Abstract: A method of producing a thin layer, high-temperature superconductor strip is disclosed. In the method, a metal salt solution is formed and coated onto a substrate including a high-temperature superconductor layer. Heat is then applied directly or indirectly to the solution. The metal salt solution may contain a metal-organic salt solution or a metal inorganic metal salt solution. When an inorganic metal salt solution is utilized, a reducing solution may also be applied to the HTSC layer prior to heating. In addition, nano-sized metal particles may be added to the metal salt solution and/or the reducing solution.

Abstract: This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.

Abstract: The display substrate includes a base substrate, a micro shutter, a first driving electrode, a second driving electrode and a plurality of anchors. The micro shutter is disposed on the base substrate, and includes a plurality of opening parts and a blocking part. The blocking part includes at least two trench structures and the blocking part is disposed between an adjacent pair of the opening parts . The first driving electrode is connected to a first side of the micro shutter. The second driving electrode is connected to a second side of the micro shutter opposite to the first side of the micro shutter. The plurality of anchors fixes the first and second driving electrodes and the micro shutter on the base substrate.

Abstract: A method and apparatus for increasing the electrical resistivity and corrosion resistance of the material forming a spacer layer in current-perpendicular-to-the-plane (CPP) giant magnetoresistive (GMR) sensors. The increased resistivity of the spacer layer, and thus, the CPP-GMR sensor permits a larger voltage across the sensor and a higher signal-to-noise ratio. The increased corrosion resistance of the spacer layer minimizes the effects of exposing the spacer layer to corrosive materials during fabrication. For example, adding tin to silver to form a metallic alloy spacer layer increases the corrosion resistance of the spacer layer and the electrical resisitivity of the CPP-GMR sensor relative to a spacer layer consisting solely of silver. The Ag—Sn alloy permits a larger current to flow through the sensor, which increases the signal-to-noise ratio.

Abstract: Embodiments of a MEMS antenna are presented. Additionally, systems incorporating embodiments of a MEMS antenna are presented. Methods of manufacturing a MEMS antenna are also presented. In one embodiment, the MEMS antenna includes a substrate, a metallic layer disposed over the substrate, the metallic layer forming a ground plane, the ground plane having a region defining a gap disposed therein, a protrusion disposed over the substrate within the region defining the gap, the protrusion extending outwardly from the ground plane, the protrusion having a length and a width, the length being greater than the width, and a first electromagnetic radiator element disposed over the protrusion, the first electromagnetic element having a length and a width, the length being greater than the width.

Abstract: Particular functional nanocomposite materials can be employed as electrodes and/or as electrodes in energy storage systems to improve performance. In one example, the nanocomposite material is characterized by nanoparticles having a high-capacity active material, a core particle having a comminution material, and a thin electronically conductive coating having an electronically conductive material. The nanoparticles are fixed between the core particle and the conductive coating. The comminution material has a Mohs hardness that is greater than that of the active material. The core particle has a diameter less than 5000 nm and the nanoparticles have diameters less than 500 nm.

Abstract: Has an object of providing a crimp terminal, a connection structural body, and a method for producing the crimp terminal, which has a conducting function with certainty, with no galvanic corrosion occurring due to an electric wire and the terminal formed of different metal materials. A crimp terminal 1 includes a box section, and a pressure-bonding section including a wire barrel section and an insulation barrel section, which are provided in this order. The crimp terminal is formed of a metal plate which is formed of a copper alloy having a higher potential than aluminum used to form core wires of an insulated wire which is to be pressure-bonded by the pressure-bonding section. The crimp terminal 1 includes, in at least a part thereof, a resin cover section for covering a surface of the metal plate with a resin.

Abstract: A method for making ion conducting films includes the use of primary inorganic chemicals, which are preferably water soluble; formulating the solution with appropriate solvent, preferably deionized water; and spray depositing the solid electrolyte matrix on a heated substrate, preferably at 100 to 400° C. using a spray deposition system. In the case of lithium, the deposition step is then followed by lithiation or addition of lithium, then thermal processing, at temperatures preferably ranging between 100 and 500° C., to obtain a high lithium ion conducting inorganic solid state electrolyte. The method may be used for other ionic conductors to make electrolytes for various applications. The electrolyte may be incorporated into a lithium ion battery.

Abstract: The invention provides a method for manufacturing the sealant for the liquid crystal display, comprising the following steps of: adding the conductive medium and the supporting fiber into the raw material of the sealant and equally mixing them; putting the obtained mixture into the defoaming machine to process defoaming treatment; distributing the defoamed mixture to the coater; executing the movement of frame drawing on the substrate for the liquid crystal display via the coater; finally the sealant for the liquid crystal display will be formed after the solidification. The invention further provides a sealant material and a liquid crystal display. The invention is able to effectively reduce the residual of the conductive adhesive or the sealant on the liquid crystal display and avoid the Mura phenomenon.

Abstract: A method of forming a conductive via in a substrate includes forming a via hole covered by a dielectric layer followed by an annealing process. The dielectric layer can getter the mobile ions from the substrate. After removing the dielectric layer, a conductive material is formed in the via hole, forming a conductive via in the substrate.

Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).

Abstract: A rapid manufacturing method includes forming tooling in a rapid manufacturing process. The tooling is coated with a conductive material.

Abstract: In one or more embodiments, barriers for reflective pixels electrodes of display devices and methods are disclosed. In one such embodiment, a reflective spatial light modulator for a display device has a plurality of reflective pixel electrodes. Each reflective pixel electrode may include a conductor, a tantalum containing barrier over the conductor, and a conductive reflector over the conductive barrier.

Abstract: An anode active material, an anode including the anode active material, a lithium battery including the anode, and a method of preparing the anode active material. The anode active material includes: a multilayer metal nanotube including: an inner layer; and an outer layer on the inner layer, wherein the inner layer includes a first metal having an atomic number equal to 13 or higher, and the outer layer includes a second metal different from the first metal.

Abstract: A method is described for the production of a manufactured article (20) constituted of an elastomeric polymer substrate, in selected zones of which there are deposits of particles of nanometric size of a metal or some other compound which create a region (24) of the polymeric element having desired electrical, biocompatibility and/or dielectric properties, and such that said properties are maintained even after numerous elastic deformations of the manufactured article; the invention also relates to functionalized elastomeric manufactured articles obtained by means of said method.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.

Abstract: Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: A method of synthesis to produce gram-scale quantities of copper nanowires in an aqueous solution, wherein the copper nanowires are dispersed in said solution. Copper nanowires grow from spherical copper nanoparticles within the first 5 minutes of the reaction. Copper nanowires can be collected from solution and printed to make conductive films (preferably <10,000 ?/sq) that preferably transmit greater than 60% of visible light.

Abstract: Disclosed are a current collector for a flexible electrode, a method of manufacturing the same, and a negative electrode including the same. The current collector for a flexible electrode includes: a flexible polymer substrate; a cross-linkable polymer layer disposed on the polymer substrate; and a metal layer disposed on the cross-linkable polymer layer, wherein the surface of the cross-linkable polymer layer includes a plurality of protrusions and grooves.

Abstract: A method for making ion conducting films includes the use of primary inorganic chemicals, which are preferably water soluble; formulating the solution with appropriate solvent, preferably deionized water; and spray depositing the solid electrolyte matrix on a heated substrate, preferably at 100 to 400° C. using a spray deposition system. In the case of lithium, the deposition step is then followed by lithiation or addition of lithium, then thermal processing, at temperatures preferably ranging between 100 and 500° C., to obtain a high lithium ion conducting inorganic solid state electrolyte. The method may be used for other ionic conductors to make electrolytes for various applications. The electrolyte may be incorporated into a lithium ion battery.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages and the fabrication thereof, wherein a microelectronic device may be formed within a bumpless build-up layer coreless (BBUL-C) microelectronic package and wherein a warpage control structure may be disposed on a back surface of the microelectronic device. The warpage control structure may be a layered structure comprising at least one layer of high coefficient of thermal expansion material, including but not limited to a filled epoxy material, and at least one high elastic modulus material layer, such as a metal layer.

Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.

Abstract: The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

Abstract: The present invention discloses a housing for an electronic device and method for making the housing. The housing includes a base, an antenna radiator, and a decoration layer. The antenna is formed on the base by injection molding and is covered by the decoration layer. The antenna radiator is made of a primary layer, and plating plastic. The antenna is covered and protected by the decoration layer, thus, the housing can be used for a long period.

Abstract: An antenna module includes a main body and an antenna radiator located on the main body. The antenna radiator is made of a liquid conductive material mixed by metal powders and diluting agent and is directly formed on the main body. A method for making the antenna module is also described.

Abstract: A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

Abstract: Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator including a plurality of ultrasonic transducers underlying and ultrasonically energizing a reservoir of liquid feed which forms droplets of the aerosol. Carrier gas is delivered to different portions of the reservoir by a plurality of gas delivery ports delivering gas from a gas delivery system. The aerosol is pyrolyzed to form particles, which are then cooled and collected. The invention also provides powders made by the method and devices made using the powders.

Abstract: A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions.

Abstract: A laminate (1) includes a ceramic substrate (11), a piezoelectric element (10), and an intermediate layer (15). The piezoelectric element (10) includes a lower electrode (12). The intermediate layer (15) is formed between the substrate (11) and the lower electrode (12) of the piezoelectric element (10). The intermediate layer (15) contains a metal or an oxide thereof as a main component. The metal is different from a metal contained in the lower electrode (12). The intermediate layer further contains holes (152).

Abstract: The invention relates to conductive inks obtained by combining AQCs and metal nanoparticles. Atomic quantum clusters (AQCs), which melt at temperatures of less than 150° C., are used as low-temperature “flux” for the formulation of conductive inks. The combination of AQCs with bimodal and trimodal mixtures of nanoparticles of various sizes guarantees the elimination of free volumes in the final sintering of the nanoparticles in order to achieve electronic structures with very low resistivity (close to that of the bulk material) with low-temperature thermal treatments (<150° C.

Abstract: In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate, the sputtering plate comprising a sputtering surface and a back surface. At least one of the back surface of the sputtering plate, the front surface of the backing plate, or the back surface of the backing plate has at least one groove (30) that is shaped and sized to correspond to an observed region of higher sputtering of the sputtering plate relative to an adjacent area of the sputtering plate. An insert (50) is placed in the groove(s). The backing plate comprises a first material, the sputtering plate comprises a second material, and an insert comprises a third material. In yet another aspect of the sputter target, a method of controlling the electromagnetic properties of a sputter target is provided.

Abstract: A cathode for an electrochemical reactor including a diffusion layer and a catalyst layer. The cathode has bimetallic or multimetallic nanoparticles, dispersed in direct contact with the diffusion layer, at least one of the metals being chromium (Cr) wholly or partly in oxidized form. The cathode is fabricated by depositing the bimetallic or multimetallic nanoparticles on the diffusion layer by DLI-MOCVD in the presence of O2.

Abstract: A conductive coating film is formed on a substrate by bringing a conductive material covered with a protective material into contact with a material having anion exchange ability, through such a process wherein an anion exchange layer containing a material having anion exchange ability is formed on a substrate and then a layer containing a conductive material covered with a protective material is formed on the anion exchange layer, or alternatively through such a process wherein a layer containing a conductive material covered with a protective material is formed on a substrate and then an anion exchange layer containing a material having anion exchange ability is formed on the layer containing a conductive material. The anion exchange layer and the layer containing a conductive material may be formed by coating, printing or the like.

Abstract: An adhesion solution containing curable amine compounds and curable epoxy compounds are applied to a dielectric material followed by drying the solution and electrolessly plating a thin metal layer on the dielectric material. The composite is then annealed to cure the amine and epoxy compounds. The adhesion solution contains an excess amount of curable amine to curable epoxy. The adhesion solution and method may be used in the manufacture of printed circuit boards.

Abstract: A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.

Abstract: A magnetic cell structure including a nonmagnetic filament contact, and methods of fabricating the structure are provided. The magnetic cell structure includes a free layer, a pinned layer, an insulative layer between the free and pinned layers, and a nonmagnetic filament contact in the insulative layer which electrically connects the free and pinned layers. The nonmagnetic filament contact is formed from a nonmagnetic source layer, also between the free and pinned layers. The filament contact directs a programming current through the magnetic cell structure such that the cross sectional area of the programming current in the free layer is less than the cross section of the structure. The decrease in the cross sectional area of the programming current in the free layer enables a lower programming current to reach a critical switching current density in the free layer and switch the magnetization of the free layer, programming the magnetic cell.

Abstract: The present invention discloses a color filter by copper and silver film, comprising: a lower copper layer; a lower silver layer formed on the lower copper layer; a medium formed on the lower silver layer; an upper copper layer formed on the medium; and an upper silver layer formed on the upper copper layer.

Abstract: This document provides conductive patterns, electrical sensors including conductive patterns, and methods of making conductive patterns used in electrical sensors. In some cases, the conductive patterns can define one or more microelectrodes. For example, thermal transfer printing techniques are described. In some cases, a microfluidics device can include one or more microelectrodes in a micro-channel.

Abstract: Provided are probes featuring multiple electrodes, which probes have diameters in the nanometer range and may be inserted into cells or other subjects so as to monitor an electrical characteristic of the subject. The probes may also include a conductive coating on at least one probe element to improve the probes' performance. The probes may also be used to inject a fluid or other agent into the subject and simultaneously monitor changes in the subject's electrical characteristics in response to the injection. Related methods of fabricating and of using the inventive probes are also provided.

Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

Abstract: To provide a substrate for mounting an element having good sulfurization resistance. A substrate 1 for mounting an element, comprising a low temperature co-fired ceramic substrate 2, a thick film conductor layer 3 made of a metal composed mainly of silver, which is formed on the surface of the low temperature co-fired ceramic substrate 2, a covering 4 made of a low temperature co-fired ceramic, which covers the edge portion 31 of the thick film conductor layer 3 and which is bonded to the low temperature co-fired ceramic substrate 2 on the outer side of the edge portion 31, and a plated layer 5 made of an electrically conductive metal, which is formed on the surface of the thick film conductor layer 3.

Abstract: The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also to processes and methods for fabricating microsystems and connectors.

Abstract: There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided.

Abstract: An integrated system for processing a substrate in controlled environment to enable deposition of a thin copper seed layer on a surface of a metallic barrier layer of a copper interconnect is provided. The system includes a lab-ambient transfer chamber, a vacuum transfer chamber, a vacuum process module for cleaning an exposed surface of a metal oxide of a underlying metal, a vacuum process module for depositing the metallic barrier layer, and a controlled-ambient transfer chamber filled with an inert gas, wherein at least one controlled-ambient process module is coupled to the controlled-ambient transfer chamber. In addition, the system includes an electroless copper deposition process module used to deposit the thin layer of copper seed layer on the surface of the metallic barrier layer.

Abstract: A process of fabricating a slip ring component, a slip ring component, and a slip ring assembly are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.

Abstract: A protective coating for a metal substrate is provided that is light, durable, galvanically protective, and easily applied at the site of manufacture. The coating has at least two layers, one of which is a galvanizing layer and one of which is a micro-composite of a galvanic metal and a non-conducting material, such as polymer. Such coatings are useful for example to protect pipes or other metal surfaces in corrosive environments. Methods of producing the coating are provided, including methods that use advanced spraying techniques to provide very thin but consistent layers. Using the advanced spraying methods the composite layer can be created by co-spraying the galvanic metal and the nonconductive material onto the surface of the galvanic coating. Optionally, an outer coat of insulating material can be applied to provide further protection to the surface.

Abstract: A method is provided which includes dispensing and removing different deposition solutions during an electroless deposition process to form different sub-films of a composite layer. Another method includes forming a film by an electroless deposition process and subsequently annealing the microelectronic topography to induce diffusion of an element within the film. Yet another method includes reiterating different mechanisms of deposition growth, namely interfacial electroless reduction and chemical adsorption, from a single deposition solution to form different sub-films of a composite layer. A microelectronic topography resulting from one or more of the methods includes a film formed in contact with a structure having a bulk concentration of a first element. The film has periodic successions of regions each comprising a region with a concentration of a second element greater than a set amount and a region with a concentration of the second element less than the set amount.

Abstract: Provided are an electrode structure capable of suppressing a leakage current, having a high capacitance, allowing an electrical short circuit caused through contact with an electrolyte to be suppressed, and operable to be applied as an anode of a capacitor; a method for manufacturing the electrode structure; and a capacitor including the electrode structure. The method for manufacturing the electrode structure includes: a covering layer formation step of forming on a surface of an aluminum material a covering layer of a dielectric precursor including valve metal; and a reduction heating step of heating in a reducing atmosphere including no carbon the aluminum material having the covering layer formed thereon.

Abstract: A method of manufacturing a zinc oxide-based thin film for a transparent electrode and a zinc oxide-based thin film manufactured using the method, in which both conductivity and transmittance can be improved. The method includes the step of forming a transparent oxide thin film doped with a dopant on a transparent substrate, and the step of rapidly heat-treating the transparent oxide thin film.