Abstract: At least one data-line pair has a first data line aligned with a first column of memory cells and a second data line aligned with a second column of memory cells. The first data line is coupled to the second column of memory cells and the second data line is coupled to the first column of memory cells.

Abstract: A semiconductor storage device includes a first memory cell for storing two kinds of states, a second memory cell for storing two kinds of states, and a sense amplifier for detecting a potential difference between voltages equivalent to readout currents of the first and second memory cells, respectively. Either one of information data “0” or data “1”, which is stored in combination of the first and second memory cells, is read out by detecting the potential difference equivalent to the readout current difference between the first and second memory cells.

Abstract: An object of this invention is to provide a rewritable nonvolatile memory cell that can have a wide reading margin, and can control both a word line and a bit line by changing the level of Vcc. As a solution, a flip-flop is formed by cross (loop) connect of inverters including memory transistors that can control a threshold voltage by charge injection into the side spacer of the transistors. In the case of writing data to one memory transistor, a high voltage is supplied to a source of the memory transistor through a source line and a high voltage is supplied to a gate of the memory transistor through a load transistor of the other side inverter. In the case of erasing the written data, a high voltage is supplied to the source of the memory transistor through the source line.

Abstract: A Multiple-bit per Cell (MBC) non-volatile memory apparatus, method, and system wherein a controller for writing/reading data to/from a memory array controls polarity of data by selectively inverting data words to maximize a number of bits to be programmed within (M?1) virtual pages and selectively inverts data words to minimize a number of bits to be programmed in an Mth virtual page where M is the number of bits per cell. A corresponding polarity control flag is set when a data word is inverted. Data is selectively inverted according the corresponding polarity flag when being read from the M virtual pages. A number of the highest threshold voltage programming states in reduced. This provides tighter distribution of programmed cell threshold voltage, reduced power consumption, reduced programming time, and enhanced device reliability.

Abstract: Memory embodiments are provided to operate in memory systems which are configured to have a system ground and a system substrate that are biased at different voltages. At least one of these embodiments includes a memory cell and write and read circuits in which the memory cell is coupled to the system substrate and the write and read circuits are coupled to the system ground. The memory cell preferably has a cross-coupled pair of transistors which can be set in first and second states. The write circuit is arranged and level shifted to drive the cross-coupled pair into either selected one of the states and the read circuit is arranged and level shifted to provide a data signal indicative of the selected state.

Abstract: A memory cell includes a non-volatile p-channel transistor having a source coupled to a first potential, a drain, and a gate. A non-volatile n-channel transistor has a source coupled to a second potential, a drain, and a gate. A switch transistor has a gate coupled to a switch node, a source, and a drain. A stress transistor has a source and drain coupled between the drain of the non-volatile p-channel transistor and the drain of the non-volatile n-channel transistor, the stress transistor having a gate coupled to a gate bias circuit. Where one of the first or second potentials is a bit line, an isolation transistor is coupled between the other of the second potentials and one of the non-volatile transistors.

Abstract: A disclosed embodiment is a programmable memory cell comprising an elevated ground node having a voltage greater than a common ground node by an amount substantially equal to a voltage drop across a trigger point adjustment element. In one embodiment, the trigger point adjustment element can be a diode. The trigger voltage of the programmable memory cell is raised closer to a supply voltage when current passes through the trigger point adjustment element during a write operation. The programmable memory cell can comprise a pair of cross-coupled inverters, and first and second programmable antifuses that can be coupled to each inverter in the pair of cross-coupled inverters. Since the trigger voltage of the programmable memory cell is raised closer to the supply voltage, a programmed antifuse can easily reach below the trigger voltage and result in a successful write operation even when the supply voltage is a low voltage.

Abstract: An integrated circuit has a plurality of first memory cells, which are electrically coupled along a first line, and additionally has a plurality of second memory cells which are electrically coupled along a second line. The integrated circuit furthermore has a switching unit having a plurality of switching elements having in turn a first contact and a second contact. The first contact of a first switching element is coupled to the plurality of first memory cells, and the first contact of a second switching element is coupled to the plurality of second memory cells. In addition, the first contact of a third switching element is coupled to the second contact of the first switching element, and the first contact of a fourth switching element is coupled to the second contact of the second switching element.

Abstract: A semiconductor device has a plurality of bit lines BL provided in a memory cell area 101, a plurality of word lines WL provided crossing the plurality of bit lines BL, a plurality of diffusion source lines VSL provided along the plurality of word lines WL, a plurality of non-volatile active cells AC storing data, the plurality of non-volatile active cells AC being provided at cross sections of the plurality of bit lines BL and the plurality of word lines WL and being connected to the plurality of bit lines BL, the plurality of word lines WL, and the plurality of diffusion source lines VSL, and a controller simultaneously writes or reads data to and from at least two active cells AC among the plurality of active cells AC, in which the number of the plurality of active cells AC is less than that of the cross sections.

Abstract: A memory unit is provided herein. Two non-volatile devices are used to store a logic state of the memory unit into the non-volatile devices. Although a power supply for the memory unit is shut down, the non-volatile devices still keep the data stored therein. The present invention not only has an advantage of high speed operation of a static random access memory (SRAM), but also has a function for storing data of a non-volatile memory.

Abstract: A semiconductor memory array having a first memory cell array with a number of first memory cells and a second cell array with a number of second memory cells. The memory cells in the first and second memory cell arrays are arranged in rows and columns. Each column of second memory cells in the second memory array is coupled to a column of first memory cells in the first memory array.

Abstract: A nonvolatile programmable logic circuit using a ferroelectric memory performs a nonvolatile memory function and an operation function without additional memory devices, thereby reducing power consumption. Also, a nonvolatile ferroelectric memory is applied to a FPGA (Field Programmable Gate Array), thereby preventing leakage of internal data and reducing the area of a chip.

Abstract: A Multiple-bit per Cell (MBC) non-volatile memory apparatus, method, and system wherein a controller for writing/reading data to/from a memory array controls polarity of data by selectively inverting data words to maximize a number of bits to be programmed within (M?1) virtual pages and selectively inverts data words to minimize a number of bits to be programmed in an Mth virtual page where M is the number of bits per cell. A corresponding polarity control flag is set when a data word is inverted. Data is selectively inverted according the corresponding polarity flag when being read from the M virtual pages. A number of the highest threshold voltage programming states in reduced. This provides tighter distribution of programmed cell threshold voltage, reduced power consumption, reduced programming time, and enhanced device reliability.

Abstract: Embodiments of the invention relate to the testing and reduction of read disturb failures in a memory, e.g., an array of SRAM cells. A read disturb test mode may be added during wafer sort to identify any marginal memory cells that may fail read disturb, thus minimizing yield loss. The read disturb test mode may include first writing data to the memory. After a predetermined time period, the read disturb test mode reads data from the same memory, and compares the read data with the data previously written to the memory. A repair signal may be generated, when the read data is different from the data previously written to the memory. Additionally, a system may be implemented to reduce read disturb failures in the memory. The system may include a match logic circuit and a data selecting circuit. When a match condition is satisfied, data is read from a register that stores the previous written data, instead of from the memory. The match logic circuit may be selectively enabled or disabled.

Abstract: A Static Random Access Memory (SRAM) cell having a source-biasing mechanism for leakage reduction. In standby mode, the cell's wordline is deselected and a source-biasing potential is provided to the cell. In read mode, the wordline is selected and responsive thereto, the source-biasing potential provided to the cell is deactivated. Upon completion of reading, the source-biasing potential is re-activated.

Abstract: A static memory cell comprising a pair of cross-coupled inverters (10, 12) which is “shadowed” with non-volatile memory elements (14, 16) so that data written in the static memory can be stored in the non-volatile cell, but also can be recalled later. The non-volatile cells (14, 16) are programmed with opposite data to increase the robustness of the retrieval process, and they are cross-coupled to the internal nodes (A, B) of the static memory cell, one the non-volatile cells (14) having a control gate connected to B and its source to A, and the other non-volatile element (16) having a control gate connected to A and its source to B. The drain of each non-volatile element (14, 16) is connected by means of a respective pMOS transistor (18, 20) to a program supply means.

Abstract: A memory device has a pair of conductive layers and an organic compound having a liquid crystal property that is interposed between the pair of conductive layers. Data is recorded in the memory device by applying a first voltage to the pair of conductive layers and heating the organic compound, to cause a phase change of the organic compound from a first phase to a second phase.

Abstract: A non-volatile memory device and method thereof are provided. The example non-volatile memory device may include a plurality of main cells, each of the plurality of main cells arranged at first intersection regions between one of a plurality of word lines and one of a plurality of main bit line pairs and a plurality of flag cells, each of the plurality of flag cells arranged at second intersection regions between one of the plurality of word lines and a plurality of flag bit line pairs, each of the plurality of flag cells configured to store page information in a manner such that page information associated with main cells corresponding to one of the main bit line pairs is stored in flag cells corresponding to more than one of the flag bit line pairs.

Abstract: A non-volatile storage element includes a first data terminal and a second data terminal, a first MOS transistor and a second MOS transistor, the first MOS transistor and the second MOS transistor having a first conductivity type, a third MOS transistor and a four MOS transistor, the third MOS transistor and the fourth MOS transistor having floating gates and having a second conductivity type, and a fifth MOS transistor and a sixth MOS transistor having the second conductivity type.

Abstract: The local row decoder includes a first MOS transistor of a first conductivity type having one end connected to the local word line, the other end supplied with a first voltage, and a gate connected to the global word line, and a second MOS transistor of a second conductivity type having one end connected to the local word line, the other end supplied with a second voltage, and a gate connected to the global word line. The global row decoder is capable of independently selecting either a first global word line or a second global word line. The first global word line is connected to the first MOS transistor and the second MOS transistor both connected to any one of the local word lines. The second global word line is connected to the first MOS transistor and the second MOS transistor both connected to another adjacent local word line.

Abstract: A NAND-type non-volatile memory device includes a substrate and a device isolation layer disposed on the substrate to define an active region. First and second selection transistors are disposed in the active region, such that each of the first and second selection transistors has a recessed channel. A plurality of memory transistors is disposed in the active region between the first selection transistor and the second selection transistor.

Abstract: The invention concerns semiconductor latches capable of memorizing any programmed information even after power supply has been removed. Used is a 0.6 m BiCMOS EPROM process but it is applicable in any other process having hot electron injection devices like EPROM, Flash EEPROM.

Abstract: A system and method for programming and erasing a semiconductor memory is disclosed. More particularly, the present invention uses the bit lines of a volatile memory portion of semiconductor memory so as to program and erase the non-volatile portion of the semiconductor memory.

Abstract: A system and method for programming both sides of the non-volatile portion in a semiconductor memory is disclosed. The present invention erases and then programs the memory stacks in the non-volatile portion of an nvSRAM.

Abstract: A memory device comprising memory cells having volatile and non-volatile memory portions. The volatile memory portion of each cell includes circuitry for performing RAM functions while the non-volatile memory portion comprises circuitry defining pre-coded data. The memory device comprises a mechanism to operate an initialization sequence, which sets the initial state of the volatile memory portion of each memory cell to the pre-coded data defined in the associated non-volatile memory portion. The initialization sequence allows the initial state of each memory cell's volatile portion to be re-established after power has been applied to the memory device.

Abstract: A system and method for disturbing an erased memory location structure in a non-volatile portion of a semiconductor memory is disclosed. The present invention applies a voltage to a first memory location of a non-volatile portion of the semiconductor memory that is in a programmed state and a second memory location of a non-volatile portion of the semiconductor memory that is in an erased state so as to keep the first memory location programmed and to transition the second memory location from a programmed state to an erased state.

Abstract: Information stored as physical states of cells of a memory is read by setting each of one or more references to a respective member of a first set of values and reading the physical states of the cells according to the first set. Then, at least some of the references are set to respective members of a second set of values, and the physical states of the cells are read according to the second set. At least one member of the second set is different from any member of the first set, so that the two readings together read the physical states of the cells with higher resolution than the first reading alone.

Abstract: In a semiconductor memory including word lines and bit lines arranged in a matrix and a plurality of memory cells provided at intersections of the word lines and the bit lines, a bit line precharge circuit is provided for controlling the potential of a low-data holding power supply coupled to memory cells provided on a corresponding one of the bit lines. In a write operation, the bit line precharge circuit controls the potential of a low-data holding power supply of a memory cell corresponding to a selected bit line to be higher than the potential of a low-data holding power supply of a memory cell corresponding to an unselected bit line.

Abstract: In a non-volatile memory, the initiation of program verification is adaptively set so that programming time is decreased. In one approach, non-volatile storage elements are programmed based on a lower page of data to have a voltage threshold (VTH) that falls within a first VTH distribution or a higher, intermediate VTH distribution. Subsequently, the non-volatile storage elements with the first VTH distribution either remain there, or are programmed to a second VTH distribution, based on an upper page of data. The non-volatile storage elements with the intermediate VTH distribution are programmed to third and fourth VTH distributions. The non-volatile storage elements being programmed to the third VTH distribution are specially identified and tracked. Verification of the non-volatile storage elements being programmed to the fourth VTH distribution is initiated after one of the identified non-volatile storage elements transitions to the third VTH distribution from the intermediate VTH distribution.

Abstract: A NAND flash memory device includes an array of NAND flash memory cells; a plurality of word lines connected to the NAND flash memory cells; and a plurality of bit lines connected to the NAND flash memory cells. Each bit line includes a first bit line portion, a second bit line portion, and a switching device extending between the first and second bit line portions to selectively connect the first and second bit line portions together. At least a first NAND flash memory cell is connected to the first bit line portion, and at least a second NAND flash memory cell is connected to the second bit line portion. By including primary and secondary page buffers, two pages of memory cells connected to a same group of bit lines can be programmed in a single programming operation, to achieve “double-speed” programming.

Abstract: Non-volatile memory read operations compensate for floating gate coupling when the apparent threshold voltage of a memory cell may have shifted. A memory cell of interest can be read using a reference value based on a level of charge read from a neighboring memory cell. Misreading the neighboring cell may have greater effects in particular programming methodologies, and more specifically, when reading the neighboring cell for particular states or charge levels in those methodologies. In one embodiment, memory cells are programmed to create a wider margin between particular states where misreading a neighboring cell is more detrimental. Further, memory cells are read in one embodiment by compensating for floating gate coupling based on the state of a neighboring cell when reading at certain reference levels but not when reading at other reference levels, such as those where a wider margin has been created.

Abstract: A method and device demultiplex a crossbar non-volatile memory that includes a first array of row nano-wires and a second array of column nano-wires, which cross the row nano-wires at a plurality of cross-points, hosting plural memory cells. A first electrode and a second electrode respectively cross a modulated doping portion of the row nano-wires and a modulated doping portion of the column nano-wires. A first contact and a second contact respectively the row nano-wires and the column nano-wires. The first electrode and the second electrode are biased respectively with a first and a second adjustable voltage value that progressively switch one by one said memory cells from the OFF state to the ON state, and this state can be memorized.

Abstract: A memory includes a sense amplifier segment and a plurality of word lines including a first transfer word line and a second transfer word line complementary to the first transfer word line. The memory includes a plurality of bit lines coupled to the sense amplifier segment and a memory cell located at each cross point of each word line and each bit line. The first transfer word line and the second transfer word line are adapted for simultaneously inverting data bit values stored in memory cells along a failed word line to correct a parity error during self refresh.

Abstract: The present invention is directed to a dual chip package that is connected to a host and includes a first memory chip and a second memory chip. Each of the first and second memory chips includes a flash memory; an option pad connected to either a first or second voltage; a register configured to store a flag signal indicating whether a memory chip is selected; a comparator circuit configured to compare a flag signal stored in the register with a logic value apparent at the option pad to generate a flash access signal. Each of the first and second memory chips also includes a memory controller unit configured to access the flash memory in response to the flash access signal, and an interrupt controller unit configured to provide an interrupt signal to the host in response to the flash access signal and a control signal provided from the host.

Abstract: A semiconductor memory device is disclosed, which includes a first SRAM cell which includes cross-connected first and second inverters having first and second nodes, a first transistor connected between a first bit line and the first node and having a gate connected to a first write word line, a second transistor connected between a second bit line and the second node and having a gate connected to the first write word line, a third transistor having a gate connected to the second node, a fourth transistor connected between the first bit line and the third transistor and having a gate connected to a read word line, and a second SRAM cell which includes fifth-eighth transistors corresponding to the first-fourth transistors and has substantially the same configuration as the first SRAM, wherein the drains of the fourth and eighth transistors are connected to the first and second bit lines, respectively.

Abstract: A nonvolatile semiconductor memory device includes a control circuit, an inverting circuit, and memory units, each of the memory units including a latch having a first node and a second node, a plate line, a first MIS transistor having one of source/drain nodes coupled to the first node of the latch, another one of the source/drain nodes coupled to the plate line, and a gate node coupled to a word line, and a second MIS transistor having one of source/drain nodes coupled to the second node of the latch, another one of the source/drain nodes coupled to the plate line, and a gate node coupled to the word line, wherein the control circuit is configured to invert the data latched in the latch by reading the data from the latch, causing the inverting circuit to invert the read data, and writing the inverted data to the latch.

Abstract: A semiconductor memory device is capable of reading data at a high speed, without using a reference cell transistor. The semiconductor memory device includes a sensing unit including first cross-coupled MOS transistors to sense and amplify a voltage difference between a first node and a second node, and a unit cell including second cross-coupled cell MOS transistors to latch data and output a first signal and a second signal corresponding to the latched data to the first node and the second node, respectively.

Abstract: The invention relates to a non-volatile storage element comprising date connections (I1/O1, I2/O2) and two MOS transistors (60,70) of a first conductivity type, the source connections of the transistors being connected to a second supply voltage connection (10). A drain connection of the MOS transistor (60) is connected to the data connection (I1,O1), and a drain connection of the MOS transistor (70) is connected to the data connection (I2/O2), said MOS transistors (60, 70) being cross-coupled. The inventive storage element also comprises two cross-coupled floating gate MOS transistors (40, 50) of a second conductivity type, a drain connection of the MOS transistor (40) being connected to the data connection (I1/O1), and a drain connection of the MOS transistor (50) being connected to the data connection (I1/O1), and a drain connection of the MOS transistor (50) being connected to the data connection (I2/O2).

Abstract: A system that increases device yield by correcting improper operation of the device's memory cells due to process variations is disclosed. The device includes an array of memory cells and an adjustable bias voltage circuit, and is coupled to a test circuit that generates a feedback signal indicating whether one or more of the memory cells fail to operate properly. The adjustable bias voltage circuit selectively adjusts a bias voltage tied to the substrate provided to the memory cells in response to the feedback signal to alter the operating characteristics of the memory cells so that all of the memory cells will operate properly. For some embodiments, a plurality of fuses are provided for storing control signals that control the bias voltage provided to the memory cells.

Abstract: An integrated DRAM-NVRAM, multi-level memory cell is comprised of a vertical DRAM device with a shared vertical gate floating plate device. The floating plate device provides enhanced charge storage for the DRAM part of the cell through the shared floating body in a pillar between the two functions. The memory cell is formed in a substrate with trenches that form pillars. A vertical wordline/gate on one side of a pillar is used to control the DRAM part of the cell. A vertical trapping layer on the other side of the pillar stores one or more charges as part of the floating plate device and to enhance the DRAM function through the floating body between the DRAM and floating plate device. A vertical NVRAM wordline/control gate is formed alongside the trapping layer and is shared with an adjacent floating plate device.

Abstract: Methods and apparatus to provide refresh when an out of range address is received are disclosed. An example method of providing a refresh signal to a memory cell includes receiving a memory address on address lines ranging from a most significant bit address line to a least significant bit address line. A memory driver logic device is coupled to the memory cell. An out of range logic decoder is coupled to provide a fixed logic input to a first input of the memory driver logic device. Address logic is provided to cause the memory driver logic device to enable the memory cell if the memory address is a local out of range address.

Abstract: An electronic device includes a memory cell that utilizes a bi-directional low impedance, low voltage drop full pass gate to connect a bit cell to a bit write line during a write phase, and during a read phase the full pass gate can remain off and a high input impedance read port can acquire and transmit the logic state stored by the memory cell to another subsystem. The full pass gate can be implemented by connecting a P type metal semiconductor field effect transistor (PMOS) in parallel with an NMOS device and driving the gates of the transistors with a differential signal. When a write operation requires a current to flow in a first direction, the PMOS device provides a negligible voltage drop, and when the write operation requires current to flow in a second or the opposite direction, the NMOS device can provide a negligible voltage.

Abstract: A semiconductor transistor array is disclosed having a plurality of identical transistors, with sources of the transistors commonly coupled to a first voltage supply, and bulks of the transistors commonly coupled to a second voltage supply which is different from the first voltage supply, wherein different voltages can be supplied to the sources and bulks.

Abstract: A static random access memory (SRAM) cell having an inverter and a tri-state inverter. An input of the inverter is coupled to an output of the tri-state inverter and an output of the inverter is coupled to an input of the tri-state inverter. The tri-state inverter has an enable node to which a read signal is applied and is configured to generate an output signal that is the complement of an input signal in response to an active read signal. The SRAM cell further includes an access transistor having a first node coupled to the output of the tri-state inverter and having a second node coupled to the digit line. The access transistor is configured to couple the first and second nodes in response to an active access signal applied to its gate.

Abstract: A nonvolatile memory circuit includes a flip-flop to degrade an internal circuit irreversibly based on a voltage applied to a first or second bit line so as to latch data in a nonvolatile manner, a first switch coupled between a first output terminal of the flip-flop and the first bit line, a second switch coupled between the first output terminal of the flip-flop and the first bit line, a third switch coupled between a second output terminal of the flip-flop outputting an inverse of an output of the first output terminal and the second bit line, and a fourth switch coupled between the second output terminal of the flip-flop and the second bit line.

Abstract: The present invention proposes a Field Programmable Gate Array device comprising a plurality of configurable electrical connections, a plurality of controlled switches, each one adapted to activating/de-activating at least one respective electrical connection in response to a switch control signal and a control unit including an arrangement of a plurality of control cells. Each control cells controls at least one of said controlled switches by the respective switch control signal, each control cell including a volatile storage element adapted to storing in a volatile way a control logic value corresponding to a preselected status of the at least one controlled switch, and providing to the controlled switch said switch control signal corresponding to the stored logic value. Each control cell further includes a non-volatile storage element coupled to the volatile storage element, the non-volatile storage element being adapted to storing in a non-volatile way the control logic value.

Abstract: Disclosed are embodiments of a method and apparatus for avoiding cell data destruction caused by cell stability problems in static random access memory (SRAM) cells. In one embodiment, data inside of an SRAM cell is transferred to one of its bitline in advance of an actual Read/Write operation utilizing a transfer device controlled by a pre-read signal. In one embodiment, the read and write bitlines are shared and the transfer device and pr are not needed. Since the bitline voltage has already been changed to the state which reflects the cell data in advance, the memory cells remains relatively stable. By shifting the bitline voltage before the wordline is turned on, the accessed cell is relieved from the stress which would have otherwise caused cell stability problems.

Abstract: A method of operating a semiconductor integrated circuit including a SRAM block, in which non-volatile data is stored in the SRAM block, is disclosed. In an exemplary embodiment, the non-volatile data is stored by flowing a drain current in one of a pair of pull-down transistors constituting the SRAM cell while supplying a fixed potential to the sources of the pull-down transistors. A semiconductor integrated circuit including a SRAM block and a control circuit that controls the SRAM block to store non-volatile data is also disclosed.

Abstract: A static random access memory (SRAM) cell includes a first load device, a first pull-down transistor, and a switch-box coupled between the first load device and the first pull-down transistor. The switch-box is configured to receive a switch control signal to turn off a first connection between the first load device and the first pull-down transistor during read operations of the SRAM cell and to turn on the first connection during write operations.

Abstract: A programmable and erasable digital switch device is provided. An N-type memory transistor and a P-type memory transistor are formed over a substrate. The N-type memory transistor includes a first N-type doped region, a second N-type doped region, a first charge storage layer and a first control gate. The P-type memory transistor includes a first P-type doped region, a second P-type doped region, a second charge storage layer and a second control gate. A common bit line doped region is formed between the N-type memory transistor and the P type memory transistor and electrically connects the first N-type region to the second P-type doped region. A word line electrically connects the first control gate to the second control gate.