Abstract: At the front side of a wafer cassette fitted to a wafer feeding unit of a magnetic levitation wafer conveying device, a wafer stopper for preventing the wafer waiting in the wafer cassette from popping out is provided. The wafer supplied from the magnetic levitation conveying device is supplied into the reaction chamber by magnetic force, and is directly held in the reaction chamber by this magnetic force. Since the wafer stopper is positioned between the wafer cassette fitted in the wafer feeding unit and the starting end of the wafer conveying route, the wafer waiting in the wafer cassette next to the wafer to be conveyed is prevented from popping out together with the wafer to be conveyed. Moreover, the wafer conveyed by the magnetic force can be directly held in the reaction chamber in heated state.

Abstract: A semiconductor device manufacturing apparatus and method includes a reticle library for accommodating therein a first reticle cassette, a cassette table for holding thereon a second reticle cassette of a shape different from that of the first reticle cassette, a first opening and closing mechanism for opening/closing the first reticle cassette in accordance with a predetermined first sequence, a second opening and closing mechanism for opening/closing the second reticle cassette in accordance with a predetermined second sequence different from the first sequence, a reticle stage for holding a reticle as unloaded from the first reticle cassette, for use of the reticle in the apparatus, a reticle hand for conveying a reticle as unloaded from the reticle stage, and a controller operable to discriminate one of the first and second reticle cassettes into which one cassette the reticle as unloaded from the reticle stage is to be accommodated, on the basis of reticle control information.

Abstract: A modular system and a method of creating a modular system comprising a substantially rigid frame and a plurality of modules mounted at predetermined locations on the frame by means of kinematic couplings. The frame includes a main beam in the form of a spine, and a plurality of transversely extending bulkheads. The method includes creating a model of the system using rigid bodies and thereafter providing the frame and modules and securing them kinematically. The kinematic couplings comprise three pairs of aligning elements, each in the form of a male element and a contact element. The contact elements may take the form of grooves, tetrahedral depressions, or flat surfaces.

Abstract: A clean transfer method and an apparatus therefor capable of facilitating storage and transfer of transferred objects by a vacuum clean box and realizing transfer of the objects to various processing units other than a vacuum unit. A vacuum clean box and a clean unit are airtightly connected to each other. The vacuum clean box includes a first shutter acting also as a lid and arranged so as to airtightly close a first opening of the box. The clean unit is provided with a second opening selectively closed by a second shutter. Airtight connection between the vacuum clean box and the clean unit is carried out while keeping the first and second openings closed by the first and second shutters, respectively, to thereby form a closed space therebetween which the first and second shutters face. Then, the closed space is evacuated to a vacuum, followed by opening of only the first shutter.

Abstract: A workpiece support for supporting a semiconductor workpiece in a semiconductor processing machine is disclosed. The workpiece support has an operator base which essentially forms a yoke having two yoke arms. An operator arm having two fork arms is pivotally mounted between the two yoke arms of the operator base such that the fork arms are protruding. A processing head having a workpiece holder is rotatably mounted between the two protruding fork arms. The processing head may rotate about the fork arms to present the workpiece holder in a position to receive a workpiece or to deploy the workpiece in the semiconductor manufacturing process. The operator arm which pivots about the operator base yoke arms is used to lower the processing head and the workpiece into the process. Both the processing head and the operator arm are supported along horizontal axes having at least two points of support distally separated for stability.

Abstract: A technique for handling discs, such as wafers for integrated circuits, which must be processed in ultra-clean rooms and which are transported to various workstations for processing. A horizontally extended rail has storage positions therealong where standard commercial carriers are positioned which contain vertically standing wafers. A lifting device can lift any carrier over neighboring carriers and moves it to a carrying basket located on an extension of the rail. The carrying basket is then turned by 90.degree. so that the vertical wafers lie horizontally. A tongue-shaped device can be moved under any of these wafers for removal thereof from the basket and subsequent transport to a workstation, and return.

Abstract: The object of a charging device for semiconductor processing installations is to increase the flexibility of the charging process while excluding negative influences on dependability and clean room conditions. At least in a portion of the movement of a linearly movable part which is supported by a stationary part of a drive for transferring a transport object between two end positions, a gripper for the transport object being attached to the movable part, a rotating movement of the gripper is combined with the linear movement. The device is provided in particular for use in the fabrication of semiconductors.

Abstract: The present invention is an improved container and interface for transporting or otherwise handling contamination-sensitive materials, such as semi-conductor wafers during processing. The container of the present invention employs a door-within-a-door design, allowing the container to connect with different interfaces on a single side. Employing a container of the present invention, manufacturers may connect a single container to different tools or mini-environments employing incompatible interfaces without the need to use different containers or to access the contents of a single container from different directions. The present invention is particularly useful in instances where a single interface standard, e.g., SEMI Standard SMIF interfaces, has not been uniformly adopted in a facility.

Abstract: A plasma processing apparatus for etching, ashing, or otherwise processing silicon wafers has a pair of spaced reaction chambers each for processing a silicon wafers in a plasma, a pair of spaced cassette table mechanisms each for supporting a wafer cassette which houses a plurality of wafers therein, and a transfer robot disposed between the pair of spaced reaction chambers and the pair of spaced cassette table mechanisms, for transferring the wafers, one at a time, between the wafer cassette supported by one of the workpiece table mechanisms and one of the reaction chambers. Each of the cassette table mechanisms has a turntable for placing the wafer thereon, the turntable being rotatable to orient the wafer cassette out of physical interference with the robot arm of the transfer robot.

Abstract: According to the present invention, a substrate processing method has (a) the step of predetermining initial conditions for cassettes and substrates before processing is started, (b) the step of setting the cassettes in which the substrates are stored, in the loading/unloading section on the basis of the initial conditions, (c) the step of detecting the states of the cassettes set in the loading/unloading section and checking, on the basis of the detection results, whether the cassettes are set in the states set in the step (a), (d) the step of displaying the states of the cassettes when it is determined in the step (c) that the state of at least one cassette is not the state set in the step (a), (e) the step of resetting the cassette in the state set in the step (a) on the basis of the display in the step (d), (f) the step of detecting the substrates which are present in the cassettes set in the loading/unloading section and obtaining mapping data on the basis of the detection results, (g) the step of select

Abstract: A semiconductor substrate production control system controlling the production of semiconductor substrates grouped as lots so that a delay of each lot between processing operations does not exceed a time limit within which the amount of deterioration of the substrates exceeds permissible levels when plural types and plural lots of semiconductor substrates are arbitrarily provided in a process requiring consecutive processing operations. A first control unit controls the progress of production of the semiconductor substrates per lot and various processing equipment. Storage stations store the lots. First and second processing equipment implement predetermined processing operations on the lots, and a conveyer conveys the lots between the storage unit and the first and second processing equipment.

Abstract: A vacuum treating apparatus having a vacuum treating chamber for treating a to-be-treated substrate in vacuum, includes a plurality of substrate cassettes which are installed in the open air and hold substrates that are to be conveyed into the vacuum treating chamber, a device for conveying the substrates between the substrate cassettes and the vacuum treating chamber, and a device which selects either that the to-be-treated substrate after treated in the vacuum treating chamber be held in the substrate cassette from which the to-be-treated substrate was taken out or that the to-be-treated substrate after treated in the vacuum treating chamber be held in another substrate cassette which is different from the substrate cassette.

Abstract: A SMIF system for transferring semiconductor wafers between two controlled environments, one being within a wafer cassette carrier and the other being within an enclosure around a wafer processing apparatus. In a carrier loading position, a carrier door rests on a port door which forms part of a platform for vertically fixing and horizontally moving the cassette within the enclosure. A carrier cover, when unlocked from the carrier door, is engageable by a port plate for vertical movement therewith as an elevator mechanism moves the port plate between down and up positions. In the down position, the port door closes an enclosure opening defined by the port plate. In the up position, the port plate raises the carrier cover to allow access to the wafers in the cassette by an article processing apparatus. External and internal panels carried by the port plate cause the controlled environment of the enclosure to be extended to include a compartment containing the uncovered cassette.

Abstract: The docking and purging system docks a modular isolation container for substrates used in manufacturing integrated circuits for purging and processing in a processing environment. A door portion of the docking and purging system includes a shelf for receiving the modular isolation container before insertion in a docking chamber formed in the housing connected for communication with the processing environment. A vacuum manifold with suction cups is provided for gripping and removing the modular isolation container door to allow access to the interior chamber of the modular isolation container. The docking chamber and interior chamber of the modular isolation container can also be purged of particulate contaminates by filtered air or inert gas ducted to the docking chamber.

Abstract: A method and system for detecting focus spots. Data from a file created during stepper operation is extracted to get field coordinate position, leveling scheme, and tilt with respect to the x- and y-axes, and wafer height with respect to the focal plane for the multiple fields on the multiple wafers in a production batch. A delta value is calculated for the x- and y-axes tilt data which averages the tilt of each field with its surrounding fields. Delta values are placed in a 3-dimensional data structure linking neighboring fields and corresponding fields on subsequent wafers. Focus spots are detected by the repeated presence of data spikes over the sum of the arithmetic mean and some multiple of the standard deviation of the delta values.

Abstract: A stage assembly for a substrate processing system including a cassette support assembly for receiving and supporting a cassette and an actuation and support assembly for supporting and moving the cassette and cassette support assembly between a loading position and a processing position. The processing position provides convenient and efficient access by a central processing system, and the loading position preferably places each cassette closer to, and aligned with, a front panel of the processing system for convenient access by an operator. The actuator and support assembly preferably includes a frame assembly and a rotating plate pivotally mounted to the frame assembly, where the cassette support assembly is mounted to the rotating plate for pivoting relative to the frame assembly. An actuator assembly mounted to the frame assembly flits the cassette support assembly between the loading and processing positions. A shaft assembly pivotally mounts the cassette support assembly to the rotating plate.

Abstract: A substrate processing method includes the steps of accommodating a plurality of substrates within a carrier, where the carrier has a bottom that is open and has a function of stopping inclination of the substrates, transporting the substrates and the carrier to a processing chamber by a transport mechanism having a function of supporting weights of the substrates, and carrying out a process on the substrates within the processing chamber.

Abstract: A transport container for wafer-shaped objects to keep particles away from and remove them from the interior of the transport container when opening the latter, in particular also those particles located in the door gaps, without restricting handling. Cleaning in the form of a self-cleaning process should also be effective when a plurality of transport containers are stacked one on top of the other and the latter should be optionally accessible. At least parts of the rear wall region of a closable container enclosure are constructed as a plenum chamber which has a closable air inlet and a closable air outlet in the base region and cover region, and a connection is formed from the latter to the interior of the container via a filter. The air inlet is constructed so as to complement a connection of a gas reservoir and an air outlet of an additional transport container for coupling. The arrangement is applicable in the manufacture of integrated circuits.

Abstract: A multiprocessing apparatus has a plurality of process processors connected to a carrier processor and controlled by a control system, wherein the apparatus includes connection information signal generating means for generating a connection information signal expressing information of connection of the plurality of process processors to the carrier processor, switching means for generating a registration information signal expressing information of registration of connection of the plurality of process processors to the carrier processor, and control means for carrying out a control process while logically judging a matching state between the connected process processors and the registered process processors by reference to the connection information and the registration information. Thus, it is possible to provide a multiprocessing apparatus in which process processors to be connected to the carrier processor can be increased or decreased in number easily and securely.

Abstract: The object of a device for coupling loading and unloading devices with semiconductor machines is to couple devices required for the use of SMIF technology with semiconductor processing machines in which subsequent integration of SMIF technology is not possible, wherein the charging to be carried out after coupling is highly flexible and capable of managing increasing dimensions of semiconductor wafers. An adjustable receiving element for the loading and unloading device is provided inside a movable enclosure, this receiving element being displaceable between at least two planes situated one above the other, one plane serving for charging the loading and unloading device and every other plane being used for the charging of the semiconductor machine carried out by the loading and unloading device. The enclosure has aligning and holding elements for fastening to a coupling element which is aligned with the semiconductor processing machine.

Abstract: An adaptor plate for allowing 200 mm SMIF pods carrying one or more semiconductor wafers to be used on an access port of a wafer processing station configured to accept a 300 mm SMIF pod. The adaptor plate has a substantially circular outer circumference conforming substantially in size and shape to the outer circumference of a conventional 300 mm SMIF pod, and a central opening conforming substantially in size and shape to a conventional rectangular 200 mm SMIF pod. The one or more semiconductor wafers are supported on pod door of the pod, and the semiconductor wafers and pod door are lowered through the central opening in the adaptor plate into the wafer processing station. With the adaptor plate supported on the access port, and a cover of the 200 mm SMIF pod supported around the central opening, the access port is entirely covered and entry of contaminants into the processing station through the access port is prevented.

Abstract: A substrate photolithography system includes a substrate handling robot which pivots about a fixed point and transfers substrates between photoresist coater, a developer, and a heating/cooling unit, all of which are clustered about the robot. The end effector of the robot is capable of both vertical and lateral movement so that individual modules of the heating/cooling unit may be stacked. An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. A cassette input/output unit handles cassettes which contain semiconductor wafers or other substrates that are to be delivered to or withdrawn from a semiconductor processing system.

Abstract: The object of a device for transferring a transport object between two end positions is to exclude negative influences on dependability and clean room conditions, also in lengthy transport paths, while ensuring a highly flexible transfer. To control the operation of sensors and actuators at a movable part of a drive serving to transfer, electrical contact between these sensors and actuators and a supply unit located in a stationary part of the drive is effected exclusively in the two end positions. The device is provided in particular for use in the manufacture of semiconductors, e.g., for charging semiconductor processing machines, but is not limited to this field.

Abstract: A load lock interface for a semiconductor wafer process chamber includes a platform adapted to receive and engage with a carrier containing a cassette of semiconductor wafers; and a removable bell-shaped enclosure adapted to surround and seal said carrier from the ambient environment while the carrier is engaged with the load lock interface platform. Once engaged with the carrier, the platform is operable to withdraw the cassette of wafers from the carrier and position the cassette within a load lock. Thereafter, the cassette may be indexed and individual wafers may be removed from the cassette for processing within the process chamber.

Abstract: A conveying system provides a cassette accommodating workpieces; a container containing the cassette; a transferring device for conveying the cassette while supporting it or conveying the container which is empty or contains the cassette while supporting it, the transferring device having a supporting device for supporting the cassette. In the conveying system, a handle is provided on the upper surface of the container so that it is supported by the supporting device.

Abstract: A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced relationship and transporting them in a particle free environment. The carrier is supported adjacent a load lock chamber which also has a particle free environment. A multilevel end effector associated with the load lock chamber includes a plurality of spaced end effector sets, each set being adapted to support a wafer thereon and aligned with an associated wafer supported in the carrier. The plurality of wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber awaiting further processing.

Abstract: Load transferring apparatus comprises a base member, a planar platform for supporting a load and a drive arm pivotally mounted on the base member for moving the platform in plane between a retracted position at which the platform assumes a first orientation and an extended position at which the platform assumes a second angularly transposed orientation while remaining substantially in the plane occupied when in the retracted position. The drive arm is fixed to a drive arm shaft which, in turn, is rotatably mounted on the base member. A constraining link extends between the base member and the platform and is generally parallel to the drive arm. An elevator drive is operable for moving the base member raised and lowered positions and a coupling drivingly connects the drive arm shaft to the drive shaft throughout a range of positions between the raised position and the lowered position. The base plate includes an upstanding stop plate.

Abstract: A loadlock chamber for transferring one or more semiconductor wafers from a storage and transfer pod into high-vacuum process chambers in a contaminant free environment. The loadlock chamber includes mechanisms for separating a wafer-carrying cassette from the storage and transfer pod, mechanisms for transferring the cassette into a chamber which may be sealed and evacuated, and mechanisms for allowing transfer of wafers between the cassette and the various process chambers, wherein each of the mechanisms operates in an environment that is sealed against the external environment.

Abstract: A boat, carrying wafers to be processed, is pushed into a furnace by a substantially elongated and cantilevered actuator arm having a lug that pushes by first rotating the arm, to cause the lug to traverse a vertical rod attached to against a plate affixed to the boat. The boat is later pulled out of the furnace the boat, and thereafter pulling on the arm to enable the lug to pull against the vertical rod to withdraw the boat. Reliable operation is attained regardless of sagging of the actuator arm relative to the boat.

Abstract: A human guided mobile loader stocker developed to mechanically assist in SMIF container movement. The assist includes a pushcart, a semi-motorized transport arm, a processor, and communication devices. A group of containers are placed on the cart using the arm. The cart is pushed to a semiconductor processing tool where the arm is used to transfer containers to and from the port of the processing tool. The processor and communication devices are used for inventory control and guiding the container to the port of the processing tool.

Abstract: An improved clean environment container for semiconductor wafers that can have more than one port for interfacing with a clean environment. The multiple ports permit interfacing with more than one type of clean environment interface. A diagonal seal surface provides a tight clean seal around the container door and the interface between the door and the clean environment, maintaining utmost cleanliness.

Abstract: A substrate processing apparatus comprises a processing part and a transferring part. In the processing part there are a plurality of stages in which a plurality of processing units are arranged in a row along a horizontal direction and the stages are arranged in a stack vertically. Thus, the processing units are arranged in matrix. The transferring part includes a plurality of horizontal transferring devices each movable in the horizontal direction and a vertical transferring device movable in the vertical direction. Hence, a substrate is movable both horizontally and vertically to be transferred to the desired processing unit.

Abstract: A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region.

Abstract: A circulation duct with a blow fan and a shutter is provided to form gas flows in a transfer chamber below a heat treatment furnace, and a dust removing filter unit is provided in a blowout port of the circulation gas passage. Three, for example, gas supply pipes with a number of blowout holes are provided on the front side of the filter unit at set heights, and a clean air source is connected to the proximal end of the air supply pipes through an opening/closing valve. Clean gas is fed into the transfer chamber from the clean air source from the start of an unloading of the wafers to the time of the dismounting of the wafers from a wafer boat with the circulation of gas flows in the circulation gas passage stopped. A filter material of the dust removing filter is PTFE, which can reduce the amount of impurities scattered from the dust removing filter that attach on the wafers.

Abstract: An apparatus for automatically organizing a variable number of lots into a batch which can be treated with high efficiency in a semiconductor wafer manufacturing line is installed for changing the number of lots organized into a batch between preceding and succeeding processes when such change is required.

Abstract: An electrode forming system automatically carries out overall steps of charging chip components, coating electrode material on both ends of the components and discharging the components using a holding plate, a guide plate and a spacer. This system comprises a charger, a transferer, an electrode coater, a drying furnace, a holding plate standby means, a spacer storage means, a holding plate storage means, a discharger, a transport robot, conveyor means and a control unit. Movements of these apparatus are integratedly controlled by the control unit. The robot transports the holding plate, the guide plate or the spacer among these apparatus arranged within its working area.

Abstract: A method and apparatus for transferring articles from a transportable container, for example, a SMIF pod, to a second container, for example, a processing station having a port which provides access to the interior region of the processing station. A non-contact seal or an isolation cover or skirt seals the port so that the interior region of the container can be purged of contaminants prior to exposing the interior environment of the processing station to the environment within the container. The purging of the container may be a multi-step process in which the container door is moved between several intermediate positions so that the container door itself is purged prior to the purging of the environment within the container.

Abstract: A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto trays for processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: A tiltable specimen holder (48) in an apparatus (46) for performing an automated operation on a selected one of multiple specimens (12) contained in a specimen carrier (10) has a receiving member (60) that, when oriented in a load position (48C; FIG. 10), receives the carrier from, or presents the carrier to, the hand (108) of a human being (110) without substantial flexure of the human being's wrists (112). The holder also has a bottom member (62) that cooperates with the receiving member and a support member (32, 34) of the carrier to place and hold the carrier in a predetermined alignment relative to the receiving member. The receiving member has beveled edges (84, 86, 88) that cooperate with a guide member (28, 30) of the carrier to guide the carrier to self-align into grooves (90, 92) defined by the beveled edges. Rollers (94) in the grooves cooperate with the guide members to guide the carrier to the predetermined alignment.

Abstract: An apparatus for carrying a variety of products for effectively processing and carrying plural kinds of works such as semiconductor wafers includes a plurality of processing stations for processing plural kinds of works, a carriage system for carrying plural kinds of works, and a transfer system for delivering works between the carriage system and a processing station. A method for carrying a variety of products is realized in which the carriage system simultaneously carries plural kinds of works between the plurality of processing stations and stops at a predetermined position of the transfer system, whereas the transfer system identifies and delivers the desired kind of work to and from the carriage system.

Abstract: A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus has an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. An open/close valve and an open/close device are connected to each of the inert gas supply pipes and the exhaust pipes.

Abstract: A cassette loading mechanism for semiconductor processing equipment reduces the possibility of repetitive stress injury that may occur as a result of repeatedly loading and unloading a cassette of substrates by eliminating manual cassette rotation. The loader receives a cassette and, by compound translational movement, rotates the cassette about 90.degree. from a horizontal loading position, in which the substrates contained therein are positioned in a vertical orientation, to a position in which the substrates contained therein are positioned in a horizontal orientation, such that the cassette is aligned to the other components of the substrate handling system for substrate transfer. The cassette motions are interlocked with the cassette clamping mechanism and the cassette loader door and a cassette shuttle by pneumatic or electronic logic.

Abstract: The system according to the invention makes it possible to handle and transfer flat objects under an ultraclean atmosphere without using white rooms. It essentially comprises interfaces (5) making it possible to receive individual boxes (1), each of which contains a flat object, opening each box and feeding each flat object into a working station (6A). The system is completed by tunnels (4) making it possible to transfer the flat objects from one working station (6A, 6B) to another.

Abstract: A holder mechanism tilts and rotates a vertically oriented wafer-loaded cassette for proper presentation in a horizontal orientation to the robotic arm of a workstation. The mechanism includes a cassette holder, a support member, and a motor. The cassette holder has first and second supports that define orthogonal first and second planes. In two embodiments, the support member connects the cassette holder to the motor shaft and, as the motor shaft rotates, the cassette holder is rotated about a single pivot axis that is oblique to the first and second planes. This rotation tilts a cassette placed in the holder through a tilt angle of about 45.degree. to 90.degree., and simultaneous rotates the cassette through an angle .theta. about the vertical axis. The support member shape determines whether tilting and rotation is away from or toward the motor, and also determines the angle of rotation .theta. and the tilt angle.

Abstract: An enclosed semiconductor wafer holder, and a cover providing isolation control of semiconductor wafers that is simple, lower cost, and non-obtrusive is described. The device includes a cover with a sealing perimeter that creates a hermetic seal when engaged with the semiconductor wafer holder. It also includes a purging means attached to the holder that allows an active gentle purging of inert gas into the sealed semiconductor wafer holder. The holder has contoured recess-forming pairs that do not effect semiconductor wafer transfer when the recess forming pairs are warped. The recess-forming pairs also have integrally corresponding ribs that help prevent warpage of the contoured recess-forming pairs during the plastic injection molding process.

Abstract: A cassette carrier unit for carrying a cassette, in which a plurality of substrates are housed, into and out of cassette chambers of the multi-chamber system including a hand on which the cassette is mounted. A multi-joined arm for supports the swingable hand, and a base supports the multi-joined swingable arm. The multi-joined arm includes a first shaft member rotatably attached to the hand, a second shaft member rotatably attached to the base, a third shaft member rotated associating with the first shaft member but in a direction reverse to the direction in which the first shaft member is rotated, and a fourth shaft member rotatably attached to the base and to which rotation drive force is transmitted. A first arm is rotatably attached to the first shaft member at the front end thereof and to the second shaft member at the base end thereof.

Abstract: A container for storing a plurality of semiconductor wafers comprises two end walls and two side walls. The container has a main opening through which the wafers are inserted into or withdrawn from the container and a sub-opening through which a wafer counter approaches the wafers. A plurality of slots are formed in the container to hold the wafers one by one at intervals. Each slot includes a pair of grooves which are formed in inner surfaces of both the side walls, have a V-shaped cross-section, and which divergently open toward a central portion of the container. One surface of each groove serves as a supporting surface on which a wafer is disposed substantially horizontal when the container is positioned such that the reference plane is horizontal. The supporting surfaces of the pair of grooves have a pair of converging portions which converge toward the second opening.

Abstract: An assembly for transferring discs between disc manufacturing machinery or processes comprises a series of storage cassettes having discs stored therein. Each stored disc is retrieved from the cassette and placed into a shuttle which carries the disc while it is processed. The processed disc is retrieved from the shuttle subsequent to the disc manufacturing process and placed into a second storage cassette. The apparatus transfers the discs by gripping them between a stationary member which engages the edge of the disc and a selectably moveable member which engages the disc hole such that the disc is pinched between the two gripping members. The gripping and transferring functions are controlled by a computer.

Abstract: A carrying in-and-out device is provided with four posts which are disposed in a distributive arrangement. The provision of the four posts ensures sufficient strength of the device even if the posts are formed thin, and the distributive disposition of the posts minimizes the turbulence and swirls of clean air to be caused when the clean air collides with the posts. As a result, there is little agitation of dust particles inside a passage. The dust particles are carried along without being scattered, and thus, loads can be prevented from adhering to the dust particles. Dust particles produced in an upper frame are sucked by upper fans and then discharged into the posts. The dust particles on the posts are further sucked by lower fans to be discharged downward.

Abstract: A heat treatment apparatus for semiconductor wafers is provided with a number, such as two, of heat treatment units which are arranged horizontally and which load wafer boats containing wafers from below. A wafer delivery section is provided to correspond to each of the two heat treatment units, and wafers are conveyed by a wafer transfer mechanism between the wafer delivery section and the heat treatment units. Carrier accommodation racks are provided in upper and lower positions across the two heat treatment units in such a manner that they can be used in common for both wafer delivery sections. The carrier transfer mechanism is provided in front of the two carrier accommodation racks in order to convey carriers containing wafers between carrier stages at front portions of the wafer heat treatment apparatus, the two carrier accommodation racks, and the two wafer delivery sections.