Abstract: Disclosed is a semiconductor device comprising gate stack structures on a substrate, separation structures extending in a first direction on the substrate and separating the gate stack structures, and vertical structures penetrating the gate stack structures. Each gate stack structure includes cell dielectric layers and electrodes including upper electrodes, a barrier layer extending between the electrodes and the cell dielectric layers, a separation dielectric pattern extending in the first direction and penetrating the upper electrodes to separate each upper electrode into pieces that are spaced apart from each other in a second direction intersecting the first direction, and capping patterns between the separation dielectric pattern and the upper electrodes. The capping patterns are on sidewalls of each upper electrode and spaced apart from each other in a third direction perpendicular to a top surface of the substrate. Each capping pattern is on a sidewall of the barrier layer.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: Capacitors, apparatus including a capacitor, and methods for forming a capacitor are provided. One such capacitor may include a first conductor a second conductor above the first conductor, and a dielectric between the first conductor and the second conductor. The dielectric does not cover a portion of the first conductor; and the second conductor does not cover the portion of the first conductor not covered by the dielectric.

Abstract: A memory device includes a cell block including memory cells; a control logic; and a correction block in a dummy region in a core region. The correction block may include first metal lines extending in a first direction; vias extending in a second direction; and second metal lines extending in a third direction. Each of the second metal lines may have a metal center line defining a center of each of the second metal lines in the first direction. Each of the vias may have a via center line defining a center of each of the vias in the first direction. At least one metal center line and at least one via center line may be spaced apart from each other by a first gap in the first direction.

Abstract: The disclosure discloses a three-dimensional stacked memory and a preparation method thereof. The storage unit adopts a constrained structure phase change storage unit, and uses a crossbar storage array structure to build a large-capacity storage array. The preparation method includes: preparing N first strip-shaped electrodes along a crystal direction on a substrate; preparing a first insulating layer with M*N array of through holes; filling the M*N array of through holes of the first insulating layer with a phase change material to form first phase change units; preparing M second strip-shaped electrodes; preparing a second insulating layer, using spin-coated photoresist as a sacrificial material, performing a local planarization on the surface of the second insulating layer; forming M*N array of through holes on the second insulating layer; filling a phase change material to form second phase change units; preparing N third strip-shaped electrodes to form a two-layer stacked phase change memory.

Abstract: In an example, an apparatus includes a memory array in a first region and decode circuitry in a second region separate from a semiconductor. The decode circuitry is coupled to an access line in the memory array.

Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.

Abstract: A voltage regulator circuit using precharge voltage rails is generally disclosed. For example, the voltage regulator circuit may include a first voltage regulator having a voltage output, an output capacitor coupled to the voltage output, and one or more precharge voltage circuits configured to selectively couple to the voltage output, each of the one or more precharge voltage circuits comprising a capacitor coupled between an output of a precharge voltage regulator and a reference potential.

Abstract: Provided is a control signal generator for a sense amplifier, the control signal generator including a replica circuit including replica transistors corresponding to transistors included in the sense amplifier, and configured to receive at least one input signal of the sense amplifier and a first control signal for enabling a sensing operation by the sense amplifier; and an amplifying circuit configured to output, by amplifying an output signal from the replica circuit, a second control signal for enabling an amplifying operation by the sense amplifier after the sensing operation is enabled.

Abstract: Provided is a one-time programmable (OTP) memory device, which includes a data input circuit that receives a supply voltage and applies the supply voltage to one of a plurality of bit lines that is selected by a write switch, and an OTP memory cell array including a plurality of OTP memory cells arranged in a plurality of rows and columns. The OTP memory cells on the same row connected to the same bit line. The OTP memory device also includes a column decoder that selects one of the plurality of columns of the OTP memory cells to apply the supply voltage thereto, and a detection amplifier that performs a read operation of the OTP memory cells connected to one of the plurality of bit lines that is selected by a read switch.

Abstract: The invention provides a code generating apparatus and an OTP memory block. The code generating apparatus of present disclosure includes a plurality of first one time programming (OTP) memory cells, a reference signal provider and a sense amplifier. The first OTP memory cells are coupled to a first bit line. The reference signal provider provides a reference signal. Wherein, at least one of the first OTP memory cells provides a read current to the first bit line, and the sense amplifier compares the read current and the reference signal to generate an output code. A current value of the reference signal is set within a range, and the range is set by the bit current corresponding to a maximum bit count, such as that the output code is determined by a manufacturing variation of the at least one first OTP memory cell.

Abstract: In various embodiments, a method is provided. The method may include forming a buried electrically charged region at a predefined position in a first layer in such a way that the buried electrically charged region generates an electric field having a lateral inhomogeneous field distribution above the first layer, and forming a second layer above the first layer using the field distribution in such a way that a structure of the second layer correlates with the position of the buried electrically charged region.

Abstract: Integrated circuits with programmable resistive switch elements are provided. A programmable resistive switch element may include two non-volatile resistive elements connected in series and a programming transistor. The programmable resistive switch elements may be configured in a crossbar array and may be interposed within the user data path. Driver circuits may also be included for selectively turning on or turning off the switches by applying positive and optionally negative voltages.

Abstract: A semiconductor device is disclosed that includes a substrate and at least a first, second, third, and fourth vertical transistor supported by the substrate. Each transistor comprises a vertical channel, a polarity gate electrode forming a polarity gate adapted to act on a first portion of the channel to affect a polarity of the channel, and a control gate electrode forming a control gate adapted to act on a second portion of the channel to control the electrical conductivity of the channel. The polarity gate electrode and the control gate electrode of each one of the transistors extend laterally from their respective gate and in mutually opposite directions, and the transistors are laterally spaced from each other and arranged such that the control gate electrodes of the first and third transistor face each other and the control gate electrodes of the second and fourth transistor face each other.

Abstract: Memory cells and corresponding memory arrays are provided. The memory cell comprises a fusable element and a bipolar transistor arranged adjacent to the fusable element.

Abstract: Programmable via devices and fabrication methods thereof are presented. The programmable via devices include, for instance, a first metal layer and a second metal layer electrically connected by a via link. The via link includes a semiconductor portion and a metal portion, where the via link facilitates programming of the programmable via device by applying a programming current through the via link to migrate materials between the semiconductor portion and the metal portion to facilitate a change of an electrical resistance of the via link. In one embodiment, the programming current facilitates formation of at least one gap region within the via link, the at least one gap region facilitating the change of the electrical resistance of the via link.

Abstract: A one-time programming cell includes a first metal oxide semiconductor (MOS) structure and a second transistor having a common gate electrode electrically connected to a word line. The first MOS structure has a first gate dielectric layer and the second MOS structure has a second gate dielectric layer. The second gate dielectric layer is thicker than the first gate dielectric layer. Source nodes of the first MOS structure and the second MOS structure are electrically connected, and a drain node of the second MOS structure is electrically connected to a bit line.

Abstract: Subject matter disclosed herein relates to methods and apparatus, such as memory devices and systems including such memory devices. In one apparatus example, a plurality of block configurations may be employed. Block configurations may include an arrangement of similarly doped semiconductor switches. Block configurations may select a respective tile of a memory array, a particular memory cell of the respective tile, and select a memory operation to apply to the particular memory cell. Immediately adjacent block configurations within a particular slice of the memory array may be substantially mirrored and immediately adjacent block configurations in separate immediately adjacent slices of the memory array may be substantially similar. Similarly doped diffusion regions for similarly doped semiconductor switches in substantially mirrored block configurations may be arranged to electrically share a common potential signal value level. Other apparatus and methods are also disclosed.

Abstract: Some embodiments include a memory array having a first memory cell adjacent to a second memory cell along a lateral direction. The second memory cell is vertically offset relative to the first memory cell. Some embodiments include a memory array having a series of data/sense lines extending along a first direction, a series of access lines extending along a second direction, and memory cells vertically between the access lines and data/sense lines. The memory cells are arranged in a grid having columns along the first direction and rows along the second direction. Memory cells in a common column and/or row as one another are arranged in two alternating sets, with a first set having memory cells at a first height and a second set having memory cells at a second height vertically offset relative to the first height. Some embodiments include methods of forming memory arrays.

Abstract: A one-time programmable (OTP) memory capable of performing a multi-programming and a semiconductor memory device including the OTP memory are disclosed. The OTP memory includes a plurality of fuse cells in which two or more fuse cells are programmed at a time. In a program mode, in response to determining that a current flowing through each of the fuse cells increases to a predetermined value, the OTP memory blocks the current flowing through each of the fuse cells.

Abstract: Disclosed is a ROM memory device including a plurality of rows and columns of memory cells, each memory cell including a bit line pair and a transistor to store two bits of data therein, and a virtual ground line disposed between adjacent pairs of bit line pairs, wherein the bit line pair and virtual ground line are used to read data stored in the memory cells.

Abstract: A semiconductor chip D1 of a flash memory which is stacked together with other semiconductor chips D2˜DN to form a multi-chip package (MCP), including a memory cell array 20 of the flash memory for storing an ID code and an upper address, wherein the ID code is written into the a fuse data region 20F of the memory cell array 20 before the assembly process. According to the invention, ID codes and upper addresses can be assigned and written to each of the semiconductor chips of a multi-chip package easily without increasing the size of the semiconductor chips in comparison with the prior art.

Abstract: The present invention provides a reprogrammable electrically blowable fuse and associated design structure. The electrically blowable fuse is programmed using an electro-migration effect and is reprogrammed using a reverse electro-migration effect. The state (i.e., “opened” or “closed”) of the electrically blowable fuse is determined by a sensing system which compares a resistance of the electrically blowable fuse to a reference resistance.

Abstract: A two-bit read-only-memory (ROM) cell and method of sensing its data state. Each ROM cell in an array includes a single n-channel metal-oxide-semiconductor (MOS) transistor with a source biased to a reference voltage, and its drain connected by a contact or via to one or none of first, second, and third bit lines associated with its column in the array. Each row in the array is associated with a word line serving as the transistor gates for the cells in that row. In response to a column address, a column select circuit selects one pair of the three bit lines to be applied to a sense line in wired-NOR fashion for sensing.

Abstract: A semiconductor memory device includes a non-volatile device array of once rewritable non-volatile devices arranged in a matrix. The device includes a plurality of non-volatile device sub-arrays formed by dividing the non-volatile device array; a power interconnect contact region provided between at least one of pairs of the plurality of non-volatile device sub-arrays, and connected to a power interconnect provided at an upper layer of the non-volatile device array; and an ESD protection circuit located in the power interconnect contact region between ground and a power source for the non-volatile devices.

Abstract: A one-time programmable memory includes a first one-time programmable memory cell including a fuse core having an input terminal for receiving a trim signal, an output terminal for providing a sense signal, and a fuse. The fuse core conducts current through the fuse in response to the trim signal. The one-time programmable memory cell also includes a sense circuit having an input terminal coupled to the output terminal of the fuse core, and an output terminal for providing a termination signal, and a logic circuit having a first input terminal for receiving a program enable signal, a second input terminal for receiving a data signal, a third input terminal coupled to the output terminal of the sense circuit for receiving the termination signal, and an output terminal coupled to the input terminal of the fuse core for providing the trim signal.

Abstract: The present invention discloses a three-dimensional writable printed memory (3D-wP). It comprises at least a printed memory array and a writable memory array. The printed memory array stores contents data, which are recorded with a printing means; the writable memory array stores custom data, which are recorded with a writing means. The writing means is preferably direct-write lithography. To maintain manufacturing throughput, the total amount of custom data should be less than 1% of the total amount of content data.

Abstract: The present invention discloses a mask-ROM with reserved space (mask-ROMRS). For small content revision, the present invention salvages the original data-mask by writing the data-pattern of new content into a reserved mask-region which originally has no data-pattern.

Abstract: An encoded ROM array structure couples a first one of a first set of bitlines to a second one of a second set of bitlines through a transistor when the wordline connected to the gate terminal of that transistor is asserted. This encoded arrangement can be extended to any number of encoded bitlines, e.g., 2, 4, 8, 16, and so on. Each of the first plurality and second sets of bit lines are coupled to circuits for charging and discharging the bitlines. To read data from the first set of bit lines, the second set of bitlines is discharged, and vice versa.

Abstract: A Read Only Memory (ROM) bitline cell apparatus and programming method therefore. The programming methodology ensures a ROM structure having open state and/or breaks in the diffusion and/or dummy wordline rows to provide bitline load balancing. The ROM bitline cell apparatus and programming method exhibits improved load balancing for any combination of 1's or all 0's on the bitline. The programming methodology identifies groups of consecutive ‘1’s on the bitline and instead of connecting the ‘1’ devices between BL/BL or GND/GND, those ‘1’ devices can be connected between BL/OPEN, OPEN/BL, GND/OPEN, OPEN/GND or OPEN/OPEN. With little or no variation in bitline loading, timing can be optimized for that single case of bitline loading.

Abstract: Among other things, an n-bit ROM cell, such as a twin-bit ROM cell, and techniques for addressing one or more ROM cell portions of the n-bit ROM cell are provided. A twin-bit ROM cell comprises a first ROM cell portion adjacent to or substantially contiguous with a second ROM cell portion. The first ROM cell portion is associated with a first data bit value. The second ROM cell portion is associated with a second data bit value distinct from the first data bit value. Because the first ROM cell portion is adjacent to the second ROM cell portion, OD-to-OD spacing between the twin-bit ROM cell and an adjacent twin-bit ROM cell is increased to provide, for example, improved isolation, cell current, ROM speed, and VCCmin performance in comparison with single-bit ROM cells, while maintaining a substantially similar to pitch as the single-bit ROM cells.

Abstract: An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer, second and third semiconductor layers, a dielectric film and a conductive film, a first electrode, a second electrode, and a third electrode, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, the filament being formed by causing a dielectric breakdown of at least a part of the dielectric film, through application of a voltage equal to or higher than a predetermined threshold between the second and third electrodes, thereby causing an electric current to flow between the conductive film and the third semiconductor layer.

Abstract: A two-bit read-only-memory (ROM) cell and method of sensing its data state. Each ROM cell in an array includes a single n-channel metal-oxide-semiconductor (MOS) transistor with a source biased to a reference voltage, and its drain connected by a contact or via to one or none of first, second, and third bit lines associated with its column in the array. Each row in the array is associated with a word line serving as the transistor gates for the cells in that row. In response to a column address, a column select circuit selects one pair of the three bit lines to be applied to a sense line in wired-NOR fashion for sensing.

Abstract: The programming of a read-only memory formed of MOS transistors is set by a mask for forming an insulating layer prior to the forming of contacts of active regions of the transistors. The programming of the read-only memory cannot be determined by visible inspection of the memory.

Abstract: A three dimensional semiconductor memory device has a stacked structure including cell gates stacked therein that are insulated from each other and first string selection gates laterally separated from each other, vertical active patterns extending through the first string selection gates, multi-layered dielectric layers between sidewalls of the vertical active patterns and the cell gates and between the sidewalls of the vertical active patterns and the first string selection gates, and at least one first supplement conductive pattern. The first string selection gates are disposed over an uppermost cell gate of the cell gates. Each vertical active pattern extends through each of the cell gates stacked under the first string selection gates. The first supplement conductive pattern is in contact with a sidewall of one of the first string selection gates.

Abstract: An electronic device can include a nonvolatile memory cell, wherein the nonvolatile memory cell can include an antifuse component, a switch, and a read transistor having a control electrode. Within the nonvolatile memory cell, the switch can be coupled to the antifuse component, and the control electrode of the read transistor can be coupled to the antifuse component. The nonvolatile memory cell can be programmed by flowing current through the antifuse component and the switch and bypassing the current away the read transistor. Thus, programming can be performed without flowing current through the read transistor decreasing the likelihood of the read transistor sustaining damage during programming. Further, the antifuse component may not be connected in series with the current electrodes of the read transistor, and thus, during read operations, read current differences between programmed and unprogrammed nonvolatile memory cells can be more readily determined.

Abstract: Described embodiments provide a memory having at least one sense amplifier. The sense amplifier has a first capacitor, an inverting amplifier, a switch, an amplifier, and a second capacitor. The first capacitor is coupled between the input of the sense amplifier and a first node. The inverting amplifier has an input coupled to the first node and an output coupled to an internal node and the switch is coupled between the input and output of the inverting amplifier. The amplifier has an input coupled to the internal node and an output coupled to an output of the sense amplifier and the second capacitor is coupled between the internal node and a control node. When data is to be read from the memory, the second capacitor forces a small voltage reduction onto the intermediate node, helping the sense amplifier resolve the data value stored in the memory cell.

Abstract: Provided is a semiconductor memory device. The semiconductor includes a One Time Programmable (OTP) cell array, a converging circuit and a sense amplifier circuit. The OTP cell array includes a plurality of OTP cells connected to a plurality of bit lines, each bit line extending in a first direction. The converging includes a common node contacting a first bit line and a second bit line. The sense amplifier circuit includes a sense amplifier connected to the common node, the sense amplifier configured to amplify a signal of the common node.

Abstract: The present invention discloses a three-dimensional writable printed memory (3D-wP). It comprises at least a printed memory array and a writable memory array. The printed memory array stores contents data, which are recorded with a printing means; the writable memory array stores custom data, which are recorded with a writing means. The writing means is preferably direct-write lithography. To maintain manufacturing throughput, the total amount of custom data should be less than 1% of the total amount of content data.

Abstract: In various embodiments, a memory cell and a memory are provided. The memory cell comprises a Static Random Access Memory (SRAM) cell including a reset-set (RS) flip-flop and a Read Only Memory (ROM) cell being connected (or coupled) to the SRAM cell to set logic states of internal latch nodes of the RS flip-flop when the ROM cell is triggered. The size of the memory cells proposed in an embodiment of the invention is much smaller than the sum of the size of ROM cells and the size of SRAM cells with the capacity of the memory cells same as the sum of the capacity of the ROM cells and the capacity of the SRAM cells.

Abstract: A one-bit memory cell for a nonvolatile memory includes a bit line and a plurality of serially-connected storage units. The bit line is connected to the serially-connected storage units. Each storage unit includes a first doped region, a second doped region and a third doped region, which are formed in a surface of a substrate. A first gate structure is disposed over a first channel region between the first doped region and the second doped region. The first gate structure is connected to a control signal line. A second gate structure is disposed over a second channel region between the second doped region and the third doped region. The second gate structure is connected to an anti-fuse signal line.

Abstract: A nonvolatile memory includes a memory cell including a first transistor and a second transistor. The first transistor includes a first channel, a first gate electrode, a first source electrode, and a first drain electrode. The second transistor includes a second channel made of oxide semiconductor material, a second gate electrode, a second source electrode, and a second drain electrode. One of the second source electrode and the second drain electrode is electrically connected to the first gate electrode. Data writing in the memory cell is done by raising the potential of a node between one of the second source electrode and the second drain electrode and the first gate electrode. Data erasure in the memory cell is done by irradiating the second channel with ultraviolet light and lowering the potential of the node.

Abstract: An operation method of a semiconductor device, includes providing one or more memory elements each including a first semiconductor layer of a first conductivity type, second and third semiconductor layers of a second conductivity type, which are disposed to be separated from each other in the first semiconductor layer, a first electrode electrically connected to the second semiconductor layer, and a second electrode electrically connected to the third semiconductor layer, and performing operation of writing information on a memory element to be driven of the one or more memory elements. The operation of writing is performed by forming a filament in a region between the second and third semiconductor layers, which is a conductive path electrically linking these semiconductor layers, through application of a voltage equal to or higher than a predetermined threshold between the first electrode and the second electrode.

Abstract: A storage unit for an occupant detection system detecting an occupant based on a magnitude correlation between a detection load value obtained by a load sensor and a threshold value, the storage unit includes a first ROM storing either one of the threshold value and a threshold value specific information for identifying the threshold value, the first ROM being rewritable and a second ROM storing information except for either one of the threshold value and the threshold value specific information, a rewriting of the second ROM being more difficult than a rewriting of the first ROM.

Abstract: Method for conversion of a Flash memory cell on a first semiconductor device to a ROM memory cell in a second semiconductor device, the first and second semiconductor device each being arranged on a semiconductor substrate and each comprising an identical device portion and an identical wiring scheme for wiring the device portion to the Flash memory cell and to the ROM memory cell, respectively; the Flash memory cell being made in non-volatile memory technology and comprising an access transistor and a floating transistor, the floating transistor comprising a floating gate and a control gate; the ROM memory cell being made in a baseline technology and comprising a single gate transistor, which method includes manipulating a layout of at least one baseline mask as used in the baseline technology; the manipulation including: incorporating into the layout of the at least one baseline mask a layout of the Flash memory cell, and converting the layout of the Flash memory cell to a layout of one ROM memory cell by e

Abstract: Some embodiments include methods in which first insulative material is formed across a memory region and a peripheral region of a substrate. An etch stop structure is formed to have a higher portion over the memory region than over the peripheral region. A second insulative material is formed to protect the lower portion of the etch stop structure, and the higher portion is removed. Subsequently, at least some of the first and second insulative materials are removed. Some embodiments include semiconductor constructions having a first region with first features, and a second region with second features. The first features are closer spaced than the second features. A first insulative material is over the second region and an insulative structure is over the first insulative material. The structure has a stem joined to a bench. The bench has an upper surface, and the stem extends to above the upper surface.

Abstract: In-system repairing or configuring faulty memories after being used in a system are disclosed. In one embodiment, a memory chip can include at least one OTP memory to store defective addresses that are to be repaired. Advantageously, the OTP memory can operate without requiring additional I/O pins or high voltage supplies for reading or programming. The memory chip can also include control logic to control reading or programming of the OTP memory as needed.

Abstract: Provided is a semiconductor package which includes: a semiconductor substrate; a functional element that is disposed on one surface of the semiconductor substrate; a protection substrate that is disposed in an opposite side of that surface of the semiconductor substrate with a predetermined gap from a surface of the semiconductor substrate; and a junction member that is disposed to surround the functional element and bonds the semiconductor substrate and the protection substrate together, wherein the functional element has a shape different from a shape of a plane surrounded by the junction member in that surface of the semiconductor substrate, or is disposed in a region deviated from a central region of the plane surrounded by the junction member in that surface of the semiconductor substrate.

Abstract: In some aspects, a memory cell is provided that includes a steering element and a metal-insulator-metal (“MIM”) stack coupled in series with the steering element. The MIM stack includes a first dielectric material layer and a second dielectric material layer disposed on the first dielectric material layer, without a metal or other conductive layer disposed between the first dielectric material layer and the second dielectric material layer. Numerous other aspects are provided.

Abstract: A circuit includes a fuse and a sensing and control circuit. The fuse is coupled between a MOS transistor and a current source node. The sensing and control circuit is configured to receive a programming pulse and output a modified programming signal to the gate of the MOS transistor for programming the fuse. The modified programming signal has a pulse width based on a magnitude of a current through the first fuse.