Abstract: The invention is a method for positioning a conveying mechanism having a holding portion for semiconductor wafers. Respective provisional position coordinates of an orienting teaching standard position and a container teaching standard positions are inputted into a controlling unit in advance. A wafer to be conveyed precisely positioned with respect to and held by the holding portion is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates. Then, a wafer to be conveyed precisely positioned with respect to the container teaching standard position is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position.

Abstract: An automated conveyance system moves green tires (24) with monorail carriers (18) to tire molding presses (40). Each monorail carrier (18) deposits a green tire (24) into an elevator system (31) which, in turn, transfers the green tire to within reach of a press loader (38) for tire press (40). The elevator system (31) also provides a buffer storage for the tires in process. In one embodiment, the green tire in the basket (28) is rotated about a vertical path through which the basket moves to within reach of the press loader. In another embodiment, the elevator system (31) can move the green tire by linear translation from the vertical path through which the basket moves to within reach of the loader (38).

Abstract: A substrate processing apparatus includes a substrate holder for holding a plurality of wafers and being loaded therewith into a process tube through an opening in the process tube, in which a plurality of the wafers are processed, a wafer transfer system for charging a plurality of the wafers to the substrate holder, a boat waiting chamber installed on a line passing through the opening in the process tube and substantially hermetically accommodating the substrate holder before and after the substrate holder is loaded into and unloaded from the process tube and a wafer transfer chamber for substantially hermetically accommodating the wafer transfer system. An oxygen concentration of the boat waiting chamber is different from that of the wafer transfer chamber.

Abstract: A substrate lift mechanism includes a plurality of fingers mounted on a hoop controlled by an actuator to transfer a substrate, such as a wafer or a flat panel display, from an edge grip arm to a chuck on a processing tool, such as integrated metrology tools. The substrate lift mechanism includes a base that is configured to be mounted to existing processing tools thereby allowing the processing tools to be adapted to be operable with new edge grip arms. The plurality of fingers are positioned to permit an edge grip arm to pass between two of the fingers and are configured to gravitationally support the substrate. Advantageously, the base of the substrate lift mechanism has a small footprint to minimize the space requirements of the processing tool to which it is mounted.

Abstract: A method of transferring semi-conductor substrates from a first location to a second location. The first and second locations are adapted to hold a plurality of the substrates in individual support area. The method comprises use of a transfer mechanism with two substrate holding end effectors which each have support areas adapted to individually support different maximum numbers of substrates thereon. The substrates are transferred from the first location to the second location with the first end effector and, when empty individual support areas in the second location or substrates at the first location are less than the maximum number of support areas on the first end effector, transferring substrates from the first location to the second location with use of the second end effector.

Abstract: A method of and apparatus for conveying a conveyable object is disclosed whereby the object (W) attracted at a conveying start site (A) by suction to an attractor means (12) carried by a conveyer arm (14) and conveyed by the conveyer arm (14) while being retained by suction to the attractor means (12) is instantaneously detached from the attractor means (12) at an object conveying destination site (B). To attract the object (W) and to hold it retained to the attractor means (12), an attractor plate (32) having fastened thereto the attractor means (12) and attached to a lower end of an inner cylinder (28) that extends in the outer cylinder (20) is held in a vacuum contact with a head plate (24) attached to a lower end of an outer cylinder (20) carried by a conveyer arm (14) in which a vacuum communication is established of the attractor means (12) with a suction source (16) via the attractor plate (32), the head plate (24) and suction hose means (22).

Abstract: An electronic-component supplying apparatus, including a bed with two linear guides; six tables movably supported by the guides, each table supporting electronic-component supplying cartridges such that respective component-supply portions of the cartridges are arranged along a straight line parallel to the guides, the six tables including a first group of three tables and a second group of three tables; three carriers which are movable, independent of one another, through three routes, respectively, each carrier being stopable at any position on the corresponding route, the three routes extending parallel to one another and the guides, within a carrier-movement area on the bed; engaging devices and engageable portions each of which is disengageably engageable with at least one corresponding engaging device of the engaging devices, one of (a) each of the six tables and (b) each of the three carriers supporting a corresponding one of the engaging devices, the other of (a) the each of the six tables and (b) the

Abstract: A machine for manufacturing semiconductor devices has a processing chamber for processing the semiconductor wafer. A transfer chamber has at least two positions, one position to facilitate the transfer of a wafer to be processed into the transfer chamber and to facilitate the transfer of a processed wafer from the transfer chamber to the cassette from which the wafer originated. The second position facilitates the transfer of a wafer to and from the processing chamber. A transfer arm simultaneously transfers an unprocessed wafer from the first position to the second position with the transfer of a processed wafer from the second position to the first position.

Abstract: An apparatus for automatically and simultaneously loading a single long wafer boat or a plurality of wafer boats onto a cantilever paddle includes a stationary first track aligned with a first opening of a diffusion furnace and a first carriage moveable on the first track. The first carriage supports a cantilever paddle. A first vertical translation mechanism includes a first stationary part and a first vertically moveable support. A second vertical translation mechanism includes a second stationary part and a second vertically moveable support. A first horizontal translation mechanism includes a first base supported by the first vertically moveable support and a first horizontally moveable arm supported by the first base. A second horizontal translation mechanism includes a second base supported by the second vertically moveable support and a second horizontally moveable arm supported by the second base.

Abstract: In an air lock for continuous introduction into and/or removal of workpieces from spaces (1, 4) separated atmospherically, the individual substrates (3, 13) are transported through a transfer channel (24). At least one lock chamber (7a-7m) serving to accommodate the substrates (3, 13) is arranged movably in the transfer channel (24). During the substrate transport in the transfer channel (24), the lock chamber (7a-7m) is atmospherically separated both from the exterior (1) having normal pressure and from the coating chamber (4). The air lock (2) includes a carrousel lock which has a carrousel housing (24) and a lock chamber wheel (10). On the periphery in the lock chamber wheel (10) individual lock chambers (7a-7m) are provided, in which the workpieces (3, 13) to be brought into the chamber to be loaded (4) are inserted freely accessible on the normal pressure side.

Abstract: A group of bolts are suppled into a placing surface of a tray, an isolated bolt is searched for by a visual sensor, and its deviation from a standard position at the time of teaching is determined. The isolated bolt is picked up by a robot that has been taught how to pick up an isolated bolt laying in a standard position. The position of the robot's hand is corrected according to the deviation from the standard position before the robot attempts to pick up the located isolated bolt. If no isolated bolt is found, a shaking device 1 is operated to loosen the piled-up bolts, and a new isolated bolt is again searched for by the visual sensor. The isolated bolt, if found, is picked up. The picking-up operation may be performed by searching for an isolated small set of bolts using a three-dimensional visual sensor. The oscillating excitation can also be provided by a robot.

Abstract: An apparatus for automatically and simultaneously loading/unloading a plurality of wafer boats (24) onto/from a cantilever paddle includes a cantilever paddle (47-1) and a carriage (42-1) supporting the cantilever paddle First and second vertical translation mechanisms (34A,B) each include a stationary part (62,63) and a vertically moveable support (61). First and second horizontal translation mechanisms (50A,B) each have a base (86) supported by one of the vertically moveable supports and a horizontally moveable arm (51) supported by the base (86). A horizontal boat support assembly (102) supports the loaded wafer boats and has an end supported by a first horizontally moveable arm (51A) and another end supported by a second horizontally moveable arm (51B).

Abstract: A catalyst loading system for utilizing catalyst from a bulk supply located adjacent but not on the upper tube sheet of a catalytic reactor and for mechanized measuring of multiple identical quantities of catalyst and for mechanized loading of catalyst pellets into the reaction tubes of the reactor to achieve even drop rate, compaction and outage of the reaction tubes. From the bulk supply, multi-compartment catalyst charging hoppers are individually filled in rapid and accurately measured fashion by mechanized filling equipment having a predetermined sequence of operation that ensures accuracy of volumetric catalyst measurement. The charging hoppers are used for delivery of measured volumes of catalyst of a reactor tube loading mechanism which may take the form of a mobile cart framework being selectively positionable relative to the upper tube sheet and reaction tubes of a catalytic reactor to be charged with catalyst pellets.

Abstract: A transfer mechanism is provided for placing a wafer at a prescribed position on an arm without any additional step. The transfer mechanism for transferring a workpiece into and from a storage section comprises an arm member for holding a workpiece having a projection which can be contacted with an edge of the workpiece at the tip end portion thereof, a movement mechanism for reciprocating the arm member between a retracted and an extended positions while holding the workpiece thereon to transfer the workpiece to and from the storage section, and a positioning member which is positioned in the vicinity of the arm member and can be contacted with the edge of the workpiece for positioning the held workpiece in a prescribed position on the arm member.

Abstract: The present invention generally provides a rotary wafer carousel and related wafer handler for moving wafers or other workpieces through a processing system, i.e., a semiconductor fabrication tool. Generally, the present invention includes a rotary wafer carousel having a plurality of wafer seats disposed thereon to support one or more wafers. The rotary carousel is preferably disposed through the lid in a transfer chamber opposite the robot which is preferably disposed through the bottom of the transfer chamber. The rotary carousel and the robot cooperate to locate wafers adjacent to process chambers and move wafers into and out of various chambers of the system. The invention improves the throughput of the system by positioning wafers adjacent to the appropriate chamber to reduce the amount of movement required of the robot for transporting wafers between chambers.

Abstract: A vacuum processing system has a wafer handling chamber, such as a mini-environment, for moving wafers therethrough. The wafer handling chamber has a wafer aligner, or orienter, for aligning the wafers according to the requirements of a process that the wafer is to undergo in the system. The wafer aligner is disposed at a location in the wafer handling chamber to minimize the number of movements that the wafer makes as it passes through the wafer handling chamber, to minimize interference between wafer handlers, or robots, when more than one wafer handler is used in the wafer handling chamber and to minimize the footprint area of the system. The presence of the wafer aligner in the wafer handling chamber eliminates the need to provide a separate wafer aligning chamber in the system.

Abstract: The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.

Abstract: A catalyst loading system for utilizing catalyst from a bulk supply located adjacent but not on the upper tube sheet of a catalytic reactor and for mechanized measuring of multiple identical quantities of catalyst and for mechanized loading of catalyst pellets into the reaction tubes of the reactor to achieve even drop rate, compaction and outage of the reaction tubes. A pair of electronic vibrators are mounted to the cart framework and provide for support and vibratory movement of a vibratory tray having a catalyst feed hopper adapted to feed catalyst pellets to a plurality of generally parallel catalyst transfer troughs along which catalyst pellets are moved by vibration of the vibratory tray to a plurality of drop tubes. A compartmented hopper is fixed to the vibratory tray and controllably feeds catalyst pellets into respective catalyst transfer troughs.

Abstract: This invention relates to a device for removing and transporting articles, such as ophthalmic lens mold sections, or packaging elements from a mold. The invention, in one embodiment includes first, second, and third assemblies; the first of which removes the articles from the molding station at a first location and transports them to a second location; the second assembly receives the articles from the first assembly and transports them to a third location, and the third assembly receives the articles from the second assembly and transports them to a fourth location. A second embodiment includes a flipper assembly disposed between the first and second assemblies, which flipper receives the articles from the first assembly and inverts them before depositing them onto the second assembly. This second embodiment is useful in conjunction with molded articles which are transported to the flipper assembly in an inverted position.

Abstract: This invention relates to a method for removing and transporting articles, such as ophthalmic lens mold sections, or packaging elements from a mold. The invention, in one embodiment includes first, second, and third assemblies; the first of which removes the articles from the molding station at a first location and transports them to a second location; the second assembly receives the articles from the first assembly and transports them to a third location, and the third assembly receives the articles from the second assembly and transports them to a fourth location. A second embodiment includes a flipper assembly disposed between the first and second assemblies, which flipper receives the articles from the first assembly and inverts them before depositing them onto the second assembly. This second embodiment is useful in conjunction with molded articles which are transported to the flipper assembly in an inverted position.

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract: A new parts handling apparatus is provided which can shorten the index time and increase working ability without increasing the number of components and can restrict the rise of manufacturing cost. X driving member 12 to be moved rightward and leftward in correlation to the rotation of a ball screw 2 by a servomotor 1 is provided with a pair of right and left movable members 7 mounted movably in the Z direction. Two contact hands 5 are attached to each movable member 7 through aligning mechanisms 8 respectively. Each movable member 7 is provided with a Z driving member 6 mounted slidably in the X direction. The Z driving member 6 is engaged with a ball screw 4, and the ball screw 4 is connected to a servomotor 3. When the ball screw 4 is rotated by the servomotor 3, the Z driving member 6 moves vertically in the figure, thereby also moving the movable member 7 vertically.

Abstract: An IC handler affords ICs to be tested for a sufficiently long period of time for them to take up either heat or cold. A turntable is formed with N circular rows of positioning recesses lying on concentric circles. ICs to be tested are successively fed into the positioning recesses of either the outermost or innermost row. When each of the ICs makes a revolution with the rotation of the turntable, the IC is crossed over into one of the positioning recesses of another one of the rows. After the IC has made at least one revolution, it further travels through a predetermined angle from the cross-over position to a position of delivery to a testing section, and is then delivered to the testing section.

Abstract: An apparatus for automatically organizing a variable number of lots into a batch which can be treated with high efficiency in a semiconductor wafer manufacturing line is installed for changing the number of lots organized into a batch between preceding and succeeding processes when such change is required.

Abstract: A system and a method are provided for automatically loading and unloading pallets holding a workpiece for machining of the workpiece within a machining area. The pallets are loaded into the machining area by transfer of a pallet from the staging area to a machining area. Rails which maintain the pallets within each area are aligned. An arm having pins at each end engages passageways associated with the pallets and the machining area, respectively. As a result, the pallet may be transferred from the staging area to the machining area and back as the arm translates within the passageways.

Abstract: The present invention provides a transfer apparatus and a transfer method capable of reducing the time required for transferring a plurality of to-be-transferred objects, and a treatment apparatus and a treatment method capable of increasing the throughput. The transfer apparatus, wherein the objects are transferred from a first support unit supporting the objects to a second support unit capable of supporting the objects, comprising load/unload means for unloading the objects one by one from the first support unit in a first position in which the objects can be carried out of the first support unit, and loading the objects into the second support unit one by one in a second position in which the objects can be carried into the second support unit, a third support unit for permitting loading and unloading of the objects by the load/unload means, the third support unit being capable of supporting the objects, and transfer means for moving the load/unload means from the first position to the second position.

Abstract: In a lead frame conveying method and apparatus used in, for instance, a wire bonding machine, a detection of the leading end of a lead frame supplied from a lead frame magazine and a positioning of the lead frame on a lead frame path are executed by a positioning sensor which is installed in the vicinity of a bonding position; and after the positioning, the lead frame is chucked by feeding claws so that a first bonding portion on the lead frame is conveyed by the feeding claws to the bonding position, thus avoiding use of the end surfaces of the feeding claws during the execution of positioning of the lead frame.

Abstract: In order to manufacture a semiconductor device of high performance a small-sized transfer arm mechanism, capable of retaining a predetermined transfer stroke, is put to practical use without any increase in the height of the arm mechanism. The transfer arm includes arcuate portions having center axes different from each other, and restraint generating means for generating restraints in directions where the individual center axes are attracted. This way, a plurality of arms are joined by joints having a structure for transmitting rolling motions to the arcuate portions contacting each other to thereby control the drive shaft of the arcuate portions rotationally and thereby move the arms. This transfer arm mechanism is used in various environments including semiconductor manufacturing, such as DRAMs (dynamic random access memory).

Abstract: An improved apparatus and method is provided for storing semiconductor wafer carriers, and for loading wafers or wafer carriers to a fabrication tool. The apparatus comprises a plurality of storage locations positioned above the fabrication tool. The apparatus receives wafer carriers via a factory load port. The wafer carriers are transported between the factory load port and the storage locations via a first robot, and are transported between the fabrication tool load port and the storage locations via a second robot. Both robots access the respective load port from overhead, thus eliminating the need for a front loader robot, and reducing the apparatus' footprint. Each robot may access overhead factory transportation systems to provide further flexibility in wafer carrier transport. Additionally, the apparatus of the present invention may include a mechanism for opening pod type wafer carriers and for extracting wafers therefrom.

Abstract: A device is provided for unloading a mold from the mold support surface of a concrete products producing machine and moving it to a remote mold replacement station, and then loading a replacement mold to the support surface of the machine. It incorporates a carriage supporting framework, a mold carriage transport system on the framework extending into the molding machine from the mold replacement station, which is mounted by the framework for vertical travel, and a mold transport carriage for moving from the replacement station along the transport system to a position juxtaposed vertically with the machine mold support surface. An actuatable mechanism interacts with the transport system for moving the transport system vertically relative to the carriage supporting framework from a remote support position aligned vertically with the mold to a mold support position in which the transport system can move the mold out of the machine.

Abstract: The present invention generally provides a rotary wafer carousel and related wafer handler for moving wafers or other workpieces through a processing system, i.e., a semiconductor fabrication tool. Generally, the present invention includes a rotary wafer carousel having a plurality of wafer seats disposed thereon to support one or more wafers. The rotary carousel is preferably disposed through the lid in a transfer chamber opposite the robot which is preferably disposed through the bottom of the transfer chamber. The rotary carousel and the robot cooperate to locate wafers adjacent to process chambers and move wafers into and out of various chambers of the system. The invention improves the throughput of the system by positioning wafers adjacent to the appropriate chamber to reduce the amount of movement required of the robot for transporting wafers between chambers.

Abstract: The invention relates to an apparatus for processing shipping articles provided with shipping addresses. The apparatus comprises a device for transporting the shipping articles along a transport path. A device is disposed in the transport path for automatically reading the shipping addresses. An assessment device automatically assesses the read shipping addresses. The individual shipping articles are selectively deposited into cells of an intermediate storage device disposed in the transport path following the reading of the shipping address. A detection device detects an association between each cell and the shipping article deposited therein and in response to an assessment of the shipping address by the assessment device, produces a first removal signal for removing the shipping article from the cell and conveying the shipping article back to the transport path.