Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged in a matrix, a read unit which reads out data from the memory cells in the memory cell array, a write unit which writes data in the memory cells in the memory cell array, a read voltage generating unit which generates a read voltage and supplies the read voltage to the read unit, and a voltage control unit which controls the read voltage in accordance with temperatures.

Abstract: A memory chip and method for operating the same are provided. The memory chip includes a number of pads. The method includes inputting a number of first test signals to the pads respectively, wherein the first test signals corresponding to two physically-adjacent pads are complementary; inputting a number of second test signals, respectively successive to the first test signals, to the pads, wherein the first test signal and the second test signal corresponding to each of the pads are complementary; and outputting expected data from the memory chip if the first test signals and the second test signals are successfully received by the memory chip.

Abstract: A semiconductor memory device uses a magnetic tunnel junction device (MTJ) and includes a memory cell connected between a first driving line and a second driving line and configured to store data having a data state that is determined based on a direction of a current flowing through the first and the second driving lines, and a current controlling block configured to control a supply current provided to the first and second driving lines in response to temperature information in a writing operation.

Abstract: The memory module includes front and back faces. Multiple devices are disposed on each of the faces. A first control line serially connects a first group of devices on both the front and back faces so that the first group of devices commonly contribute multiple bits to a data bus. A second control line serially connects a second group of devices on both the front and back faces so that the second group of devices commonly contribute multiple bits to a data bus.

Abstract: A temperature sensing system, which comprises: a temperature analyzing circuit, for sensing temperature and generating an analyzing result in response to the sensed temperature; and a control unit, for controlling a temperature sensing time interval; wherein the control unit continuously changes the temperature sensing time interval according to a predetermined temperature range in response to the sensed temperature.

Abstract: A semiconductor memory device includes a plurality of memory banks; a plurality of temperature sensing circuits, and a shared control circuit. The temperature sensing circuits correspond to the memory banks and each is disposed in the vicinity of a corresponding memory bank. The shared control circuit is connected to the plurality of temperature sensing circuits and a plurality of refresh circuits for refreshing the plurality of memory banks, performs calibration on the plurality of temperature sensing circuits, performs digital processing on signals for separately controlling refresh intervals for the plurality of memory banks, and transmits the processed signals to the plurality of refresh circuits. Therefore, the refresh intervals for individual channels or banks are separately or selectively controlled. Further, since the plurality of temperature sensing circuits are connected to the shared temperature control circuit, the occupied area of the circuits in a chip is reduced or minimized.

Abstract: A memory apparatus includes a temperature detection block configured to detect temperature of an internal circuit and output a temperature detection signal, a current control block configured to receive the temperature detection signal and generate a pulse control signal, and a write driver configured to provide a program pulse having a compensated level and width to a memory cell in response to the pulse control signal.

Abstract: A sense amplifier and method of implementing includes a reference current generation circuit, which is used for providing a reference current with a settable temperature coefficient for a main circuit of the sense amplifier; the main circuit is used for comparing the reference current with a storage cell current, and distinguishing between 0 and 1 Storage Cell. A method of implementing the sense amplifier that is as below: With an additional current reference circuit, generating and inputting the reference current with a positive/negative/zero temperature coefficient into the main circuit, by mixing a proportional absolute temperature current and a constant current according to different ratios; a storage cell selection tube in a mirror branch of a biased current of the main circuit, so as to constitute a source degeneration circuit, making the biased current change with the power supply voltage and realizing a gain compensation function.

Abstract: A circuit system periodically checks a system-environment monitor value, and then obtains a system-environment monitor value index corresponding to the system-environment monitor value in the environment-adjustment look-up table. Finally, the circuit system adjusts a signal delay time according to a delay adjustment value corresponding to the system-environment monitor value index.

Abstract: A refresh control circuit of a semiconductor memory apparatus includes: a variable oscillator configured to generate a room-temperature oscillation signal and a limit-temperature oscillation signal in response to a temperature state signal; a cycle selector configured to selectively output the room temperature oscillation signal and the limit-temperature oscillation signal as a variable oscillation signal in response to the temperature state signal; a refresh signal generator configured to generate a refresh signal in response to the variable oscillation signal and a fixed oscillation signal; and a temperature state detector configured to generate the temperature state signal by detecting current temperature in response to the room-temperature oscillation signal and the fixed oscillation signal.

Abstract: An internal voltage generator of a semiconductor memory device includes a proportional to absolute temperature (PTAT) current generator configured to generate a PTAT current having a varying current in proportion to a temperature change, a current control circuit configured to generate an internal current identical with the PTAT current and generate an internal voltage based on the internal current, and an offset circuit configured to control the internal voltage to a set voltage level.

Abstract: A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element.

Abstract: A flag signal generation circuit includes a first periodic signal detection unit, a second periodic signal detection unit, and a flag signal output unit. The first periodic signal detection unit is configured to detect a change in a level of a first periodic signal and generate a first detection signal. The second periodic signal detection unit is configured to detect a change in a level of a second periodic signal and generate a second detection signal. The flag signal output unit is configured to generate a pre-flag signal from the first and second detection signals, buffer the pre-flag signal in response to a mode register read signal, and output the buffered pre-flag signal as a flag signal.

Abstract: A phase-change random access memory device is provided. The phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit, multiple local bit lines, each being connected to multiple phase-change memory cells, and multiple column select transistors selectively connecting the global bit line with each of the multiple local bit lines, each column select transistor having a resistance that varies depending on its distance from the write circuit and the read circuit.

Abstract: A nonvolatile memory device comprising: a plurality of memory banks, each of which operates independently and includes a plurality of resistance memory cells, each cell including a variable resistive element having a resistance varying depending on stored data; a plurality of global bit lines, each global bit line being shared by the plurality of memory banks; a temperature compensation circuit including one or more reference cells; and a data read circuit which is electrically connected to the plurality of global bit lines and performs a read operation by supplying at least one of the resistance memory cells with a current varying according to resistances of the reference cells.

Abstract: The invention discloses a method for protecting data in a non-volatile storage device and a computer thereof. The computer includes a non-volatile storage device, a temperature sensing unit, and a controller. The temperature sensing unit is disposed at the non-volatile storage device to sense a sensed temperature of the non-volatile storage device and to compare the sensed temperature with a predetermined temperature. The controller is coupled with the temperature sensing unit. When the sensed temperature is higher than the predetermined temperature, the controller makes the computer enter into a hibernation state.

Abstract: A non volatile memory device comprises memory cells such as MRAM cells, reading circuits and a reference cell for generating a reference for use by the reading circuits, and can determine if the reference is degraded by thermal instability. This can help reduce a data error rate. Detecting such degradation can prove to be more effective than trying to design in enough margins for the lifetime of the device. The reference cell can be less susceptible to degradation than other cells by using different shape of cells and different write currents. Where each reference cell is used by many memory cells, the reference cell tends to be used more often than any particular memory cell and so can be more susceptible to degradation. Another way of ensuring against longer term degradation of the reference is periodically rewriting the reference cell.

Abstract: A memory circuit includes a plurality of memory cells and a plurality of bit lines and row lines connected to the memory cells for accessing selected memory cells. The memory circuit includes a programmable voltage source adapted for connection to at least one bit line and operative to precharge the bit line to a prescribed voltage level prior to accessing a selected one of the memory cells coupled to the bit line. A control circuit coupled to the bit line is operative to oppose discharge of the bit line during at least a portion of a given memory read cycle. A tracking circuit connected to the control circuit is operative to control a delay in activation of the control circuit and/or a duration of time the control circuit is active as a function of a parameter affecting signal development time of a data signal on the bit line.

Abstract: A nonvolatile memory device is operated by programming sample data in the memory device for verification using verify voltage levels derived from an ideal verify voltage Vv associated with a particular temperature range, performing read verify operations on the sample data using the verify voltage Vv associated with the temperature range; and determining a temperature compensation parameter Nc based on results of the read verify operations.

Abstract: There is provided a semiconductor device including: a temperature sensor detecting temperature; an inner circuit operating when supplied with a power supply voltage from a power supply line; a switch connected between the power supply line and the inner circuit; and a control circuit performing control in which, in a case where the temperature detected by the temperature sensor is higher than a threshold value, the switch is turned on when the inner circuit is in operation and the switch is turned off when the inner circuit is in non-operation, and in a case where the temperature detected by the temperature sensor is lower than the threshold value, the switch is turned on when the inner circuit is in operation and in non-operation.

Abstract: The non-volatile random access memory (RAM) includes a non-volatile RAM array, a buffer configured to buffer data to be programmed in the non-volatile RAM array and configured to buffer data read from the non-volatile RAM array, and a control block configured to read data from at least one of the non-volatile RAM array and the buffer based on whether the data to be read has been stored in the buffer, a temperature when the data was programmed, and a time lapse since the programming of the data.

Abstract: A nonvolatile memory device and a method of operating the same. The nonvolatile memory device includes a memory cell array including memory cells for storing data, a temperature sensor and a controller. The temperature sensor outputs a temperature detection signal according to ambient temperatures while changing one or more pieces of reference voltage information, which are previously stored, when data is programmed into the memory cell array. The controller performs a verify operation of the program using a fast verify method and decides the number of steps which are comprised in step-shaped verify voltage pulse of the fast verify method according to the temperature detection signal.

Abstract: In a method of using a memory cell employing a field effect transistor (FET), the FET is heated to a first temperature sufficient to support bias temperature instability in the FET. The bit line is driven to a high voltage state. The word line is driven to a predetermined voltage state that causes bias temperature instability in the FET. The temperature, the high voltage state on the bit line and the predetermined voltage state on the word line are maintained for an amount of time sufficient to change a threshold voltage of the FET to a state where a desired data value is stored on the FET. The FET is cooled to a second temperature that is cooler than the first temperature after the amount of time has expired.

Abstract: A semiconductor memory device capable of measuring a temperature without the influence of noise includes a temperature sensing device for sensing a current temperature in response to a control signal, wherein the semiconductor memory device enters a power save mode for a predetermined time starting from an activation of the control signal and wherein the power save mode has substantially no power consumption. A method for driving a semiconductor memory device in accordance with the present invention includes sensing a current temperature in response to a control signal and entering a power save mode for a predetermined time starting from an activation of the control signal, wherein the power save mode has substantially no power consumption.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worse case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored an temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A method of reading data in a non-volatile memory device compensates for a change in a reading/verifying result in accordance with a change of temperature. The method includes sensing a temperature of memory cells, setting a first voltage and a second voltage of a bit line sensing signal in accordance with the sensed temperature, precharging a bit line in accordance with the set first voltage, evaluating a change of a voltage level of the bit line based on whether a memory cell for a read operation is programmed, and sensing data of the memory cell in accordance with the set second voltage. The method may read/verify data constantly even though a temperature is changed.

Abstract: A temperature sensor includes a temperature sensing unit for producing a sensing level by sensing an internal temperature in a semiconductor memory device, a reference level generating unit for setting up a reference level by selecting one of a plurality of reference voltages, which are set up according to the internal temperature of the semiconductor memory device, in response to a test mode signal and a temperature detecting signal, wherein the reference level generating unit includes fuse, and a comparison unit for comparing the sensing level to the reference level and producing the temperature detecting signal.

Abstract: A semiconductor device includes a first temperature sensing circuit, a multiplexer, and an output circuit. The first temperature sensing circuit can be configured to provide a first temperature indication based on a first temperature threshold value. The first temperature indication can include a first temperature indication logic level. The multiplexer can include a first multiplexer input configured to receive the first temperature indication, a second multiplexer input configured to receive a data signal, and a third multiplexer input configured to receive a temperature read enable signal. The multiplexer can be configured to provide a first multiplexer output. The output circuit can include a first output terminal. The output circuit can be configured to receive the first multiplexer output. The multiplexer and the output circuit can be configured to provide the first temperature indication to the first output terminal when the temperature read enable is enabled.

Abstract: A memory system is provided with a processor, a main memory, and a flash memory. Performance of the memory system is improved through achievement of speed-up and high data reliability. The memory system includes a nonvolatile memory device and a controller configured to drive a control program to control the nonvolatile memory device. The control program executes a second access operation for the nonvolatile memory device even before a first access operation to the nonvolatile memory device is completed.

Abstract: Apparatus and systems are provided for thermal regulation of a memory integrated circuit (“IC”). The apparatus and systems may include a thermal sensor on a memory IC, and a heating element coupled to the thermal sensor. The heating element is adapted to heat the memory IC in response to a signal from the thermal sensor. Other aspects are also provided.

Abstract: A flag signal generation circuit includes a first periodic signal detection unit, a second periodic signal detection unit, and a flag signal output unit. The first periodic signal detection unit is configured to detect a change in a level of a first periodic signal and generate a first detection signal. The second periodic signal detection unit is configured to detect a change in a level of a second periodic signal and generate a second detection signal. The flag signal output unit is configured to generate a pre-flag signal from the first and second detection signals, buffer the pre-flag signal in response to a mode register read signal, and output the buffered pre-flag signal as a flag signal.

Abstract: A core voltage discharger is capable of adjusting an amount of a current discharged according to temperature. The discharger for decreasing a level of a predetermined voltage receives temperature information from an on die thermal sensor and discharges a different amount of current in response to the temperature information.

Abstract: A nonvolatile memory device includes a memory cell array including a plurality of nonvolatile memory cells each having a resistance corresponding to one of a plurality of first resistance distributions, a temperature compensation circuit including one or more reference cells each having a resistance corresponding to one among one or more second resistance distributions, and a data read circuit including a compensation unit and a sense amplifier, the compensation unit being adapted to supply compensation current to a sensing node, an amount of the compensation current varying based on the resistance of each reference cell, and the sense amplifier being adapted to compare the level of the sensing node with a reference level and to output a comparison result.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: Program disturb is reduced in a non-volatile storage system during a programming operation by switching from using programming pulses of a longer duration to programming pulses of a shorter duration, partway through the programming operation. A switchover point can be based on temperature, selected word line position and/or tracking of storage elements to a trigger state. The switchover point occurs sooner for higher temperatures, and for drain side word lines. The trigger state can be selected based on temperature. A portion of storage elements which are required to reach the trigger state to trigger a switchover can also be set a function of temperature. Programming pulses of a shorter duration improve channel boosting for inhibited storage elements, thereby reducing program disturb for these storage elements.

Abstract: A semiconductor memory device capable of measuring a temperature without the influence of noise includes a temperature sensing device for sensing a current temperature in response to a control signal, wherein the semiconductor memory device enters a power save mode for a predetermined time starting from an activation of the control signal and wherein the power save mode has substantially no power consumption. A method for driving a semiconductor memory device in accordance with the present invention includes sensing a current temperature in response to a control signal and entering a power save mode for a predetermined time starting from an activation of the control signal, wherein the power save mode has substantially no power consumption.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, or a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: At the time of, for example, a set operation (SET) for making a phase-change element in a crystalline state, a pulse of a voltage Vreset required for melting the element is applied to the phase-change element, and subsequently a pulse of a voltage Vset that is lower than Vreset and is required for crystallizing the element is applied thereto. And, the magnitude of this voltage Vset is then changed depending on the ambient temperature so that the magnitude of the voltage Vset is small as the temperature becomes high (TH). In this manner, a margin of a write operation between the set operation and a reset operation (RESET) for making the element to be in amorphous state is improved.

Abstract: The memory module includes front and back faces. Multiple devices are disposed on each of the faces. A first control line serially connects a first group of devices on both the front and back faces so that the first group of devices commonly contribute multiple bits to a data bus. A second control line serially connects a second group of devices on both the front and back faces so that the second group of devices commonly contribute multiple bits to a data bus.

Abstract: The present invention provides a thermostatic bias controller for use with a memory array. The thermostatic bias controller includes a temperature sensing circuit configured to sense a temperature associated with the memory array. The thermostatic bias controller also includes a voltage control circuit coupled to the temperature sensing circuit and configured to provide a bias voltage to at least one back-gate of the memory array based on the temperature.

Abstract: A semiconductor memory device uses a magnetic tunnel junction device (MTJ) and includes a memory cell connected between a first driving line and a second driving line and configured to store data having a data state that is determined based on a direction of a current flowing through the first and the second driving lines, and a current controlling block configured to control a supply current provided to the first and second driving lines in response to temperature information in a writing operation.

Abstract: There is provided a technique for ensuring both an SNM and a write margin simultaneously in a semiconductor device having static memory cells. A semiconductor device has a plurality of static memory cells. The semiconductor device includes a memory cell array having the static memory cells arranged in a matrix, a temperature sensor circuit for sensing a temperature in the semiconductor device, and a word driver for controlling a voltage supplied to a word line of the memory cell array based on an output of the temperature sensor circuit at the time of writing to or reading from a memory cell.

Abstract: Data is programmed into and read from a set of target memory cells. When reading the data, temperature compensation is provided. The temperature compensation is based on temperature information and the state of one or more neighbor memory cells. In one embodiment, when data is read from set of target memory cells, the system senses the current temperature and determines the differences in temperature between the current temperature and the temperature at the time the data was programmed. If the difference in temperature is greater than a threshold, then the process of reading the data includes providing temperature compensation based on temperature information and neighbor state information. In one alternative, the decision to provide the temperature compensation can be triggered by conditions other than a temperature differential.

Abstract: The present disclosure includes devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory. One or more embodiments can include a memory device including a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.

Abstract: The present disclosure relates to the heating of memory cells.

Abstract: A circuit and corresponding method for providing a reference voltage are presented. The circuit includes a current source having a magnitude with positive temperature correlation connected to a node, and a diode element connected between the node and ground, where the node supplies the reference voltage. The circuit also includes a variable resistance connected to receive an input indicative of the circuit temperature and through which the diode element is connected to the node. The value of the variable resistance is adjusted based upon the circuit temperature input. The circuit is useful for application as a peripheral circuitry, such as on a flash or other non-volatile memory and other circuits requiring an on-chip reference voltage source.

Abstract: Apparatus and systems are provided for thermal regulation of a memory integrated circuit (“IC”). The apparatus and systems may include a thermal sensor on a memory IC, and a heating element coupled to the thermal sensor. The heating element is adapted to heat the memory IC in response to a signal from the thermal sensor. Other aspects are also provided.

Abstract: A semiconductor memory device is provided which comprises: a sense amplifier; and a bit line, wherein the disconnection of the sense amplifier from the bit line is performed in a data read operation when temperature in the semiconductor memory device is at a first temperature, and wherein the disconnection of the sense amplifier from the bit line is not performed in the data read operation when the temperature in the semiconductor memory device is at a second temperature.

Abstract: A semiconductor memory device, which performs a refresh operation, includes: a temperature sensing unit for measuring temperature and for generating a temperature controlled voltage and a reference current based on the measured temperature; an analog-digital conversion unit for converting the temperature controlled voltage to an N-bit digital signal; a refresh control unit for generating a refresh signal in response to the N-bit digital signal, wherein, a period of the refresh signal is controlled based on the N-bit digital signal.

Abstract: A semiconductor device has a DRAM cell configured from an information charge accumulating capacitor and a memory cell selecting transistor, the threshold voltage value of a MOS transistor that constitutes a sense circuit is monitored, and the monitored threshold voltage value of the MOS transistor is converted through the use of a transfer ratio that is determined based on the capacitance of the information charge accumulating capacitor and the parasitic capacitance of the bit line. The converted voltage value is level-shifted so that the pre-charge voltage of a pre-charge circuit is a pre-set voltage, a current feeding capability is added to the level-shifted voltage value, and the voltage is fed as the pre-charge voltage.