Abstract: A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further contains non-gold alloys of aluminum, copper and preferably an element of the group of Co, Ni, Ga, Ti, In, Cd, Sn, Fe and Pd.

Abstract: This invention relates to a wire bonding gold line used for connecting a semiconductor tip electrode with an outside lead portion. This gold wire characteristically contains gold (Au) having a purity level 99.996-99.9995 wt % and 0.0032-0.008 wt % by total weight of said gold wire of germanium (Ge) so that the electric resistance of the wire bonding gold line is reduced, while the mechanical strength such as tensile strength and high temperature strength is excellent and a gold ball can be shaped into the form of a nearly perfect sphere in the connection of the tip electrode.

Abstract: A bonding wire for use in semiconductor devices which consists essentially of 0.0003 to 0.01 wt. % of barium and the balance gold, the gold purity of said bonding wire being at least 99.99%. The bonding wire may further contain at least one element selected from the group consisting of 0.0005 to 0.005 wt. % of aluminum, 0.0001 to 0.003 wt. % of calcium, 0.0005 to 0.005 wt. % of silver and 0.0005 to 0.005 wt. % of palladium. The total content of the elements and barium in the bonding wire should not exceed 0.01 wt. % based on the weight of the bonding wire so that the gold purity of the bonding wire is at least 99.99%. The use of the additive elements improve the mechanical strength and wire-bondability, making the bonding wire highly suitable for use in wire bonding of semiconductor elements, especially for high-speed bonding.

Abstract: A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy can possess in solid state different crystal structures at a first temperature higher than the room temperature and at a second temperature lower than the first temperature but not lower than the room temperature. A part of the surface of the alloy exhibits, as a result of being quenched from the first temperature, a crystal structure which is different from the crystal structure at the second temperature, while the other part possesses the crystal structure at the second temperature, so that these two parts exhibit different spectral reflectances. Using this recording medium, it is possible to record, reproduce and erase information by means of, for example, laser beams.

Abstract: Superelastic dental Au-Cu-Zn alloys characterizing that it is in a range defined by point A (63 wt % Au, 11 wt % Cu, 26 wt % Zn), Point B (55 wt % Au, 17 wt % Cu, 28 wt % Zn), Point C (55 wt % Au, 18 wt % Cu, 27 wt % Zn), Point D (63 wt % Au, 14 Wt % Cu, 23 wt % Zn), Point E (65 wt % Au, 12 wt % Cu, 23 wt % Zn) and Point F (65 wt % Au, 11 wt % Cu, 24 wt % Zn), in the Au-Cu-Zn ternary diagram of FIG. 1.

Abstract: Brazing alloys containing up to a specified amount of a reactive metal selected from the group consisting of titanium, zirconium, vanadium and mixtures thereof and only one metal selected from the group consisting of silver, gold, palladium, iron, nickel, copper and aluminum are ductile and can be rolled into foils.

Abstract: A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.

Abstract: A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 97% by weight gold and 3 to 25% by weight cadmium/antimony alloy dispersed in an inert liquid vehicle.

Abstract: A heat resistant brazing alloy of a major amount of gold, a lesser amount of indium and a minor amount of tin. The alloy is particularly suited for use in bonding electrical components to chip carrying substrates which are to be reworked.

Abstract: Reactive metal-palladium-gold ductile alloys are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A multicomponent alloy for targets employed in the sputter coating of gold layers, said alloy having 35% to 55%, preferably either 50% or 42%, non-aurous alloy components.

Abstract: A jewelry alloy is disclosed preferably of 3 to 5 karat gold having the color, hue and shine characteristics of 10 or higher karat yellow gold. Although the alloy disclosed is virtually identical in appearance to 10 to 18 karat yellow gold, it is substantially less expensive and provides a relatively low cost substitute for 10 and higher karat yellow gold. The alloy has the following composition, by weight:Gold: 17-25%Silver: 10-27%Copper: 40-60%Zinc: 3- 12%In addition to its appearance, the alloy disclosed has good corrosion and high tarnish resistance, good workability and castability and can be plated, if desired, and sized with conventional solders.

Abstract: Gold based contact materials fabricated by directional solidification and hibiting increased strength, hardness, wear resistance and undegraded electrical conductivity, are presented. An eutectic structure comprises a matrix metal consisting essentially of gold and a second phase rich in an alloying material. The second phase rich in an alloying material is disposed within the matrix metal in a plurality of elongated zones formed by directional solidification of the alloy with each zone having an elongated axis generally normal to a contact boundary surface of the solid. The second phase is rich in an alloying material selected from a group of alloying elements consisting of Be, Ca, Sr, La, Na, Th, Zr, Hf, Sb, Ge, Mo, Si and the rare earth elements. Selected ones of the alloying elements can be subjected to internal oxidation for forming hard, oxide particles of the second phase material.

Abstract: Gold-based intermetallic compounds suitable as a contact material for electrical contacts are presented. The gold-based electrical compounds are selected from a group consisting of Au.sub.4 In, Au.sub.10 Sn, and AuPd or from intermetallic compounds having an ordered hexagonal crystal structure and of the type Au.sub.n X where n is at least 3 and X is selected from a group consisting of In, Sn, and Pd.

Abstract: There is presented gold based contact materials fabricated by internal carization and method therefor. Carburizable refractory elements are carburized by internal carburization by exposing a gold based solid solution containing the refractory element to an atmosphere of a gaseous oxide of carbon at an elevated temperature. The elevated temperature is chosen to be below the melting point of the solid solution and high enough to cause gaseous decomposition of a carbon material packed with the solid solution within an enclosing container. The carburizable refractory element with the solid solution is preferentially carburized by the gaseous oxide of carbon to form hard, refractory second phase carbide particles within the gold matrix.

Abstract: A gold based electrical contact material comprising an oxide of an oxidize element in the gold matrix formed by subjecting the solid solution to an oxidizing atmosphere for internally oxidizing the oxidizable element is presented. Such internal oxidation forms hard second phase oxide particles dispersed throughout the solution having high wear resistance, high hardness, high strength and high conductivity with homogeneous and uncontaminated structure.

Abstract: There is presented an electrical contact material consisting of an alloy of gold and a compound selected from a group consisting of a carbide, a boride, or a silicide of a refractory element. The compound of the refractory element is selected from a group consisting of WC, Hfb.sub.2, TiB.sub.2, ZrB.sub.2, WSi.sub.2, and TiSi.sub.2. The resulting alloys have a hexagonal crystal structure and exhibit high wear resistance, low contact resistance, low electrical noise, and a homogeneous uncontaminated microstructure.

Abstract: This invention relates to an alloy for bonding gold-plated substrates together. In a more specific aspect, it relates to a braze alloy for bonding gold-plated lids to gold-plated seal rings or gold-plated Kovar substrates. In another aspect, it deals with a method for bonding gold-plated lids to gold-plated Kovar substrates.