Abstract: Methods, systems, and devices for on-die termination configuration for a memory device are described. In some examples, a memory device may determine a connection option from a set of connections options for which an ODT pin of the memory device is configured. Each connection option may correspond to a termination configuration for a different pin, such as a command and address (CA) pin, a clock (CK) pin, or a chip select (CS). Based on the determined connection option, the memory device may identify a respective termination option for each of the different pins, such as a first termination option for the CA pin, a second termination option for the CK pin, and a third termination option for the CS pin, and configure each of the different pins according to the respective termination option for that pin.

Abstract: One example of the present disclosure includes performing a comparison operation in memory using a logical representation of a first value stored in a first portion of a number of memory cells coupled to a sense line of a memory array and a logical representation of a second value stored in a second portion of the number of memory cells coupled to the sense line of the memory array. The comparison operation compares the first value to the second value, and the method can include storing a logical representation of a result of the comparison operation in a third portion of the number of memory cells coupled to the sense line of the memory array.

Abstract: An example apparatus having a heterogenous memory system includes a first sensor layer, of a plurality of stacked sensor layers, including an array of pixels; and one or more semiconductor layers of the plurality of stacked sensor layers located beneath the first sensor layer, the one or more semiconductor layers configured to process pixel data output by the array of pixels, the one or more semiconductor layers including a first memory to store most significant bits (“MSBs”) of data involved in the processing of the pixel data; a second memory to store least significant bits (“LSBs”) of the data; and wherein the first memory has a lower bit error rate (“BER”) than the second memory.

Abstract: A device includes a memory array, bit line pairs, word lines, a modulation circuit and a control signal generator. The memory array has bit cells arranged in rows and columns. Each bit line pair is connected to a respective column of bit cells. Each word line is connected to a respective row of bit cells. The modulation circuit is coupled with at least one bit line pair. The control signal generator is coupled with the modulation circuit. The control signal generator includes a tracking wiring with a tracking length positively correlated with a depth distance of the word lines. The control signal generator is configured to produce a control signal, switching to a first voltage level for a first time duration in reference with the tracking length, for controlling the modulation circuit. A method of controlling aforesaid device is also disclosed.

Abstract: Memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some configurations, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.

Abstract: A semiconductor memory device includes a transmission circuit and a control circuit. The transmission circuit is configured to obtain write data and transmit that into a memory cell array according to the external clock signal when the chip selection signal is asserted. The control circuit is configured to control the transmission circuit to transmit first write data into the memory cell array when the chip selection signal changes from assertion to negation during the input period of the first write data, according to the external clock signal.

Abstract: A training method for a memory system is provided. The memory system includes a memory controller and a memory. The memory controller is connected with the memory. The training method includes the following steps. Firstly, the memory samples n command/address signals according to a first signal edge and a second signal edge of a clock signal to acquire a first sampled content and a second sampled content. The memory selectively outputting one of the first sampled content and the second sampled content through m data signals to the memory controller in response to a control signal. Moreover, m is larger than n and smaller than 2n.

Abstract: Methods, systems, and devices for performing quick precharge command sequences are described. An operating mode that is associated with a command sequence having a reduced duration relative to another operating mode may be configured at a memory device. The operating mode may be configured based on determining that a procedure does not attempt to preserve or is independent of preserving a logic state of accessed memory cells, among other conditions. While operating in the mode, the memory device may perform a received precharge command using a first set of operations having a first duration—rather than a second set of operations having a second set of operations having a second, longer duration—to perform the received precharge command. The first set of operations may also use less current or introduce less disturbance into the memory device relative to the second set of operations.

Abstract: An electronic device includes an enable signal generation circuit configured to activate, when a write operation is performed, a termination enable signal earlier than a time point when a write latency elapses, by a duration amount of an entry offset period; and a data input and output circuit configured to receive, when the write operation is performed, data later than the time point when the write latency elapses, based on the termination enable signal, wherein the data input and output circuit receives the data after the write latency elapses by a duration amount of a first data reception delay period.

Abstract: A serializer includes data input circuits configured to receive N-number of pieces of data in parallel, where N is an even number, data connection circuits configured to receive internal clock signals having different phases in different arrangements, and data output circuits configured to output the N-number of pieces of data in sequence in a single cycle of each of the internal clock signals, wherein the data connection circuits operate the data output circuits such that the data output circuits, in response to the internal clock signals, output corresponding data of the N-number of pieces of data in an enable period in the single cycle and have a high impedance state in a disable period in the single cycle.

Abstract: A circuit includes a memory array, a control circuit configured to identify an address of a first row containing a weak cell, and store corresponding address information in a storage device, and an address decoding circuit including NAND pairs, inverter pairs, and a logic tree. Each NAND pair receives corresponding bits of the address information and the address of the first row and corresponding inverted bits of the address information and the address of the first row inverted by corresponding inverter pairs, and output terminals of the NAND pairs are connected to the logic tree. The logic tree matches the address information with the address of the first row based on output logic levels from the NAND pairs and, in response to the corresponding address information matching the address of the first row, activates a second row of the memory array simultaneously with the first row being activated.

Abstract: Examples of the present disclosure provide apparatuses and methods for smallest value element or largest value element determination in memory. An example method comprises: storing an elements vector comprising a plurality of elements in a group of memory cells coupled to an access line of an array; performing, using sensing circuitry coupled to the array, a logical operation using a first vector and a second vector as inputs, with a result of the logical operation being stored in the array as a result vector; updating the result vector responsive to performing a plurality of subsequent logical operations using the sensing circuitry; and providing an indication of which of the plurality of elements have one of a smallest value and a largest value.

Abstract: Methods and systems for replaying buffered audio of a telephone call are provided herein. In some embodiments, a method for replaying buffered audio of a telephone call, comprises buffering audio data associated with a telephone call when a quality of an established data connection decreases below a first threshold quality measure; playing the buffered audio data from the buffer; determining the quality of the established data connection exceeds a second threshold quality measure; and replaying the audio data from the buffer, wherein replaying the audio comprises modifying the playback rate of the buffered audio data during playback.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.

Abstract: A delay tracking method and a memory system are provided. The delay tracking method is applied to a memory system supporting a low-frequency-mode (LFM) and a high-frequency-mode (HFM) of an operating clock. The delay tracking method includes the steps of selecting a LFM oscillator for obtaining a LFM delay value when the operating clock is in the HFM; and selecting a HFM oscillator for obtaining a HFM delay value when the operating clock is in the LFM.

Abstract: Methods, systems, and devices for detection of illegal commands are described. A memory device, such as a dynamic random access memory (DRAM), may receive a command from a device, such as a host device, to perform an access operation on at least one memory cell of a memory device. The memory device may determine, using a detection component, that a timing threshold associated with an operation of the memory device would be violated by performing the access operation. The memory device may refrain from executing the access operation based on determining that performing the access operation included in the command would violate the timing threshold. The memory device may transmit, to the device, an indication that performing the command would violate the timing threshold.

Abstract: A shared data transfer clock is used among double data rate memory ranks. A memory controller processes incoming memory access commands destined for at least one of a plurality of double data rate memory ranks and determines when a target DDR memory rank is out of synchronization with respect to the shared data transfer clock and a memory clock. In response to determining that the target DDR memory rank is out of synchronization, the memory controller determines whether the non-target DDR memory rank is out-of-synchronization with respect to the shared data transfer clock and the memory clock, and issues a data transfer clock synchronization command to the target DDR memory rank in response to determining that the non-target DDR memory rank is out-of-synchronization with respect to the shared data transfer clock and the memory clock.

Abstract: Methods, systems, and apparatuses for a memory device (e.g., DRAM) including an error check and scrub (ECS) procedure in conjunction with refresh operations are described. The ECS procedure may include read/modify-write cycles when errors are detected in code words. In some embodiments, the memory device may complete the ECS procedure over multiple refresh commands, namely by performing a read (or read/modify) portion of the ECS procedure while a first refresh command is executed, and by performing a write portion of the ECS procedure while a second refresh command is executed. The ECS procedure described herein may facilitate avoiding signaling conflicts or interferences that may occur between the ECS procedure and other memory operations.

Abstract: Embodiments herein include a first line, wherein the first line is complementary to a second line; a voltage generator configured to generate a first supply voltage, a second supply voltage and a third supply voltage, the third supply voltage is lower than the second supply voltage, the voltage generator further comprises a transistor structure with a plurality of transistors electrically connected in parallel from the first supply voltage to a supply output node that provides the second supply voltage; a memory cell electrically coupled to the first and second lines, the memory cell further comprises two cross-coupled transistor strings connected from the first supply voltage to a ground voltage; a pre-charger with a first pre-charger transistor cross-coupled to a second pre-charger transistor, the pre-charger is configured to pre-charge the first and second lines to a level of a source voltage.

Abstract: An operation method of a resistive memory device includes receiving write data and an address; determining whether the write data is in a first state or in a second state; applying a first pulse to a target memory cell corresponding to the address, among a plurality of memory cells, when the write data is in the first state; and selectively applying, when the write data is in the second state, a second pulse to the target memory cell according to a comparison result of the write data and pre-read data which is pre-stored data read from the target memory cell.

Abstract: Apparatuses and methods are provided for processing in memory. An example apparatus comprises a host and a processing in memory (PIM) capable device coupled to the host via an interface comprising a sideband channel. The PIM capable device comprises an array of memory cells coupled to sensing circuitry and is configured to perform bit vector operations on data stored in the array, and the host comprises a PIM control component to perform virtual address resolution for PIM operations prior to providing a number of corresponding bit vector operations to the PIM capable device via the sideband channel.

Abstract: A semiconductor memory device comprising a plurality of memory cells configured to store digital data and an input multiplexer configured to enable the selection of a particular memory cell from the plurality of memory cells. The semiconductor memory device further comprises a read/write driver circuit configured to read data from the selected memory cell and write data to the selected memory cell, and a write logic block configured to provide logical control to the read/write driver circuit for writing data to the selected of memory cell. The read/write driver circuit may be coupled to the read/write input multiplexer by a data line and an inverted data line and the read and the write operations to the selected memory cell occur over the same data line and inverted data line.

Abstract: Methods, apparatuses, and systems for staggering refresh operations to memory arrays in different dies of a three-dimensional stacked (3DS) memory device are described. A 3DS memory device may include one die or layer of that controls or regulates commands, including refresh commands, to other dies or layers of the memory device. For example, one die of the 3DS memory may delay a refresh command when issuing the multiple concurrent memory refreshes would cause some problematic performance condition, such as high peak current, within the memory device.

Abstract: A semiconductor memory device includes: a column of segments, each segment including bit cells; a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; each of the bit cells being connected correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including a global write driver connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line; and a local write driver included in each segment, each local write driver being connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line; and wherein: the global write driver and each local write driver is connected between the GWB line and the LWB line and between the GWB_bar line and the LWB_bar line.

Abstract: A delay tracking method and a memory system are provided. The delay tracking method is applied to a memory system supporting a low-frequency-mode (LFM) and a high-frequency-mode (HFM) of an operating clock. The delay tracking method includes the steps of selecting a LFM oscillator for obtaining a LFM delay value when the operating clock is in the HFM; and selecting a HFM oscillator for obtaining a HFM delay value when the operating clock is in the LFM.

Abstract: Methods, apparatuses, and systems for tensor memory access are described. Multiple data located in different physical addresses of memory may be concurrently read or written by, for example, employing various processing patterns of tensor or matrix related computations. A memory controller, which may comprise a data address generator, may be configured to generate a sequence of memory addresses for a memory access operation based on a starting address and a dimension of a tensor or matrix. At least one dimension of a tensor or matrix may correspond to a row, a column, a diagonal, a determinant, or an Nth dimension of the tensor or matrix. The memory controller may also comprise a buffer configured to read and write the data generated from or according to a sequence of memory of addresses.

Abstract: Techniques and mechanisms for providing termination for a plurality of chips of a memory device. In an embodiment, a memory device is an integrated circuit (IC) package which includes a command and address bus and a plurality of memory chips each coupled thereto. Of the plurality of memory chips, only a first memory chip is operable to selectively provide termination to the command and address bus. Of the respective on-die termination control circuits of the plurality of memory chips, only the on-die termination control circuit of the first memory chip is coupled via any termination control signal line to any input/output (I/O) contact of the IC package. In another embodiment, the plurality of memory chips are configured in a series with one another, and wherein the first memory chip is located at an end of the series.

Abstract: A differential type non-volatile memory circuit comprising a differential sensing circuit, a differential data line pair, a memory cell array, and a differential bit line pair is provided. The differential sensing circuit has a differential input terminal pair and a differential output terminal pair. The differential data line pair is electrically connected to the differential input terminal pair of the differential sensing circuit. The memory cell array has at least one differential non-volatile memory cell configured to store data. The differential bit line pair is electrically connected between the memory cell array and the differential data line pair. When logic states of the differential output terminal pair start to be different in a read operation phase of the memory cell array, the differential sensing circuit and the differential data line pair are disconnected.

Abstract: The disclosed controller includes a DDR architecture that includes a dual-channel interface designed to include DQS IO ports configured to generate a first DQS signal that is a distance of substantially 0.125 times the period of a clock signal (?T denoting the 0.125 of the period of the clock signal) ahead of a rising edge of the clock signal and a second DQS signal that is a distance of substantially 0.125 times the period of the clock signal behind the rising edge of a clock signal. If ?T is more than a tDQSS then ?T is set to tDQSS, where tDQSS is a maximum allowable time between either DQS signal and the rising edge of the clock signal.

Abstract: Devices and methods include receiving write command at a command interface of the semiconductor device to write data to memory. An external data strobe is received at a data strobe pin of the semiconductor device. The received external data strobe is divided into multiple phases using phase division circuitry to divide the data strobe into multiple phases to be used in writing the data to the memory.

Abstract: A user terminal includes a WiFi card and a communications card. The WiFi card includes a first electronic controller, an antenna in communication with the first electronic controller, the antenna of the WiFi card configured to receive a signal from a remote device. The communications card includes a second electronic controller, a connector configured to connect to an external communications device, and a power switch in communication with the second electronic controller and the connector, the second electronic controller configured to control the power switch to enable or disable power through the connector upon receiving instructions from the first electronic controller, based on the signal received by the antenna of the WiFi card.

Abstract: A read-only memory (ROM) device includes a memory cell that is electrically coupled to a bitline (BL) or to a BL which represents a complement of the BL. The ROM device precharges the BL and the BL to a first logical value. The ROM device activates the memory cell which discharges the BL when the memory cell is coupled to the BL or discharges the BL when the memory cell is coupled to the BL. The ROM device reads the first logical value as being stored within the memory cell when the BL is less than the BL. Otherwise, the ROM device reads the second logical value as being stored within the memory cell when the BL is greater than the BL.

Abstract: A circuit for reducing static power in SRAM and methods for using the same are disclosed. In one embodiment, a circuit for reducing static power in SRAM includes a plurality of memory blocks, where a memory block in the plurality of memory blocks includes a plurality memory banks, where a memory bank in the plurality of memory banks includes a plurality bit cells. The circuit further includes a bias circuit configured to produce a bias voltage to a row of bit cells, where the bias circuit is coupled to a circuit ground terminal of the row of bit cells in the plurality of bit cells, and a controller configured to control the bias circuit to produce a first set of bias settings in an access mode and control the bias circuit to produce a second set of bias settings in a standby mode of the SRAM.

Abstract: Memory systems can include shifting an ODT information signal prior to passing it through a cloned DLL delay line. The shifted ODT information passes through a cloned DLL delay line to move it into a DLL domain. Meanwhile, a clock gate can use a command indication to select whether to provide a clock signal to a DLL delay line. The clock gate can block the clock signal in the absence of a read or write operation and can pass the clock signal during read or write operations. When the DLL delay line receives the clock signal, it delays the clock signal to be in the DLL domain. By locating the ODT shifter before the cloned DLL delay line, as opposed to after it, the ODT shifter doesn't need a signal passed through the DLL delay line. Preventing the clock signal from passing through the DLL delay line reduces power consumption.

Abstract: An integrated circuit includes a physical layer interface having a control timing domain and a data timing domain, and circuits that enable the control timing domain during a change in power conservation mode in response to a first event, and that enable the data timing domain in response to a second event. The control timing domain can include interface circuits coupled to a command and address path, and the data timing domain can include interface circuits coupled to a data path.

Abstract: In one embodiment, a semiconductor storage device includes a plurality of memory chips, at least one of the memory chips including a first controller configured to be shifted to a wait state of generating a peak current, before generating the peak current in accordance with a command. The device further includes a control chip including a second controller configured to search a state of the first controller and control, based on a result of searching the state of the first controller, whether or not to issue a cancel instruction for the wait state to the first controller that has been shifted to the wait state.

Abstract: A memory device is provided. The memory device comprises a memory array and circuitry configured to determine one or more settings for the memory array corresponding to a powered-on state of the memory device, to store the one or more settings in a non-volatile memory location, and in response to returning to the powered-on state from a reduced-power state, to read the one or more settings from the non-volatile memory location.

Abstract: A data processing system includes a memory and a data processor. The data processor is connected to the memory and adapted to access the memory in response to scheduled memory access requests. The data processor has power management logic that, in response to detecting a memory power state change, determines whether to retrain or suppress retraining of at least one parameter related to accessing the memory based on an operating state of the memory. The power management logic further determines a retraining interval for retraining the at least one parameter related to accessing the memory, and initiates a retraining operation in response to the memory power state change based on the operating state of the memory being outside of a predetermined threshold.

Abstract: A storage device comprises a controller, such as an ASIC controller, and one or more NAND flash memory devices. The controller comprises a differential receiver and a delay locked loop circuit. During read and write operations, the controller is configured to vary a delay of a data strobe signal by an interval across a width of a data window using the delay locked loop circuit, and to compare a write pattern to a read pattern for each delayed interval to determine the timing margins of the storage device. During read and write operations, the controller is further configured to apply a reference voltage to a host interface or a memory interface, increment and decrement the reference voltage by a set value, and compare a write pattern to a read pattern for each varied reference voltage value to determine the voltage margins of the storage device.

Abstract: One controller for controlling operation of a memory device includes an output circuit configured to supply a chip select signal, an address signal, a command signal, and a clock signal to the memory device, and a data processing circuit configured to process read data and write data through a data terminal based on the chip select signal, the address signal, the command signal, and the clock signal supplied by the output circuit. The controller is configured to supply the address signal and the command signal to the memory device a predetermined duration after the output circuit supplies the chip select signal.

Abstract: A memory is described. The memory includes a storage cell. The memory also includes a read bit line coupled to the storage cell. The memory also includes at least one N type pre charge transistor coupled between the read bit line and a power supply node. The at least one N type pre-charge transistor is to pre-charge the read bit line. The memory also includes at least one P type pre charge transistor that is also coupled between the read bit line and the power supply node. The at least one P type pre-charge transistor is to pre-charge the read bit line with the at least one N type transistor.

Abstract: The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling data transfer through a memory interface in an asynchronous mode by writing data to the memory device at least partially in response to a write enable signal on a first interface contact, and reading data from the memory device at least partially in response to a read enable signal on a second interface contact. The method further includes controlling data transfer in a synchronous mode by transferring data at least partially in response to a clock signal on the first interface contact, and providing a bidirectional data strobe signal on an interface contact not utilized in the asynchronous mode.

Abstract: Devices and methods include receiving write command at a command interface of the semiconductor device to write data to memory. An external data strobe is received at a data strobe pin of the semiconductor device. The received external data strobe is divided into multiple phases using phase division circuitry to divide the data strobe into multiple phases to be used in writing the data to the memory.

Abstract: A method for calibrating a communication channel coupling first and second components includes transmitting a data signal from the first component to the second component on the communication channel, and sensing a characteristic, such as phase, of the data signal on the second component. Information about the sensed characteristic is fed back to the first component using an auxiliary channel. An adjustable parameter, such as phase, for the transmitter is adjusted on the first component in response to the information. Also, a characteristic of a data signal received from the transmitter on the second component is sensed and used to adjust an adjustable parameter for the receiver on the first component.

Abstract: A storage device includes a nonvolatile memory device that detects loop counts of state pass loops of at least one target state of a plurality of target states, and generates state loop count information (SLCI) indicative of whether a program operation is successful based on the detected loop count of the state pass loops, during a program operation of selected memory cells; and a storage controller that makes a request to the nonvolatile memory device for the state loop count information in response to detection of an operation condition or an external command, and assigns a memory block in which the selected memory cells are included as a bad block based on the state loop count information from the nonvolatile memory device.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory cell having a first variable resistance element, a second memory cell having a second variable resistance element, and a first circuit which controls writing to the first memory cell and the second memory cell. The first circuit receives a first command instructing writing to the first memory cell, after receiving the first command, receives a second command instructing writing to the second memory cell, and after receiving the second command, performs writing to the second memory cell when performing writing to the first memory cell.

Abstract: An apparatus is provided which comprises: a buffer to receive first data from a host, and output the first data with configurable delay; and one or more circuitries to: compare the first data from the host with second data that is accessible to the apparatus, wherein the second data is substantially a copy of the first data, and calibrate the delay of the buffer, based at least in part on the comparison of the first data and the second data.

Abstract: A device with an I/O interface includes a replica clock distribution path matched to a clock distribution path of an unmatched receiver circuit. The device can monitor changes in delay in the replica path, and adjust delay in the real clock distribution path in response to the delay changes detected in the replica path. The receiver circuit includes a data path and a clock distribution network in an unmatched configuration. A ring oscillator circuit includes a replica clock distribution network matched to the real clock distribution network. Thus, delay changes detected for the replica clock distribution network indicates a change in delay in the real clock distribution network, which can be compensated accordingly.

Abstract: A sense structure may include sense amplifiers each having measuring and reference terminals for receiving a measuring and a reference current, respectively, output circuitry for providing an output voltage based upon the measuring and reference currents, and voltage regulating circuitry in cascade configuration for regulating a voltage at the measuring and reference terminals. The regulating circuitry may include measuring and regulating transistors and a reference regulating transistor having a first conduction terminal coupled with the measuring terminal and with the reference terminal, respectively, a second conduction terminal coupled with the output circuitry and a control terminal coupled with a biasing terminal. Biasing circuitry is for providing a biasing voltage to the biasing terminal, and common regulating circuitry is for regulating the biasing voltage. Each sense amplifier may also include local regulating circuitry for regulating the biasing voltage applied to the biasing terminal.

Abstract: A sense amplify enable (SAE) signal is generated on a SAE line by receiving a trigger signal at a first circuit portion coupled to a first domain power supply and a second circuit portion coupled to a second domain power supply. The second domain power supply is separate and distinct from the first domain power supply. The first circuit portion and the second circuit portion are each further coupled to the SAE line for carrying the SAE signal. For a first period of time, a first portion of the SAE signal is generated based on the first domain power supply using the first circuit portion. And, for second period of time, a second portion of the SAE signal is generated based on the second domain power supply using a second circuit portion.