Abstract: An integrated read-only memory having select transistors, each of which has a drain connection and an electrode connection for feeding an electrical signal such as a voltage or a current. A layer is provided between the drain connections and the electrode, whose electric resistance can be changed under the effect of a configuration voltage or current. The layer may be applied in a backend process.

Abstract: The electric device (1, 100) has a body (2, 102) having a resistor (7, 107) comprising a phase change material being changeable between a first phase and a second phase. The resistor (7, 107) has a first electrical resistance when the phase change material is in the first phase and a second electrical resistance, different from the first electrical resistance, when the phase change material is in the second phase. The body (2, 102) further has a heating element (6, 106) being able to conduct a current for enabling a transition from the first phase to the second phase. The heating element (6, 106) is arranged in parallel with the resistor (7, 107).

Abstract: A 1T1R resistive memory array comprised of chains of memory cells, where each memory cell is composed of a resistive element in parallel with a switch. Such chains of memory cells are non-volatile and provide for each of the memory cells to be randomly accessed.

Abstract: A method of programming a non-volatile memory device including a transition metal oxide layer includes applying a first electric pulse to the transition metal oxide layer for a first period to reduce a resistance of the transition metal oxide layer and applying a second electric pulse to the transition metal oxide layer for a second period, longer than the first period, to increase the resistance of the transition metal oxide layer. Related devices are also disclosed.

Abstract: A memory device includes an array of memory cells that include a memory element having a non-reactive resistance whose magnitude is programmable to assume a high-resistance state or a low-resistance state. Sets of first and second lines provide access to the memory cells, wherein the memory element of each memory cell is coupled between one of the first lines and one of the second lines. A checking unit determines whether to invert data values to be stored in memory cells coupled to at least a section of respective ones of the first lines based on a number of memory cells that would be programmed in the high-resistance state or the low-resistance state as a result of the data values in order to reduce the number memory cells programmed in the low-resistance state and the resulting leakage current.

Abstract: An output buffer circuit of the present invention includes a plurality of unit circuits in each of which a pull-up transistor controlled by a first input signal is connected between a high-potential power supply and common node, and a pull-down transistor controlled by a second input signal is connected between the common node and a low-potential power supply, an output terminal connected to a common connecting point of the common nodes of the plurality of unit circuits, and first resistors formed respectively between the common nodes of the plurality of unit circuits and the common connecting point.

Abstract: In integrated semiconductor memories whose stored information is represented by the magnitude of the ohmic resistance of layer stacks with a respective layer comprising a solid electrolyte, the problem arises that although the fact that the large threshold values (G1, G2) for the writing voltage and the erasure voltage differ from memory cell to memory cell means that the memory cells can be programmed individually, said memory cells cannot conventionally be erased individually, i.e., selectively in relation to the other memory cells. The reason for this is the large bandwidth of the threshold values (G1) for the erasure voltages, which ranges from a potential (Verasemin) to a potential (Verasemax). The invention proposes a semiconductor memory and a method for operating the latter, in which simultaneous biasing of all the bit lines and word lines and a specific choice of the electrical potentials allow a single memory cell to be erased selectively in relation to the other memory cells.

Abstract: Methods of operating an integrated circuit memory device include providing a first address and a first command to the memory device and executing the first command within the memory device. This step of executing the first command is performed concurrently with providing at least one of a second address and a second command to the memory device prior to terminating execution of the first command. This providing of at least one of the second address and the second command prior to termination execution of the first command improves timing efficiency by reducing delay associated with execution of each new command.

Abstract: A method of programming a phase change device includes selecting a desired threshold voltage (Vth) and applying a programming pulse to a phase change material in the phase change device. The applying of the programming pulse includes applying a quantity of energy to the phase change material to drive at least a portion of this material above a melting energy level. A portion of the energy applied to the phase change material is allowed to dissipate below the melting energy level. The shape of the energy dissipation from the phase change material is controlled until the energy applied to the phase change material is less than a quenched energy level, to cause the phase change device to have the desired Vth. A remaining portion of the energy applied to the phase change material is allowed to dissipate to an environmental level.

Abstract: A read-only memory (ROM) is disclosed that uses the presence or absence of linear passive electrical elements, such as resistors or capacitors, to encode zeros and ones, permitting a large-area ROM to be fabricated, possibly on a flexible substrate. The ROM includes a substrate, a plurality of row conductors insulated from each other and at least partially layered on a portion of the substrate; a plurality of column conductors insulated from each other and from the row conductors and at least partially layered above or below a portion of the plurality of row conductors, a plurality of amplifiers electrically connected to the column conductors, and at least one linear passive element attached between the row conductors and the column conductors.

Abstract: A floating-gate transistor array and method for programming the same. The floating-gate transistor array includes a plurality of transistors having a source, drain, and floating-gate, whereby the plurality of transistors is arranged into multiple rows and columns. Each row of transistors includes a row programming switch having an output connected to each floating-gate within the row, while each column of transistors includes a column programming switch having an output connected to each drain within the column. The source of each transistor is coupled with a source line corresponding to the specific row of the transistor. The row and column programming switches are utilized to select and program a desired floating-gate transistor. In an indirect programming method, two transistors share a floating gate, such that programming a programmer transistor modifies the current of an agent transistor, which is attached to the circuit, thereby permitting run-time programming.

Abstract: In a memory circuit having memory cells which are connected in series between a ground line PL and a bit line BL and in each case have a resistance memory element said element having a bipolar switching behavior having an anode electrode and a cathode electrode, and a drive transistor connected in parallel with the resistance memory element, the drive transistors of the memory cells in each case are connected to a word line in order to switch the drive transistor on and off in such a way that a current path is formed via the associated drive transistor in a non-activated state of a memory cell and a current path is formed via the associated resistance memory element in an activated state of a memory cell, a first changeover switch being arranged at one end and a second changeover switch at other ends of the series of memory cells in order alternately to produce a connection between the series-connected memory cells and the ground line and the bit line in a manner dependent on an applied address.

Abstract: The present invention relates to a non-volatile memory comprising a memory array comprising functional memory cells and non-functional memory cells linked to at least one non-functional word line. A word line address decoder comprises a special decoding section linked to the non-functional word line, for selecting the non-functional word line when a functional word line is read-selected, such that non-functional memory cells are selected simultaneously with the functional memory cells, and distort the reading of the functional memory cells. Application particularly to integrated circuits for smart cards.

Abstract: A nonvolatile semiconductor memory circuit includes a selection line, a first bit line, a second bit line, a first MIS transistor having a first gate coupled to the selection line, a first drain coupled to the first bit line via a first node, and a first source coupled to a predetermined potential, a second MIS transistor having a second gate coupled to the selection line, a second drain coupled to the second bit line via a second node, and a second source coupled to the predetermined potential, and a latch circuit coupled to the first node and the second node to store data responsive to a signal difference between the first node and the second node, wherein the selection line is operative to supply a write potential that creates a lingering change in a threshold voltage of one of the first MIS transistor and the second MIS transistor.

Abstract: A nonvolatile semiconductor device is configured so that a load circuit applying voltage to a variable resistive element is provided electrically connecting in series to the variable resistive element, a load resistive characteristic of the load circuit can be switched between two different characteristics. The two load resistive characteristics are selectively switched depending on whether a resistive characteristic of the variable resistive element transits from low resistance state to high resistance state, or vice versa, voltage necessary for transition from one of the two resistive characteristics to the other is applied by applying writing voltage to a serial circuit of the variable resistive element and load circuit. After the resistive characteristic of the variable resistive element transits from one to the other, voltage applied to the variable resistive element does not allow a resistive characteristic to return from the other to one depending on the selected load resistive characteristic.

Abstract: A storage apparatus includes memory devices each having a storage element with a characteristic that the application of an electric signal not lower than a first threshold signal allows the storage element to shift from a high resistance value state to a low resistance value state, and that the application of an electric signal not lower than a second threshold signal, which has a polarity different from that of the first threshold signal, allows the storage element to shift form a low resistance value state to a high resistance value state, and a circuit element connected to the storage element in series to be a load; wherein the memory devices are arranged in a matrix and one terminal of each of the memory devices is connected to a common line; and wherein an intermediate potential between a power supply potential and a ground potential is applied to the common line.

Abstract: The present invention relates to a method and apparatus for sensing the resistance state of a programmable resistance memory, using complementary memory elements, one holding the resistance state being sensed and the other holding a complementary resistance state. A sense amplifier detects voltages discharging through the resistance elements to determine the resistance state of an element being read.

Abstract: A semiconductor memory device includes a memory cell unit including at least one semiconductor memory cell, a voltage generating circuit which produces an operating voltage to which reference is made in performing a predetermined operation on the memory cell unit. The device further includes a constant-current circuit capable of a current trimming operation and adapted to supply a constant current to the voltage generating circuit.

Abstract: A method for reading a memory cell, wherein the memory cell comprises two source/drain regions and a gate, wherein the source/drain regions are each connected to a respective local bitline, and, wherein one of the source/drain regions of a neighboring memory cell is connected to one of the local bitlines, the other source/drain region of the neighboring memory cell being connected to another local bitline, comprising the steps of connecting the local bitline that connects the source/drain region of the memory cell and the source/drain region of the neighboring memory cell to a first global bitline, connecting the local bitline that connects the other source/drain region of the memory cell to a second global bitline, connecting the local bitline that connects the other source/drain region of the neighboring memory cell to one of a plurality of local power rails, applying a gate potential to the gate of the memory cell, applying a potential to the first global bitline and applying another potential to the secon

Abstract: An apparatus and method to improve a cycle time of a Read Only Memory (ROM). Loading of each bit line is controlled such that no bit line has less than a specified loading fraction of a loading of a maximally loaded bit line. No additional space or additional circuitry is required. Four NFET pair arrangements are personalizable by via placement by a designer or design automation program. One of the NFET pair arrangements is usable to pad load on a bit line without altering a logical personalization of the bit line. Proper selection from the four NFET pair arrangements ensure that no bit line has less than the specified loading fraction of the loading of the maximally loaded bit line, as well as providing proper logical personality of the bit line.

Abstract: Provided is a resistive memory arrangement having a cell array structured in rows and columns and having resistive memory cells connected to a drive element for driving. Each drive element is jointly connected to n cell resistors forming a memory cell, the cell resistors being CBRAM resistance elements, in particular, and also to a writing, reading and erasing method for a resistive memory arrangement realized with CBRAM resistance elements.

Abstract: A memory array architecture incorporates certain advantages from both cross-point and 1T-1Cell architectures during reading operations. The fast read-time and higher signal to noise ratio of the 1T-1Cell architecture and the higher packing density of the cross-point architecture are both exploited by using a single access transistor to control the reading of multiple stacked columns of memory cells, each column being provided in a respective stacked memory layer.

Abstract: The nonvolatile semiconductor memory device of the present invention includes a memory cell array wherein data is stored in a nonvolatile state based on a difference in memory information between two memory cells comprising a memory cell pair, and a writing controller for writing data to the memory cell array. The writing controller is capable of individually setting memory information of each of the memory cells in the memory cell array.

Abstract: Method and apparatus are disclosed for regulating an antifuse programming current by lightly doping an electrically connected region so that the resistance of the region responds in a non-linear manner to changes in voltage. In this way a variable resistor or a variably resistive transistor may be created which vary their resistance in response to an applied voltage and which may thereby limit a programming current while not limiting a lesser, reading current to a serially connected antifuse.

Abstract: A multi-stable memory or data storage element is used in crosspoint data-storage arrays, as a switch, a memory device, or as a logical device. The general structure of the multi-stable element comprises a layered, composite medium that both transports and stores charge disposed between two electrodes. Dispersed within the composite medium are discrete charge storage particles that trap and store charge. The multi-stable element achieves an exemplary bi-stable characteristic, providing a switchable device that has two or more stable states reliably created by the application of a voltage to the device. The voltages applied to achieve the “on” state, the “off” state, any intermediate state, and to read the state of the multi-stable element are all of the same polarity.

Abstract: A semiconductor memory device having: a cell array including bit lines, word lines and memory cells disposed at crossings thereof, plural memory cells being connected in series to constitute a NAND cell unit, plural blocks being arranged, each being constituted by plural NAND cell units arranged in the word line direction; and a row decoder configured to select a block, wherein the row decoder includes: transferring transistor arrays disposed in association with the blocks, in each of which transistors are arranged for transferring word line drive voltages; first decode portions disposed in association with the transferring transistor arrays, which are applied with boosted voltages to selectively drive the transferring transistor arrays; and second decode portions configured to select one of the blocks, each of which is disposed to be shared by adjacent two first decode portions.

Abstract: Non-volatile memory cell with a single semiconductor device per memory cell. The present invention generally allows for a plurality of memory cells to be formed on a semiconductor substrate that supports a semiconductor device. A multi-resistive state material layer that changes its resistive state between a low resistive state and a high resistive state upon application of a voltage pulse is formed above the substrate, generally at a very high temperature. While the layers fabricated between the substrate and the multi-resistive state material use materials that can withstand high temperature processing, the layers fabricated above the multi-resistive state material do not need to withstand high temperature processing.

Abstract: A memory array architecture suitable for variable resistance memory that mitigates sneak path and associated problems by limiting the number of memory cells associated with an addressed cell to a known number having a sneak path resistance that can be calculated and taken into consideration when sensing the addressed memory cell. Blocks of memory cells are associated with access transistors, which separate the memory cells connected thereto into one half (½) sections of cell blocks. The access transistors can be associated with n memory cells, where n is an even number of at least 2; there may or may not be an equal number of cells on either side of the transistor. The memory array has memory cells, which are grouped into 1T-2nCell blocks.

Abstract: A novel switching device is provided with an active region arranged between first and second electrodes and including a molecular system and ionic complexes distributed in the system. A control electrode is provided for controlling an electric field applied to the active region, which switches between a high-impedance state and a low-impedance state when the electrical field having a predetermined polarity and intensity is applied for a predetermined time.

Abstract: Methods of programming a wordline of multi-level flash memory cells (MLB) having three or more data levels per bit corresponding to three or more threshold voltages are provided. The present invention employs an interactive program algorithm that programs the bits of the wordline of memory cells in two programming phases, comprising a rough programming phase and a fine programming phase to achieve highly compact Vt distributions. In one example, cell bit-pairs that are to be programmed to the same program pattern are selected along a wordline. Groups of sample bits are chosen for each wordline to represent each possible program level. The sample bits are then programmed to determine a corresponding drain voltage at which each sample group is first programmed. This fast-bit drain voltage (Fvd) for each program level essentially provides a wordline specific program characterization of the Vt required for the remaining bits of that wordline.

Abstract: Non-volatile memory cell with a single semiconductor device per memory cell. The present invention generally allows for a plurality of memory cells to be formed on a semiconductor substrate that supports a semiconductor device. A multi-resistive state material layer that changes its resistive state between a low resistive state and a high resistive state upon application of a voltage pulse is formed above the substrate, generally at a very high temperature. While the layers fabricated between the substrate and the multi-resistive state material use materials that can withstand high temperature processing, the layers fabricated above the multi-resistive state material do not need to withstand high temperature processing.

Abstract: MRAM has read word lines WLR and write word line WLW extending in the y direction, write/read bit line BLW/R and write bit line BLW extending in the x direction, and the memory cells MC disposed at the points of the intersection of these lines. The memory MC includes sub-cells SC1 and SC2. The sub-cell SC1 includes magneto resistive elements MTJ1 and MTJ2 and a selection transistor Tr1, and the sub-cell SC2 includes magneto resistive elements MTJ3 and MTJ4 and a selection transistor Tr2. The magneto resistive elements MTJ1 and MTJ2 are connected in parallel, and the magneto resistive elements MTJ3 and MTJ4 are also connected in parallel. Further, the sub-cells SC1 and SC2 are connected in series between the write/read bit line BLW/R and the ground.

Abstract: A memory cell is provided with a pair of electrodes, and an active layer sandwiched between the electrodes and including a molecular system and ionic complexes distributed in the molecular system. The active layer having a high-impedance state and a low-impedance state switches from the high-impedance state to the low-impedance state when an amplitude of a writing signal exceeds a writing threshold level, to enable writing information into the memory cell. The active layer switches from the low-impedance state to the high-impedance state when an amplitude of an erasing signal having opposite polarity with respect to the writing signal exceeds an erasing threshold level, to enable erasing information from the memory cell.

Abstract: A one-time programmable memory cell and the programming thereof including a programming transistor which is disposed in series with a polycrystalline silicon programming resistor forming the memory element. The programming is non-destructive with respect to the polycrystalline silicon resistor.

Abstract: The invention relates to a memory circuit for providing an item of information for a prescribed period of time. The memory circuit has a memory cell with a PMC resistance component which has a solid electrolyte material and a write circuit for writing to the memory cell by applying an electrical variable to the solid electrolyte material. The write circuit is configured to set a resistance of the PMC resistance component on the basis of the prescribed period of time. The resistance corresponds to a logic state of the memory cell and increases over time such that the resistance reaches or exceeds a prescribed resistance threshold value in the prescribed period of time.

Abstract: The present invention relates to a programmable non-volatile semiconductor memory device comprising a matrix of rows and columns of memory cells (1). To reduce the required memory area a 3T memory cell is proposed comprising a bridge of two bridge transistors (MN0, MN1), preferably NMOS transistors, a read transistor, preferably an PMOS transistor, and a silicided polysilicium fuse resistor (R). The read transistors enable the use of a single sense line (SL) for all memory cells (1) of the same row or column in the matrix thus enabling the use of a common sense amplifier for sensing memory cells (1).

Abstract: An improved magnetic random access memory (MRAM) has two sets of signal lines where each set is substantially perpendicular to the other, and memory cells located at the intersections of the signal lines. Each memory cell has a magneto-resistant element containing a magnetization layer whose magnetic characteristics change depending on the intensity of the magnetic field applied. A desired magnetic field can be applied to any cell by supplying appropriate write currents to the signal lines intersecting at that cell. The relationship between applied magnetic fields, two different threshold function values, and four different magnetic fields that result at each cell is disclosed. Better performance, namely, improved selectivity and a more stable write operation, results.

Abstract: An offset compensated memory element voltage supply including a differential amplifier with a compensation circuit, and a transistor with a gate connected to the output of the differential amplifier. The compensation circuit of the differential amplifier includes a compensation capacitor that stores a compensation voltage during a calibration phase, and applies the stored compensation voltage to a compensation input of the compensation circuit of the amplifier during a measurement phase. Feedback from a source of the transistor controls the output of the differential amplifier to maintain a standard voltage across a resistive memory element connected to the source during measurement of the resistance of the resistive memory element, and the compensation circuit improves the accuracy of the voltage across the resistive memory element by compensating for an offset voltage of the differential amplifier.

Abstract: A programmable memory circuit and a method for programming the same are disclosed. A polycrystalline silicon resistor pair are used in a programmable memory cell. The pair includes a first polycrystalline silicon resistor stressable by a predetermined current thereacross, and a second polycrystalline silicon resistor similarly structured as the first polycrystalline silicon resistor stressable by the predetermined current, wherein when only the first resistor is stressed by the predetermined current, a resistance of the first resistor is lowered as compared to the unstressed second resistor, thereby programming the memory cell.

Abstract: A method comprising forming as stacked materials on a substrate, a volume of programmable material and a signal line, conformably forming a first dielectric material on the stacked materials, forming a second dielectric material on the first material, etching an opening in the second dielectric material with an etchant that, between the first dielectric material and the second dielectric material, favors removal of the second dielectric material, and forming a contact in the opening to the stacked materials. An apparatus comprising a contact point formed on a substrate, a volume of programmable material formed on the contact point, a signal line formed on the volume of programmable material, a first dielectric material conformally formed on the signal line, a different second dielectric material formed on the first dielectric material, and a contact formed through the first dielectric material and the second dielectric material to the signal line.

Abstract: The invention relates to a DNR (differential negative resistance) exhibiting device that can be programmed to store information as readable current amplitudes and to methods of making such a device. The stored data is semi-volatile. Generally, information written to a device in accordance with the invention can maintain its memory for a matter of minutes, hours, or days before a refresh is necessary. The power requirements of the device are far reduced compared to DRAM. The memory function of the device is highly stable, repeatable, and predictable. The device can be produced in a variety of ways.

Abstract: A dynamically-operating restoration circuit is used to apply a voltage or current restore pulse signal to thyristor-based memory cells and therein restore data in the cell using the internal positive feedback loop of the thyristor. In one example implementation, the internal positive feedback loop in the thyristor is used to restore the conducting state of a device after the thyristor current drops below the holding current. A pulse and/or periodic waveform are defined and applied to ensure that the thyristor is not released from its conducting state. The time average of the periodic restore current in the thyristor may be lower than the holding current threshold. While not necessarily limited to memory cells that are thyristor-based, various embodiments of the invention have been found to be the particularly useful for high-speed, low-power memory cells in which a thin capacitively-coupled thyristor is used to provide a bi-stable storage element.

Abstract: A 2-terminal trapped charge memory device is disclosed with voltage switchable multi-level resistance. The trapped charge memory device has a trapped charge memory body sandwiched between two electrodes. The trapped charge memory body can be made of a variety of semiconducting or insulating materials of single-crystalline, poly-crystalline or amorphous structure while containing current carrier traps whose respective energy levels and degrees of carrier occupancy, modifiable by the height and width of an applied write voltage pulse, determine the resistance. The mechanism of modification can be through carrier tunneling, free carrier capturing, trap-hopping conduction or Frenkel-Poole conduction. The current carrier traps can be created with dopant varieties or an initialization procedure.

Abstract: This invention relates to an array architecture which incorporates certain advantages from both cross-point and 1T-1MTJ architectures during reading operations. The fast read-time and higher signal to noise ratio of the 1T-1MTJ architecture and the higher packing density of the cross-point architecture are both exploited by using a single access transistor to control the reading of multiple stacked columns of cells each column being provided in a respective stacked memory layer.

Abstract: A synchronous semiconductor memory device includes a data input buffer and a data strobe input buffer. The data strobe input buffer includes an input buffer circuit and a detection circuit. The input buffer circuit is configured to be enabled based on an active signal, and to compare a data strobe signal with a first reference voltage to generate an internal data strobe signal. The detection circuit is configured to be enabled based on the active signal, and to compare the data strobe signal with a second reference voltage to generate a detection signal for enabling the data input buffer.

Abstract: Circuitry that discharges conductive array lines is provided. Generally, the conductive array lines are simultaneously selected and apply an appropriate programming pulse. Accordingly, the conductive array lines need to be discharged in connection with a write operation. The discharge can occur either prior to or following a write operation.

Abstract: A multiple-level memory cell including a storage element formed of several polysilicon resistors connected in series between two input/output terminals; and a load in series with said resistive element, the midpoint of this series connection forming a read terminal of the memory cell, and the respective junction points of said resistors of the storage element being accessible.

Abstract: A method and apparatus are disclosed for sensing the resistance state of a resistance-based memory element using complementary resistance-based elements, one holding the resistance state being sensed and the other holding a complementary resistance state. A sense amplifier detects voltages discharging through the high and low resistance elements to determine the resistance state of an element being read.

Abstract: One end of each variable resistive element, which forms a memory array, in the same row is connected to the same word line and the other end of each variable resistive element in the same column is connected to the same bit line. A first word line voltage is selected and applied to the selected word line, a second word line voltage is selected and applied to the unselected word lines, a first bit line voltage is selected and applied to the selected bit line, and a second bit line voltage is selected and applied to the unselected bit lines.

Abstract: A multi-stable memory or data storage element is used in crosspoint data-storage arrays, as a switch, a memory device, or as a logical device. The general structure of the multi-stable element comprises a layered, composite medium that both transports and stores charge disposed between two electrodes. Dispersed within the composite medium are discrete charge storage particles that trap and store charge. The multi-stable element achieves an exemplary bi-stable characteristic, providing a switchable device that has two or more stable states reliably created by the application of a voltage to the device. The voltages applied to achieve the “on” state, the “off” state, any intermediate state, and to read the state of the multi-stable element are all of the same polarity. The multi-stable element is stable, cyclable, and reproducible in both the “on” state and the “off” state. The storage medium has a relatively high resistance in both its on and off states.