Abstract: A device for transferring and characterizing objects positions the object on a horizontal work field. The device includes at least one rail extending parallel to the X direction and a displacement unit, movable back and forth in the X direction, having a motorized gripping mechanism for grasping an object. A processor for controlling movements of the displacement unit and actions of the gripping mechanism is distinguished in that the displacement unit includes a carrying device, movable together therewith along the rail, for transferring objects in the X direction. The carrying device is a plate for carrying objects moved onto this carrying plate using the gripping mechanism. According to a method of the invention, objects are moved onto the plate of the carrying device, transferred in the X direction, and deposited again at a second position.

Abstract: There is provided a robot-guidance assembly for providing a precision motion of an object, especially for providing a precision motion of a disklike member such as a wafer, including a robot having at least one robot arm. The at least one robot arm has a free end and a fixed end. The robot can move the free end of the at least one robot arm in at least one moving plane. The assembly also includes a guiding apparatus for precisely guiding the free end of the at least one robot arm in the at least one moving plane. There is also provided a method for inspecting a surface of an object.

Abstract: A method for estimating the effective volumetric capacity of a truck body is provided. The method includes the step of establishing a side-to-side profile of a generic load model. A front-to-rear profile of the generic load model is also established. Load plateau lines having predetermined dimensions are established in the front-to-rear and side-to-side profiles and the height of the plateau lines are determined. A top profile of the generic load is then created and the shape of the load plateau is adjusted into a closed curve shape. The front, rear and side load lines below the final outer boundary of the load plateau are then contoured into a generally conical shaped surface. The final three-dimensional generic load model is formed by where this generally conical shaped surface intersects the sides walls, front and floor of the truck body. The volume of the final three-dimensional generic load model can then be calculated.

Abstract: An object handling apparatus capable of securely holding an object and precisely transferring the held object from a first place to a second place without need of a specific jig for positioning the object on a pallet. A position of an object supplied to the first place is detected by a first visual sensor to obtain a compensation amount for compensating a position displacement of the supplied object. The object is held by a robot hand having position/orientation compensated using the compensation amount and position/orientation of the object held by the robot hand relative to the robot hand is detected by a second visual sensor. A displacement of the position/orientation of the object held by the robot hand from a reference position/orientation is compensated based on the detected position/orientation of the object on the robot hand, so that the object held by the robot hand is precisely moved to have a predetermined position/orientation to be transferred to the second place.

Abstract: A substrate carrying device capable of causing a substrate to float by a gas can be manufactured at a low manufacturing cost and can suppress the consumption of a gas for carrying the substrate.

Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

Abstract: An apparatus for accepting and transferring at least one disk-like member is provided. The apparatus includes a pick- and place-mechanism including gripping means. In effect, the mechanism is adapted to provide pick- and/or place-cycles, which during operation provides a movement of said gripping means between an up and a down position and vice versa, whereby, in the down position, said gripping means either picks the disk-like member from a load position or places the disk-like member onto the load position.

Abstract: An automatic plate feeding system for loading plates of various sizes into a printing plate imaging device, which includes a plurality of trays staggered one on top of the other is provided. At least two of the trays contain plates of different sizes stacked with their sensitive side downward. Separation papers are interposed between the plates. The automatic plate feeding system includes suction cups, which touch the non-sensitive surface of the plate, and a loading mechanism for loading plates from the trays and feeding the loaded plates to the imaging device.

Abstract: To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different positions of the first axis. The plasma cross-section at the level at which the plasma contacts the article is asymmetric so that those points on the article that move at a greater linear velocity (due to being farther from the first axis) move longer distances through the plasma. As a result, the plasma processing time becomes more uniform for different points on the article surface. In some embodiments, two shuttles are provided for loading and unloading the plasma processing system. One of the shuttles stands empty waiting to unload the processed articles from the system, while the other shuttle holds unprocessed articles waiting to load them into the system.

Abstract: A material handling and transport system and process for moving a substrate carrier between storage and processing destinations are provided. The system includes a vehicle that runs on a support structure, such as a pathway or a track assembly supported on the floor, which may be in a pressurized tunnel. A carrier nest on the vehicle receives and supports the carrier. A lifting mechanism on the vehicle vertically raises and lowers the carrier nest. A load port support surface is disposed vertically above the support structure. The carrier is raised through an opening in the load port support surface. A load port nest on the load port support surface receives and supports the carrier adjacent a selected destination. A carrier manipulation mechanism manipulates the carrier over the load port nest. The lifting mechanism then lowers the carrier onto the load port nest. The system is particularly suited for handling and transporting semiconductor wafer carriers.

Abstract: An automated material handling system that includes an extractor/buffer apparatus capable of simultaneously accessing multiple Work-In-Process (WIP) parts, thereby providing a highly efficient interface between WIP storage locations and transport equipment. The extractor/buffer apparatus includes multiple extractor/buffer modules, each module being configured to interface with a location for holding WIP parts that is a number of WIP parts deep. Each module includes a platform for holding multiple WIP parts. Further, multiple modules may be disposed side-by-side to form an extractor/buffer apparatus capable of handling multiple rows of WIP parts.

Abstract: A method for operating a plurality of stockers, comprises the steps of: monitoring utilization of the plurality of stockers, each stocker capable of storing a plurality of wafer, LCD or reticle containers; and automatically transferring a first wafer, LCD or reticle container from a first one of the stockers to a second one of the stockers if the utilization of the first stocker is greater than a predetermined thereshold.

Abstract: A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

Abstract: After a roll supply carriage housing rolls in a light-shielded case is coupled to a film manufacturing apparatus, shutters are opened, and a roll retainer shaft and a roll loading shaft are connected to each other. A motor in a roll transferring apparatus is energized to transfer one of the rolls into the roll transferring apparatus. Then, a rotary table is turned to supply the transferred roll to a given region in the film manufacturing apparatus.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: A wafer monitoring system including a gripper operative to fixedly hold a wafer, a bottom buffering unit comprising at least one supporting element adapted to support a wafer, a top buffering unit comprising at least two supporting elements adapted to support a wafer, a first actuator operative to effect relative movement between at least two supporting elements of the top buffering unit, monitoring apparatus operative to perform processing steps on a wafer while the wafer is held fixed to the gripper, and an actuator operative to effect relative movement between the gripper and the top and bottom buffering units, the top and bottom buffering units being operative to buffer processed and unprocessed wafers thereby to enable a robot to arrive at and leave the monitoring apparatus with at least one wafer thereon.

Abstract: A substrate transport apparatus comprising a drive section and a robot transport arm. The robot transport arm is mounted to the drive section. The robot transport arm has a wrist and an end effector to hold the substrate thereon. The end effector is rotatably mounted to the wrist to rotate about the wrist. The rotation of the end effector about the wrist is slaved to the robot transport arm. The robot transport arm is adapted to transport substrates into and out of two general side-by-side orientated substrate holding areas with the drive section being located in only one location relative to the two holding areas.

Abstract: The invention relates to a particularly effective method for loading and unloading loads in a rack storage facility with several rack bays and aisles which are located between the rack bays. According to the method, a load is transported to a front end of a rack bay and at the front end of the rack bay, is moved in a vertical direction to a target level. The load is then moved into the aisle in a horizontal direction, at the target level. The load is moved in the aisle to a target location at the corresponding target level and then finally out of the aisle and into the rack in a horizontal direction. The invention also relates to a storage loading system for carrying out the inventive method. According to this method, several guiding elements corresponding to the individual levels of the rack bays are provided in the aisles. Moveable transport devices for receiving loads are provided on the guiding elements.

Abstract: A multi-chamber system of an etching facility for manufacturing semiconductor devices occupies a minimum amount of floor space in a cleanroom by installing a plurality of processing chambers in multi-layers and in parallel along a transfer path situated between the processing chambers. The multi-layers number 2 to 5, and the transfer path can be rectangular in shape and need only be slightly wider than the diameter of a wafer. The total width of the multi-chamber system is the sum of the width of one processing chamber plus the width of the transfer path.

Abstract: A substrate processing method comprises stopping the transfer of a head substrate of a succeeding lot for a period which is an integral multiple of a cycle time after a last substrate of a preceding lot is transferred from a cassette section to a processing section by a transfer mechanism, executing dummy dispense of a predetermined time by a solution processing unit during the substrate transfer stop period, and transferring the head substrate of the succeeding lot to the processing section by the transfer mechanism after the dummy dispense.

Abstract: Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and flow diverters positioned within the vacuum plenum that define vacuum distribution channels coupled in fluid communication with vacuum ports of the vacuum chuck. The invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums that are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer. The apparatus of the present invention has particularly utility for securing thin semiconductor wafers with a significant warpage.

Abstract: Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Abstract: A method of changing a width of a variable-width substrate conveyor including a feeding device for feeding a circuit substrate along the guide rails, a pair of guide rails having guide surfaces for guiding the circuit substrate being fed by the feeding device, in a longitudinal direction of the guide rails, and a width changing device for moving the guide rails relative to each other toward or away from each other, to change a distance between the guide rails, wherein an image-taking device is operated to take an image of a portion of at least one of the guide rails, and the width changing device is controlled on the basis of the image taken by the image-taking device.

Abstract: A plasma treatment system in which untreated workpieces are serially received one at a time on an infeed table but stored in parallel on the infeed table. The untreated workpieces are transferred simultaneously, in parallel, into a plasma treatment chamber. Thereafter, treated workpieces are transferred simultaneously, in parallel, out of the plasma treatment chamber onto an outfeed table; and the outfeed table serially discharges the treated workpieces one at a time from the outfeed table.

Abstract: A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a corresponding plurality of mounter heads, and then placing the electrical components onto the printed circuit board with the mounter heads. The mounter heads are arranged so that they can move with respect to each other in both the X and Y directions, which allows the mounting device to mount a plurality of electrical components onto the printed circuit board substantially simultaneously, thereby reducing the amount of time required to produce a finished PCB. In some embodiments of the invention, the printed circuit board may be moved from a first position at which a first mounting head mounts electrical components onto the printed circuit board to a second mounting position at which a second mounting head mounts electrical components on the printed circuit board.

Abstract: A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section.

Abstract: A method for providing distributed material management and flow control in an integrated circuit (IC) factory. The IC factory comprises a factory stocker, a plurality of process bays and a factory transport agent for moving wafer cassettes between the bay and the stocker. Each of the bays comprises a bay stocker, a plurality of tools, a mini-stocker and a bay transport agent for moving wafers amongst the bay components. The apparatus uses partitioned stockers to facilitate deadlock avoidance or deadlock resolution. Additionally, various algorithms are used to detect wafer cassette movement situations where deadlocks may result from a wafer cassette movement within a bay and for resolving deadlocks when they occur.

Abstract: A semiconductor process apparatus and a SMIF pod used therein. The semiconductor process apparatus comprises a first support, a second support, and a SMIF pod. The first support includes a first pin and a first rotating device, and the first pin is rotated by the first rotating device in a first direction. The second support includes a second pin and a second rotating device, and the second pin is rotated by the second rotating device in a second direction opposite the first direction. The SMIF pod includes a base and a cover. The base includes a slot and an engaging member, and the cover defines a hole for the engaging member to be inserted into. The first pin is inserted into the slot when the SMIF pod is disposed on the first support, and the slot is rotated by the first pin in the first direction so that the engaging member is withdrawn from the hole.

Abstract: A workpiece handling system with dual load locks, a transport chamber and a process chamber. Workpieces may be retrieved from one load lock for processing at vacuum pressure, while workpieces are unloaded from the other load lock at the pressure of the surrounding environment. The transport chamber has a transport robot with two arms. Processed workpieces and new workpieces may be exchanged by a simple under/over motion of the two robot arms. The transport robot rotates about a central shaft to align with the load locks or the process chamber. The robot may also be raised or lowered to align the arms with the desired location to which workpieces are deposited or from which workpieces are retrieved. The two load locks may be positioned one above the other such that a simple vertical motion of the robot can be used to select between the two load locks. The two load locks and transport robot allow almost continuous processing.

Abstract: A robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted onto a moveable member, and the assembly facilitates substrate transfers, such as removal of a processed substrate and insertion of an unprocessed substrate within a processing chamber through a single entry of the robot blade into the processing chamber.

Abstract: A closure assembly is described which includes a plurality of inflatable seals, a sliding door, and a frame configured to allow said door to slide back and forth therein. The sliding door includes a first portion having an opening therethrough and a second solid portion. The door further include a plurality of grooves, one plurality encircling the opening in the first portion and second plurality encircling the second portion. The inflatable seals are configured to fit into at least one of the grooves encircling each portion. The frame has a middle opening which can be aligned with the first portion of the door for allowing objects to pass through. The frame also has a top opening and a bottom opening which allows changing of the inflatable seals without removing the door from the frame. The assembly provides for a sealing of either portion of the door around the middle opening of the frame.

Abstract: In a soft contact lens manufacturing process, an injection molding machine (IMM) produces many thermoplastic injection molded front curve (FC) and back curve (BC) mold parts, each of which mold parts is subsequently used only once to mold a single soft contact lens. An inlay station with alignment assemblies and transfer tubes provide for the precise transfer to and alignment of the FC and BC molds in pallets during their transfer from the IMM to pallets on an assembly line in a high speed automated commercial production operation. A rotatable FC transfer arm and a rotatable BC transfer arm transfer the FC and BC molds from the IMM machine to the pallets in an inlay station. The precisely aligned transfer is provided by two alignment rods of an alignment assembly which pass through two alignment apertures in the pallet and then pass through two alignment apertures in one of the FC or BC alignment arms.

Abstract: In a device according to the invention for the automatic charging of processing stations (1) with printing cylinders (9) a number of charging stations (2) is provided, each being designed as input location for entering the printing cylinder (9) into the device, as storing location for storing the printing cylinder (9) before and after processing, and as output location for delivering the printing cylinder (9) from the device after processing. The printing cylinders (9) may each be supplied to the processing station (1) by means of a crane (3) without being required that the operator must wait at the device until the crane has terminated its operation.

Abstract: Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Abstract: A method for transferring one or more substrates or masks in a storage box to an apparatus for handling, processing or using the substrates or masks or vice versa, the storage box including a cover having an openable cover part. The method includes providing the storage box onto an openable wall part of a wall of an enclosed protective environment of the apparatus such that the openable cover part overlaps the openable wall part, the protective environment being adapted to be filled with an inert gas or to be evacuated; opening the openable cover part and the openable wall part, whereby the cover of the storage box forms part of the wall of the protective environment and an inside of the storage box becomes part of the protective environment; and transferring at least one of the substrates or masks from an inside space of the storage box to an inside space of the protective environment, or vice versa.

Abstract: A processor for processing articles, such as semiconductor wafers, includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. An article extraction mechanism adapted to seal with the pod removes articles from the pod without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism adapted to seal with a pod in the interface section. The article insertion mechanism allows insertion of the articles into the pod after processing by at least one processing station.

Abstract: The present invention generally provides a processing system having a robot assembly which includes a multiple sided robot blade that can support a substrate on at least two sides thereof and associated methods to transfer one or more substrates in a processing system. An unprocessed substrate can be supported on the blade while a processed substrate is retrieved from a location to which the unprocessed substrate is to be delivered. The processing throughput rate is increased by reducing the movements required by the robot to exchange processed substrates and unprocessed substrates, thus decreasing the swap time.

Abstract: In a tray feeder, in which a drawing section draws a palette from a container and supplies the palette to a pick-up point where a pick-up head of a parts-mounting-apparatus picks up parts, the head starts lowering and halts at a stand-by position before the palette held by the drawing section arrives at the pick-up point. When the drawing section arrives at the pick-up point, the head lowers again from the stand-by position. This mechanism reduces a time necessary for picking up a part.

Abstract: Apparatus and methods for a wafer handling system that manipulates semiconductor wafers. The present invention includes an end effector having a vacuum chuck, an internal vacuum plenum, and a plurality of flow diverters positioned within the vacuum plenum to define vacuum distribution channels in fluid communication with respective vacuum ports of the vacuum chuck. The present invention also includes a vacuum chuck having flow diverters positioned in one or more internal vacuum plenums which are in fluid communication with the vacuum ports of the vacuum chuck. The flow diverters of the vacuum chucks adjust the vacuum pressure supplied to the vacuum ports such that, as vacuum ports are occluded by the wafer, the vacuum pressure is preferentially applied to unblocked vacuum ports for increasing the attractive force applied to unengaged portions of the wafer.

Abstract: A device for transporting cartridges comprises a housing for holding a plurality of cartridges in a temperature controlled environment. A transport system is also provided and has a grasping mechanism for grasping one of the cartridges. The transport system is further used to remove the cartridge from the housing and to place the cartridge into a scanner.

Abstract: A robotic semiconductor handling system includes two robot arms for transferring substrates between processing, cooling, and storage stations. The first robot arm has a paddle-type end effector adapted such that it can support one substrate at a primary location as well as a second substrate at a secondary staging location. The second robot arm is a Bernoulli-style wand that transfers a substrate from the primary location to the secondary one, and transfers substrates from either location to the process chamber. The use of the dual-location paddle allows for a significant reduction in cycle-time over a single paddle location and a Bernoulli wand system.

Abstract: A method and apparatus for providing distributed material management and flow control in an integrated circuit (IC) factory. The IC factory comprises a factory stocker, a plurality of process bays and a factory transport agent for moving wafer cassettes between the bay and the stocker. Each of the bays comprises a bay stocker, a plurality of tools, a mini-stocker and a bay transport agent for moving wafers amongst the bay components. The apparatus uses partitioned stockers to facilitate deadlock avoidance or deadlock resolution. Additionally, various algorithms are used to detect wafer cassette movement situations where deadlocks may result from a wafer cassette movement within a bay and for resolving deadlocks when they occur.

Abstract: A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Abstract: An off-loading system comprising an array of suction tubes which are each able to pick up an associated semiconductor device from the matrix of devices and a pump which pulls air through the suction tubes to create a sufficiently low pressure within the suction tubes to allow each suction tube to pick up an associated device. In another embodiment of the invention, the off-loading system also includes a pin board which supports an array of pins configured to raise a selected array of the semiconductor devices to assist in picking up the selected array of devices from the matrix of devices. Another embodiment of the invention includes a rack that includes multiple elongated rails which form multiple channels through which the semiconductor devices travel so that they may properly enter a subsequent phase of the manufacturing process.

Abstract: In accordance with the present invention, a method for preventing miss-process in a semiconductor wafer transfer system is provided. The method comprises transferring a pod with a workpiece therein and a tagging system thereon to an interface apparatus. A first signal is sent to an interface apparatus by a host controller to request to lock the pod. Then, the pod is locked on the interface apparatus. Then a tag reader mounted on the interface apparatus reads information from the tagging system. Then, a second signal is sent to a processing tool by the host controller to request to check whether the processing tool is ready, and the workpiece is transferred to the processing tool for process if the processing tool is ready. The present invention avoids miss-operation of changing any unlocked pod during checking if the process tool is ready.

Abstract: An apparatus for automatically and simultaneously loading/unloading a plurality of wafer boats (24) onto/from a cantilever paddle includes a cantilever paddle (47-1) and a carriage (42-1) supporting the cantilever paddle First and second vertical translation mechanisms (34A,B) each include a stationary part (62,63) and a vertically moveable support (61). First and second horizontal translation mechanisms (50A,B) each have a base (86) supported by one of the vertically moveable supports and a horizontally moveable arm (51) supported by the base (86). A horizontal boat support assembly (102) supports the loaded wafer boats and has an end supported by a first horizontally moveable arm (51A) and another end supported by a second horizontally moveable arm (51B).

Abstract: A concrete product molding machine has a mold removal and replacement mechanism which includes a transfer carriage movable from a location remote from mold supports on the machine along a pathway leading longitudinally abeam of the mold supports. Motor mechanism is activatable for moving a transfer carriage longitudinally adjacent to the machine, moving a cross carriage transversely inward, raising an elevator platform to deposit a mold thereon, returning the cross carriage transversely, and moving the transfer carriage longitudinally to remove the mold to a position adjacent to a mold deposit and replacement station. The mold is deposited at the mold deposit and replacement station and a replacement mold is deposited on the removal and replacement mechanism to be transferred to the concrete molding machine.

Abstract: A tray feeder sequentially takes pallets, each holding a tray storing electronic parts, out of a magazine and feeds them to a pick-up position where the electronic parts are picked up by a transfer head of an electronic parts-mounting apparatus. The tray feeder comprises the magazines for containing the pallets in a stacked manner, a drawing portion for drawing the pallet from the magazine and carrying the same thereon, a lifting-lowering portion for vertically moving the drawing portion, a non-mounted-parts discharge portion provided above the magazines, and a replenishing portion for receiving the pallet, holding the empty tray from which the electronic parts have been picked up, and for recharging the pallet after fresh electronic parts are replenished. With this construction, there can be achieved the tray feeder that is excellent in the operation efficiency and is compact in size.

Abstract: The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.

Abstract: A new parts handling apparatus is provided which can shorten the index time and increase working ability without increasing the number of components and can restrict the rise of manufacturing cost. X driving member 12 to be moved rightward and leftward in correlation to the rotation of a ball screw 2 by a servomotor 1 is provided with a pair of right and left movable members 7 mounted movably in the Z direction. Two contact hands 5 are attached to each movable member 7 through aligning mechanisms 8 respectively. Each movable member 7 is provided with a Z driving member 6 mounted slidably in the X direction. The Z driving member 6 is engaged with a ball screw 4, and the ball screw 4 is connected to a servomotor 3. When the ball screw 4 is rotated by the servomotor 3, the Z driving member 6 moves vertically in the figure, thereby also moving the movable member 7 vertically.