete button without a host device.

Abstract: An electronic device includes a chassis, a mounting assembly, and an assisting member. The mounting assembly is secured to the chassis and includes a circuit board and a connector secured to the circuit board. The signal module is secured to the chassis and includes a signal card, and the signal card is engaged with the connector. The assisting member is secured to a first end of the mounting assembly and includes an assisting corner. The assisting corner abuts the signal module. The connector is located between the assisting corner and a second end of the mounting assembly, which is opposite to the first end. The second end rotates about the assisting corner, and the connector disengages from the signal card when the second end is rotated about the assisting corner.

Abstract: An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.

Abstract: An expansion card holding structure for portable electronic device includes a sliding tray and a computer enclosure. The sliding tray includes a receiving portion for receiving an expansion card. The sliding tray defines an opening allowing a connector of the expansion card to extend through. The computer enclosure includes an expansion slot. The sliding tray is slidably attached to the computer enclosure.

Abstract: An exemplary chip card holder for holding a chip card includes a base member, a card receiving frame and a cover. The card receiving frame is mounted on the base member and defines an accommodating space for receiving the chip card therein. The accommodating space has an inserting opening for inserting the chip card into and removing the chip card out from the accommodating space. The cover includes a resisting block protruding therefrom. The cover is detachably latched to the base member in such a way that the resisting block is aligned with the inserting opening and located adjacent to an end of the chip card to hold the chip card within the accommodating space.

Abstract: A label transport device for transporting indicia-bearing labels for identifying electrical and electronic components, comprising a generally rectangular carrier frame member having a generally planar support surface, a generally rectangular planar indicia-bearing label, and a mounting arrangement for mounting the label on the carrier frame, including at least one positioning tab member connected with one edge of the label, and a positioning lug arranged on one of the frame and tab members for engagement with an opening contained in the other of the tab and frame members, thereby to position the label at a given transport location on the carrier frame member. The frame is injection-molded from a synthetic plastic material and includes a plurality of parallel spaced longitudinal spars that are connected together integrally by a plurality of parallel transverse spars.

Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

Abstract: An expandable computer system and a fastening device are disclosed in this invention. The expandable computer system includes a computer, an expansion device and a rigid component. The expansion device includes a first holding portion disposed at a first side of the expansion device, and a first interface socket disposed at a second side of the expansion device. The computer includes a second holding portion and a second interface socket. The rigid component has two transmission plugs and a transmission circuit. The two transmission plugs are coupled with two terminals of the transmission circuit. When the first holding portion is connected with the second holding portion, the two transmission plugs are detachably connected with the first interface socket and the second interface socket to fasten the expansion device to the computer.

Abstract: A chip card holding mechanism includes a bracket, an unlock assembly and a tray. The bracket defines a receiving chamber. The unlock assembly is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket via the unlock assembly, for receiving a chip card. The unlock assembly includes an ejecting member and an unlock member, the ejecting member is slidably assembled to the opening of the bracket and pushes against the tray. The unlock member is an included accessory for driving the ejecting member to slide, thereby ejecting the tray. An electronic device using the chip card holding mechanism is also provided.

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract: A sliding expansion data card includes a data card interface, a spring plate, a main bearing plate, and a shield. The data card interface is set at one end of the main bearing plate. One end of the spring plate is set on the shield which is located on the lower surface of the main bearing plate, and the other end contacts the data card interface.

Abstract: A semiconductor memory card includes a semiconductor memory, a controller, input/output terminals, resistive elements, first wires, and second wires. The semiconductor memory is mounted on one surface of a substrate. The controller is mounted on the other surface of the substrate and controls the semiconductor memory. The input/output terminals input and output signals to and from the semiconductor memory via the controller. The resistive elements electrically connect input/output terminals to the controller. The first wires connect one-side ends of each of the resistive elements to the controller and each of which has a wire length of 4.0 mm or less. The second wires connect the other-side ends of each of the resistive elements to the input/output terminals.

Abstract: An expansion card fastening device includes a bracket, a first fastener, and a second fastener. The bracket includes parallel arranged fences. The first fastener is assembled on one of the fences, and includes a connecting portion, a supporting portion, and an elastic element. The supporting portion and the elastic element are both disposed on an end of the connection portion. A first clasp protrudes from the supporting portion, and faces the same direction with a free end of the elastic element. A second fastener pivots to the supporting portion, and is resisted by the elastic element. A second clasp protrudes from the second fastener, and faces the same direction with the first clasp.

Abstract: A contact allocation method for a subscriber smart card (300) in a mobile terminal (100) fitted with said card, the mobile terminal including at least first and second electronic modules (130, 140) suitable for communicating with the subscriber smart card (300) using respective first and second communications protocols. To enable the way in which the contacts of the subscriber smart card (300) are allocated to be managed dynamically, the card is connected to the first and to the second electronic modules (130, 140) in alternation by selectively connecting at least one contact (C4) of said card to the first or to the second electronic module (130, 140).

Abstract: An active patch panel uses small form factor plus (SFP+) connectivity with a plurality of channels extending between first and second faces of the panel. The channels connect ports on the opposing faces of the panel and are provided with additional electronic elements, such as an equalizer, a clock data recovery element, and a pre-emphasis element. A controller can be connected to the plurality of channels to provide instructions for simultaneous equalization and pre-emphasis of a plurality of cable assemblies in the same channel.

Abstract: Devices and systems are disclosed which relate to enabling NFC communication on devices such as an iPhone. A traditional smart card tray is modified to include contact leads from the inside of the smart card tray to an exterior surface of the smart card tray. Exposed contacts on the external surface provide an outside interface for add-ons. An exemplary add-on is an NFC circuit coupled to or embedded within a mobile device skin. The skin fits snugly around a portion of the mobile device, and includes on one surface contact points that line up with the outside interface of the mobile device. The contact points provide electrical communication between NFC circuitry of the mobile device skin and the smart card within the mobile device. When the skin is worn on the mobile device, the mobile device is NFC enabled. When the skin is removed, the NFC is no longer available.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract: A combination terminal includes a first logic circuit that is configured to interface with a first device using a first protocol. The combination terminal also includes a second logic circuit configured to interface with a second device using a second protocol. The combination terminal includes a retractable portion that includes a first plurality of contacts and retracts based upon an insertion of the second device; connects a first portion of the first device with the first logic circuit; and selects an active logic circuit. The combination terminal includes a static portion comprising a second plurality of contacts and connects the second device with the second logic circuit; and connects a second portion of the first device with the first logic circuit using the second plurality of contacts. The first device is connected to the first logic circuit using the first plurality of contacts and the second plurality of contacts.

Abstract: An IC card includes a frame of a rectangular border-shape, a printed circuit board, and one pair of shells. The printed circuit board is disposed on an interior portion of the frame and equips an electronic component. The one pair of shells cover the area surrounded by the frame with both faces of the shells, and constitute an outer shell of the IC card. One of the shells has a plurality of intermittent bent pieces on a periphery thereof. The bent pieces face an edge portion of the frame. The bent pieces establish one pair of hook pieces which protrude from a plate thickness surface (a flat side) on a front end portion thereof. Ultrasonic vibration is applied to a front end portion of the bent pieces while an edge portion of the frame is subjected to pressure, joining the bent pieces to the frame.

Abstract: A detachable adapter is adapted to be disposed in a handheld device and adapted to accommodate a memory card. The handheld device includes a socket connector. The memory card has a memory card terminal set. The socket connector has a socket body and a socket terminal set disposed at the socket body. The adapter includes an adapter body, and first, second and third terminal sets. The detachable adapter has an accommodating cavity in which the first terminal set is disposed. The second and third terminal sets are disposed on the adapter body. When the memory card is accommodated in the accommodating cavity, the first terminal set contacts the memory card terminal set. When the adapter body is assembled to the socket body, the second terminal set contacts the socket terminal set. When the adapter body is inserted into an electronic apparatus, the third terminal set contacts an apparatus terminal set.