Abstract: A sensor system is located in an environment composed of a first medium, where waves propagate with a first phase velocity, the sensor system including at least one main enclosure and a sensor array with at least two sensors, said sensor array being arranged inside the main enclosure, wherein the space inside the main enclosure between the sensor array and the inner surface of the main enclosure is filled with a second medium, in which waves propagate with a second phase velocity, the second phase velocity being different from the first velocity.

Abstract: An audio apparatus has a housing including a tub-shaped recessed part having an upper surface and a wall surface formed on the upper surface. Microphones are circularly arranged in the vicinity of the wall surface inside the recessed part. Each microphone face toward a center direction of the recessed part and the upper surface so that a sound pick-up directivity is toward the center of the housing. A back side, opposite to the direction having the directivity of each microphone is open acoustically and is directed toward a direction higher than the wall surface of the tub-shaped recessed part.

Abstract: A microphone boom is provided with extendable microphone arrays, and a headset having such a microphone boom. The headset comprise a casing accommodating the signal transmission circuitry and further comprises a speaker adapted to serve a sound signal at the proximity of a users ear and the speaker is protruding from the casing at a speaker-end of the casing and one microphone array is fixated relative to the casing distally with respect to the speaker-end.

Abstract: A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components.

Abstract: As described herein, a sound pickup for musical cymbals includes an integrated assembly attachable to a cymbal stand. The integrated assembly includes a plurality of microphones arranged and electrically connected such that the resulting amplified sound is of optimal quality and of relatively constant loudness regardless of cymbal tilt. In one embodiment, two microphones are used, with the signal phase from one microphone being inverted prior to combination with the signal from the other microphone. The inversion is implemented using an inverter and serves to cancel signals that are in phase with one another and augment signals that are out of phase with one another. This, along with suitable placement of the pickup, exploits the fact that the more desirable components of the cymbal's vibration at the inflection point of the cymbal are out of phase with each other, whereas the less-desirable components are in phase with each other.

Abstract: A wireless communication headset having both wired and wireless modes is provided. The wireless headset can include a headset connector assembly that can be coupled to a cable connector of a cable, which can in turn be connected to a telephone. When the wireless headset is coupled to the telephone, it can advantageously be operable to exchange audio information with the telephone through the cable, receive electrical power from the telephone through the cable, or both. In addition, the cable connector can advantageously be coupled to the wireless headset without obstructing airflow to a microphone that is located in the headset connector assembly, through use of apparatus of the invention located on the cable connector, such as an acoustic tunnel, a microphone-speaker pair, or a microphone that is coupled to control circuitry operable to disable the microphone of the headset.

Abstract: An acoustic assembly includes an upper housing and a lower housing. The lower housing is coupled to the upper housing forming an interior cavity there between. At least one acoustic component is disposed within the cavity. At least one metalized area is formed in the upper housing or the lower housing. The at least one metalized area is in contact with the at least one acoustic component and is configured and arranged to provide an electrical connection between the acoustic component in the cavity and a customer that is exterior to the assembly. The at least one metalized area directly adheres to the upper housing or lower housing.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A system and methods for controlling a mobile electronic device is disclosed. A notification in response to a prescribed event is outputted. A change in a position of the mobile electronic device is detected. A strength of the notification is reduced, when a change in the position of the mobile electronic device is detected while the notification sound is being outputted.

Abstract: Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).

Abstract: A microphone system and microphone mount system integrate upon and into a drum head to efficiently capture various drum sounds. An attachment ring 170 is attached to the perimeter of a void within a drum head. A slide bracket slides 160 into the attachment ring 170. The slide bracket 160 is secured to and is part of a microphone assembly 100. The microphone assembly accommodates flexible goose necks 200 that hold microphone clip adapters to secure additional microphones both interior and exterior to a drum head 300.

Abstract: A unidirectional microphone is provided that has an excellent directional frequency response and a high sensitivity. Sound waves are guided to a rear acoustic terminal 10b of an acoustic resistance tube 30 through an acoustic resistance member 31. A rear end opening 30b of the acoustic resistance tube 30 is blocked so as to prevent the sound waves from entering the rear acoustic terminal 10b from the rear end opening 30b of the acoustic resistance tube 30 on the side of the rear acoustic terminal 10b. A gap G which allows low-frequency sound waves to pass and through which a front acoustic chamber A1 and a rear acoustic chamber A2 in the acoustic resistance tube 30 communicate with each other is provided between the inner peripheral surface of the acoustic resistance tube 30 and the outer peripheral surface of the microphone unit 10.

Abstract: An implantable microphone, comprising a source of incoherent light, a light detector for outputting a signal corresponding to the total light intensity impinging onto a detector surface, a housing for housing the light source and the detector, and a sensor membrane for being exposed to surrounding soft tissue, the membrane being arranged to seal an opening of the housing and comprising reflector means provided at the inner side of the sensor membrane for reflecting light from the light source onto the detector in manner that the total light intensity reflected onto the detector varies as a function of the position of the reflector means relative to the detector.

Abstract: A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.

Abstract: A microphone having an integral ball along the microphone body is mounted in a housing that defines a socket for receiving the ball. The microphone may be articulated on the ball and socket mount and the resistance to the articulation force may be varied by tightening and loosening a slotted cap that exerts a spring force on the microphone. The microphone and housing may be mounted to a surface such as a wall or ceiling and plenum ratings may be maintained through ceiling mounts.

Abstract: Systems and methods for enhancing performance of a microphone are disclosed. An airflow control system may include a block-shaped structure and an airflow impedance element residing within a cavity of the block-shaped structure. The airflow impedance element may be formed by filling the cavity with a plurality of pre-processed airflow impedance elements and sintering these elements, and may include a plurality of non-linear pathways. The plurality non-linear pathways may both impede airflow therethrough (e.g., when a force exerted by the airflow exceeds a predetermined amount) and pass sound that may match a frequency response of a microphone without substantially affecting the amplitude and frequency characteristics of the sound.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer 52 is mounted on a top surface of a circuit board 43, and an acoustic sensor 51 is mounted on the top surface thereof. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52, and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51, the interposer 52 and the like are covered by a cover 42 put on the top surface of the circuit board 43. In the cover 42, a sound introduction hole 48 is opened in a position opposed to the front chamber of the acoustic sensor 51. The interposer 52 is formed with a ventilation notch 71 for acoustically communicating a space below a diaphragm 56 of the acoustic sensor 51 with a space inside the cover 42 and outside the interposer 52.

Abstract: A microphone assembly is operable to be removably attached to a surface. The microphone assembly includes a microphone and a microphone support that operably supports the microphone. The microphone assembly further includes a coupling assembly that is operable to removably connect the microphone support to the surface. The coupling assembly includes at least one magnet that magnetically and removably attaches the microphone support to the surface.

Abstract: Provided is a portable terminal including a microphone hole formed to perforate from an outer wall of a housing to an inner wall of the housing, a duct groove extending from an inner side of the housing and being open on a top surface thereof, a microphone holder coupled with the top surface of the duct groove, and a microphone coupled with the microphone holder, in which a duct connected to the microphone hole is formed by coupling the microphone holder with the duct groove, and the microphone is connected with the microphone hole through the duct. The duck is formed by coupling the duct groove formed in the housing of the terminal with the microphone holder coupled with the microphone, thereby smoothly delivering input sound such as user's voice to the microphone and contributing to the slimness of the terminal.

Abstract: A MEMS microphone having an improved noise performance due to reduced DC leakage current is provided. For that, a minimum distance between a signal line of the MEMS microphone and other conducting structures is maintained. Further, a DC guard structure fencing at least a section of the signal line is provided.

Abstract: According to one embodiment, a sound collector includes a housing and a microphone holding member. The housing includes an opening portion. The opening portion is configured to receive a sound wave having a path. The housing is configured to be tightly closed except the opening portion. The microphone holding member is configured to be provided in the housing and hold a microphone that receives the sound wave propagating through the path at a predetermined position.

Abstract: A capacitor microphone includes: a capacitor microphone unit; a microphone casing that incorporates the microphone unit and is provided with an opening communicating with a rear acoustic terminal of the microphone unit; and a shield plate that covers the opening in the microphone casing from inside of the microphone casing. The shield plate has a projection extending towards axial direction of the microphone casing at least on microphone unit side in the axial direction of the microphone casing. The projection is folded to be pressed firmly against the outer surface of a casing of the capacitor microphone unit. The shield plate is rolled into a cylindrical shape and is in contact with the inner surface of the microphone casing with pressure.

Abstract: An acoustically isolated support and handle system for a sound pickup system includes vibrationally isolated, releasable connections for an adjustable microphone adapter in front of the reflector and for a pair of support handles and optionally a universal mounting bracket at the rear of the reflector. The handles provide a connection bracket for the optional use of a neck strap that would allow an operator to shift at least a portion of the weight of the device to the operator's neck and back while also providing the option for handheld aiming.

Abstract: A cap body 3 is provided for covering a housing of a microphone body 2. The cap body 3 has an insertion hole 32 into which the housing is inserted, sound collecting holes 31a and 31b through which the exterior of the cap body 3 is in communication with the insertion hole 32. While the housing is inserted into the insertion hole 32, a sound collector 21 lies in the insertion hole 32, and the axis line direction of the sound collecting holes 31a and 31b are different from the directive axis of the microphone body 2 of which the housing is inserted in the insertion hole 32.

Abstract: A rigid, flat plate diaphragm for an acoustic device is illustrated. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing its response to not be adversely affected by fabrication stresses and causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible.

Abstract: A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm.

Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

Abstract: A device for isolating a microphone from vibrations, the device comprising a frame comprising a plurality of surfaces, the plurality of surfaces laying on a plane that is different from each other and defining at least one mounting point; at least one non-resonant cord attached to the mounting point of the frame, the non-resonant cord adapted to support a microphone and absorb vibration; and a biasing device connected to the non-resonant cord, the biasing device adapted to provide tension to the non-resonant cord.

Abstract: Provided is a microphone unit having flat frequency characteristics. A microphone unit includes a casing, a first substrate, a second substrate, a vibrating unit, a diaphragm, an ASIC, and a dummy component. The dummy component is attached to the substrate to be located below an opening.

Abstract: In an audio signal transmission/reception device that receives and emits sounds so as to perform transmission and reception of audio signals via communications, user operability can be improved and the size of a main unit can be reduced. It is equipped with a speaker array for arranging a plurality of speaker units, which are arranged on the lower surface of the main unit, and a microphone array for arranging a plurality of microphones, which are arranged on the side surface of the main unit in its longitudinal direction. Legs having hollow structures are attached to the main unit so as to support the main unit at a prescribed height above the mount surface (e.g., the surface of a desk) and to secure good sound emission characteristics of the speaker array.

Abstract: A microphone unit comprises a microphone, leg members and a base. The microphone comprises a diaphragm for detecting sound and a housing for containing the diaphragm. The leg members project outwardly from a rear wall of the housing, and are provided near a second through-hole which connects a second inner space to outer space. The base is connected to the leg members to form a gap between the housing and the base. When the microphone unit thus formed in a simple structure and reduced thickness is mounted in a product, the gap allows the outer space to be connected to the second inner space through the second through-hole, making it possible to efficiently guide sound to the second inner space and obtain good differential characteristics.

Abstract: A microphone with an offset acoustic channel. The microphone includes an external case, an acoustic chamber enclosure within the external case, a microphone transducer positioned within the acoustic chamber enclosure, and a gasket positioned between the external case and the acoustic chamber enclosure. A first opening in the external case is positioned an offset lateral distance from a second opening in the acoustic chamber enclosure. An acoustic channel is formed in the gasket extending from the first opening to the second opening along the offset lateral distance.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Abstract: An air cushioned microphone cable retractor and receptacle assembly for use in controlling the deployment and retraction of a limited length of microphone cable includes a hollow cylindrical housing portion, in which a pulley mounted to a piston is disposed. A microphone cable is connected to the pulley, and then to the microphone, which is configured to reside in a top receptacle when not in use. In use, the microphone may be pulled out and away from the receptacle, at which time air above the piston is permitted to readily escape from above while the overall resistance is determined by operation of a lower relief valve. When the microphone is placed back in the receptacle, the weight of the piston pulls the cable back within the housing, with air venting structure providing an air damping feature to slow the retraction of the cable.

Abstract: Provided is an integrated gooseneck condenser microphone including a microphone unit and an output module which are connected to each other. The gooseneck condenser microphone can improve the connection strength of a microphone housing and prevent the generation of noise due to disturbance electromagnetic waves. The gooseneck condenser microphone includes a connection member 20b which is provided at the rear end of a shielded housing 20a and into which the leading end of a supporting pipe 30 is inserted and an electrical insulating member 6 that is interposed between the connection member and the supporting pipe and electrically insulates the connection member from the supporting pipe. A groove portion 5 is formed in the inner circumferential surface of the connection member along the circumferential direction, and the leading ends of the supporting pipe and the electrical insulating member inserted into the connection member are fitted to the groove portion while the diameters thereof are expanded.

Abstract: A microphone unit is provided with an electroacoustic conversion portion that includes a diaphragm vibrated by sound pressure and that converts the sound pressure into electrical signals and a board on which the electroacoustic conversion portion is mounted. In the board, there are provided a board opening portion that is formed to face the diaphragm and locating walls that come in contact with the electroacoustic conversion portion to locate the electroacoustic conversion portion.

Abstract: A boundary microphone is provided to effectively reduce noises caused by external electromagnetic waves by providing electrostatic shielding, including on the portion of lead wires from a microphone unit to a circuit board. The boundary microphone has a base plate, a cover, a circuit board, and a microphone unit mounted in the opening with a metallic holder. A shield pattern for electrostatically shielding inside of the recess with the base plate is formed on the circuit board. The holder is configured to include a cylindrical section into which a rear end side of the microphone unit is fitted, and a D-cut section in which a part of a circumferential surface and a base surface of a cylinder with a base integral with the cylindrical section are cut away in parallel to a board surface of the circuit board, and the lead wire is routed within the D-cut section.

Abstract: An implantable microphone is disclosed having an external diaphragm and housing that forming chamber capable of being pressurized by deformational movement of the diaphragm induced by pressure waves (e.g., acoustic signals) propagating through overlying tissue. The chamber is shaped such that the volume of the chamber upon deflection of the diaphragm is reduced compared to a static volume of the chamber (i.e., volume of the chamber with no diaphragm deflection). As a result, the change in pressure within the chamber for a given diaphragm displacement is greater than it would be within a chamber having a cylindrical volume, leading to greater microphone sensitivity. In one arrangement, the chamber is shaped such that it is deeper at its center than at its edges, for example, to form a conical or paraboloidal volume.

Abstract: A headset includes a wearable body, first and second earphones extending from the wearable body, controls for controlling an external communication/multimedia device wirelessly, a microphone for picking up vocal data from a user of the headset system and a signal processing unit. The signal processing unit includes circuitry for processing the vocal data into a distinctly audible vocal feedback signal, circuitry for enhancing the vocal feedback signal thereby producing an enhanced vocal feedback signal and circuitry for mixing the enhanced vocal feedback signal with audio signals originating from the external communication/multimedia device, thereby producing a mixed output signal and then sending the mixed output signal to the user via the earphones. The external communication/multimedia device comprises a vocal command application and the headset further comprises a vocal command control for sending vocal commands to the external communication/multimedia device and to the vocal command application.