Abstract: A regulator includes a variable resistance unit coupled between an input node to which a pumping voltage is inputted and a control node and configured to adjust resistance of the variable resistance unit in response to a control signal varied depending on a target voltage, a voltage output unit configured to adjust the pumping voltage according to potential of the control node and output the adjusted pumping voltage, and a regulation unit configured to control the potential of the control node according to the adjusted pumping voltage, to output the target voltage. The regulator adjusts the resistance of an internal resistor according to the target voltage, thereby reducing current consumption.

Abstract: Devices, systems, methods, and other embodiments associated with accessing memory using fractional reference voltage are described. In one embodiment, an apparatus includes comparison logic. The comparison logic compares a threshold voltage of a memory cell to at least one pair of reference voltages that are near an integral reference voltage to generate comparison results. The apparatus includes read logic to determine a bit value of the memory cell based, at least in part, on the comparison results.

Abstract: A semiconductor memory device is provided which includes a function block including a plurality of transistors; a body bias control unit configured to detect a command and to generate a body bias selection signal according to the detection result; and a body bias generator configured to generate a body voltage according to the body bias selection signal and to provide the body voltage to bodies of the plurality of transistors, wherein the body bias generator down-converts a power supply voltage supplied from an external device to generate the body voltage.

Abstract: Integrated circuits with wireless communications circuitry having peak cancelling circuitry operable to perform crest factor reduction is provided. The peak cancelling circuitry may include a peak detection circuit, a delay circuit, and peak cancellation pulse generation circuitry. The peak cancellation pulse generation circuitry may include multiple pulse generation blocks coupled in a cascade configuration. Each pulse generation block may include a counter for providing memory address signals, a register for latching peak scaling factor information, a pulse memory block for storing a respective sub-pulse, and a multiplier for scaling the stored sub-pulse by the latched peak scaling factor. The pulse memory block may be implemented using single-port memory or dual-port memory.

Abstract: A semiconductor device comprises a first pair of signal lines and a first control circuit. The first control circuit precharges each of the first pair of signal lines to a first voltage in response to a precharge signal, and changes the voltage level of each of the first pair of signal lines to a second voltage different from the first voltage when a deep power down signal is input.

Abstract: A device can include a plurality of memory cells, each memory cell including at least one latch circuit coupled between two data nodes, a first nonvolatile section coupled to a first data node, and a second nonvolatile section coupled to a second data node; and each nonvolatile section including at least one switch element in series with a programmable nonvolatile element, the switch element configured to couple the nonvolatile element to the corresponding data node during a high reliability read operation of the memory cell.

Abstract: A nonvolatile semiconductor memory device comprises multiple memory strings each including a plurality of first and second groups of serially connected memory cells, and a back gate transistor serially connected between the first and second groups of memory cells, a plurality of word lines, each word line being connected to a control gate of a different memory cell in each of the memory strings, a voltage generating circuit configured to generate control voltages of different voltage levels, and a control circuit configured to control application of control voltages to the word lines and the back gate line. A control voltage applied to the back gate line may be varied depending on how far a selected word line is from the back gate line, and a control voltage applied to unselected word lines may be varied depending on how far the unselected word line is from the selected word line.

Abstract: Apparatuses and methods for comparing a sense current representative of a number of failing memory cells of a group of memory cells and a reference current representative of a reference number of failing memory cells is provided. One such apparatus includes a comparator configured to receive the sense current and to receive the reference current. The comparator includes a sense current buffer configured to buffer the sense current and the comparator is further configured to provide an output signal having a logic level indicative of a result of the comparison.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: According to one embodiment, a memory cell, a word line, and a peripheral circuit are provided. In the memory cell, a ferroelectric film is provided for a gate insulating film. The word line is connected to a control gate electrode of the memory cell. In the peripheral circuit, ferroelectric films are provided for gate insulating films and the peripheral circuit is provided near the memory cell. Here, between the same conductive type transistors of the peripheral circuit, a channel impurity concentration of a transistor to which a driving voltage which drives the word line is applied is different from a channel impurity concentration of a transistor to which a voltage which is lower than the driving voltage is applied.

Abstract: A highly distributed current reference for a solid-state memory comprises a centrally located current digital-to-analog converter (IDAC) and a plurality of remotely located tile current references. The IDAC comprises a first active device that generates a reference current, and a device that forms a first source degeneration resistance for the first active device. The IDAC outputs a voltage signal that represents a magnitude of the reference current. A remotely located tile current reference comprises a second active device and a device that forms a second source degeneration resistance for the second active device. The source degeneration resistances and capacitance coupled to the voltage signal output from the IDAC compensate for current, temperature, supply and process variations.

Abstract: A semiconductor device and a method of operating the same, the semiconductor device including a sense amplifier connected between a bit line and a complementary bit line; a first power supply circuit configured to select between supplying a power supply voltage to the first node and blocking the power supply voltage from the first node in response to a first control signal; a second power supply circuit configured to select between supplying a ground voltage to the second node and blocking the ground voltage from the second node in response to a second control signal; and a first boosting circuit configured to boost a voltage at the first node in response to a third control signal.

Abstract: A semiconductor device includes first and second bit lines, and a transistor coupled between the first and second bit lines. The semiconductor device further includes a substrate bias control circuit that supplies one of a first substrate bias voltage and a second substrate bias voltage to the transistor. By controlling the substrate bias voltage of the transistor, high-speed equalization is performed, and an increase in leak current at times of standby and activation is prevented.

Abstract: An array configuration capable of supplying a necessary and sufficient current in a small area is achieved and a reference cell configuration suitable to temperature characteristics of a TMR element is achieved. In a memory using inversion of spin transfer switching, a plurality of program drivers are arranged separately along one global bit line, and one sense amplifier is provided to one global bit line. A reference cell to which “1” and “0” are programmed is shared by two arrays and a sense amplifier.

Abstract: A memory device is provided, which includes a plurality of global bit lines, a discharge line, a switching circuit configured to connect the plurality of global bit lines to the discharge line in response to a discharge enable signal, a first discharge circuit configured to apply a first voltage that is higher than a ground voltage to the discharge line, a precharge circuit configured to apply a precharge voltage to a selected global bit line among the plurality of global bit lines, and a second discharge circuit configured to discharge the selected global bit line to a second voltage that is higher than the ground voltage.

Abstract: An object is to provide a semiconductor device with a novel structure, which can hold stored data even when power is not supplied and which has an unlimited number of write cycles. The semiconductor device is formed using a memory cell including a wide band gap semiconductor such as an oxide semiconductor. The semiconductor device includes a potential change circuit having a function of outputting a potential lower than a reference potential for reading data from the memory cell. When the wide band gap semiconductor which allows a sufficient reduction in off-state current of a transistor included in the memory cell is used, a semiconductor device which can hold data for a long period can be provided.

Abstract: A decoder circuit includes high voltage and low voltage transistors. The decoder circuit uses the high voltage transistors during modify operations to provide a high voltage, e.g., a boosted voltage, to memory cells to change memory cell status or perform other operations. The decoder circuit uses the low voltage transistors during read operations.

Abstract: Described examples include sensing circuits and reference voltage generators for providing a reference voltage to a sensing circuit. The sensing circuits may sense a state of a memory cell, which may be a PCM memory cell. The sensing circuits may include a cascode transistor. Examples of reference voltage generators may include a global reference voltage generator coupled to multiple bank reference voltage generators which may reduce an output resistance of the voltage generator routing.

Abstract: A fuse-based memory includes a plurality of bit lines. Each bit lines couples to a corresponding plurality of fuses. The fuses couple to ground through corresponding access transistors. The memory is configured to precharge an accessed one of the bit lines and a reference one of the bit lines using a low voltage supply. In contrast, a resulting voltage difference between the accessed bit line and the reference bit line is sensed using a sense amplifier powered by a high voltage supply, wherein a high voltage supplied by the high power supply is greater than a low voltage supplied by the low voltage supply.

Abstract: A semiconductor memory storage device is disclosed. The memory comprises a plurality of storage cells for storing data each storage cell comprising an access control device for providing the storage cell with access to or isolation from a data access port in response to an access control signal, access control circuitry for transmitting the access control signal along an access control line to control a plurality of the access control devices connected to the access control line.

Abstract: A signal driving device includes a constant current circuit configured to provide a constant current, a first mirror circuit configured to generate a mirror current from the constant current and provide a voltage according to the mirror current of the constant current, a circuit comprising a switch device and configured to provide a driver current, a second mirror circuit configured to generate a mirror current of the driver current and output a voltage that includes a voltage drop caused when the mirror current of the driver current flows through a replica switch device, and a differential amplifier configured to receive the voltage from the first mirror circuit and the voltage from the second mirror circuit to provide a biased voltage for the bias circuit and thereby induce the driver current.

Abstract: A circuit includes one or more memory cells, a data line associated with the one or more memory cells, one or more reference cells, a reference data line associated with the one or more reference cells, a first circuit coupled to the reference data line and the data line, and a second circuit. The first circuit is configured to output a first logical value based on a voltage level of the data line upon occurrence of a voltage level of the reference data line reaching a trip point. The second circuit is configured to output a second logical value based on the voltage level on the data line prior to the occurrence of the voltage level of the reference data line reaching the trip point, and to output the first logical value after the occurrence of the voltage level of the reference data line reaching the trip point.

Abstract: A semiconductor memory circuit includes: a plurality of memory regions; a plurality of driving units configured to be enabled in response to a plurality of enable signals, respectively, and generate a predetermined voltage used for operations of the plurality of memory regions; and an enable control unit configured to count a control pulse and activate one or more enable signals among the plurality of enable signals.

Abstract: A method of testing a semiconductor memory device is provided. Data is written to a plurality of memory cells disposed in a memory cell block of the semiconductor memory device. A first driving voltage is applied to a first group of word lines. A second driving voltage is applied to a second group of word lines. Each word line of the first group of the word lines is interposed between two neighboring word lines of the second group of the word lines. The first driving voltage has a voltage level different from that of the second driving voltage. The data is read from first memory cells coupled to the first group to determine whether each of the first memory cells is defective.

Abstract: A memory element includes a nonvolatile switch to be set to a first low resistance state by applying a voltage higher than a positive threshold voltage and to a second high resistance state by applying another voltage more negative than a negative threshold voltage. The memory element further includes a volatile switch in series with the nonvolatile switch, the nonvolatile switch to be set to a third low resistance state by applying a current higher than a threshold current and to fourth high resistance state by applying a current lower than the threshold current. A method for operating a memory array with memory elements with series volatile and nonvolatile switches is also provided.

Abstract: A semiconductor memory apparatus includes a program pulse generation block configured to generate a first write control signal, second write control signal and a program completion signal in response to a programming enable signal; a set program control circuit configured to repeatedly generate a set programming enable signal a predetermined number of times in response to an erase command and the program completion signal; and a controller configured to disable the first write control signal in response to the erase command and generate the programming enable signal in response to the set programming enable signal.

Abstract: A memory includes a word line having a word line voltage, a charge pump coupled to the word line, and a dynamic feedback control circuit coupled to the charge pump. The dynamic feedback control circuit is capable of changing a clock frequency of a clock signal supplied the charge pump from a first non-zero value to a second non-zero value depending on the difference between the word line voltage and a target threshold voltage.

Abstract: An integrated circuit includes a high voltage generator generating a high voltage, a negative voltage generator generating a negative voltage, a divided voltage generator generating a divided voltage by dividing the power source voltage and supplying it to a read voltage terminal, a first power gate supplying the high voltage or the divided voltage to a program voltage terminal, a second power gate supplying the negative voltage or the ground voltage to a deactivation voltage terminal, a third power gate supplying the ground voltage or the divided voltage to an activation voltage terminal, and an e-fuse array circuit operating using voltage of the program voltage terminal as a program voltage, voltage of the divided voltage terminal as a read voltage, voltage of the activation voltage terminal as an activation voltage, and voltage of the deactivation voltage terminal as a deactivation voltage.

Abstract: This document discusses, among other things, a reference voltage generator circuit coupled to a plurality of fuse read circuits. The reference voltage generator circuit can be configured to mirror a reference current to produce a reference voltage and a gate bias voltage. The plurality of fuse read circuits can each be coupled to the reference voltage generator circuit and can also be coupled to a fuse of a plurality of fuses. Each fuse read circuit of the plurality of fuse read circuits can be configured to mirror the reference current using the gate bias voltage to produce a fuse read voltage across each fuse coupled to the plurality of fuse read circuits. Each fuse read circuit of the plurality of fuse read circuits can compare the fuse read voltage of each fuse and the reference voltage and can indicate a state of each fuse coupled to each fuse read circuit using the comparison.

Abstract: Methods for performing parallel voltage and current compensation during reading and/or writing of memory cells in a memory array are described. In some embodiments, the compensation may include adjusting a bit line voltage and/or bit line reference current applied to a memory cell based on a memory array zone, a bit line layer, and a memory cell direction associated with the memory cell. The compensation may include adjusting the bit line voltage and/or bit line reference current on a per memory cell basis depending on memory cell specific characteristics. In some embodiments, a read/write circuit for reading and/or writing a memory cell may select a bit line voltage from a plurality of bit line voltage options to be applied to the memory cell based on whether the memory cell has been characterized as a strong, weak, or typical memory cell.

Abstract: In one embodiment, an integrated programmable device has a plurality of current sense amplifiers for reading data from non-volatile memory and a reference generator that provides common bias reference voltages to the sense amplifiers. The sense amplifiers can read data from the non-volatile memory at low power supply voltage levels (e.g., 750 mV) relative to the nominal supply level (e.g., 1.2V). Each sense amplifier has a trans-impedance amplifier that converts a memory bit-line current into a voltage level indicative of whether a selected memory cell is programmed or erased. The trans-impedance amplifier has a current mirror with a high-threshold regeneration device that lowers the sense amplifier's range of operating voltages. Each sense amplifier also has a level-shifted inverter that further lowers the sense amplifier's operating voltage range.

Abstract: A control logic unit generates a control signal which is activated while a power supply normally operates. A charge circuit is connected to a first node on a voltage control line supplied with a voltage generated by a voltage generation circuit, so that its capacitive element is charged with electric charge. A first discharge circuit is connected to a charge storage node of the charge circuit and discharges the stored electric charge when the control signal is activated. A second discharge circuit discharges the first node when the charge storage node has a potential exceeding a predetermined potential.

Abstract: An object is to provide a semiconductor device having a novel structure. A first wiring; a second wiring; a third wiring, a fourth wiring; a first transistor including a first gate electrode, a first source electrode, and a first drain electrode; a second transistor including a second gate electrode, a second source electrode, and a second drain electrode are included. The first transistor is provided over a substrate including a semiconductor material and a second transistor includes an oxide semiconductor layer.

Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. In some embodiments, a plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: A memory circuit including at least one memory array and at least one sleep transistor connected to the at least one memory array and connected to a first power line for providing a first power voltage. The memory circuit further includes at least one diode-connected transistor directly connected to the at least one memory array and directly connected to the first power line and a back-bias circuit electrically coupled with a bulk of the at least one diode-connected transistor.

Abstract: A method for adaptive voltage range management in non-volatile memory is described. The method includes establishing an adaptive voltage range for a memory element of an electronic memory device. The memory element includes at least two states. The adaptive voltage range comprises a lower state and an upper state. The method also includes establishing an adjustment process to implement a first adjustment of an abode characteristic of a first state and to implement a second adjustment of an abode characteristic of a second state in the adaptive voltage range in response to a trigger event, wherein the first adjustment of an abode characteristic of the first state is different from the second adjustment of an abode characteristic of the second state.

Abstract: A power circuit configured to supply an operating voltage to a memory controller configured to control a flash memory and an access to the flash memory, comprises an input side charging unit that is a charging unit configured to be charged by an input voltage that is supplied from the outside, a voltage regulation unit configured to regulate any higher one of the input voltage and a charging voltage of the input side charging unit to be the operating voltage and to output the voltage, an output side charging unit that is a charging unit configured to be charged by the operating voltage, and a discharging unit configured to discharge electricity that has been charged to the output side charging unit in the case in which any higher one of the input voltage and the charging voltage becomes lower than the setting value.

Abstract: A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. Comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and comparison result indicates the number of different bits existing between the output data and the input data. Voltage level control unit is configured to generate a control signal according to the comparison result. Voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. Comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and comparison result indicates the number of different bits existing between the output data and the input data. Voltage level control unit is configured to generate a control signal according to the comparison result. Voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.

Abstract: A method of operating a semiconductor memory device is disclosed. The method may include receiving an access command, applying a first voltage to a selected word line of the semiconductor memory device for a period of time in response to receiving the access command, applying a second voltage to word lines adjacent to the selected word line before and after the period of time, and applying a third voltage to the word lines adjacent to the selected word line for the period of time, a voltage level of the third voltage greater than the second voltage. The applying the third voltage may occur when the semiconductor memory device is operated at a temperature below the predetermined temperature.

Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. In some embodiments, a plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: A word line driver including a control switch configured to receive a control signal, where the control switch is between a first node configured to receive an operating voltage signal and a second node configured to determine an output of the word line driver. The word line driver further includes a cross-coupled amplifier electrically connected to the second node. The word line driver further includes at least one inverter electrically connected to the cross-coupled amplifier. A semiconductor device including the word line driver and a memory array including at least one electronic fuse.

Abstract: Systems and methods of testing a reference cell in a memory array are disclosed. In a particular embodiment, a method includes coupling a first reference cell of a first reference cell pair of a memory array to a first input of a first sense amplifier of the memory array. The method also includes providing a reference signal to a second input of the first sense amplifier. The reference signal is associated with a second reference cell pair of the memory array.

Abstract: A system includes a voltage generator to produce a pre-charge voltage signal for pre-charging one or more signals in a memory circuit. The one or more signals can be data bus lines used to access memory. The voltage generator can include an input indicating whether the memory circuit is set to a power-saving mode. According to one embodiment, the input adjusts a magnitude of the pre-charge voltage signal produced by the voltage generator. Such an embodiment is useful over conventional methods because adjusting the pre-charge voltage can result in power savings. As an example, when in the power-saving mode, the voltage generator circuit can adjust the pre-charge voltage to a value that reduces an amount of leakage current associated with a pre-charge voltage. Reducing the leakage with respect to the pre-charge voltage means that the saved power can be used for other useful purposes.

Abstract: A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and outputting a current with said current mirror.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes: a semiconductor substrate; a memory cell array including a plurality of memory cells, the memory cells being stacked on the semiconductor substrate; and a power supply circuit provided on the semiconductor substrate. The power supply circuit includes: a pump circuit configured to generate a voltage and supply the voltage to the memory cell array; a limiter circuit configured to output control signal for activating the pump circuit according to a comparison result between a voltage value of the output terminal and a first value; a capacitor configured to adjust a voltage of the output terminal; a boost circuit configured to charge the capacitor using a constant current based on the control signal; and a switch configured to stop a charge operation of the boost circuit. The capacitor is provided directly below the memory cell array.

Abstract: A system including a reference voltage module configured to generate one or more reference voltages for determining states of a plurality of memory cells of a nonvolatile memory, where the plurality of memory cells have a threshold voltage distribution. A divider module divides, in response to a change in the threshold voltage distribution, a voltage range into a plurality of regions. An update module updates, to compensate for the change in the threshold voltage distribution, one of the reference voltages to a voltage value associated with one of the plurality of regions.

Abstract: A system and method to enable reading from non-volatile memory (NVM) devices is described. In one embodiment, the method includes setting a sensing parameter used to read data stored in a NVM device, reading from pluralities of locations of the NVM device with the sensing parameter set at the first value. The locations of the NVM device store an identical value. The method also includes verifying whether the identical value is read correctly from the locations of the NVM device. The method also includes setting the sensing parameter to a second value when the identical value is not read correctly with the sensing parameter set at the first value. The method further includes determining a third value for the sensing parameter from the identical value and setting the sensing parameter to the third value when the identical value is read correctly.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.