Mounting Or Support Patents (Class 381/361)
  • Patent number: 8488777
    Abstract: The disclosure provides a microphone coupler system for a microphone mounted on a printed circuit board (PCB) for a communication device. The system comprises a boot assembly to enclose the microphone and to direct acoustic signals to the microphone within the communication device, the boot assembly having a coupling section shaped to hold the microphone with the aperture facing upward from the PCB and an elongated section extending from the coupling section. In the system, an acoustic channel for the microphone is formed in part by the boot assembly when the boot assembly is mounted over the microphone. The system may further comprise a platform having an aperture, the platform for mounting on the PCB over the microphone.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: July 16, 2013
    Assignee: Research In Motion Limited
    Inventors: Larry Hawker, George Mankaruse, James Infanti
  • Patent number: 8467558
    Abstract: There is provided a dynamic microphone in which vibration noise generated by the rolling of a microphone unit caused by a vibration component perpendicular to the principal axis direction of the microphone is reduced effectively. In the dynamic microphone including a microphone unit 110, an inner cylinder 120 having a back air chamber in the structure thereof constituting a microphone body 10 together with the microphone unit 110, and a microphone casing 20 serving as an outer cylinder, in which a part of the inner cylinder 120 of the microphone body 10 is supported by a floating type vibration-proof structure using an elastic member 30, a weight 40 for causing the center of gravity O of the microphone body 10 to coincide with a supporting point S using the elastic member 30 is attached to the inner cylinder 120 so as to be preferably movable.
    Type: Grant
    Filed: April 11, 2011
    Date of Patent: June 18, 2013
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Shioto Okita
  • Patent number: 8463334
    Abstract: A wideband voice electro-acoustic apparatus for a wireless telephone, including a mouthpiece for a wireless telephone. The mouthpiece has a wideband voice frequency response/passband in the frequency range of 200 Hz to 7000 Hz. The apparatus also includes an earpiece for a wireless telephone. The earpiece has a wideband voice passband in the frequency range of 200 Hz to 7000 Hz. The wideband voice electro-acoustic apparatus improves the voice quality of wireless voice band communication over that available using a conventional wireless telephone having an electro-acoustic passband smaller than 200 Hz to 7000 Hz.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: June 11, 2013
    Assignee: QUALCOMM Incorporated
    Inventor: Louis Dominic Oliveira
  • Publication number: 20130142374
    Abstract: A microphone assembly, in which a microphone component and an ear set component are formed on the same printed circuit board, and a method of manufacturing the microphone assembly. In the microphone assembly, one electrode of a power supplier is connected to a diaphragm assembly through a grounding pattern of the PCB and a mike cell case and the other electrode of the power supplier is supplied to a back electrode plate through a conductive member to charge two electrodes. When an acoustic signal is input to the mike cell unit, the diaphragm assembly vibrates, and thus, an electrostatic capacity of the mike cell unit changes. The acoustic signal is transmitted to a field effect transistor (FET) mounted outside the mike cell unit along a signal pattern of the PCB and is processed by the FET.
    Type: Application
    Filed: June 21, 2012
    Publication date: June 6, 2013
    Applicant: BSE CO., LTD.
    Inventors: Dong Sun LEE, Hyoung Joo KIM
  • Patent number: 8457342
    Abstract: A differential microphone includes a housing having a first space and a second space formed therein, and a first diaphragm arranged within the housing. A first opening connecting the first space to outside and a second opening connecting the second space to the outside are formed in the housing. A dimension of the first opening and the second opening in a first direction perpendicular to a straight line passing through centers of both openings is longer than a dimension of the first opening and the second opening in a second direction parallel to the straight line passing through the centers of both openings.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: June 4, 2013
    Assignees: Funai Electric Co., Ltd., Funai Electric Advanced Applied Technology Research Institute Inc.
    Inventors: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda, Rikuo Takano, Kiyoshi Sugiyama, Toshimi Fukuoka, Masatoshi Ono
  • Patent number: 8448326
    Abstract: An electret accelerometer is provided in which a diaphragm, an electret, a back plate and an electronic circuit are placed in a casing and the casing is sealed to isolate the diaphragm from external acoustic signals.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: May 28, 2013
    Assignee: Microsoft Corporation
    Inventor: Michael J. Sinclair
  • Patent number: 8447057
    Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package substrate having an acoustic pathway therethrough that opens to an interior of the device. A MEMS microphone die having an integrated filter and a movable membrane is positioned within the interior of the device. The package substrate includes a conductive layer facing the interior of the device, and a package filter formed from the conductive layer is provided along the acoustic pathway, resulting in increased packaged MEMS microphone device yield.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: May 21, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Thomas Goida, Jicheng Yang, Woodrow Beckford
  • Publication number: 20130121523
    Abstract: Electric components and methods of manufacture are specified. An electric component comprises a carrier having a recess which penetrates the carrier and also a first chip and external contact area. The first chip is arranged in the recess in the carrier. The external contact area is provided for connecting up the first chip to an external circuit environment.
    Type: Application
    Filed: May 16, 2011
    Publication date: May 16, 2013
    Applicant: Epcos AG
    Inventor: Wolfgang Pahl
  • Patent number: 8441515
    Abstract: Embodiments of the present disclosure generally include a method and apparatus for minimizing acoustic echo in video conference. In one embodiment, a computer implemented method for minimizing acoustic echo in video conferencing comprises determining position information wherein the position information is derivable from a video stream and processing the position information using a computer to identify at least one direction wherein the one direction minimizes acoustic echo.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: May 14, 2013
    Assignee: Sony Corporation
    Inventor: Eric Yam
  • Patent number: 8442256
    Abstract: A base having a flat shape; a support provided on a bottom surface of the base; a microphone unit incorporated in the base and converts sound into an electric signal; and a pressure sensitive switch with which an output signal from the microphone unit is turned on and off are included. At least one such pressure sensitive switch is provided to be pressed between the base and the support.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: May 14, 2013
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Satoshi Yoshino
  • Patent number: 8438710
    Abstract: A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: May 14, 2013
    Inventor: Gang Li
  • Patent number: 8437490
    Abstract: A video teleconferencing directional microphone has two surfaces joined with an angle of 90° relative to each other, a first omni directional microphone element arranged adjacent to the intersection between the two surfaces. The ceiling microphone assembly also includes a second omni directional microphone element arranged at a predetermined distance (d) from both surfaces. A subtractor subtracts the output of the first microphone element from the output of the second microphone element, and the output of the subtractor is equalized by an equalizer (Heq) to generate an equalized output. The surfaces and subtractor generates a quarter toroid directivity pattern for the ceiling microphone assembly. The quarter toroid sensitivity pattern increases sensitivity in the direction of a sound source of interest, but reduces sensitivity to any sound waves generated by noise sources at other locations or reverberations.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Cisco Technology, Inc.
    Inventor: Trygve Frederik Marton
  • Patent number: 8433089
    Abstract: A microphone unit is disposed in the inside of a first housing of a voice input apparatus. The microphone unit includes: a second housing; a diaphragm which is disposed in the inside of the second housing; and an electric circuit portion which processes an electric signal that is generated based on a vibration of the diaphragm. In the voice input apparatus, a first sound guide space which guides a sound outside the first housing to a first surface of the diaphragm and a second sound guide space which guides a sound outside the first housing to a second surface of the diaphragm are formed. The electric circuit portion is disposed in either one of the first sound guide space and the second sound guide space; and an acoustic resistance portion which adjusts at least one of a frequency characteristic of the first sound guide space and a frequency characteristic of the second sound guide space is formed.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: April 30, 2013
    Assignees: Funai Electric Co., Ltd., Funai Electric Advanced Applied Technology Research Institute Inc.
    Inventors: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda, Masatoshi Ono, Rikuo Takano, Toshimi Fukuoka
  • Patent number: 8406446
    Abstract: A microphone includes: a housing that serves as a microphone grip; a microphone unit supported at one end of the housing; an air chamber provided behind the microphone unit in the housing. The air chamber is filled with a plurality of elastic particles. The individual particles are mechanically bonded to one another and part of the particles are mechanically bonded to the housing such that gaps are formed therebetween.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: March 26, 2013
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Publication number: 20130070951
    Abstract: An enclosure (10) of a microphone unit (1) includes a mounting portion (11) which has a mounting surface (11a) where a first vibration portion (13) and a second vibration portion (15) are mounted and in which, in the back surface (11b) of the mounting surface (11a), a first sound hole (23) and a second sound hole (25) are provided; in the enclosure (10), a first sound path (41) is provided that transmits sound waves input through the first sound hole (23) to one surface of a first diaphragm (134) and that also transmits the sound waves to one surface of a second diaphragm (154) and a second sound path (42) is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm (154).
    Type: Application
    Filed: May 27, 2011
    Publication date: March 21, 2013
    Applicant: FUNAI ELECTRIC CO., LTD.
    Inventors: Fuminori Tanaka, Takeshi Inoda, Ryusuke Horibe
  • Patent number: 8385567
    Abstract: There is provided a condenser microphone of a type such that a microphone cable is directly drawn into a microphone casing, in which the electromagnetic shieldability of a microphone cable draw-in portion can be enhanced, and the microphone cable can be fixed easily.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: February 26, 2013
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 8385569
    Abstract: An acoustic transducer unit includes a first member having a recess, and a plate-like second member having main surfaces. The second member is bonded to the first member so as to cover the recess and form a housing. A microphone element, which is an acoustic transducer, is accommodated in an internal space of the housing, and an acoustic path is provided between the internal space and an external space of the housing. A conductive electromagnetic-shielding member and terminal members for electrically connecting the microphone element and an external circuit are embedded in a resin body of the first member by insert molding. An electromagnetic shield layer of the second member is electrically connected to the electromagnetic-shielding member.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: February 26, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoru Hachinohe, Takahiro Oguchi
  • Publication number: 20130034257
    Abstract: A MEMS microphone. The MEMS microphone includes a substrate, a transducer support that includes or supports a transducer, a housing, and an acoustic channel. The transducer support resides on the substrate. The housing surrounds the transducer support and includes an acoustic aperture. The acoustic channel couples the acoustic aperture to the transducer, and isolates the transducer from an interior area of the MEMS microphone.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Applicant: ROBERT BOSCH GMBH
    Inventors: Andrew J. Doller, Michael Peter Knauss, Philip Sean Stetson
  • Patent number: 8369555
    Abstract: Electronic devices and microphone devices are described.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: February 5, 2013
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: R. Shane Fazzio, Atul Goel
  • Patent number: 8369544
    Abstract: A microphone component that may be used in many types of enclosures for making contact with a living body for picking up body sounds. Piezoelectric transflexural diaphragm elements (3, 5, 6) are known; however, they are only useful as microphone elements when the manner of creating electrical contact does not influence their mechanical properties. A microphone component has been developed, which is both rugged and amenable to very inexpensive manufacture. This is obtained using a laminated construction in which a special layer is placed between the piezoelectric transflexural diaphragm element and the electrical interface element.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: February 5, 2013
    Assignee: 3M Innovative Properties Company
    Inventor: Bjoern Knud Andersen
  • Patent number: 8358004
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: January 22, 2013
    Assignee: Knowles Electronics LLC
    Inventor: Anthony D Minervini
  • Patent number: 8351632
    Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: January 8, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Kieran P. Harney, Jason Weigold, Gary Elko
  • Patent number: 8351634
    Abstract: A side-ported MEMS microphone package defines an acoustic path from a side of the package substrate to a microphone die disposed within a chamber defined by the substrate and a lid attached to the substrate. Optionally or alternatively, a circuit board, to which the microphone package is mounted, may define an acoustic path from an edge of the circuit board to a location under the microphone package, adjacent a bottom port on the microphone package. In either case, the acoustic path may be a hollow passage through at least a portion of the substrate or the circuit board. The passage may be defined by holes, channels, notches, etc. defined in each of several layers of a laminated substrate or circuit board, or the passage may be defined by holes drilled, molded or otherwise formed in a solid or laminated substrate or circuit board.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: January 8, 2013
    Assignee: Analog Devices, Inc.
    Inventor: Aleksey S. Khenkin
  • Patent number: 8345911
    Abstract: The present disclosure comprises a compact, sound recording equipment stand, which further comprises a support base, a microphone, a monitor, a sound filter, speakers, a tactile input and lighting source. The stand may additionally comprise a hydraulic pump for raising and lowering various pieces of attached components. In the preferred embodiment, the monitor is built inside a transparent sound filter, placed slightly above head level of an artist. The other components of the stand may similarly be covered in material to maximize sound absorption.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: January 1, 2013
    Inventor: Asaf Fulks
  • Patent number: 8335338
    Abstract: The present invention relates to a loudspeaker in the acoustic field and the information communication field. The invention provides a loudspeaker that can realize a thinner size. To achieve this, the loudspeaker of the present invention is structured so that a part of a diaphragm is inserted to a dent or an opening formed at the center poles of a lower plate of a magnetic circuit. This structure allows the diaphragm to be stored within the height of the magnetic circuit, thus allowing the loudspeaker to have a thinner size.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: December 18, 2012
    Assignee: Panasonic Corporation
    Inventors: Kouzi Sano, Masahide Sumiyama, Takanori Fukuyama, Takeshi Shimokawatoko, Kazutaka Kubo, Satoshi Itoh, Kazuki Honda
  • Patent number: 8331604
    Abstract: According to one embodiment, A microphone-earphone includes a speaker connected to an acoustic device configured to measure acoustic characteristics of a listener's external auditory canal, and configured to output an acoustic signal toward the listener's external auditory canal, a microphone device disposed outside the listener's external auditory canal, an acoustic tube including one end connected to the microphone device and the other end opening to the listener's external auditory canal, and a housing including an opening portion which accommodates the speaker and is so disposed as to guide sound, which is output from the speaker, to the listener's external auditory canal. An inside diameter of the acoustic tube is less than a diameter of the opening portion.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: December 11, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuyuki Saito, Toshifumi Yamamoto, Norikatsu Chiba, Yasuhiro Kanishima, Takashi Fukuda
  • Patent number: 8331601
    Abstract: A housing sub-assembly for mounting a microphone sub-assembly to a vehicle includes, but is not limited to a main body portion that is adapted to be mounted to an interior surface of the vehicle. The main body portion is configured to connect to the microphone sub-assembly and to support the microphone sub-assembly in a position such that a portion of the microphone sub-assembly protrudes beyond an end of the main body portion when the main body portion is connected to the microphone sub-assembly.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: December 11, 2012
    Assignees: General Motors LLC, GM Global Technology Operations LLC
    Inventors: Jesse T. Gratke, Darryl T. Fornatoro
  • Patent number: 8320600
    Abstract: A communication system is provided for a patient featuring a cushion with an opening for receiving the face of the patient. The cushion includes a microphone for receiving audible signals from the patient and one or more speakers for delivering audible signals to the patient. The microphone and speaker(s) are integrated with the cushion to avoid interfering with the comfort of the patient. In one embodiment, the audible signals are delivered to and from the patient via a communication port. In another embodiment, the system includes a display device, so the patient may view parts of the patient's body on the device and then communicate with system operators through the microphone and speaker(s).
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: November 27, 2012
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Todd K. Whitehurst, Rafael Carbunaru, Kristen Jaax, James Makous, Courtney Lane, Mark Pierre, Cliff Brainard, Charles Tilden Hagan, IV
  • Publication number: 20120288130
    Abstract: A microphone arrangement includes a housing having a sound hole, a first input audio transducer with a first sensitivity and a second input audio transducer with a second sensitivity. In this microphone arrangement, the first and the second input audio transducers are arranged in the housing, such that the first input audio transducer is directly acoustically coupled with the sound hole and the second input audio transducer is indirectly acoustically coupled with a sound hole via the first input audio transducer.
    Type: Application
    Filed: May 11, 2011
    Publication date: November 15, 2012
    Applicant: Infineon Technologies AG
    Inventor: Alfons Dehe
  • Patent number: 8311262
    Abstract: A ceiling mount bracket for a loudspeaker. The ceiling mount bracket includes a mounting plate; an assembly to orient the loudspeaker; an assembly to receive audio signals and to provide the audio signals to the speaker; and a wiring block to connect to signal transmission wires. The wiring block includes a first terminal designated for 70/100 volt operation; a second terminal designated for 8 ohm operation; an electrically conductive path from the first terminal to a first pin of the receptacle; and an electrically conductive path from the second terminal to a second pin for the receptacle. The ceiling mount bracket also includes a mounting position for a ceramic connector and thermal fuse. The mounting position includes a threaded hole to accommodate a corresponding threaded extension of the ceramic connector and thermal fuse. The ceiling mount bracket also includes a cover enclosing more than 200 cubic centimeters.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: November 13, 2012
    Assignee: Bose Corporation
    Inventors: Randy J. Kulchy, John W. Mazejka, Robert A. Warden
  • Patent number: 8311256
    Abstract: An application for a music system includes an enclosure and at least one cavity formed in the enclosure. The cavity(s) have side slots sized to interface with a hand of a person and have an opening towards the top. The opening towards the top of each of the cavities is sized to accept and hold a microphone. The cavities are used to carry the system and alternately hold one or more microphones.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: November 13, 2012
    Inventor: Jack Strauser
  • Patent number: 8311255
    Abstract: An electronic device is provided that includes a housing and a connector assembly coupled to the housing. The connector assembly can include a microphone port. The electronic device can further include a microphone mounted within the housing and a channel that fluidically couples the microphone to the microphone port. A joint connector and microphone assembly is also provided. The assembly can include a microphone with a top surface and side surfaces. The top surface of the microphone can include a microphone input. The assembly can include a microphone boot mounted to the microphone such that the boot interfaces with a portion of the top surface and the side surfaces to form a seal around the microphone input. The microphone boot can include a connector sealing portion and an aperture for fluidically coupling the microphone input to a microphone port. The assembly can include a connector plate mounted to the connector sealing portion.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: November 13, 2012
    Assignee: Apple Inc.
    Inventors: M. Evans Hankey, Emery Sanford, Christopher D Prest
  • Patent number: 8306252
    Abstract: Systems and methods are provided for media devices including a housing, a frame disposed adjacent to the housing, and a microphone assembly that is integrated with the frame for receiving sound.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: November 6, 2012
    Assignee: Apple Inc.
    Inventors: Richard Hung Minh Dinh, Tang Yew Tan, Derek Boyd Barrentine
  • Publication number: 20120275633
    Abstract: A system is disclosed for safely and efficiently removing or returning a radio microphone from a mounting surface. The system includes a first magnet attached to the rear side of a radio microphone and a second magnet located at a desired mounting position on the mounting surface. The second magnet preferably includes an outer vinyl layer to prevent breaking or cracking of the first second magnet when returning the radio microphone to its mounting position.
    Type: Application
    Filed: July 13, 2012
    Publication date: November 1, 2012
    Applicant: INNOVATIVE PRODUCTS INC.
    Inventors: Bryan J. Schreiber, Michael J. Tinter
  • Patent number: 8284966
    Abstract: An elastic shield comprising an acoustic channel having a sound inlet and a sound outlet, and a hollow portion being adapted to at least partly surround a miniature microphone, or alternatively, arranged to follow an outer contour of a miniature microphone. The present invention further relates to a miniature microphone assembly comprising a miniature microphone having a sound inlet, and an elastic shield comprising an acoustic channel having a sound inlet and a sound outlet, the elastic shield further comprising a hollow portion housing at least part of the miniature microphone in a manner so that the sound outlet of the acoustic channel is aligned with the sound inlet of the miniature microphone.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: October 9, 2012
    Assignee: Sonion Mems A/S
    Inventors: Christopher Wilk, Bjarke Pihl Bovbjerg, Tapio Juhani Liusvaara
  • Patent number: 8280080
    Abstract: A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: October 2, 2012
    Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
    Inventors: Joel Philliber, John Choy, David Martin
  • Publication number: 20120237073
    Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package substrate having an acoustic pathway therethrough that opens to an interior of the device. A MEMS microphone die having an integrated filter and a movable membrane is positioned within the interior of the device. The package substrate includes a conductive layer facing the interior of the device, and a package filter formed from the conductive layer is provided along the acoustic pathway, resulting in increased packaged MEMS microphone device yield.
    Type: Application
    Filed: March 18, 2011
    Publication date: September 20, 2012
    Applicant: ANALOG DEVICES, INC.
    Inventors: Thomas Goida, Jicheng Yang, Woodrow Beckford
  • Patent number: 8270653
    Abstract: A microphone-unit supporting structure comprises a microphone unit and a holder. The microphone unit includes a substantially-cylindrical microphone element, a printed circuit board fixed to a back of the microphone element, and at least two projections extending radially outward from the printed circuit board and being circumferentially spaced at such an angular interval that when one of the projections is assumed to be on a reference line for line symmetry, the other projection or projections are off the reference line. The holder includes a microphone-unit supporting portion for supporting the microphone unit. The holder has a first groove for receiving first one of the projections, and a second groove for receiving second one of the projections. The first groove is open in a backward direction. The second groove is open in a frontward direction.
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: September 18, 2012
    Assignee: Kabushiki Kaisha Kenwood
    Inventors: Atsuko Yamagushi, Keita Shimizu
  • Patent number: 8270652
    Abstract: A television mount incorporating an integrated audio system. The mount attaches the television to a wall or a pedestal. The mount includes an electronics/subwoofer enclosure. This enclosure house an audio amplifier and a low-range speaker. One or more external speakers are attached to a speaker assembly which is connected to the mount—preferably by attaching the supports to the electronics/subwoofer enclosure. The speaker supports is preferably made adjustable so that the degree of extension from the mount may be adjusted by the user.
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: September 18, 2012
    Assignee: Metra Electronics, Corp.
    Inventors: Douglas G. Caldes, Raymond I. Leake
  • Patent number: 8270651
    Abstract: A system and method for mounting modular audio-visual components on a surface such as a wall. In particular, a modular mounting bar may comprise at least one audio-visual module which may be affixed to a rail configured to be attached to a wall at a plurality of locations along the rail and configured to receive a module at a plurality of locations along the rail. A cover or grille may be configured to be attached in front of the modules.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: September 18, 2012
    Assignee: KSC Industries, Inc.
    Inventors: William A. McCarty, Jeff W. King
  • Patent number: 8254619
    Abstract: An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: August 28, 2012
    Assignee: Lingsen Precision Industries Ltd.
    Inventors: Jen-Chuan Yeh, Jyong-Yue Tian, Kuo-Ting Lee
  • Patent number: 8254618
    Abstract: A microphone which does not need a hanger plate structure is provided. A conductive hanger knob is provided at the back of the rear case of a microphone case. The hanger knob has three layers of a conductive shaft part, an insulator part and a conductive bolt part in the named order from its center. The shaft part is electrically insulated from the bolt part. A notch that locks the bolt part of the hanger knob at a hanger surface is formed at a conductive hanger hook on which the microphone is hooked via the hanger knob. A support spring portion disposed at the back of the hanger surface urges the shaft part of the hanger knob locked at the notch in a direction of pushing the shaft part back toward the hanger surface. This provides electric conduction between the shaft part and the bolt part via the hanger hook.
    Type: Grant
    Filed: October 12, 2009
    Date of Patent: August 28, 2012
    Assignee: Icom Incorporated
    Inventor: Shuichi Babasaki
  • Publication number: 20120207335
    Abstract: A microphone has first and second supports, a MEMS cartridge attached to the first support, at least part of the MEMS cartridge facing an opening in the first support, adhesive attaching the MEMS cartridge to the first support, an AMP/AD device attached to one of the supports, and a first conductor through which the MEMS cartridge electrically communicates with the AMP/AD. A second conductor is provided through which the AMP/AD electrically communicates with the external electrical contact, and a casing is located between and attached to the first and second supports. During operation, the MEMS cartridge receives an acoustic signal and generates a first electrical signal, the AMP/AD receives the first electrical signal from the MEMS cartridge, and the AMP/AD outputs to the external electrical contact a second electrical signal related to the first electrical signal.
    Type: Application
    Filed: February 14, 2011
    Publication date: August 16, 2012
    Applicant: NXP B.V.
    Inventor: Paul T. Spaanderman
  • Publication number: 20120207336
    Abstract: A cap body 3 is provided for covering a housing of a microphone body 2. The cap body 3 has an insertion hole 32 into which the housing is inserted, sound collecting holes 31a and 31b through which the exterior of the cap body 3 is in communication with the insertion hole 32. While the housing is inserted into the insertion hole 32, a sound collector 21 lies in the insertion hole 32, and the axis line direction of the sound collecting holes 31a and 31b are different from the directive axis of the microphone body 2 of which the housing is inserted in the insertion hole 32.
    Type: Application
    Filed: February 15, 2012
    Publication date: August 16, 2012
    Inventors: Noriko Matsui, Hiroshi Akino
  • Patent number: 8238587
    Abstract: The present invention provides an electret condenser microphone including a diaphragm, a frame adapted to affix the diaphragm to, and a backplate positionable inside the frame and opposite the diaphragm with a space reserved therebetween.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: August 7, 2012
    Assignee: Hosiden Corporation
    Inventors: Hideo Yuasa, Hidenori Motonaga
  • Publication number: 20120189151
    Abstract: A rigid, flat plate diaphragm for an acoustic device is illustrated. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing its response to not be adversely affected by fabrication stresses and causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 26, 2012
    Applicant: Research Foundation of State University of New York
    Inventors: Ronald N. Miles, Weili Cui
  • Patent number: 8229153
    Abstract: In one aspect, a boot located inside a mobile device holds a microphone. The boot has a straight, front chamber section whose mouth is aligned (vertically and horizontally) with a microphone-associated, acoustic case opening in a sidewall of the outer housing of the device. In another aspect, the front chamber section is defined by a front sidewall on whose outer surface a circumferential rib is formed. This portion of the boot sidewall is disposed within a tube section (which may be formed in the sidewall of the device's outer case), to form an acoustic seal around the mouth of the boot. Other embodiments are also described.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: July 24, 2012
    Assignee: Apple Inc.
    Inventors: Adam D. Mittleman, Richard P. Howarth, Chad G. Seguin
  • Patent number: 8224012
    Abstract: A microphone assembly includes one or more transducers positioned in a housing. Circuitry is coupled to the transducer for outputting an electrical signal such that the microphone has a main lobe directed forwardly and attenuates signals originating from the sides and/or rear. The transducers can advantageously include multiple transducers, which, with the circuit, produce a desired sensitivity pattern. The microphone assembly can be employed in a vehicle accessory.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: July 17, 2012
    Assignee: Gentex Corporation
    Inventors: Alan R Watson, Robert C Knapp, Robert R Turnbull, William R Spence, G. Bruce Poe, Michael A Bryson
  • Patent number: 8218807
    Abstract: An apparatus that allows a standard straight microphone stand to be used as a boom-style microphone stand is herein disclosed comprising an extender having a tapered cylindrical section that essentially converts the standard straight microphone stand to a boom-type stand. In use, a person would insert the standard microphone into the tapered cylindrical extender while routing the microphone cable through the slot running the length of the cylinder. Next, the small tapered end is then secured to a standard microphone stand using a friction fit to keep it in place. The device therefore provides a useable microphone extension without the possibility of tipping the stand over. The device is to be provided in various lengths suitable to various microphone applications.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: July 10, 2012
    Inventor: Cass R. Johnson
  • Publication number: 20120170785
    Abstract: The present invention discloses a noise-vibration (NV) microphone stand for holding an NV microphone a predetermined distance from a surface that the NV microphone stand is attached to. The NV microphone stand can include a rod having an attachment end that is operable to attach to the surface to be tested and with the rod extending away from the surface. In addition, an arm can be attached to and extend from the rod, the arm having an NV microphone bracket spaced apart from the rod. The NV microphone bracket can have an opening that is dimensioned for the NV microphone to slide therewithin, the opening having a plurality of friction wiper blades that come into contact with the NV microphone when it slides within the bracket.
    Type: Application
    Filed: January 3, 2011
    Publication date: July 5, 2012
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Alberto N. Reginaldo