Mounting Or Support Patents (Class 381/361)
  • Patent number: 9716934
    Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: July 25, 2017
    Assignee: Apple Inc.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Esge B. Andersen
  • Patent number: 9654882
    Abstract: Provided is a condenser microphone including an audio-signal outputting printed circuit board and a rear case that are in stable electrical connection with each other. The condenser microphone includes a microphone unit 10, an audio-signal outputting printed circuit board 20 connected with the microphone unit 10, a rear case 30 having deep groove 31a, the deep groove 31a receiving the audio-signal outputting printed circuit board 20, a mounting groove 31b being formed on the outer periphery of the rear case 30, the mounting groove 31b receiving a mounting member 50, a fitting groove 21 being formed on the audio-signal outputting printed circuit board 20, the fitting groove 21 receiving the mounting member 50.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: May 16, 2017
    Assignee: KABUSHIKI KAISHA AUDIO TECHNICA
    Inventor: Hiroshi Akino
  • Patent number: 9549272
    Abstract: The present invention discloses a multifunctional device for assembly and test of wire-control earphone, belonging to the technical field of assembly and test device of electronic products, comprising an operating platform, and a wire-control component region and a wire slot are provided on the upper surface of the operating platform, the assembly of wire-control earphone can be achieved by the operating platform; and touch control holes are provided in the wire-control component region, the touch control holes are in one-to-one correspondence with rods, each of the rods has a touch control end and an operating end, a socket is provided on the operating platform, the socket is connected to a circuit board, a signal transmitting elastic sheet is provided on the circuit board, and after an earphone plug is inserted into the socket, by pressing the operating end of the rod, the touch control terminal comes into contact with the contact point on the wire-control earphone, then through the signal transmitting elas
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: January 17, 2017
    Assignee: Goertek, Inc.
    Inventors: Shoubiao Deng, Shuliang Gong, Baohui Song
  • Patent number: 9538271
    Abstract: An electronic apparatus is disclosed. An electronic apparatus comprises an inner chassis, a microphone that is disposed inside the inner chassis and has a sound collecting surface for obtaining voice, and an outer casing that covers an outside of the inner chassis. The inner chassis includes a sound passing hole penetrating the inner chassis in such a position as to face the sound collecting surface. The outer casing includes an inner surface that faces the inner chassis and an edge that faces the inner chassis with a gap between the inner chassis and the edge. The inner surface includes a sound passing groove that communicates with the sound passing hole. The sound passing groove extends to the edge.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: January 3, 2017
    Assignee: KYOCERA Corporation
    Inventor: Ryosuke Iwaya
  • Patent number: 9503808
    Abstract: A boundary microphone that can reduce the change in its directional property caused by change of a sound collection axis of a microphone unit is provided. The boundary microphone includes a unidirectional microphone unit, a cylindrical unit holding member having a unit accommodating pocket in its peripheral surface to accommodate the unidirectional microphone unit, and a boundary plate to which top face the unit holding member is attached so as to rotate about its axis. When the unidirectional microphone unit is held in the unit holding member, a front acoustic terminal is positioned to face the outside of the peripheral surface of the unit holding member, the sound collection axis intersects the axis of a hollow of the unit holding member, and a rear acoustic terminal communicates with the outside at both side ends of the hollow via the hollow of the unit holding member.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: November 22, 2016
    Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
    Inventor: Hiroshi Akino
  • Patent number: 9497527
    Abstract: A portable electronic device may have acoustic ports such as microphone and speaker ports. Acoustic devices such as microphones and speakers may be associated with the acoustic ports. An acoustic port may have an opening between an interior and exterior of the portable electronic device. The opening may be covered by a metal mesh. An acoustic fabric may be interposed between the metal mesh and the opening. The opening may be formed from a hole in a glass member having outer and inner chamfers. A microphone boot may be provided that forms front and rear radial seals with a housing of the device and a microphone unit respectively. The microphone boot may also form multiple face seals with the microphone unit. A speaker for the speaker port may be enclosed in a sealed speaker enclosure. The speaker enclosure may have a pressure-equalizing vent slit covered with an acoustic mesh.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: November 15, 2016
    Assignee: Apple Inc.
    Inventors: Adam Mittleman, Richard P. Howarth, Chad Seguin
  • Patent number: 9438972
    Abstract: The present invention relates to a silicon based MEMS microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams which are interconnected with each other and supported on the side wall of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 6, 2016
    Assignee: GOERTEK INC.
    Inventors: Zhe Wang, Mengjin Cai
  • Patent number: 9426919
    Abstract: An electronic device is provided. The electronic device includes a mainboard, a housing, and a sealing member. The mainboard surface-mounts a socket connector thereon. The housing receives the mainboard and forms a through hole. The sealing member defines a space for receiving the socket connector via coupling with the mainboard and allows the space and the through hole of the housing to communicate with each other.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: August 23, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Cheon Wee, Sung-Ill Kang, Jun-Woo Park, Chang-Seok Bae
  • Patent number: 9226081
    Abstract: The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect when in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: December 29, 2015
    Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.
    Inventor: Jinghua Ye
  • Patent number: 9190069
    Abstract: A voice reinforcement system extracts a portion of a converted speech signal and redirects it towards a listening area where it may be added with the original signal. The system includes a speech input, a filter, and a converter. The speech input generates an intermediate signal from a speech signal. The filter extracts a portion of the signal extending above a cutoff frequency. The converter converts the filtered signal to an aural signal directed towards a listening area.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: November 17, 2015
    Assignee: 2236008 Ontario Inc.
    Inventors: Phillip A. Hetherington, Alex Escott
  • Patent number: 9154871
    Abstract: A condenser microphone includes a volume restrictor disposed in a space inside a microphone case and an electronic circuit disposed in the space and encompassed by the volume restrictor. The volume restrictor reduces the volume of the space and prevents sound waves entering the space through openings on the microphone case from reaching the electronic circuit.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: October 6, 2015
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 9107008
    Abstract: A microphone comprises a movable diaphragm 2 and a back electrode 4. The mechanical relationship between the back electrode 4 and the diaphragm 2 is adjustable thereby to control the cut-off frequency of the microphone. This enables the microphone to be adapted to different noise environments.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: August 11, 2015
    Assignee: Knowles IPC(M) SDN BHD
    Inventor: Stefan Leitner
  • Patent number: 9099569
    Abstract: A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: August 4, 2015
    Assignee: BSE CO., LTD.
    Inventors: Sang Ho Lee, Yong Hyun Shim
  • Patent number: 9040360
    Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 26, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9024432
    Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9023689
    Abstract: A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid with an acoustic port, and the MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the lid-mounted MEMS microphone die.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 5, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Publication number: 20150117692
    Abstract: A microphone includes an output controller 14 to control output from a microphone unit 10, a metal portion 20 of an outer casing of the microphone, a neon tube 24 to discharge static electricity from an external object through the metal portion 20, and an acoustic coupler 30 to control the output controller 14 through generation of sound in response to a discharge current from the neon tube 24 and detection of the sound.
    Type: Application
    Filed: September 22, 2014
    Publication date: April 30, 2015
    Applicant: KABUSHIKI KAISHA AUDIO-TECHNICA
    Inventor: Hiroshi Akino
  • Patent number: 9014402
    Abstract: An acoustically isolated support and handle system for a sound pickup system includes vibrationally isolated, releasable connections for an adjustable microphone adapter in front of the reflector and for a pair of support handles and optionally a universal mounting bracket at the rear of the reflector. The handles provide a connection bracket for the optional use of a neck strap that would allow an operator to shift at least a portion of the weight of the device to the operator's neck and back while also providing the option for handheld aiming.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: April 21, 2015
    Assignee: Klover Products, Inc.
    Inventors: Paul Terpstra, Patrick Santini
  • Patent number: 9006880
    Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: April 14, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 9003637
    Abstract: A method of manufacturing a microphone assembly having an ear set function includes assembling a mike cell unit; obtaining a region for connection with the mike cell unit on a PCB, mounting only a conductive member in the region, and mounting other remaining components outside the region; adhering the mike cell unit to a corresponding region of the PCB; and sealing an adhering portion between the mike cell unit and the PCB. Assembling the mike cell unit includes inserting a mike cell case having a sound hole and a curing portion into a diaphragm assembly; stacking a spacer on the diaphragm assembly; inserting a back electrode plate into an insulating ring base; mounting the insulating ring base on the spacer; mounting a metal ring base on the insulating ring base; and curing or clamping a curing portion of the mike cell case.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: April 14, 2015
    Assignee: BSE Co., Ltd.
    Inventors: Dong Sun Lee, Hyoung Joo Kim
  • Publication number: 20150098602
    Abstract: This invention relates to microphone accessories for use with a hand-held microphone, and to a method of using a microphone. The microphone accessory in accordance with the invention has a body comprising an attachment formation for attaching the microphone accessory to the handle of the microphone, a holding portion to be engaged by a hand of the user, a cover portion coupled to the holding portion and substantially spaced therefrom so as to define a holding zone between the holding portion and the cover portion for receipt of the hand of the user to engage the holding portion, in use, wherein the cover portion substantially shields or covers the holding zone and/or the hand of the user; and a static non-electronically variable display device and/or an electronically variable display device. The invention also relates to a wearable microphone accessory.
    Type: Application
    Filed: September 4, 2014
    Publication date: April 9, 2015
    Inventor: STEVEN MARK LEVINSOHN
  • Patent number: 8989411
    Abstract: A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: March 24, 2015
    Assignee: Board of Regents, The University of Texas System
    Inventors: Neal A. Hall, Michael Louis Kuntzman, Karen Denise Kirk
  • Patent number: 8989421
    Abstract: A gooseneck microphone has a configuration capable of preventing both of the occurrence of noise caused by extraneous electromagnetic waves and the occurrence of noise caused by electric discharge when touched. The gooseneck microphone includes a microphone unit having an electrostatic acousto-electric converter and a metal unit casing; a unit holder having a circuit board mounted with an impedance converter electrically connected to an output side of the acousto-electric converter, a cylindrical outer cylinder body, a cylindrical inner cylinder body arranged in the outer cylinder body, and a synthetic resin cover member covering the outer cylinder body; a metal support pipe having flexibility, the unit holder being supported on one end side of the support pipe; and a microphone cable having a two-core shield covering cable and inserted through the support pipe, one end side of the microphone cable being brought into the unit holder.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: March 24, 2015
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 8983552
    Abstract: A battery powered electronic device (1) comprising a housing (2) and a movable part (3) extending from the housing (2). The movable part (3) is movably attached to the housing (2), such that it can be moved between a compact position and an extended position. The electronic device comprises a switch, which is adapted to sense, whether the movable part (3) is in the compact position or not, and the switch is utilized to switch the electronic device (1) On, when the movable part (3) is in the extended position, and Off, when the movable part (3) is in the compact position. The electronics of the device (1) is adapted to be set to off or into a low-power shipping mode, all though the movable part (3) is in the extended position.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: March 17, 2015
    Assignee: GN Netcom A/S
    Inventors: Peter Birk Andersen, Michael Hoby Andersen, Tommy Sorensen, Jes Lundberg, Carsten Jurs
  • Patent number: 8983107
    Abstract: A silicon based capacitive microphone includes a printed circuit board, a shell mounted on the printed circuit board and forming a receiving space together with the printed board, a chamber support located on top of the printed circuit board and received in the receiving space, a transducer unit and a controlling chip respectively mounted on the chamber support, wherein the chamber support forms a first chamber together with the printed board, the chamber support includes an opening, the transducer unit is provided with a second chamber and covers the opening, the second chamber communicates with the first chamber via the opening.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: March 17, 2015
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Guojun Liu
  • Patent number: 8971552
    Abstract: An electronic device capable of improving the ease of assembling a speaker and a microphone and ensuring the sound insulation for the speaker and microphone with a less number of parts. When the electronic device is assembled, a protrusion portion of the holding member and an elastic member disposed on an upper surface of the speaker are brought in close contact with an upper plate portion of a front cover, whereby a space defined by the protrusion portion, an upper surface of the microphone, and a microphone hole formed surface of the upper plate portion and a space defined by the elastic member, the upper surface of the speaker, and a speaker hole formed surface of the upper plate portion are each isolated and shielded from another space defined inside of the front cover.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: March 3, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideaki Momose, Honkai Tomimoto
  • Patent number: 8965026
    Abstract: Some embodiments herein include at least one of systems, methods, and devices for remote audio capture using a hand-held device. In some embodiments, the device captures, stores, and transmits audio to another device via wireless technologies. In some embodiments, the device may be used either as a hand-held microphone or as a lavaliere microphone.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: February 24, 2015
    Assignee: Canopy Co.
    Inventor: Andrew Charles Kamin-Lyndgaard
  • Patent number: 8948433
    Abstract: Provided is a narrow-angle directional microphone in which a microphone unit is attached to an acoustic tube, the acoustic tube is accommodated a microphone case and which prevents the rattling of components provided in the microphone case and has high mechanical strength. A narrow-angle directional microphone 1 includes a microphone unit 2, an acoustic tube 3 that has an opening formed in a circumferential wall along an axis direction and a rear end to which the microphone unit is connected, a cylindrical microphone case 4 that accommodates the acoustic tube, and fixing means 3a, 4a, 10, and 20a that fix the acoustic tube in the microphone case, with stress being applied to the acoustic tube in the microphone case in the axis direction from the leading end side of the acoustic tube using the rear end of the acoustic tube as a fulcrum.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: February 3, 2015
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Publication number: 20150024807
    Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Inventors: Klaus Elian, Horst Theuss, Thomas Mueller
  • Patent number: 8923528
    Abstract: Apparatus and methods are disclosed for wireless communications using a hearing aid, or other suitable receiver. According to one embodiment, a mobile phone device comprises an LCD display having a substantially planar top viewing surface, a transmitter for outputting an electromagnetic signal to an inductively-coupled hearing aid telecoil receiver, and a layer of austenitic stainless steel forming a support frame for the LCD display. A portion of the transmitter and the layer of austenitic stainless steel are positioned underneath the LCD display, thus providing a compact mobile phone design with negligible impact, or even improvement, of the output electromagnetic signal.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: December 30, 2014
    Assignee: Microsoft Corporation
    Inventor: Glenn S. Arche
  • Patent number: 8913756
    Abstract: A connector with an audio receiving module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio receiving module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio receiving module is contained in the containing space and disposed at a position corresponding to the opening and includes a microphone unit and a plurality of pins, and the microphone unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio receiving effect.
    Type: Grant
    Filed: November 22, 2012
    Date of Patent: December 16, 2014
    Inventor: Nai-Chien Chang
  • Patent number: 8912892
    Abstract: An autonomous and controllable system of sensors and methods for using such a system of sensors are described.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: December 16, 2014
    Assignee: California Institute of Technology
    Inventors: Faranak Davoodi, Neil Murphy, Farhooman Davoudi
  • Publication number: 20140348370
    Abstract: An electronic device is provided. The electronic device includes a case, a microphone array housing consists of a first acoustic extending structure, a second acoustic extending structure, an interface IC, a first membrane and a second membrane. The case includes a first acoustic opening and a second acoustic opening. The first acoustic extending structure is connected to the first acoustic opening. The second acoustic extending structure is connected to the second acoustic opening. The first membrane receives a first acoustic signal via the first acoustic opening and the first acoustic extending structure. The second membrane receives a second acoustic signal via the second acoustic opening and the second acoustic extending structure.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Applicant: Fortemedia, Inc.
    Inventors: Yen-Son Paul HUANG, Iou-Din Jean CHEN, James Juei Son LIN
  • Patent number: 8885864
    Abstract: A hearing aid (1) comprises a housing, two microphones (3, 4), signal processing means provided with user selectable settings, and a receiver. The housing is provided with mechanical sound generating means (5, 11). The sound generating means is capable of providing a specific sound when manipulated by a hearing aid user. The sound generating means is arranged such that the two signals (25), obtained from the specific sound being recorded by the two different microphones (3, 4) will have a negative correlation, making said specific sound identifiable by said signal processing means. The signal processing means are arranged for selecting a specific setting dependent on one or more sounds generated by the sound generating means (5, 11). The invention further provides a method for selecting a setting of a hearing aid.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: November 11, 2014
    Assignee: Widex A/S
    Inventor: Kristian Timm Andersen
  • Patent number: 8885855
    Abstract: A high directivity boundary microphone (10) is disclosed, build up of a normal unidirectional microphone element (12) with cardioid-directivity behavior. The microphone element (12) is placed on a holder plate (14), with a membrane (16) of the microphone element (12) facing a plane (18) where a holder (20), comprising the holder plate (14) and a holder feet (22), is placed upon. The holder (20) ensures that the microphone element (12) is aligned at an angle (24) of preferably 35° respective to the plane (18). In this position, the microphone element (12) can detect direct sound (26) in a defined speech area (28A, 28B) as well as delayed sound (30) that is reflected at the plane (18) beneath the microphone element (12). Outside the defined speech area (28A, 28B) the sensitivity is strongly reduced.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: November 11, 2014
    Assignee: Robert Bosch GmbH
    Inventor: Aldo Van Dijk
  • Patent number: 8879767
    Abstract: A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: November 4, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Timothy K. Wickstrom
  • Publication number: 20140321687
    Abstract: An acoustic apparatus includes a substrate, micro electro mechanical system (MEMS) die, and an integrated circuit. The substrate includes a permanent opening that extends there through. The micro electro mechanical system (MEMS) die is disposed over the permanent opening and the MEMS die includes a pierce-less diaphragm that is moved by sound energy. A first temporary opening extends through the substrate. The integrated circuit is disposed on the substrate and includes a second opening. The first temporary opening and the second opening are generally aligned. A cover that is coupled to the substrate and encloses the MEMS die and the integrated circuit. The cover and the substrate form a back volume, and the diaphragm separates the back volume from a front volume. The first temporary opening is unrestricted at a first point in time to allow gasses present in the back volume to exit through the temporary opening to the exterior and the pierce-less diaphragm prevents the gasses from passing there through.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 30, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Kurt B. Friel, John B. Szczech
  • Patent number: 8873789
    Abstract: A microphone having an integral ball along the microphone body is mounted in a housing that defines a socket for receiving the ball. The microphone may be articulated on the ball and socket mount and the resistance to the articulation force may be varied by tightening and loosening a slotted cap that exerts a spring force on the microphone. The microphone and housing may be mounted to a surface such as a wall or ceiling and plenum ratings may be maintained through ceiling mounts.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: October 28, 2014
    Assignee: Audix Corporation
    Inventor: Fred Bigeh
  • Patent number: 8867773
    Abstract: An audio processing device including a first audio collecting unit configured to convert an audio vibration into an electric signal and acquire an audio signal includes a shielding unit having a predetermined resonant frequency that shields the first audio collecting unit from an influence of airflow outside the device; and an acquiring unit configured to acquire, as a first audio signal, an audio signal in a predetermined frequency band lower than the resonant frequency of the shielding unit from among the audio signal acquired by the first audio collecting unit that is shielded from the influence of the air flow outside the device by the shielding unit.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: October 21, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masafumi Kimura, Fumihiro Kajimura
  • Patent number: 8861764
    Abstract: An enclosure (10) of a microphone unit (1) includes a mounting portion (11) which has a mounting surface (11a) where a first vibration portion (13) and a second vibration portion (15) are mounted and in which, in the back surface (11b) of the mounting surface (11a), a first sound hole (23) and a second sound hole (25) are provided; in the enclosure (10), a first sound path (41) is provided that transmits sound waves input through the first sound hole (23) to one surface of a first diaphragm (134) and that also transmits the sound waves to one surface of a second diaphragm (154) and a second sound path (42) is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm (154).
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: October 14, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Fuminori Tanaka, Takeshi Inoda, Ryusuke Horibe
  • Publication number: 20140301589
    Abstract: A microphone unit is provided which includes a microphone for picking up sound of a unit which sound is to be picked up, a clamping unit having a first end configured to clamp to the unit and a second end for holding the microphone, a contactless vibration sensor configured to detect vibrations of the unit, and an audio gate unit coupled to the output of the microphone and to the output of the contactless vibration sensor as a trigger signal to allow the output of the microphone to be forwarded to an output terminal.
    Type: Application
    Filed: April 5, 2013
    Publication date: October 9, 2014
    Inventors: Andrew Greenwood, Sebastian Chafe, Stefan Thien
  • Patent number: 8842859
    Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: September 23, 2014
    Assignee: Invensense, Inc.
    Inventors: Michael D. Delaus, Kathleen O'Donnell
  • Publication number: 20140270311
    Abstract: A microphone support and enclosing windscreen has microphone supports curving about 270 degrees about an axis with upper and lower fingers to grip the microphone above and below the longitudinal axis of the microphone. The microphone supports move along an upper rail of a connector. First and second cage portions have longitudinal ribs connected to circular rings forming a windscreen support, with base rings on each cage portion connected to a bracket to encircle the microphone and its supports during use. One of the cage portions moves along the connector and rotates to allow access to the microphone.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: M. KLEMME TECHNOLOGY, CORP.
    Inventors: Brenda Klemme Parker, David J. Corey, David J. Fisk, Steve Ouk
  • Patent number: 8818010
    Abstract: Disclosed is a microphone unit comprising a film substrate (1), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (11), including the electrically conductive layers (15, 16), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: August 26, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Takeshi Inoda, Ryusuke Horibe, Fuminori Tanaka, Tomio Ishida
  • Patent number: 8810724
    Abstract: An image-pickup apparatus includes a speaker, a movable barrel having a lens, a fixed barrel where a cam groove engaging with a cam pin provided on the movable barrel and configured to drive the movable barrel is formed on its inner periphery and an exterior part where the fixed barrel is attachable. A sound space is formed by concaving an outer periphery of the fixed barrel, the speaker is arranged so as to cover the sound space, an opening connected with the sound space is formed on the exterior part, and a bottom part of the sound space is located closer to an optical axis of the lens than to the bottom part of the cam groove in the fixed barrel.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: August 19, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Teruaki Ikezawa
  • Publication number: 20140226846
    Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.
    Type: Application
    Filed: April 22, 2014
    Publication date: August 14, 2014
    Inventors: Mark SHEPLAK, David Patrick ARNOLD
  • Patent number: 8804982
    Abstract: A transducer assembly utilizing at least two MEMS transducers is provided, the transducer assembly preferably defining either an omnidirectional or directional microphone. In addition to at least first and second MEMS transducers, the assembly includes a signal processing circuit electrically connected to the MEMS transducers, a plurality of terminal pads electrically connected to the signal processing circuit, and a transducer enclosure housing the first and second MEMS transducers. The MEMS transducers may be electrically connected to the signal processing circuit using either wire bonds or a flip-chip design. The signal processing circuit may be comprised of either a discrete circuit or an integrated circuit. The first and second MEMS transducers may be electrically connected in series or in parallel to the signal processing circuit. The first and second MEMS transducers may be acoustically coupled in series or in parallel.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: August 12, 2014
    Assignee: Harman International Industries, Inc.
    Inventors: Alan Dean Michel, Jeffrey Phillip McAteer, John Charles Baumhauer, Jr.
  • Publication number: 20140211975
    Abstract: One embodiment provides a counterbalancing arrangement, including: a pin arrangement attached to a monopole; the pin arrangement rotating with respect to the monopole such that roll movement of the monopole imparts yaw movement to the pin arrangement; the pin arrangement having a gimbal; a camera mounting platform having an upper and lower surface; the gimbal connecting to the lower surface of the camera mounting platform; the gimbal having a yaw degree of freedom locked with respect to the camera mounting platform; and a counterbalancing arm attached to the camera mounting platform. Other aspects are described and claimed.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 31, 2014
    Inventors: Vincent H. Roberts, Kenneth D. Salter
  • Patent number: 8774440
    Abstract: An air cushioned microphone cable retractor and receptacle assembly for use in controlling the deployment and retraction of a limited length of microphone cable includes a hollow cylindrical housing portion, in which a pulley mounted to a piston is disposed. A microphone cable is connected to the pulley, and then to the microphone, which is configured to reside in a top receptacle when not in use. In use, the microphone may be pulled out and away from the receptacle, at which time air above the piston is permitted to readily escape from above while the overall resistance is determined by operation of a lower relief valve. When the microphone is placed back in the receptacle, the weight of the piston pulls the cable back within the housing, with air venting structure providing an air damping feature to slow the retraction of the cable.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 8, 2014
    Assignee: Xedit Corporation
    Inventor: Claude M Karczmer
  • Patent number: 8765530
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 1, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini