Abstract: Methods for fabricating porous low-k materials are provided, such as plasma enhanced chemically vapor deposited (PE-CVD) and chemically vapor deposited (CVD) low-k films used as dielectric materials in between interconnect structures in semiconductor devices. More specifically, a new method is provided which results in a low-k material with significant improved chemical stability and improved elastic modulus, for a porosity obtained.

Abstract: In one aspect, the present invention provides nanosized systems for generating electrical energy based on the use of a chemically reactive composition to generate a thermoelectric wave. For example, the system can include at least one nanostructure (e.g., a carbon nanotube) extending along an axial direction between a proximal end and a distal end. A chemically reactive composition is dispersed along at least a portion of the nanostructure, e.g., along its axial direction, so as to provide thermal coupling with the nanostructure. The chemical composition can undergo an exothermic chemical reaction to generate heat. The system can further include an ignition mechanism adapted to activate the chemical composition so as to generate a thermal wave that propagates along the axial direction of the nanostructure, where the thermal wave is accompanied by an electrical energy wave propagating along the axial direction.

Abstract: This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of titanium.

Abstract: Methods of depositing pure metal and aluminum alloy metal films. Certain methods comprises contacting a substrate surface with first and second precursors, the first precursor comprising an aluminum precursor selected from dimethylaluminum hydride, alane coordinated to an amine, and a compound having a structure represented by: wherein R is a C1-C6 alkyl group, and the second precursor comprising a metal halide. Other methods relate to sequentially exposing a substrate to a first and second precursor, the first precursor comprising an aluminum precursor as described above, and the second precursor comprising Ti(NR?2)4 or Ta(NR?2)5, wherein R? is an alkyl, alkenyl, alkynyl, keto or aldehyde group.

Abstract: A high-barrier film is provided that includes a biaxially-oriented polyethylene terephthalate (PET) layer having a first side and a second side opposite the first side, a cross-linked acrylic primer layer, and a metal barrier layer. The cross-linked acrylic primer layer is adjacent to the second side of the PET layer and has a dynamic coefficient of friction (?D) to steel of less than about 0.45, while the metal barrier layer is adjacent to the first side of the PET layer. The film has a total thickness of less than about 10 ?m and has a tensile strength of at least about 2500 kg/cm2. Processes for producing the high-barrier film are also provided.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: A primer coating is provided for use on polymeric substrates to enhance the adhesion of metallized coatings to the substrates. The primer coating also improves the gas barrier properties of the substrate when used in combination with a metallized coating. The primer coating includes an amorphous polyvinyl alcohol, polyethyleneimine, and optionally, an aqueous dispersion of polyurethane. The primer coating may be applied to a variety of polymeric substrates including polylactic acid, polyethylene terephthalate, biaxially oriented polyethylene terephthalate, oriented polypropylene, biaxially oriented polypropylene, and biaxially oriented polyamide. When used in combination with the subsequently applied metallized coating, an oxygen transmission rate of about 0.1 and 5.0 cc/m2/day at 0% relative humidity is achieved.

Abstract: Disclosed herein are an insulating base plated with a metal layer, a plating method thereof, and a transparent electrode including the insulating base. During the manufacture of a polymer layer, a structure of an interface layer between a surface of the polymer layer and a metal layer is modified, adhesion with metal is excellent and the polishability of the interface layer is reduced, and thus, the reflectivity of the metal layer is reduced and particular color impression of metal is reduced to obtain black-oxide treated properties. When the metal layer formed on the insulating base is used in a mesh-type transparent electrode having a fine pattern, sufficient adhesion with metal for forming a pattern is obtained and the reflectivity of an adhesion layer of the metal layer is reduced, thereby increasing the visibility. Accordingly, the insulating base may be suitable for products such as transparent electrodes or touch panels.

Abstract: A method for providing electroless plating is provided. An amorphous carbon barrier layer is formed over the low-k dielectric layer by providing a flow a deposition gas, comprising a hydrocarbon, H2, and an oxygen free diluent, forming a plasma from the deposition gas, and stopping the flow of the deposition gas. The amorphous carbon barrier layer is conditioned by providing a flow of a conditioning gas comprising H2 and a diluent, forming a plasma from the conditioning gas, which conditions a top surface of the amorphous carbon barrier layer, and stopping the flow of the conditioning gas. The amorphous carbon barrier layer is functionalized by providing a flow of a functionalizing gas comprising NH3 or H2 and N2, forming a plasma from the functionalizing gas, and stopping the flow of the functionalizing gas. An electroless process is provided to form an electrode over the barrier layer.

Abstract: Systems and methods for producing crystalline materials by atomic layer deposition, allowing for high control of localized doping. Such materials may be fibers or films suitable for use in optoelectronics and lasers.

Abstract: Disclosed herein is an improved, metallized polymer film and method for preparing the same. Such films comprise a) at least one treated polymeric skin layer comprising butylene, and b) a metal layer deposited onto at least one surface of this polymeric skin layer. The polymeric skin layer can comprise a propylene-butylene copolymer or an ethylene-propylene-butylene terpolymer, with this copolymer or terpolymer containing from about 4 wt % to about 12 wt % of butylene. The polymeric skin layer is preferably preconditioned by subjecting an outermost surface thereof to plasma treatment which facilitates the deposition thereon of a strongly adhering metal layer which is preferably aluminum. The resulting multi-layer films exhibit metal adhesion bond strength of at least about 100 grams/25 mm. These films will preferably also exhibit a Water Vapor Transmission Rate of from about 0.05 to about 0.2 g/m2/24 hour, and an Oxygen Transmission Rate of from about 5.0 to about 20 cm3/m2/24 hour.

Abstract: Enhanced corrosion resistance is achieved in a coating by using a germanium-containing precursor and hollow cathode techniques to form a first layer directly on the surface of a workpiece, prior to forming an outer layer, such as a layer of diamond-like carbon (DLC). The use of a germanium or germanium-carbide precursor reduces film stress and enables an increase in the thickness of the subsequently formed DLC. Germanium incorporation also reduces the porosity of the layer. In one embodiment, a cap layer containing germanium is added after the DLC in order to further reduce the susceptibility of the coating to chemical penetration from the top.

Abstract: The present invention provides (i) a process for producing a metal film with which process a metal film and a metal pattern can be formed, at low cost, on an arbitrary substrate, (ii) a primer composition, (iii) a metal film, and (iv) use of the metal film. The process includes the steps of: forming an organic film with use of a primer composition which contains (i) an addition polymerizable compound including three or more reactive groups, (ii) an addition polymerizable compound including an acid group, (iii) an addition polymerizable compound including a basic group, and (iv) an addition polymerizable compound including a hydrophilic functional group; form a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing with a metal (M2) ion aqueous solution containing a metal (M2) ion which has a less ionization tendency than the metal (M1) ion; and reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film.

Abstract: A half mirror has a shape on a substrate and excels in appearance and design and is fabricated by a method. The method includes forming an organic film by applying, onto a transparent substrate or film, a primer composition containing an addition-polymerizable compound having three or more reactive groups, an addition-polymerizable compound having an acidic group, and an addition-polymerizable compound having a hydrophilic functional group, and polymerizing the primer composition. The method includes turning the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing metal (M1) ions, and turning the metal (M1) salt into a metal (M2) salt by treating the organic film with a metal (M2) ion aqueous solution containing metal (M2) ions that are lower in ionization tendency than metal (M1) ions, and (d) reducing metal (M2) ions to form a metal film on a surface of the organic film.

Abstract: An object of the present invention is to provide a production process of a roller for an electrophotography, having a surface layer the electric resistance of which has been controlled by corona discharge treatment while keeping any pinholes from coming about on the surface. A production process of a roller for an electrophotography, said roller comprising a conductive mandrel and a conductive surface layer comprising a resin and carbon black dispersed in the resin, the process having the following steps (1) to (3): (1) forming a resin layer comprising a resin and carbon black dispersed therein on the circumference of the conductive mandel; (2) attaching silica particles on the surface of the resin layer; and (3) subjecting corona discharge treatment to the surface of the resin layer on which the silica particles are attached.

Abstract: The method of producing a metal film in accordance with the present invention includes: the organic film forming step of applying, onto a substrate or a film, an underlayer composition containing an addition polymerizable compound having three or more reactive groups, an addition polymerizable compound having acid groups, and an addition polymerizable compound having hydrophilic functional groups and polymerizing the composition, to form an organic film; the metal salt producing step of processing the organic film with an aqueous solution containing metal (M1) ions, to convert the acid groups to a metal (M1) salt; the metal fixing step of processing the organic film processed with the aqueous solution containing metal (M1) ions with an aqueous metal (M2) ion solution containing metal (M2) ions having lower ionicity than the metal (M1) ions, to convert the metal (M1) salt of the acid groups to a metal (M2) salt; and the reduction step of reducing the metal (M2) ions, to form a metal film on a surface of the or

Abstract: The process of the present invention for producing a metal film includes: forming an organic film using a primer composition containing an addition polymerizable compound including three or more reactive groups, an acid group-including addition polymerizable compound, and a hydrophilic functional group-including addition polymerizable compound; forming a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing the organic film with a metal (M2) ion aqueous solution containing a metal (M2) ion having less ionization tendency than the metal (M1) ion; reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and oxidizing the metal film. This provides (i) a process for producing a metal film and a metal pattern, at low cost, on an arbitrary substrate, (ii) a metal film, and (iii) use of the meta film.

Abstract: The present invention aims to provide a method of producing a magnetic recording medium which is a method of producing a magnetic recording medium having a magnetically-separated magnetic recording pattern, the method including: forming a magnetic layer on a non-magnetic substrate; then exposing a surface of the magnetic layer partially to reactive plasma, or a reactive ion generated in the plasma to amorphize the portion of the magnetic layer.

Abstract: Methods of improving the adhesion of low resistivity tungsten/tungsten nitride layers are provided. Low resistivity tungsten/tungsten nitride layers with good adhesion are formed by treating a tungsten or tungsten nitride layer before depositing low resistivity tungsten. Treatments include a plasma treatment and a temperature treatment. According to various embodiments, the treatment methods involve different gaseous atmospheres and plasma conditions.

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic substrate having a plurality of accelerators dispersed in the plastic substrate. The accelerators have a formula selected from the group consisting of: CuFe2O4-?, Ca0.25Cu0.75TiO3-?, and TiO2-?, wherein ?, ?, ? denotes oxygen vacancies in corresponding accelerators and 0.05???0.8, 0.05???0.5, and 0.05???1.0. The method further includes removing at least a portion of a surface of the plastic substrate to expose at least a first accelerator. The method further includes plating the exposed surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: This disclosure relates to a multilayer film and a process making such a film. The multilayer film of this disclosure includes (a) a metallizable skin layer having at least one of a grafted isotactic polypropylene, a grafted minirandom copolymer of isotactic polypropylene, a grafted propylene-based elastomer, or any combinations thereof; and (b) a metal layer deposited on the metallizable skin layer, wherein the isotacticity of said isotactic polypropylene is 85% or greater; the ethylene concentration of said minirandom copolymer is 1.0 wt. % or lower; the propylene concentration of said propylene-based elastomer is 89 wt. % or greater; and, wherein the graft monomer includes at least one of ethylenically unsaturated carboxylic acids, ethylenically unsaturated carboxylic acid derivatives and any combination thereof.

Abstract: A chemical sensor that utilizes localized surface Plasmon resonance including a substrate, metal-containing particles and dielectric particles, wherein the metal-containing particles and the dielectric particles are disposed on the substrate, is used as a chemical sensor element. Thereby, a chemical sensor element having a sufficient detecting sensitivity when localized surface Plasmon resonance is utilized, and a method for the fabrication thereof, can be provided.

Abstract: The present invention relates to barrier film structures and, more particularly, to film structures having EVOH and fluoropolymer in skin layer. The addition of fluoropolymer in the skin layer allows trim recycling and improves the metal appearance in the metallization by reducing die lines and scratches. Improved barrier performances have been achieved by using plasma treatment during metal vacuum deposition in the vacuum chamber.

Abstract: Disclosed herein is an improved, metallized polymer film and method for preparing the same. Such films comprise a) at least one treated polymeric skin layer comprising butylene, and b) a metal layer deposited onto at least one surface of this polymeric skin layer. The polymeric skin layer can comprise a propylene-butylene copolymer or an ethylene-propylene-butylene terpolymer, with this copolymer or terpolymer containing from about 4 wt % to about 12 wt % of butylene. The polymeric skin layer is preferably preconditioned by subjecting an outermost surface thereof to plasma treatment which facilitates the deposition thereon of a strongly adhering metal layer which is preferably aluminum. The resulting multi-layer films exhibit metal adhesion bond strength of at least about 100 grams/25 mm. These films will preferably also exhibit a Water Vapor Transmission Rate of from about 0.05 to about 0.2 g/m2/24 hour, and an Oxygen Transmission Rate of from about 5.0 to about 20 cm3/m2/24 hour.

Abstract: A ceramic substrate part comprising on its upper surface pluralities of external electrodes comprising wire-bonding electrodes, each of which comprises a primer layer based on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy containing 0.4-5% by mass of P, and a Au-based upper layer formed in this order on a ceramic substrate, the upper layer containing Pd after heated by soldering, and having a Au concentration of 80 atomic % or more based on the total concentration (100 atomic %) of Au and Pd.

Abstract: Provided is a method of preparing a film including the steps of providing a polymer substrate, depositing a metal layer on the polymer substrate in a metallization chamber, removing the metallized film from the metallization chamber, and applying a topcoat to said metal layer within 1 week of depositing the metal layer on the polymer substrate. A film produced by such a method exhibits improved barrier properties, such as improved water-vapor transmission rates.

Abstract: A method of forming a piezoelectric device is disclosed. In one such method, a coating material is formed. The coating material has a piezoelectric precursor. The coating material is applied to a first electrode. The precursor is heated to a temperature that is above the Curie temperature of the precursor, but below the melting temperature of the precursor. While the precursor is above its Curie temperature, a voltage is applied across the precursor. While the voltage is applied across the precursor, the temperature of the precursor is reduced to below the Curie temperature.

Abstract: An organic light emitting diode (OLED) display device and a method of fabricating the same are disclosed. In one embodiment, the method includes: i) preparing a support and a flexible layer, ii) forming a first metal layers on one side of a support and a second metal layer on one side of a flexible layer, iii) performing a cleaning process to the first metal layer and the second metal layer, iv) forming a first radical layer on the first metal layer and a second radical layer on the second metal layer and v) joining the first and second radial layers to each other. At least one embodiment of the invention enhances process convenience and manufacturing yield, and reduces manufacturing costs and time for a flat panel display device having a flexible substrate.

Abstract: An exemplary method for making a device housing includes the following steps: providing a substrate made of polyphenylene sulfide resin; plasma treating a surface of the substrate; and forming a non-conductive metallic coat on the treated surface of the substrate. A device housing made by the method includes a substrate and a non-conductive metallic coat formed on the substrate. The substrate is made of polyphenylene sulfide resin. Adhesion between the non-conductive metallic coat and the substrate is more than 3B.

Abstract: An object of the present invention is to provide an electroless nickel-palladium-gold plating method which is able, when performed on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components, and other resin substrates with a fine metal pattern, to prevent abnormal metal deposition on a resin surface which is an undercoat and to provide a high-quality plated surface. Another object of the present invention is to provide a plated product with a high-quality plated surface, particularly such as an interposer and motherboard, and a semiconductor apparatus using the same.

Abstract: A method for introducing a precursor vapor to a process chamber configured for forming a thin film on a substrate is described. The method includes transporting a process gas containing metal precursor vapor and a CO delivery gas to a process chamber, and introducing a CO saturation gas to the precursor vapor in the process chamber and optionally adjusting the spatial distribution of the CO saturation gas addition in order to affect improvements to the properties of the deposited film.

Abstract: A biomedical material is prepared through a plasma method. The material is a film containing titanium oxide onto polymer sheet. The film is hydrophilic, bacterial inactivated and biocompatible. The present invention can be applied to artificial guiding tube and wound dressing material.

Abstract: The present invention provides (i) a process for producing a metal film with which process a metal film and a metal pattern can be formed, at low cost, on an arbitrary substrate, (ii) a primer composition, (iii) a metal film, and (iv) use of the metal film. The process includes the steps of: forming an organic film with use of a primer composition which contains (i) an addition polymerizable compound including three or more reactive groups, (ii) an addition polymerizable compound including an acid group, (iii) an addition polymerizable compound including a basic group, and (iv) an addition polymerizable compound including a hydrophilic functional group; form a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing with a metal (M2) ion aqueous solution containing a metal (M2) ion which has a less ionization tendency than the metal (M1) ion; and reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film.

Abstract: The process of the present invention for producing a metal film includes: forming an organic film using a primer composition containing an addition polymerizable compound including three or more reactive groups, an acid group-including addition polymerizable compound, and a hydrophilic functional group-including addition polymerizable compound; forming a metal (M1) salt from the acid group; substituting the metal (M1) salt of the acid group with a metal (M2) salt by processing the organic film with a metal (M2) ion aqueous solution containing a metal (M2) ion having less ionization tendency than the metal (M1) ion; reducing the metal (M2) ion so that a metal film is formed on a surface of the organic film; and oxidizing the metal film. This provides (i) a process for producing a metal film and a metal pattern, at low cost, on an arbitrary substrate, (ii) a metal film, and (iii) use of the meta film.

Abstract: Amorphous metal oxide thin film is produced by removing through oxygen plasma treatment the organic component from an organics/metal oxide composite thin film having thoroughly dispersed therein such organic component at molecular scale. This ensures production of amorphous metal oxide thin film with low density and excellent thickness precision.

Abstract: A method for forming an optically variable device upon a substrate comprises the steps of: patterning a reflective layer on the substrate using an oil-ablation technique; removing oil residue from the first side of the substrate using a first glow discharge; and depositing thin-film layers so as to be supported by the substrate to form the optically variable device. Optionally, oil residue is removed from the second side of the substrate using a second glow discharge.

Abstract: Apparatus, and methods of making and using apparatus, for inserting intraocular lenses (IOLs) are disclosed. The apparatus includes a hollow tube having an interior wall defining a hollow space through which an intraocular lens may be passed from the open space into an eye. A lubricity enhancing component is covalently bonded to the hollow tube at the interior wall in an amount effective to facilitate the passage of the intraocular lens through the hollow space. The lubricity enhancing component includes a substituent component effective to reduce hydrolysis of said lubricity enhancing component relative to an identical lubricity enhancing component without the substituent component.

Abstract: It relates to a method for treating the surface of a printed circuit board resin and a printed circuit board resin treated thereby. The method may allows forming fine circuit patterns and improving the adhesive strength between metal patterns and the printed circuit board resin as well.

Abstract: There is disclosed a method for applying a first metal on paper, which method comprises the steps a) producing polymers on the surface of said paper, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7, b) reducing said ions to the second metal and c) depositing said first metal on the reduced ions of said second metal. The invention further comprises objects manufactured according to the method. Advantages of the present invention include improved adhesion of the metal coating, possibility to coat many difficult materials. The process is suitable for large-scale and continuous production and it will reduce the waste of metal. Circuits manufactured according to the invention display improved signal integrity. Also there is the possibility to manufacture circuits which are built up sequentially with several layers of conductors in distinct patterns. It is also possible to manufacture of circuits with a very small line width.

Abstract: The present invention relates to a process for the thermal treatment of metal coated particles, to the particles obtainable by the process and to their use for the manufacture of printable electronics, or for EMI shielding.

Abstract: Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.

Abstract: The invention relates to methods for producing doped thin layers on substrates comprising the steps of depositing a dopant precursor on the substrate via an atomic layer deposition technique; and exposing the deposited dopant precursor to radicals. The methods can further comprise depositing a compound adjacent the dopant metal via an atomic layer deposition technique; and exposing the deposited compound to radicals, thereby providing a host. The invention relates to articles comprising approximately atomically thin layers of metals or metal oxides doped with at least one different metal or metal oxide. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: The present invention relates to epitaxial, electrically conducting and mechanically robust, cubic nitride buffer layers deposited epitaxially on biaxially textured substrates such as metals and alloys. The invention comprises of a biaxially textured substrate with epitaxial layers of nitrides. The invention also discloses a method to form such epitaxial layers using a high rate deposition method as well as without the use of forming gases. The invention further comprises epitaxial layers of oxides on the biaxially textured nitride layer. In some embodiments the article further comprises electromagnetic devices which may have superconducting properties.

Abstract: Multilayer polypropylene films comprising a base layer A, at least one skin layer B adhered to said base layer A and a metal layer M deposited on the surface of said skin layer, wherein said skin layer B comprises a propylene copolymer containing from 3% to 6% by weight of C4-C10 alpha-olefin units, said propylene copolymer having a xylene soluble fraction at 23° C. of less than 4.0 wt %, a VICAT softening temperature higher than 135° C. and an indentation value according to the VICAT test method lower than or equal to 0.05 mm at 120° C.

Abstract: A metal oxide dispersion comprising metal oxide particles with a necking structure, and a solvent, wherein the liquid droplet contact angle of the metal oxide dispersion to an ITO film (Indium-Tin Oxide type film) formed is from 0 to 60°. A metal oxide dispersion for the production of a dye-sensitized solar cell electrode, comprising Metal Oxide Particle Group F having a necking structure formed by m connected particles, Metal Oxide Particle Group G having only 0.2 m or less connected particles, and a solvent, and being formable into a film at 200° C. or less. A metal oxide electrode comprising an electrically conducting substrate having thereon a metal oxide layer comprising metal oxide particles bound by a binder, wherein the binder content is from 0.005 to 5 mass % based on the metal oxide film and the metal oxide layer has a pencil scratch strength of H or more according to JIS5600.

Abstract: A method of forming MgB2 films in-situ on a substrate includes the steps of (a) depositing boron onto a surface of the substrate in a deposition zone; (b) moving the substrate into a reaction zone containing pressurized, gaseous magnesium; (c) moving the substrate back into the deposition zone; and (d) repeating steps (a)-(c). In a preferred embodiment of the invention, the substrate is moved into and out of the deposition zone and the reaction zone using a rotatable platen.

Abstract: A method for depositing metals, metal blends and alloys onto substrate surfaces, including microporous substrates utilizing a plasma operation undertaken at room temperature. In the process, a liquid solution of a monomer or comonomer precursor having a metallic component is utilized to wet the surface of the substrate, with the solvent portion thereafter being removed to leave the substrate surface coated with a dry deposit. The coated substrate is then introduced into a plasma reaction chamber with RF energy being applied across spaced electrodes to create a plasma glow along with the introduction of a plasma supporting gas. The substrate is exposed to the plasma glow for conversion of the precursor to dissociated form to create a deposit consisting essentially of the metallic component in elemental form as a cohesive film on the substrate surface. Preferred metals include such noble metals as platinum, gold and silver, as well as other metals.

Abstract: A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m2.

Abstract: A method to selectively metallize polyimide with an all-electroless process.

Abstract: The present invention generally provides a method for improving fill and electrical performance of metals deposited on patterned dielectric layers. Apertures such as vias and trenches in the patterned dielectric layer are etched to enhance filling and then cleaned in the same chamber to reduce metal oxides within the aperture.