Abstract: A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0.35 and 0.9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145.degree. and 240.degree. C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.

Abstract: A process is disclosed for manufacturing a circuit board having a metal layer in which a portion of the metal layer is removed by etching. A novel etch resist immersion tin composition is selectively applied to the metal layer to leave areas of coated and uncoated metal followed by etching the metal not coated with the resist. The immersion tin composition is applied as a substantially pore free coating at thicknesses of from about 0.08 to about 0.175 microns. The novel immersion tin composition contains a tin salt and both thiourea compounds and urea compounds.

Abstract: An improved implant is disclosed, having a customary substrate, particularly at least partially of metal, and a one- or multi-layer coating of ceramic, biologically compatible glasses and/or bioactive glasses, the improvement comprising a second type layer covalently bound on said coating of ceramic or bioglass said second type of layer being from polymeric organo-silicon compounds, and said second type of layer being covalently coupled, with or without a coupling molecule, with a third type of layer of a synthetic or natural biopolymer. Also disclosed is a process for producing the implant, by applying in known mariner a coating of ceramic, biologically compatible and/or bioactive glasses onto a substrate of said implant, providing said coating with a second type of layer of polymerized organo-silicon compound (polysiloxane) in covalent connection therewith, and coupling said second type of layer with a third type of layer of a synthetic or natural biopolymer, with or without use of a coupling means.

Abstract: A process for preparing a ceramic substrate for metallization wherein a surface of the ceramic substrate is contacted with an admixture comprised of an inert solid material and a composition containing one or more alkali metal compounds. The admixture and the substrate are heated at least to a temperature at which the alkali metal composition becomes molten. The molten alkali metal composition is kept in contact with the ceramic surface for a time period sufficient to etch the surface and thus prepare it for adherent deposition of metal. The presence of the inert solid material in the admixture prevents coalescence of the alkali metal composition on the ceramic surface. Uniform surface coverage with catalyst and metal and an adherent bond of metal to the ceramic surface are ensured by treatment with the admixture. Furthermore, an article comprised of metal directly and adherently bonded onto a ceramic substrate is provided.

Abstract: A composite film is provided which has a first layer of WSi.sub.x, where x is greater than 2, over which is disposed a second layer of a tungsten complex consisting substantially of tungsten with a small amount of silicon therein, typically less than 5%. Both layers are deposited in situ in a cold wall chemical vapor deposition chamber at a substrate temperature of between 500.degree. and 550.degree. C. Before initiating the deposition process for these first and second layers, the substrate onto which they are to be deposited is first plasma etched with NF.sub.3 as the reactant gas, then with H.sub.2 as the reactant gas, both steps being performed at approximately 100 to 200 volts self-bias. WSi.sub.

Abstract: An article comprised of metal directly and adherently bonded onto a ceramic substrate, and a process for producing same, wherein the ceramic is adhesion promoted with molten inorganic compound, treated with halide compounds that promote adsorption of catalyst for metal deposition, and plated with metal. Uniform surface coverage with catalyst and metal is ensured by the halide treatment.

Abstract: A heat transfer promoter composition comprises a triazine-dithiol derivative represented by the general formula ##STR1## wherein R represents --NHR' or --NR'.sub.2 wherein: R' is a hydrocarbon group; M is selected from the group consisting of hydrogen, alkali metals, and alkaline earth metals; and at least one of M groups is alkaline metal or alkaline earth metal. This heat transfer promotor is applied to that surface of a condenser tube to be contacted by a vapor to be condensed.

Abstract: A metal is selectively chemically vapor deposited on a substrate through openings in a moisture adsorbing mask layer by maintaining moisture in the mask layer. Thick metal layers are formed by precharging the mask with moisture. Also a cleaned tube is prepared for selective deposition by operating the process with a bare substrate until the tube is coated. The selective deposition is then performed.

Abstract: Single crystal dielectrically isolated islands are formed providing a substantially non-reflective or indentured silicon surface before the application of the dielectric isolation layer and the polycrystalline support. Thin film resistor material is formed and delineated on an insulative layer over the single crystal island juxtaposed to the substantially non-reflective bottom dielectric isolation. The thin film resistive layer is trimmed using a laser.

Abstract: A method of producing a wear protection coating on a surface of a structural part of titanium or a titanium base alloy comprising applying a metallic nickel layer which adheres to the surface of the structural part and thereafter subjecting the thus coated structural part to a heat treatment to form diffusion layers of Ti.sub.2 Ni and TiNi.sub.3 between the titanium and the nickel. Thereafter, the layer of nickel alone or with the layer of TiNi.sub.3 is removed to leave the titanium part covered by a protection layer of the remaining diffusion layer.

Abstract: A method of treating a commercially available ion plated graphite/aluminum composite with suitable hydroscopic liquid selected from the group consisting of methylene chloride, toluene, xylene and where such liquid treatment results in capillary action in the graphite fibers and subsequently heat treating the graphite/aluminum composite in a hot processing step where magnesium powder is sublime at a temperature in the range of 350.degree.-450.degree. C. and where such sublime magnesium vapor uniformly coats graphite and aluminum in the composite material so as to obtain a graphite aluminum composite coated with magnesium.

Abstract: An article comprised of metal directly and adherently bonded onto a ceramic substrate, and a process for producing same, wherein the ceramic is adhesion promoted with molten inorganic compound, treated with compounds that promote adsorption of catalyst for metal deposition, and plated with metal. Uniform surface coverage with catalyst and metal is ensured by the treatment with the adsorption promoters.

Abstract: A surface treatment process for parts fabricated of aluminum killed steel in preparation for porcelain coating wherein the parts are subjected to a plurality of sequential liquid spraying treatments as follows:(1) An aqueous alkaline cleaning solution at a temperature of about 180.degree. F. (about 82.degree. C.);(2) A first water rinse;(3) An aqueous ferric sulfate solution having a concentration of from about 0.5% to about 1% and a temperature of from about 155.degree. F. to about 160.degree. F. (about 68.degree. C. to about 71.degree. C.);(4) A second water rinse;(5) An aqueous sulfuric acid solution having a concentration of about 2.5% and a temperature of about 140.degree. F. (about 60.degree. C.);(6) A third water rinse;(7) An aqueous nickel sulfate solution having a nickel concentration of from about 2 to about 2.5 oz./gal. and a temperature of about 150.degree. F. (about 65.degree. C);(8) An aqueous sulfuric acid solution having a concentration of about 0.35% to about 0.

Abstract: A method for adhering silver to a glass substrate for producing mirrors includes attaining a silicon enriched substrate surface by reducing the oxygen therein in a vacuum and then vacuum depositing a silver layer onto the silicon enriched surface. The silicon enrichment can be attained by electron beam bombardment, ion beam bombardment, or neutral beam bombardment. It can also be attained by depositing a metal, such as aluminum, on the substrate surface, allowing the metal to oxidize by pulling oxygen from the substrate surface, thereby leaving a silicon enriched surface, and then etching or eroding the metal oxide layer away to expose the silicon enriched surface. Ultraviolet rays can be used to maintain dangling silicon bonds on the enriched surface until covalent bonding with the silver can occur. This disclosure also includes encapsulated mirrors with diffusion layers built therein. One of these mirrors is assembled on a polymer substrate.

Abstract: An optical memory element includes stripe-shaped grooves formed directly on a glass substrate. To manufacture the optical memory element, a resist film is disposed on the glass substrate, and a groove pattern is formed in the resist film. A reactive ion etching is conducted through the groove pattern formed in the resist film so as to form the guide grooves in the glass substrate. After removing the resist film from the glass substrate, a magneto-optical recording layer is formed on the glass substrate.

Abstract: A process for treating the interior surface area of a glass nozzle for use in an ink jet printer device. The process includes cleaning of the surface area with a hydrofluoric acid solution under controlled conditions, rinsing and then protecting the cleaned area with a blocking agent to prevent contamination by the atmosphere prior to use of the nozzle in a printer device. The disclosed process is useful in minimizing air bubble formation and lock within the nozzle during use, and in facilitating ejection or purging of such air bubbles as may become ingested by the nozzle during service.

Abstract: A method for the chemical removal of oxide layers from the surface of objects made of metals, in particular those made of titanium, titanium alloys, nickel, nickel alloys and chrome-nickel steels, so that these objects can subsequently be effectively coated with metals. The removal of the oxide layers is effected in a nonaqueous organic medium containing a mixture of hydrogen fluoride and one or more alkali fluorides and/or ammonium fluoride. By practice of this method, interfering oxide films can be removed from the surfaces of workpieces made of the above-named metals or metal alloys, while maintaining stable dimensional accuracy, prior to a subsequent coating of the workpiece with other metals, in particular metal coating compositions such as aluminum, zinc or silver.

Abstract: A substrate having high absorptance and emittance is produced by roughening the surface of the substrate, immersing the substrate in a first electroless plating bath having a low phosphorus to nickel concentration, then immersing the substrate in a second electroless plating bath having a phosphorus to nickel concentration higher than that of said first electroless plating bath. Thereafter, the resulting electroless nickel-phosphorus alloy coated substrate is immersed in an aqueous acidic etchant bath containing sulfuric acid, nitric acid and divalent nickel to develop a highly blackened surface on said substrate.

Abstract: A method of manufacturing a thin layer detector for integrating solid state dosimeters, in particular for thermoluminescence dosimeters (TLD's), from thermoluminescent powder material, comprising the simultaneous application of high pressure and elevated temperature to the powder layer at selected values (working point) sufficient to cause physico-chemical bonding of the layer with a suitably prepared substrate by plastic flow of the powder grains.

Abstract: The present invention relates to a process of physical vapor deposition which homogeneously and tightly coats hard compounds on the surface of cutting tools, parts requiring wear resistance or ornaments such as a watch case and the like in order to improve wear resistance, heat resistance, corrosion resistance, appearance and the like of said tools, parts or ornaments.

Abstract: The invention concerns a process for the manufacture of substrates from carbon-coated SiO.sub.2 fabric that can be used for large-surface silicon bodies, in which mineral materials or waste containing SiO.sub.2 are used as starting materials and a mixture of Al.sub.2 O.sub.3 and oxides of the alkaline and/or alkaline earth metals is used as a flux for the transformation into the glass phase. The glass fibers made from the homogenous glass melt are processed into a glass fabric, which is then subjected to an acid leaching process and coated with carbon. The process is used for the low-cost production of substrates for silicon bodies that are manufactured according to the strip-coating process for use in solar cells.

Abstract: A method for electroless nickel plating of silicon-iron which has been heat treated prior to the plating operation and subjected to thermal shock after the plating operation includes the steps of cleaning the surface of the silicon-iron with a fluoride etch salt, forming a thin deposit of palladium on the clean surface of the silicon-iron, hardening the palladium deposit by treatment with a solution of ammonium hydroxide and nickel plating the silicon-iron using an electroless nickel plating solution, followed by baking at about 250.degree. F. for about six hours.

Abstract: A speaker diaphragm of the present invention is prepared in a manner such that a boron layer is formed on one face of a dome-shaped metal foil by means of a physical vapor deposition method such as ion-plating, cathode sputtering, vacuum evaporation or the like, when necessary the metal foil is thinned by etching, and then, if necessary, another boron layer is formed on the other face of the metal foil. Alternatively, a metal layer is formed on the surface of the boron layer. The resultant speaker diaphragm is light in weight and high in modulus and also has appropriate internal mechanical resistance against vibration, thereby providing a speaker of high efficiency and satisfactory characteristics.

Abstract: The present invention relates to a membrane remover/etchant solution including an organic solvent, a strong ionizable acid, a weak acid and an acid stable surfactant. The present invention further includes a method for removing a membrane and etching a concrete surface in which the membrane remover/etchant solution is in an organic solvent system and is applied to the concrete in an inactive acid form and then water is applied to activate the acid. The resulting materials are then picked up and the surface is rinsed with water.

Abstract: A high velocity stream of gas comprising of either the carrier gas or one or more film forming or removing components is shot through a shooting means such as a nozzle or orifice in the form of a high speed stream of gas in a chemical vapor deposition growth chamber or within an attachment receiving reaction gases from such a chamber. This gas or mixture of gases entrains all of the adjacent gases within the vicinity of the shooting nozzle or orifice and is subsequently swept through a diffusion tube. The diffusion tube compresses and exhausts the gas mixture at a pressure sufficient to drive the combined gas mixture through a heat exchanger and finally back into the growth chamber. The gases within the growth chamber are provided for entrainment downstream to a heated base or substrate which is being coated with a thin film or epitaxial layer of film forming components contained in a carrier gas.

Abstract: The novel method comprises impacting an aqueous slurry of solid particles on the surface of a glass viewing window in such manner as to stress the glass in the impacted area of the window without substantial erosion, abrasion or etching of the impacted surface, and then etching the impacted surface with an aqueous fluoride etchant.

Abstract: A minimal corrosion resistor structure and deposition technique for superconductive circuits, with mutually protective niobium oxide passivation ring, gold corrosion barrier film and titanium resistive layer. Niobium has an intrinsic oxide of Nb.sub.2 O.sub.5, which must be removed from a contact area designated by an opening in photoresist; the development process leaves a photoresist overhang. The corrosion barrier film is deposited through the opening. The resistive metal layer is deposited over the corrosion barrier film through the same opening. The gold corrosion barrier film prevents the titanium resistive metal layer from making corrosive contact with the niobium. The titanium resistive metal layer encapsulates the gold corrosion barrier film to prevent diffusion between the gold and further layers to be deposited subsequently. It would normally be possible for the titanium to spill over the gold and make corrosive intimate contact with the niobium; a self-alignment technique prevents such contact.

Abstract: An improved process for etching (eroding) the inner surface of a glass capillary column in which ammonium bifluoride in liquid methanol is passed slowly through the capillary bore for a prolonged period, followed by rinsing with methanol, thereafter a gradually diluting rinse mixture of methanol and water, and finally a pure water rinse. A very fine structured etch of uniform depth is produced with no apparent air entrainment making the columns suitable for all standard stationary phase coating procedures.

Abstract: A method of forming ohmic contacts with thin film p-type semiconductor Class II B - VI A compounds comprising etching the film surface with an acidic solution, then etching with a strong basic solution and finally depositing a conductive metal layer.

Abstract: A low temperature (about 0.degree. C. to about 100.degree. C.) method is disclosed for forming an ultrathin film of copper on an aluminum carrier sheet. By this method, which employs matte finish aluminum foil, the peel strength for separating the aluminum carrier from the copper film can be preset at a desired value between 0.1 and 2 pounds per inch.

Abstract: A crysotile asbestos base material having an organo-silane outer coating bonded thereto.

Abstract: A semi-conducting, stable polychelate coating is manufactured in situ on a conducting substrate providing metal coordination centers, by carrying out a controlled chelating reaction and thermal treatment on the substrate surface with a predetermined specific amount (X.sub.o) of tetranitrile compound per unit substrate area. The temperature and duration as well as this specific amount (X.sub.o) are selected from given ranges to form a uniform polychelate coatingbonded to the substrate surface.Titanium electrodes are provided with such polychelate coatings for different purposes. Electrodes with other metal substrates are further provided with such polychelate coatings.

Abstract: Used dimensionally stable electrodes having a valve-metal base and an originally conductive and electrocatalytic coating of e.g. ruthenium-titanium oxide are cleaned and activated by impregnation with a relatively dilute solution preferably containing only a decomposable platinum-group metal compound, followed by heating to enrich the old coating with platinum-group metal/oxide. A new outer electrocatalytic coating which is the same as or similar to the old coating is then applied on top.

Abstract: A method of preparing a mercury cadmium telluride substrate with a cadmium elluride surface of less than 200 .ANG. to yield a surface exhibiting improved quality and smaller variation in the x-valve of a Hg.sub.1-x Cd.sub.x Te substrate for passivation and processing of the CdTe processed surface. The method comprises the steps of etching said Hg.sub.1-x Cd.sub.x Te substrate with a bromine methanol or bromine-DMF etch, quenching the substrate in methanol or DMF until the bromine is removed and rinsing in acetone and methanol to remove soluble residuals and drying immediately, coating said substrate with CdTe layer of about 1000 .ANG., polishing the processed CdTe layer by a contactless polishing means using a polishing solution of 50% ethylene glycol and 50% mixture of 2% bromine and 98% methanol wherein said CdTe layer is polished down to generally less than 200 .ANG.

Abstract: A method for retarding the efflorescence of masonry comprises applying to the masonry a coating consisting of a glycol such as polyethylene glycol in an acidic solution, having a pH of about 5.5, the solution being applied at the rate of about 100 sq. ft. per gallon.

Abstract: Beryllia is prepared for direct autocatalytic plating of a metal film by immersing it first in a sodium hydroxide solution for roughening the surface uniformly, rinsing it in water, then immersing it in a fluoride-based solution for etching silica and magnesium from the grain boundaries, rinsing it in water and then plating the beryllia by conventional methods for metallizing non-conductors.

Abstract: An improved substrate suitable for use as a base for a lithographic printing plate, especially a plate useful for the production of continuous tone images. The substrate is produced by extremely uniformly graining an aluminum sheet which has a highly polished, mirror-like surface.

Abstract: Aluminum is cleaned and etched prior to anodizing using solutions containing dilute hexafluorophosphoric acid and, optionally, nitric acid.

Abstract: An etchant, especially for copper, comprising sulfuric acid and hydrogen peroxide and characterized by the inclusion of a small amount of tungsten in an amount sufficient to increase the surface area of the etched metal.

Abstract: A process of treating surfaces of silica or silicate glass, especially in preparation for subsequent coating in the manufacture of optical waveguides includes introducing a gaseous medium containing at least one component which forms hydrogen fluoride when sufficiently heated to the surface to be treated, while an etching zone which covers only a portion of the surface is thus heated, so that the hydrogen fluoride etches the surface only at the etching zone. The temperature is so selected that silicon tetrafluoride formed during the etching is oxidized and the resultant silicon dioxide is deposited from the gaseous medium onto the surface outside of the etching zone to form a fused fluorine-doped vitreous layer on the previously etched portion of the surface.

Abstract: A dry glass electrode for use in potentiometric analyses of aqueous media. The electrode comprises a metal conductor constituted of platinum, gold, or tantalum, a layer comprising an oxide of the metal having a thickness of between about 50 Angstrom units and about 2 microns on an outer surface of the metal conductor, and an ion-selective glass membrane over and in electrical contact with the oxide layer. The ion-selective glass has a coefficient of thermal expansion differing by less than about 25% from the coefficient of thermal expansion of the metal.A method for producing the electrode of the invention is also disclosed.

Abstract: Method and composition for applying a coating to a metallic surface, the surface being immersed in an acidic aqueous coating composition comprising dispersed solid particles of an organic polymeric resinous coating-forming material and an oxidizing agent, wherein the weight or thickness of the coating formed on the surface is a function of the time the surface is immersed in the composition.

Abstract: Aluminum-based alloy films and metallization layers that are patterned by reactive ion etching (RIE) are passivated by etching surface portions of the films or layers with a phosphoric-chromic mixture to remove contaminants and then oxidizing the exposed surface portions in an oxygen atmosphere.

Abstract: A preform made of carbon, and especially electrical graphite (electro-graphite), is given a protective coating of pyrolytic graphite which, in turn, is activated by further coating with a carbon with a very low degree of orientation (soot) or by roughening. The process of activation reduces the effect of the sample to be analysed, while the protective effect of the pyrolytic graphite coating is preserved.

Abstract: In the process of applying a layer of copper and a layer of zirconium dioxide to the internal surface of a tube of a zirconium-based alloy, with the layer of zirconium dioxide being located between the copper layer and the internal surface of the tube, the tube surface is first treated with an activating solution in the form of an aqueous solution containing from about 1 to about 3 grams/liter of hydrogen fluoride, from about 2 to about 8 grams/liter of ammonium fluoride and from about 0.1 to about 0.5 gram/liter of sulfuric acid, the amounts of hydrogen fluoride and ammonium fluoride being chosen so that the amount of ammonium fluoride, calculated in moles, exceeds the amount of hydrogen fluoride, calculated in moles, by at least 5 percent.

Abstract: Known process for the metallization of non-conductors, particularly synthetic resins, by chemical deposition, evaporation, or sputtering operate with adhesion facilitating intermediate layers such as e.g. varnishes or pastes. There is not attained sufficient adhesiveness with these adhesion facilitators for many areas of use. Besides the adhesive facilitator can cause troubles in later processing. Therefore there is described a process in which the surface area to be coated is roughened by means of a preliminary etching before by the metallizing and wherein this surface area before the etching is exposed to a heavy ion radiation.

Abstract: A silicon nitride film is generated by heating a silicon substrate having an exposed surface in an ambient including ammonia thereby causing the exposed silicon to react with nitrogen atoms. The substrate is heated to a temperature of at least 900.degree. C. in an inert gas, such as argon, whereby the natural oxide film or impurity particles on the surface are subject to vapor etching. The substrate is then heated to a temperature in a range of 900.degree. C. to 1300.degree. C. in the ambient, including ammonia, to produce a dense and homogeneous amorphous silicon nitride film.

Abstract: A method of producing an oxygen sensing element which is essentially an oxygen concentration cell in the form of a lamination of relatively thin layers. The first step of the method is to prepare a lamination of a ceramic shield layer, an inner or reference electrode layer, a solid electrolyte layer and an outer or measurement electrode layer which is formed by sintering metal particles applied to the solid electrolyte layer surface in the form of a paste or slurry and dried. Then an additional measurement electrode layer, preferably not thicker than 1.0 micron, is formed on the outer surface of the sintered measurement electrode layer by a physical vapor deposition technique such as ion plating, sputtering or vacuum evaporation. Preferably this electrode layer is formed by a two-stage vapor deposition process wherein the first stage deposition is terminated before the deposited layer becomes thicker than 0.5 microns.

Abstract: An improved process for providing corrosion protection to ferrous metal substrates is disclosed. The improved process involves a first treating of the surface of the ferrous metal substrate with nitric acid followed by directly applying to the previously treated surface a zinc-rich coating composition. Upon curing the zinc-rich coating composition, an adherent electroconductive coating is formed. The coating provides excellent corrosion protection and since it is electroconductive, the coating is weldable and can accept a subsequent electrocoat.

Abstract: The invention provides a process and composition of low toxicity for prepng aluminum surfaces for adhesive bonding. According to the invention non-carcinogenic, non-polluting soluble metal salts generally, other than ferric sulfate disclosed in U.S. Pat. No. 4,212,701, when added in an effective amount to sulfuric acid, improve the adhesive bonding to aluminum when the aluminum is treated with such salt-sulfuric acid etchants prior to adhesive bonding.