Abstract: A phase change random access (PRAM) memory may include a memory cell array having a plurality of phase change memory cells, and a data read circuit including a compensation unit and a sense amplifier, the compensation unit configured to provide a sensing node with a compensation current to compensate for a decrease in a level of the sensing node caused by a current flowing through one of the plurality of phase change memory cells, and the sense amplifier configured to compare a level of the sensing node with a reference level and output a result of the comparison.

Abstract: A memory device includes terminals for transferring input data and output data to and from a memory array. The memory device also includes an auxiliary circuit for receiving input auxiliary information associated with the input data and for generating output auxiliary information associated with the output data. The input and output auxiliary information include inverting codes, parity codes, temperature information and time delay information. The input and output auxiliary information are transferred to and from the memory device on the same terminals that the input data and the output data are transferred.

Abstract: Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.

Abstract: A semiconductor memory device is provided for minutely changing a refresh interval according to a detected temperature and thereby lowering its power consumption. A temperature detector detects a temperature of a chip and outputs the corresponding temperature signal. A reference temperature signal output unit outputs the corresponding reference temperature signal with each of different reference temperatures to be compared with the chip temperature according to a selection signal. A temperature comparison unit compares the chip temperature with the reference temperature through the temperature signal and the reference temperature signal. A selection signal output unit outputs the selection signal according to the compared result of the temperature comparison unit. A refresh interval control unit changes the refresh interval according to the compared result of the temperature comparison unit.

Abstract: A temperature compensation circuit includes a voltage generator, a comparator and an emulation cell array. The voltage generator provides a predetermined voltage and a reference voltage. The comparator has a first terminal for receiving the predetermined voltage, and a second terminal for receiving the reference voltage. The emulation cell array is coupled to the first terminal of the comparator. When a voltage of the first terminal of the comparator is discharged, via the emulation cell array, to be lower than the reference voltage, the comparator outputs a read timing control signal to control a sense amplifier to perform a sensing operation.

Abstract: An information handling system includes a processor having access to a system memory. The system is operable to detect a thermal alert and identify an associated portion of system memory. The system may then modify memory allocation information used by an operating system to allocate system memory. When the thermal alert indicates a rising memory module temperature that exceeds a specified threshold, the modification of the memory allocation information causes the memory to appear to be more “distant” from the system processor(s) and thereby allocated less preferentially than other memory. If the temperature continues to rise beyond a higher threshold, a second modification of the memory allocation information is performed to simulate a “hot eject” of the memory module. As the memory module cools, the memory allocation information can be restored to simulate a hot add of the memory module and to restore the proximity of the memory module.

Abstract: A driver circuit for a PRAM (phase-change random access memory) device includes a write driver that generates a set/reset current in response to a set/reset pulse. In addition, a temperature compensator controls a pulse width of the set/reset pulse in response to a peripheral temperature of the PRAM device. For example, the temperature compensator maintains the pulse width to be substantially constant irrespective of the peripheral temperature. In another example, the temperature compensator decreases the pulse width for higher peripheral temperature.

Abstract: A frequency characteristic measuring circuit is disclosed, which includes a first diode element having differential input nodes and differential output nodes, thermally coupled to a resistance element of a differential amplifying circuit having the resistance element connected between the differential output nodes, and driven by a first constant current source, a second diode element for reference driven by a second constant current source, and a detection circuit which detects a potential difference between forward voltages of the first and second diode elements to output a signal in accordance with the detected potential difference.

Abstract: A nonvolatile memory device includes a read margin critical value calculation unit configured to calculate a critical value of a read margin between a read voltage and a threshold voltage of a specific cell, an interference value calculation unit configured to calculate an interference value affecting the threshold voltage of the specific cell, a comparison unit configured to compare the critical value and the interference value and to output a result of the comparison, and a data selection unit configured to output either first data, read from the specific cell using a first read voltage, or second data, read from the specific cell using a second read voltage, based on the result outputted from the comparison unit.

Abstract: A method for data storage includes programming a first group of analog memory cells at a first time at a known first temperature, so as to cause the analog memory cells in the first group to assume respective first analog storage values. Respective second analog storage values are read from the analog memory cells in the first group at a second time at which the analog memory cells are at a second temperature. A shift is estimated between the first analog storage values and the second analog storage values, and a memory access parameter is adjusted responsively to the estimated shift. A second group of the analog memory cells is accessed at the second temperature using the adjusted memory access parameter.

Abstract: According to embodiments of the present invention, an integrated circuit such as a processor includes a counter to count an actual number of unreliable storage locations in the processor cache, at least one register to store an acceptable number of unreliable storage locations for the cache, a detector to measure a thermal environment of the processor, and circuitry to raise an operating voltage of the processor if the actual number of unreliable storage locations exceeds the acceptable number of unreliable storage locations, and if the thermal environment is acceptable.

Abstract: Systems, methods, and apparatus are provided for thermal regulation of a non-volatile memory IC. The systems and apparatus may include a thermal sensor on a memory IC; and a heating element coupled to the thermal sensor and adapted to heat the memory IC in response to a signal from the thermal sensor. The methods may include sensing a temperature of a memory IC using an integrated thermal sensor on the memory IC and heating the memory IC, using an integrated heating element operatively coupled to the thermal sensor, if the sensed temperature is below a threshold temperature.

Abstract: The semiconductor device includes a temperature sensor controlled so that temperature measurement is made once at each of a plurality of different reference temperatures at an interval of a preset number of times of refresh operations and a plurality of latch circuits holding the results of temperature measurement. A refresh period is set from outputs of the latch circuits inclusive of the result of temperature measurement carried out last time for each of a plurality of different reference temperatures. After start of measurement, temperature measurements are repeated every wait time corresponding to circulation of the refresh operations. The refresh period is set such that the high-temperature side results of temperature measurement are prioritized(FIG. 2).

Abstract: One embodiment of the invention provides a compensation circuit. The compensation circuit comprises a writing driver, a distance detection circuit, an operating element and an auxiliary writing driver. The writing driver provides a writing current to a writing path. The distance detection circuit is coupled to the writing path to detect a distance that the writing current has travelled and outputs a control signal based on the distance. The operating element is coupled to the writing path. The auxiliary writing driver provides an auxiliary current to the writing path based on the control signal.

Abstract: The ferroelectric memory apparatus stores data, and includes: a ferroelectric memory element; a temperature sensor which detects a temperature of the apparatus; a control unit that outputs a control signal indicating a voltage, the voltage increasing as the temperature detected by the temperature sensor decreases; and a voltage generating unit that generates the voltage indicated by the control signal outputted by the control unit, and to supply the generated voltage to the ferroelectric memory element. This provides a ferroelectric memory apparatus which can recover from effects of thermal stress suffered after shipment—i.e., reduction in the polarization amount needed for data retention as well as imprint degradation—using a relatively simple configuration.

Abstract: An integrated device comprising a storage location, wherein data stored in the storage location is repeatedly refreshed with a first predetermined refresh rate during a first period of time. The first period of time provides a first predetermined duration. After the end of the first period of time, the data is repeatedly refreshed with a second predetermined refresh rate.

Abstract: Systems and/or methods are presented that can facilitate regulating performance of operations in a memory device based on controlling an operating temperature slope associated with the memory device. A regulator component can facilitate controlling the operating temperature slope level and controlling a reference voltage(s) associated with a word-line(s) and/or bit-line(s) to facilitate execution of operations in a memory, while also controlling a respective current level(s) associated with the reference voltage to minimize errors in the memory or harm to the memory. The reference voltage can be controlled based on a first resistance and the current level can be controlled based on a second resistance that can be based on the first resistance. An analyzer component can facilitate determining a desired operating temperature slope level. Trim bits can be employed to facilitate setting the first resistance and/or the second resistance.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A memory device in a semiconductor substrate includes at least one temperature sensor to provide a temperature dependent signal and at least one circuit to dissipate heat in response to a control signal. A control circuit is coupled to the at least one circuit and is operable to generate the control signal in response to the temperature dependent signal.

Abstract: Temperature effects in a non-volatile storage device are addressed by providing a data state-dependent, and optionally temperature dependent, sense current during verify and read operations. A different sense current is provided for each data state, so that a common temperature coefficient is realized for storage elements with different data states. The temperature coefficient for higher states can be reduced to that of lower states. During sensing, a sense time can be adjusted to achieve a desired sense current when a selected storage element is in a conductive state. A fixed voltage trip point may be maintained. During the sense time, a pre-charged capacitor discharges into a selected storage element such as via a bit line and NAND string, when the selected storage element is in a conductive state. The discharge level is translated to a current which is compared to a state-dependent, and optionally temperature dependent, reference current.

Abstract: A memory device that includes at least one memory cell, the memory cell includes: a magnetic tunnel junction (MTJ); and a transistor, wherein the transistor is operatively coupled to the MTJ; a bit line; a source line; and a word line, wherein the memory cell is operatively coupled between the bit line and the source line, and the word line is operatively coupled to the transistor; a temperature sensor; and control circuitry, wherein the temperature sensor is operatively coupled to the control circuitry and the control circuitry and temperature sensor are configured to control a current across the memory cell.

Abstract: A memory device has data transceivers, write strobe transceivers, and read strobe transceivers. The data transceivers transfer input data to the memory device and transfer output data from the memory device. The write strobe transceivers transfer timing information of the input data. The read strobe transceivers transfer timing information of the output data. The memory device also has an auxiliary circuit for generating auxiliary information. The auxiliary information includes information different from the timing information of the input data and the output data. The auxiliary circuit uses the write and read transceivers to transfer the auxiliary information to and from the memory device.

Abstract: A nonvolatile memory includes a temperature dependent read window. One or more temperature compensated wordline voltage supply circuits provide temperature compensated wordline signal(s) to the nonvolatile memory. The temperature compensated wordline signals change as the temperature dependent read window changes.

Abstract: A solid state semiconductor storage device with temperature control function comprises a non-volatile memory unit, a temperature sensing element, and a control unit. The temperature sensing element is used for sensing the operation temperature of the solid state semiconductor storage device so as to provide a temperature sensing signal to the control unit. According to the temperature sensing signal, the control unit controls the operation mode of the solid state semiconductor storage device for achieving the function of temperature control.

Abstract: A circuit and method for providing temperature data indicative of a temperature measured by a temperature sensor. The circuit is coupled to the temperature sensor and configured to identify for a coarse temperature range one of a plurality of fine temperature ranges corresponding to the temperature measured by the temperature sensor and generate temperature data that is provided on an asynchronous output data path.

Abstract: A negative voltage detection circuit including first and second MOS transistor circuits configured to change a dimension size of a transistor based on a control signal, a first comparator circuit, a gate electrode of the second MOS transistor circuit commonly coupled to the gate electrode of the first MOS transistor circuit forming a current mirror circuit, a resistive divider supplied with a negative voltage to be detected, and coupled to the end of the current path of the second MOS transistor circuit to generate a second voltage, a second voltage comparator circuit to compare the second voltage with a reference voltage and to generate a detection signal corresponding to the value of the negative voltage, and a detection circuit for detecting a temperature or power supply voltage, generate the control signal corresponding to the detection result, and supply the control signal to the first and second MOS transistor circuits.

Abstract: Non-volatile resistance change memories, systems, arrangements and associated methods are implemented in a variety of embodiments. According to one embodiment, resistance-change memory devices are implemented having a pair of electrodes and an intervening electrochemical material. A heating element facilitates changes in resistance of the electrochemical material-region due to changes in ion distribution. The method is implemented without a process for forming a filament-like region in the electrochemical material.

Abstract: Adaptive programming methods and supportive device architecture for memory devices are provided. Methods include partitioning words into variable length segments. More particularly, methods include receiving a word of data, parsing the word into a plurality of write-subsets, where the size of the write-subsets depends on values of the data and constraints that are specific to the memory circuit, and writing the data in cells of the memory circuit, one write-subset at a time. A memory device includes a digital controller capable of parsing words into a plurality of write-subsets, where the length of write-subsets are depending on values of the data and constraints that are specific to the memory device.

Abstract: Adaptive programming methods and supportive device architecture for memory devices are provided. Methods include partitioning words into variable length segments. More particularly, methods include receiving a word of data, parsing the word into a plurality of write-subsets, where the size of the write-subsets depends on values of the data and constraints that are specific to the memory circuit, and writing the data in cells of the memory circuit, one write-subset at a time. A memory device includes a digital controller capable of parsing words into a plurality of write-subsets, where the length of write-subsets are depending on values of the data and constraints that are specific to the memory device.

Abstract: A temperature compensation circuit includes a voltage generator, a comparator and an emulation cell array. The voltage generator provides a predetermined voltage and a reference voltage. The comparator has a first terminal for receiving the predetermined voltage, and a second terminal for receiving the reference voltage. The emulation cell array is coupled to the first terminal of the comparator. When a voltage of the first terminal of the comparator is discharged, via the emulation cell array, to be lower than the reference voltage, the comparator outputs a read timing control signal to control a sense amplifier to perform a sensing operation.

Abstract: A phase-change random access memory device is provided. The phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit, multiple local bit lines, each being connected to multiple phase-change memory cells, and multiple column select transistors selectively connecting the global bit line with each of the multiple local bit lines, each column select transistor having a resistance that varies depending on its distance from the write circuit and the read circuit.

Abstract: A semiconductor memory device includes a memory cell array and a voltage generation circuit for generating a voltage applied to the memory cell array, in which a plurality of drive MOS transistors having different width dimensions are selectively connected in parallel between an output line and the ground. The voltage is adjusted in response to the surrounding temperature in such a way that a prescribed number of drive MOS transistors selected from among the plurality of MOS transistors are normally and simultaneously driven. Thus, it is possible to precisely adjust the voltage in units of adjustment corresponding to differences of width dimensions without degrading the performance of the semiconductor memory device in a low current consumption mode.

Abstract: Provided are a nonvolatile memory device and a memory test system. The nonvolatile memory device includes a temperature compensator to calculate a trim value for regulating a characteristic of the nonvolatile memory device that varies with temperature in response to a test signal. The memory test system includes a plurality of nonvolatile memories and a tester. Each of the nonvolatile memories includes a temperature compensator. The tester tests the plurality of nonvolatile memories. The temperature compensator calculates a trim value for regulating a characteristic of the nonvolatile memory device that varies with temperature in response to a test signal of the tester.

Abstract: Provided is a semiconductor memory device. The semiconductor memory device includes: a voltage generator adjusting a DC voltage supplied into the semiconductor memory device according to a current temperature; and a control logic activating a temperature detection operation of the voltage generator and an adjustment operation of the DC voltage according to an operation mode, wherein the voltage generator adjusts the DC voltage according to offset information about the semiconductor memory device.

Abstract: A dynamic random access memory (DRAM) device has an array of DRAM cells of rows by columns. Each DRAM cell of the array is coupled with a wordline of a corresponding row and a bitline of a corresponding column. An entry into and an exit from the self-refresh mode are detected by a mode detector and a self-refresh mode signal is provided. An oscillation circuit generates in response to the self-refresh mode signal generates a basic time period. A first frequency divider/time period multiplier changes the basic time period in accordance with a process variation factor relating to the DRAM device. A second frequency divider/time period multiplier further changes the changed time period in accordance with a temperature change factor relating to the DRAM device. In the self-refresh mode, data stored in the DRAM cells is refreshed. In accordance with the two factors, the DRAM devices perform and achieve reliable self-refresh for variable DRAM cell retention time.

Abstract: Temperature effects in a non-volatile storage device are addressed by providing a data state-dependent, and optionally temperature dependent, sense current during verify and read operations. A different sense current is provided for each data state, so that a common temperature coefficient is realized for storage elements with different data states. The temperature coefficient for higher states can be reduced to that of lower states. During sensing, a sense time can be adjusted to achieve a desired sense current when a selected storage element is in a conductive state. A fixed voltage trip point may be maintained. During the sense time, a pre-charged capacitor discharges into a selected storage element such as via a bit line and NAND string, when the selected storage element is in a conductive state. The discharge level is translated to a current which is compared to a state-dependent, and optionally temperature dependent, reference current.

Abstract: The present disclosure includes devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory. One or more embodiments can include a memory device including a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.

Abstract: The present disclosure includes devices, methods, and systems for sensing memory, such as resistance variable memory, among other types of memory. One or more embodiments can include a method for generating currents to be used in sensing a memory cell, the method including providing a number of initial currents, and generating a number of reference currents by summing particular combinations of the initial currents.

Abstract: A temperature detector in an integrated circuit comprises a temperature-dependent voltage generator, a ring oscillator, a timer and a clock-driven recorder. The temperature-dependent voltage generator is configured to generate at least one temperature-dependent voltage. The ring oscillator is configured to generate a clock signal, which is affected by one of the at least one temperature-dependent voltage. The timer is configured to generate a time-out signal, which is affected by one of the temperature-dependent voltage. The clock-driven recorder has a clock input terminal in response to the clock signal and time-out signal.

Abstract: A nonvolatile memory device may include a memory cell array having a plurality of nonvolatile memory cells arranged in a matrix including a plurality of rows of the nonvolatile memory cells. Each of a plurality of word lines may be coupled with nonvolatile memory cells of a respective row of the matrix. A row decoder may be coupled to the plurality of word lines with the row decoder being configured to disable at least one of the word lines using a row bias having a level that is adjusted responsive to changes in temperature. Such a nonvolatile memory device may operate with reduced standby currents.

Abstract: With regard to a temperature sensor, a control logic circuit conducts control of the temperature sensor. During preparation of the temperature sensor, the control logic circuit reads the result of measurement of the property pertaining to the ambient temperature from the temperature sensor circuit, obtains the initial value and correction value from the result, and stores the pertinent values in the fuse memory. At times of operation of the temperature sensor, the control logic circuit reads the initial value and correction value from the fuse memory, and corrects the measurement values of the temperature sensor circuit using the pertinent values.

Abstract: A temperature sensor generates a digital representation of the temperature of the integrated circuit. A logic circuit reads the digital temperature and generates a multiple bit digital representation of an operational voltage and a multiple bit digital representation of a timing signal, both being functions of the integrated circuit temperature. A voltage generator converts the digital representation of the operational voltage to an analog voltage that biases portions of the integrated circuit requiring temperature compensated voltages. In one embodiment, the temperature compensated voltages bias memory cells. A timing generator converts the multiple bit digital representation of the timing signal to a logic signal.

Abstract: Methods and apparatuses are presented for controlling a fully buffered dual inline memory module. In one embodiment, the memory module may include at least two memory chips, a buffer coupled to the at least two memory chips (the buffer serially receiving data to be stored in the at least two memory chips), and a heat sink thermally coupled to the at least two memory chips and thermally coupled to the buffer such that heat generated by the buffer is coupled to a first memory chip within the at least two memory chips. The may be configured such that it operates at a higher temperature than the first memory chip and the refresh rate of the first memory chip may be adjusted when the temperature of the first memory chip is outside of a predetermined range.

Abstract: A temperature invariant reference voltage and a temperature variant physical quantity, such as a voltage or current, are generated. The temperature variant physical quantity changes in response to a temperature of the integrated circuit. A temperature sensor circuit generates a voltage that is linearly dependent on the temperature. A level generator circuit generates 2n?1 voltage levels from the reference voltage. A comparator circuit, such as an analog-to-digital circuit, compares the voltage from the temperature sensor to the 2n?1 voltage levels to determine which level is closest. An n-bit digital output of the resulting level is proportional to the temperature of the integrated circuit.

Abstract: A nonvolatile memory comprising an array of memory cells and sense amplifiers, each sense amplifier using a keeper circuit to provide an amount of current to compensate for bit line leakage current in the memory array. The amount of current from the keeper depends on the temperature of the memory and the speed of the process used to make the memory.

Abstract: A ferroelectric memory device includes a memory cell, read circuit, temperature sensing circuit, and read controller. The memory cell includes a ferroelectric capacitor. The read circuit is configured to read data from the memory cell. The temperature sensing circuit is configured to sense the ambient temperature of the memory cell. The read controller is configured to receive a temperature sensing signal from the temperature sensing circuit, and inhibit a data read operation by the read circuit when the temperature sensed by the temperature sensing circuit is higher than a preset temperature.

Abstract: Systems, methods, and apparatus are provided for thermal regulation of a non-volatile memory IC. The systems and apparatus may include a thermal sensor on a memory IC; and a heating element coupled to the thermal sensor and adapted to heat the memory IC in response to a signal from the thermal sensor. The methods may include sensing a temperature of a memory IC using an integrated thermal sensor on the memory IC and heating the memory IC, using an integrated heating element operatively coupled to the thermal sensor, if the sensed temperature is below a threshold temperature.

Abstract: A nonvolatile memory device includes a memory cell array with a matrix of nonvolatile memory cells. The nonvolatile memory cells may store data using variable resistive elements. A plurality of bitlines are coupled to a plurality of nonvolatile memory cell arrays in the memory cell array. A column selection circuit selects among the bitlines in response to a column selection signal. A controller regulates a level of the column selection signal in response to a temperature signal from a temperature sensor. The temperature sensor may be configured to measure temperature outside the nonvolatile memory device to generate the temperature signal.

Abstract: The present invention discloses a sense amplifier used in an Electrically Erasable Programmable Read-only Memory; the sense amplifier includes a reference current generation circuit, which is used for providing a reference current with a settable temperature coefficient for a main circuit of the sense amplifier; the sense amplifier further includes the main circuit, which is used for comparing the reference current with a storage cell current, and distinguishing between 0 Storage Cell and 1 Storage Cell.

Abstract: A nonvolatile memory device is operated by programming sample data in the memory device for verification using verify voltage levels derived from an ideal verify voltage Vv associated with a particular temperature range, performing read verify operations on the sample data using the verify voltage Vv associated with the temperature range; and determining a temperature compensation parameter Nc based on results of the read verify operations.