Abstract: A semiconductor wafer testing apparatus has a work table on which a carrier containing semiconductor wafers to be checked is placed. The work table is equipped for combined wafer alignment and wafer code recognition while the wafers remain in their carrier in one position on the work table. The alignment is accomplished with a wafer flat zone aligner which has a pair of roller pins each coming in contact with circumferences of the wafers being stacked in the carrier through an open lower part of the carrier and an opening in the table. The wafer code recognition is accomplished with an optical character recognizer that moves up and down and forward and backward with respect to the carrier, and interposes between the wafers in the carrier so as to read out codes which are on each wafer. This combined automated work station helps prevent contamination of the wafers by an operator or by unnecessary handling of the wafers, and also reduces cycle time for the entire inspection process.

Abstract: An automated guided vehicle includes a transporting portion having an upper surface and a driving device, the transporting portion being movable by the driving device; a transferring device provided on the upper surface of the transporting portion, the transferring device being capable of transferring a workpiece to or from an apparatus; and a mounting portion formed on the upper surface of the transporting portion, the mounting portion having at least two opening portions which allow an operation for transferring the workpiece. In the automated guided vehicle, photosensors are respectively arranged on the opening portions to detect an object which intrudes into a predetermined area or projects from the predetermined area, and a control device monitors a state of the photosensors and controls the transferring device or the driving device in accordance with the state of the photosensors.

Abstract: A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: An apparatus for automatically organizing a variable number of lots into a batch which can be treated with high efficiency in a semiconductor wafer manufacturing line is installed for changing the number of lots organized into a batch between preceding and succeeding processes when such change is required.

Abstract: An apparatus and method are described for stripping the photoresist from a wafer while in a substantially parallel manner, another wafer is being transferred between a load lock chamber and a transfer chamber, where the processing occurs. Further, a system is described whereby two load lock chambers are employed so that processing of wafers can continue uninterrupted by a delay caused by the need to open, empty, reload and re-equilibrate a single load lock chamber. Still further, a system is described for performing multi-step dry-stripping applications requiring different conditions for two or more of the steps wherein the steps may be performed simultaneously or sequentially. Finally, a system combining a dry-stripping module and a wet-cleaning module is described which combination system permits the continuous, fully-automated dry-stripping and wet-cleaning of wafers and, upon completion of the entire processing cycle, returning wafers to their original wafer cassettes.

Abstract: A wafer cassette conveying system is capable of reducing a communication amount between a conveying device and a control device, further shortening the time period required for a movement of the conveying device. A control device 15, when receiving both of a lot carrying-in request signal outputted from a first treating device 11 and an empty cassette carrying-out request signal outputted from a second treating device 12, outputs a lot carrying-in command signal. A conveying device 20, when receiving this lot carrying-in command signal, conveys an actual cassette of the first treating device 11 to the second treating device 12 and also conveys an empty cassette of the second treating device 12 to an empty cassette space 14.

Abstract: A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto novel trays for improved processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.

Abstract: The pod loader interface is a machine that is able to automatically open a SMIF pod and unload the contents thereof. An elevator raises the SMIF cover away from its base to reveal the wafer boat contained in the SMIF pod. An articulated arm thereafter reaches through an opening in a bulkhead of the machine, securing the wafer cassette and withdrawing it through the hole in the bulkhead. The wafer cassette is then placed in position to be operated upon by the next step in the manufacturing process. The machine includes an integrated clean air system to provide a clean environment for the wafers.

Abstract: First and second pairs of jaws are located above the second pair by a predetermined amount. The first pair of jaws is arranged to grasp the lid of a container while the second pair of jaws is arranged to grasp a carrier disposed in the container. A vertically extending column is adapted to be moved laterally along a predetermined path and for supporting the first and second pairs of jaws. A jaw vertically moving controller is provided so as to lift and lower the first and second pairs of jaws along the column. On the other hand, a jaw controller is provided so as to selectively and respectively open and close the first and second pairs of jaws.

Abstract: An integrated intrabay buffer, delivery, and stocker system including a pair of shuttles, capable, by themselves, of transferring a pod in an X-Z plane between the interbay transport system, the I/O ports of various process tools and a plurality of storage shelves provided along the wall of the tool bay. Advantageously, the present invention integrates together the process tools within a tool bay by providing a single transport mechanism shared by each tool, and by providing a single, large storage and buffer area for pods that is shared by each tool. This increases reliability and flexibility, and simplifies the hardware and software control. Additionally, the storage shelves may be provided above some or all of the process tools within the tool bay. Such an arrangement offers a substantially greater number of spaces to store a pod as compared to conventional tool bays.

Abstract: An apparatus, method and medium is provided for increasing the efficiency with which wafers are transferred among different processing chambers in a wafer processing facility. A multi-slot cooling chamber allows multiple wafers to be cooled while other wafers are subjected to processing steps in other chambers. Each wafer in the processing sequence is assigned a priority level depending on its processing stage, and this priority level is used to sequence the movement of wafers between chambers. A look-ahead feature prevents low-priority wafer transfers from occurring if such transfers would occur just prior to the scheduling of a high-priority wafer transfer.

Abstract: A transfer device for wafers stacked in magazines has a vertically displaceable frame of a platform, with which the cover of the box surrounding the magazine in the closed condition. The magazine remains in the original position on the base of the box and is then supplied by a gripping device from this position to a processing system in which the wafers are removed from the magazine and are processed. A gripping device preferably has two extension arms arranged on both sides of the magazine as well as one stop element which can be caused to impact on the wafer edges. The stop element preferably has two lips consisting of an elastic material which lips can be caused to impact on the wafer edges. The device permits a very fast loading and unloading into or out of the processing system.

Abstract: There is provided a cassette carrying-in system, which can rotate a cassette housing therein substrates to be treated so that the substrates are changed from a vertical state to a horizontal state and which can carry the cassette in, e.g., a load-lock chamber of a vacuum processing unit. The cassette carrying-in system is provided for carrying a cassette, in which a plurality of substrates to be processed are arranged in parallel, in a processing unit for treating the substrates.

Abstract: An apparatus for detecting the presence of a wafer cassette, or pod, resting on an arrangement of pins allows cassette detection without interfering with insertion of a robotic paddle arm beneath the cassette to remove it for transport. A cassette resides on an arrangement of beveled pins which mate with corresponding receptacles on the underside. Pins supporting the cassette have a spring biased, hollow outer cylinder coaxially mounted around a center post. A cassette placed on the pins displaces the outer cylinder downward a sufficient distance to trigger a sensor. Upon removal of the cassette, the outer cylinder is displaced upwards, resetting the sensor.

Abstract: An improved apparatus and method is provided for storing semiconductor wafer carriers, and for loading wafers or wafer carriers to a fabrication tool. The apparatus comprises a plurality of storage locations positioned above the fabrication tool. The apparatus receives wafer carriers via a factory load port. The wafer carriers are transported between the factory load port and the storage locations via a first robot, and are transported between the fabrication tool load port and the storage locations via a second robot. Both robots access the respective load port from overhead, thus eliminating the need for a front loader robot, and reducing the apparatus' footprint. Each robot may access overhead factory transportation systems to provide further flexibility in wafer carrier transport. Additionally, the apparatus of the present invention may include a mechanism for opening pod type wafer carriers and for extracting wafers therefrom.

Abstract: A functional load lock apparatus having two or more load lock chambers mounted on a central chamber which can be mounted on a single opening in a vacuum chamber such as a substrate processing platform for making integrated circuits on silicon wafers. Each load lock chamber preferably has a semi-cylindrical valve which remains sealed when the load lock chamber is open to atmospheric pressure. A wafer cassette holder positioned within each load lock chamber can be loaded and unloaded while the semi-cylindrical valves seal the vacuum chamber from atmospheric pressure. The semi-cylindrical valve pivots to an open position when the load lock chamber is under vacuum and the entire wafer cassette moves from the load lock chamber to the central chamber.

Abstract: A rotary shaft is supported by a frame so as to be rotatable and movable vertically relative to the frame. A carrying arm is pivoted to the rotary shaft and a substrate receiver is attached to an end of the carrying arm and receives a substrate. A guide base is mounted on the rotary shaft on the lower side of the substrate receiver in such a manner that the guide base is approximately parallel to the substrate receiver, and a substrate alignment mechanism is attached to the rotary shaft via the guide base. The substrate alignment mechanism includes a pair of location correcting members which are coupled to air cylinders. The location correcting members are displaced by air cylinders to correct the location of substrate.

Abstract: An improved apparatus and method is provided for handling, moving and storing semiconductor wafer carriers. The apparatus comprises two physically separate load ports, each coupled to a vertical transfer mechanism. Coupled between the two vertical transfer mechanisms is a horizontal transfer mechanism which extends above the footprint of the fabrication tool to which wafers are to be supplied. In a preferred embodiment the horizontal transfer mechanism comprises a bi-level conveyor comprised of a series of dual compartment segments. The dual compartment segments are coupled such that they may shift between a neutral and a positive position while maintaining a continuous movement channel between the two vertical transfer mechanisms. In this manner a wafer carrier may be placed within a first compartment of a neutrally positioned segment for movement; to store the wafer carrier the segment is shifted to the positive position.

Abstract: A cassette transfer mechanism according to the present invention comprises a cassette chamber for containing a cassette for holding a plurality of objects to be processed, a cassette transfer port formed in the cassette chamber, for allowing the cassette to be transferred into and from the cassette chamber, an object transfer port formed in the cassette chamber and opened at a predetermined angle to an opening direction of the cassette transfer port, for allowing the objects to be transferred into and from the cassette chamber, an elevation table provided in the cassette chamber such that the elevation table can be elevated, a shaft installed rotatably on the elevation table and extending in a direction substantially perpendicular to an opening direction of the object transfer port, a cassette support table fixed to the shaft and having a bottom support portion for receiving a bottom surface of the cassette and a back surface support portion for receiving a back surface of the cassette, for orienting the cass

Abstract: The cassette transfer mechanism of the present invention comprises a cassette chamber for housing a cassette storing a plurality of substrates, a liftable stand capable of moving up and down in the cassette chamber, a cassette holder having a bottom-surface supporting portion for supporting a bottom-surface of the cassette and a back-surface supporting portion for supporting a back-surface of the cassette, and a moving mechanism provided outside the cassette chamber and rotatably supporting the cassette holder, for moving the cassette holder between a waiting position outside the cassette chamber and the liftable stand inside the cassette chamber, wherein the moving mechanism has rotation mechanism for rotating the cassette holder around an axis crossed virtually in perpendicular to an axis extending along the moving direction of the liftable stand.

Abstract: A wafer transfer system is described for transferring a wafer while at substantially the same time another wafer is being processed. The wafer transfer system comprises, in one embodiment, a transfer chamber having a wafer transfer blade, a load lock chamber coupled to the transfer chamber, an atmospheric robot for loading and unloading the wafer into the load lock chamber, and a slider coupled to the wafer transfer blade for moving the wafer transfer blade between the transfer chamber and the load lock chamber. According to a preferred embodiment, the slider utilizes a magnetic coupling mechanism. In a further embodiment, a device comprising a transfer chamber coupled to a plurality of plasma sources capable of simultaneously or sequentially providing different plasma structures within the transfer chamber, is described.

Abstract: A rotating and translating support assembly for receiving a front-opening pod according to applicable SEMI standards, and thereafter rotating the pod to a desired orientation. In this way, a number of pods may be received at interface ports of a minienvironment, and each of the pods and ports may be angled toward and aligned with a single, 2-arm pick and place robot. In a preferred embodiment of the present invention, the rotating and translating support assembly comprises a plate rotationally and translationally mounted on a shelf extending from the minienvironment adjacent to a front-opening interface port. In one embodiment, the support plate may be mounted on a shaft attached to a rotating assembly, such as for example a worm and drive gear. The rotating assembly may in turn be mounted on a translating assembly, such as for example a carriage riding on a lead screw.

Abstract: An automatic wafer plating equipment for automatically plating wafers and more particularly, for automatically plating a small lot of wafers is disclosed. The automatic wafer plating equipment includes a transfer robot provided with a holding arm for pivoting, vertical movement, extending and extracting, a load stage, an orientation stage, a plating stage, a recovery stage, and a cleaning stage. The transfer robot carries out a series of the following operations for plating process. The wafers are picked up one by one from a supply cassette loaded to the load stage. The wafer is then fed to the orientation stage. The wafer orientated at the orientation stage is conveyed to the plating stage. The plated wafer is transferred from the plating stage to the recovery stage. When residue of a plating liquid has been recovered at the recovery stage, the wafer is conveyed to the cleaning stage.

Abstract: There is provided a clean room for manufacturing of semiconductor device which has further enhanced the transferring capability responding to the request for short Turn Around Time. In this clean room for manufacturing of semiconductor device, a manufacturing facility comprising various manufacturing apparatuses and measuring apparatuses for manufacturing semiconductor device is arranged in the manufacturing space on the floor, the clean air is blown from the ceiling side of the manufacturing space, the air is then returned to the area under the floor via the ventilating aperture formed at the floor for circulating the air. The transfer route of the transferring system for transferring precursors of semiconductor device between each manufacturing facility is provided in the air returning area under the floor provided to return the air in the manufacturing space. Feeding of the precursors between the transferring system and manufacturing space can be executed through the aperture formed on the floor.

Abstract: The invention relates to a dimensional control device for semiconductor wafer transport cassettes. Each cassette has a base from which extend vertical walls including horizontal grooves designed to receive wafers by lateral insertion. The device includes a seat provided with positioning guides of a cassette base; switches placed on the seat so that the actuation of all the switches by the positioned base indicate a suitable planarity of the base; a drawer mounted slidably on the seat so as to be engageable in the cassette in the insertion direction of the wafers, and having at least one template corresponding to a high position groove of the cassette; and a stop placed on the seat, at the side opposite to the drawer with respect to the cassette, to cause a tilting of the cassette when the drawer is moved towards the cassette and the template does not correspond to the cassette.

Abstract: An automated system is presented for containerless transfer of semiconductor wafers through a wall separating a first fabrication area and a second fabrication area. The system includes multiple containers for transporting the wafers, one or more air lock chambers, mass transfer systems, robotic arms, stock areas, and a control system. The containers (e.g., wafer boats) are dispersed between the first and second fabrication areas. A portion of the containers contain at least one semiconductor wafer, and the remainder of the containers are empty. The air lock chambers are positioned in sealed openings in the wall. The air lock chambers provide isolation between the first and second fabrication areas while permitting the transfer of semiconductor wafers between the fabrication areas. A mass transfer system is positioned within each air lock chamber and allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to each air lock chamber.

Abstract: To allow an elevating body (17) in a clean robot (RB) installed in a clean room (R) to be located outside frames (4) without protruding from a swivel base (2) in order to enable the elevating body to be assembled and maintained easily and to ensure a wide elevating stroke. Two hollow frames (4, 4) extend vertically from the right and left sides of the rear of a swivel base (2) so as to be approximately symmetrical, a cover (9) is mounted between the frames (4, 4) and an elevating body (17) having a robot body (20) at its tip is accommodated in an elevating space (13) in the cover (9) and supported by rails (15) in the frames (4) so as to travel upward and downward.

Abstract: A device for chemical wet treatment of substrates has a tank containing a treatment fluid for treating the substrates. At least one substrate carrier for supporting the substrates within the tank is provided. At least one substrate lifting device for lifting the substrates off the substrate carrier is provided. A lifting apparatus for lifting and lowering the substrate carrier is positioned in the tank. The lifting apparatus has a first transport carriage connected to the substrate lifting device and a second transport carriage connected to a holder of the substrate carrier. The first and second transport carriages are connected to one another by a jointed connection.

Abstract: A wafer transfer system is described for transferring a wafer while at substantially the same time another wafer is being processed. The wafer transfer system comprises, in one embodiment, a transfer chamber having a wafer transfer blade, a load lock chamber coupled to the transfer chamber, an atmospheric robot for loading and unloading the wafer into the load lock chamber, and a slider coupled to the wafer transfer blade for moving the wafer transfer blade between the transfer chamber and the load lock chamber. According to a preferred embodiment, the slider utilizes a magnetic coupling mechanism and a plurality of plasma sources are coupled to the transfer chamber. The plurality of plasma sources are arranged in a plurality of pairs of plasma sources. Each plasma source in a pair of plasma sources share the other plasma source's induction coils.

Abstract: A transportable container for storing and carrying articles such as semiconductor wafers or flat panel display substrates which is adapted for horizontal loading and unloading. The container includes a box and a box door. The box door can be sealably attached to the box to isolate the interior of the box from ambient atmospheric conditions. The container is adapted to mate with a port of a canopy which encloses a semiconductor processing apparatus.

Abstract: A loading apparatus includes a cassette loader with a cassette support plate that can extend through a window of an enclosure. A cassette on the support plate can be moved through the window. A motor rotates the support plate to place the cassette in position to be lifted by a robotic arm and transferred to a holding tub. When the support plate is rotated, a shield moves to a position to close the window.

Abstract: A system for automatic loading of wafer boats onto a cantilever paddle for insertion of the wafer boats into a furnace tube includes an end effector carriage moving on a track and supporting an end effector having spaced, parallel pads to engage opposed outer side portions of a wafer boat. The end effector receives a wafer boat from a robotic arm of an elevator. The robotic arm moves transversely relative to the track to position the wafer boat over the track on which the paddle carriage moves. The end effector carriage moves the end effector pads under the wafer boat, lifts it from a pair of elevator tines, moves the wafer boat over a desired part of the paddle, and lowers the wafer boat onto the paddle. The end effector carriage then returns the end effector to an initial location.

Abstract: A system includes an interface for receiving a pod having a carrier that receives wafers, and that is initially enclosed within a base and a pod cover. The system also includes a mechanism that transfers an exposed carrier between the interface and a platform of a mass-transfer machine included in the system. The machine includes a gantry arm for transferring the carrier between the platform and a transfer station. A retainer assembly is positionable over the carrier at the transfer station, and over a process carrier that is used in a processing tool. Moveable retainers of the assembly receive and hold wafers. The machine includes an elevator that moves between the transfer station and the process carrier. The elevator extends and retracts for transferring wafers between the retainers and either the carrier or the process carrier. A turntable, that receives the process carrier, permits automatically reorienting wafers.

Abstract: The present invention provides a substrate treating system for successively treating a plurality of substrates W under an air-conditioned environment.

Abstract: A mobile work-in-process parts tracking system includes a vehicle for transporting the work-in-process parts stored in containers, a tag mounted on the container and a tag reader mounted on the vehicle for reading the tag and outputting data to a data concentrator which accepts data from a plurality of tag readers and then outputting data in a single cable by removably connecting to a data distributor mounted in the factory floor, such that the location of the WIP parts transported on the vehicle can be tracked and monitored.

Abstract: A cassette chamber according to the present invention comprises a housing defining a space stored with a cassette for holding a plurality of objects of treatment, a lift base having a rotatable shaft and located in the housing for up-and-down motion, an auxiliary base fixed to the shaft and inclined at a predetermined angle to the longitudinal direction of the shaft, a cassette support having a bottom support portion set on the lift base and bearing the bottom face of the cassette and a back support portion rotatably supported by the auxiliary base and bearing the back face of the cassette, a rotation mechanism for rotating the shaft as the lift base ascends or descends, thereby rotating the auxiliary base and the cassette support between a first position inside the housing and a second position outside the housing, and a support section for keeping the back support portion of the cassette support parallel to the shaft by engaging the back support portion being rotated to the second position by the rotation m

Abstract: A vertical heat treatment system has a transfer apparatus for transferring semiconductor wafers and a cassette serving as a transport container for the semiconductor wafers. The transfer apparatus has a base disposed to be vertically movable and rotatable within a horizontal plane. Wafer arms for transferring the wafers placed on them are disposed on the base. The wafer arms can reciprocally move on the base between a standby position and an advanced position in the horizontal direction. A cassette arm for transferring a cassette placed on it is also disposed on the base. The cassette arm can reciprocally move on the base between a retreat position and a protruded position in the horizontal direction. The wafer arms and the cassette arm are reciprocally movable in opposite directions to oppose each other. While the wafer arms and the cassette arm are at the standby position and the retreat position, respectively, a holding portion of the cassette arm is present immediately above the wafer arms.

Abstract: A vacuum processing apparatus is composed of a cassette block and a vacuum processing block. The cassette block has a cassette table for mounting a plurality of cassettes containing a sample and an atmospheric transfer means. The vacuum processing block has a plurality of processing chambers for performing vacuum processing on the sample and a vacuum transfer means for transferring the sample. Both of the plan views of the cassette block and the vacuum processing block are nearly rectangular, and the width of the cassette block is designed to be larger than the width of the vacuum processing block, and the overall plan view of the vacuum processing apparatus is formed in an L-shape or a T-shape.

Abstract: A treatment system is disclosed, which has a treatment apparatus for performing a predetermined treatment for a planar workpiece contained in a carrier, and a first air-tight carrier storage chamber for storing the carrier. The treatment apparatus may also have an air-tight second carrier storage chamber. An inert gas supply pipe and an exhaust pipe are connected to each of the treatment apparatus, the first carrier storage chamber, and the second carrier storage chamber. A open/close valve device is provided for each of the inert gas supply pipes and the exhaust pipes.

Abstract: The docking and purging system docks a modular isolation container for substrates used in manufacturing integrated circuits for purging and processing in a processing environment. A door portion of the docking and purging system includes a shelf for receiving the modular isolation container before insertion in a docking chamber formed in the housing connected for communication with the processing environment. A vacuum manifold with suction cups is provided for gripping and removing the modular isolation container door to allow access to the interior chamber of the modular isolation container. The docking chamber and interior chamber of the modular isolation container can also be purged of particulate contaminates by filtered air or inert gas ducted to the docking chamber.

Abstract: A modular, transportable housing for storing substrates, such as semi-conductor wafers and masks, and for maintaining such substrates in a substantially clean environment. Substrates are supported within the housing by a plurality of combs which maintain the substrates in spaced relationship relative to each other. Access to the interior of the housing is permitted by a pivotal door assembly. A docking unit permits interface of the housing with a clean environment. Control circuitry provided in the docking unit detects the presence of a housing and loads/unloads the housing as directed by a host computer through a communication link. A memory device is preferably mounted to the housing for storing history and other information about the substrates within the housing. The host computer directs the control circuitry to retrieve the substrate information from the memory and relay the information to the host computer. During or after processing of the substrates, the host computer updates the memory as desired.

Abstract: A wafer extraction platform that is compatible with a high vacuum transfer system includes magnetically coupled upper and lower assemblies. A vacuum to atmosphere seal on the platform is maintained with two O-rings. Two opposing arrays of spaced, parallel blades in the upper assembly define slots for receiving wafers from a cassette. The upper assembly moves in response to a magnetically coupled linear slide mounted on the lower assembly. The upper assembly moves outside the load lock, and the blades pick up and simultaneously extract the wafers from the cassette. The upper assembly retracts into the load lock, and the wafers are transferred to the process chamber. A linear motor mounted at atmospheric pressure inside the lower assembly permits the horizontal movement of the upper assembly while holding the blades parallel to the wafers. Level adjustment screws and a bellows are used to level the platform.

Abstract: A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region.

Abstract: An apparatus is provided for opening a Standardized Mechanical Interface transport box and facilitating access to the articles within the transport box by mechanisms inside a pressurized, isolated, controlled environment while maintaining isolated, controlled environment conditions, the apparatus comprising: a base for opening the transport box and supporting the box port and articles within, a platform for lifting the remainder of the transport box, a mechanism for lifting the platform, a flexible seal between the base and platform with devices for controlling contamination by use of the controlled environment pressurization and a pocket-style door providing isolation to the controlled environment when the transport box is either closed or not present. The apparatus further includes a base extender slidably movable into the controlled environment and devices for sensing mispositioned articles following return of the articles from the controlled environment to the base of the transport box.

Abstract: A processing apparatus is provided with a reaction furnace for subjecting semiconductor wafers, which are objects to be processed, to a predetermined processing; a storage rack for storing carriers (wafer cassettes), each containing a predetermined number of semiconductor wafers; and a conveyor for conveying the carriers into and out of the reaction furnace and the storage rack. In this case, a second conveyor mechanism, which comprises the storage portion and at least part of the conveyor, and a third conveyor mechanism are disposed within a sealed chamber in such a manner that they are isolated from the outer atmosphere. An exchange chamber that can be isolated from the outer atmosphere is further provided, for temporarily storing carriers that are to be conveyed into or out of the storage portion, through the sealed chamber via a communicating port. The interiors of the sealed chamber and the exchange chamber are formed so that they can be supplied with nitrogen.

Abstract: A substrate processing apparatus comprises a substrate transfer chamber; a plurality of substrate processing chambers disposed on a first side wall of the substrate transfer chamber and stacked in the vertical direction; a plurality of first gate valves, each being disposed between each of the substrate processing chambers and the substrate transfer chamber; a substrate accommodating chamber disposed on a second side wall of the substrate transfer chamber; a substrate transfer device, disposed within the substrate transfer chamber, for transferring the substrate under reduced pressure between the substrate processing chambers and the substrate accommodating chamber; an elevator disposed outside the substrate transfer chamber and comprising a stationary portion and an elevating portion which is vertically movable with respect to the stationary portion; a rigid connecting member capable of moving through a through-hole formed in a predetermined face of the substrate transfer chamber, the rigid connecting member

Abstract: A method and apparatus for removing a semiconductor wafer cassette from a SMIF pod and for transferring the cassette along a vertical axis to a platform of a wafer processing station. The apparatus is comprised of a transfer device that includes a pair of gripping arms for gripping the wafer cassette from the sides of the cassette. Once gripped, the cassette moves with the transfer device upward along a vertical axis to make room for the platform to be extended from within the processing station to a position under the cassette. Thereafter, the direction of motion of the transfer device is reversed and the cassette is lowered onto the platform. Once seated on the platform, the gripping arms retract from the cassette, and the cassette is carried on the platform into the processing station.

Abstract: In a loading and unloading station for semiconductor processing installations, the object of the present invention is to ensure charging proceeding from transporting containers under clean room conditions. These transporting containers themselves serve as magazines for disk-shaped objects and are open laterally. It should also be possible, optionally, to load and unload a greater quantity of such transporting containers, wherein the exchange of transporting containers must be effected under favorable ergonomic conditions. According to the invention, the transporting container for loading, unloading and reloading of disk-shaped objects is coupled in a stationary manner by the container cover with the closure by using an adhering engagement. The charging opening and the transporting container are opened simultaneously in that the container cover and the closure are moved down jointly into the semiconductor processing installation.

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

Abstract: A system for automatic loading of wafer boats onto a cantilever paddle for insertion of the wafer boats into a furnace tube includes an end effector carriage moving on a track and supporting an end effector having spaced, parallel pads to engage opposed outer side portions of a wafer boat. The end effector receives a wafer boat from a robotic arm of an elevator. The robotic arm moves transversely relative to the track to position the wafer boat over the track on which the paddle carriage moves. The end effector carriage moves the end effector pads under the wafer boat, lifts it from a pair of elevator tines, moves the wafer boat over a desired part of the paddle, and lowers the wafer boat onto the paddle. The end effector carriage then returns the end effector to an initial location.