Abstract: A metallic film (2) made of a metal on which an electroless plating film can be deposited is formed on part of the surface of a thermoelectric semiconductor (8) which is an object to be plated, made of a constituent material to which an electroless plating can not be directly applied, and subsequently, the thermoelectric semiconductor (8) is dipped in an electroless plating bath, whereupon a conductive film (3) having a uniform thickness, made up of an electroless plating film, is formed on the entire surface of the thermoelectric semiconductor (8) containing the surface of the metallic film (2).

Abstract: A metallized polyimide film of the present invention comprises a polyimide film 1 which has undergone surface roughening treatment to produce a surface Ra value of 2 to 10 nm, an intermediate layer 2 formed from one, or two or more elements selected from a group consisting of molybdenum, silicon and silicon monoxide, which is formed on top of the surface which has undergone surface roughening treatment with an average thickness of 5 to 50% of the aforementioned Ra value, and a conductive metal layer 4 which is formed on top of the intermediate layer 2. This construction improves the bonding strength between the polyimide film and the metal layer.

Abstract: A wear resistance coated bell atomizer (32) and method for making same. The coating applied to the outer surface of a bell cup (36) of the bell atomizer (32) is preferably a silicon-doped amorphous carbon coating. This silicon-doped amorphous carbon coating significantly increases the usable life of a bell cup (36) in a bell atomizer paint system (10) by limiting the effects of abrasive materials on the wearable surfaces of the bell cup (36), including the top serrated edges (46), which may negatively affect the performance of uncoated bell atomizer spray equipment.

Abstract: For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.

Abstract: Tanned leather is dry dressed by plasma deposition at atmospheric pressure of a matrix material such as ITO, a silicone, or polyurethane, upon the protein fibers of the surface of the leather and the collagen fiber skeleton below the surface protein fibers. The leather retains its toughness, elasticity, breathability and softness or hand.

Abstract: In a device for forming magnetic film which deposits magnetic material on a substrate 12, a device is provided which, before the magnetic film is formed in a magnetic film-forming chamber 11, cleans one or both of the film-forming face and reverse face of the substrate 12 in a cleaning processing chamber 13. The cleaning mechanism carries out cleaning by placing a substrate on a horseshoe-shaped insulator substrate-holding part 51 which moves up and down, and emission of gas from the reverse face of the substrate and the like is brought about by generating Ar plasma between the upper periphery of the substrate, the substrate and a lower insulator 61 of the substrate.

Abstract: To provide an image display apparatus manufacturing method that enables bright, high-quality images to be displayed stably over a long period.

Abstract: A surface processing method for processing the surface of an insulating article in which an ion-implanted surface-modified layer is effectively formed on the article 2. In surface processing the article 2 of an insulating material, an electrically conductive thin metal film 50 is first formed on the article surface. A pulsed voltage containing a positive pulsed voltage and a negative pulsed voltage is applied to the article in a plasma containing ions to be implanted to implant ions in the article surface. This implants ions at right angles to the article surface to generate a surface-modified layer 51. There is no possibility of the article 2 being charged up due to application of a pulsed voltage.

Abstract: A film laminate is disclosed and comprises a biaxially oriented polyester film and another film laminated onto the polyester film, where the polyester film comprises a base layer at least 80% by weight of which is composed of a thermoplastic polyester, at least one cover layer and a metallic or ceramic layer located on the cover layer, where the cover layer is composed of a polymer or of a copolymer or of a mixture of polymers which comprises at least 40% by weight of ethylene 2,6-naphthalate units, up to 40% by weight of ethylene terephthalate units and, if desired, up to 60% by weight of units of other aliphatic, cycloaliphatic or aromatic diols and/or carboxylic acids, with the proviso that the Tg2 value of the polyester film is greater than the Tg2 value of the base layer but smaller than the Tg2 value of the cover layer.

Abstract: An adherent antimicrobial coating and method of making same comprising hydrogenated amorphous carbon and a dispersion of antimicrobial metal ions adapted to maintain a therapeutically effective zone of inhibition.

Abstract: A method for forming metallic nanoclusters upon a substrate includes moving the substrate through a deposition chamber at a predetermined uniform velocity and depositing metallic precursor compounds onto the substrate. The metallic precursor compounds are subsequently bombarded with an ultrasonic jet of atomic hydrogen to form the metallic nanoclusters.

Abstract: A method for chemical vapor deposition comprises providing a quantity of nitrogen at the interface between a transition metal-based material and an underlying dielectric-covered substrate. The nitrogen can be provided by heating the substrate in an atmosphere of a nitrogen-containing process gas or by exposing the surface of the dielectric-covered substrate to a plasma generated from a nitrogen-containing process gas. In certain embodiments, the nitrogen on the surface of the dielectric is bound with atoms of a transition metal to form a thin layer of a transition metal nitride. The method promotes the adhesion of the transition metal-based layer to the dielectric by nullifying the effect of halogen atoms that are also incorporated at the transition metal/dielectric interface.

Abstract: A magnetic recording medium having an excellent surface smoothness comprising a substrate and a maghemite thin film formed on the substrate. The maghemite thin film has a thickness of 10 to 50 nm and a surface roughness represented by an average surface roughness (Ra) of 0.1 to 0.7 nm and a max height (Rmax) of 1 to 10 nm. The magnetic recording medium exhibits an excellent surface smoothness without deterioration in high coercive force.

Abstract: A method for depositing nanoparticles in a thin film through the dispersion of such nanoparticles in a precursor solution which is deposited on a substrate and converted into a metal or metal oxide film. The resulting metal or metal oxide film will contain embedded nanoparticles. Such films can be used in a variety of applications such as diffusion barriers, electrodes for capacitors, conductors, resistors, inductors, dielectrics, or magnetic materials. The nanoparticle material may be selected by one skilled in the art based on the particular application.

Abstract: A microneedle array is manufactured using a mold preparation procedure that begins by placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles.

Abstract: A surface processing method for processing the surface of an insulating article in which an ion-implanted surface-modified layer is effectively formed on the article 2. In surface processing the article 2 of an insulating material, an electrically conductive thin metal film 50 is first formed on the article surface. A pulsed voltage containing a positive pulsed voltage and a negative pulsed voltage is applied to the article in a plasma containing ions to be implanted to implant ions in the article surface. This implants ions at right angles to the article surface to generate a surface-modified layer 51. There is no possibility of the article 2 being charged up due to application of a pulsed voltage.

Abstract: A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Abstract: A surface treatment method wherein one or more active particle streams are generated and aimed at a surface to be treated so that the particle stream interacts therewith. The active particle stream consists of activated particles forming chemically active sites on the surface, and modifying particles occupying said sites. The energy of the activated particles is greater than the energy at break of the inhibited surface bonds of the surface, and lower than the radiative flaw formation energy on the surface. The strength of the particle stream at the treated surface is greater than a quantity N/t where N is the surface density of the inhibited bonds to be broken and t is the duration of exposure of any point on the treated surface to the stream. A device for carrying out the method is also provided.

Abstract: Coatings, devices and methods are provided, wherein the contacting surface of a medical device with at least one contacting surface for contacting a bodily fluid or tissue is modified by plasma treatment in a plasma comprising nitrogen-containing molecules and oxygen-containing molecules. The nitrogen-containing molecules include NH3, (NH4)+, N2O, NO, NO2 and N2O4, and the oxygen-containing molecules include O2 and O3. The plasma-modified contacting surface exhibits decreased adhesion of at least some mammalian cells, such as platelets and leukocytes, decreased restenosis when used with stents, and increased apoptosis. Additional layers may be applied, including plasma polymerized hydrocyclosiloxane monomers, amine-providing groups such as N-trimethylsilyl-allylamine, polyoxyalkylene tethers, and bioactive compounds.

Abstract: There are known for use in the electronics industry polyimide substrates with copper coatings, which are produced by decomposition of organometallic compounds by means of a glow discharge process and subsequent electroless metallization of the resulting metal film. From deposition of the first metal coating there results, without addition of oxygen, carbon-containing layers which have a low conductivity and low catalytic activity. If only alkaline metallizing baths are used, initially securely adhering metal coatings are in fact deposited on the polyimide surfaces, the secure adhesion of the metal coatings on the polyimide however is considerably impaired upon contact of the metal with aqueous-alkaline solutions. If operation is in an oxygen atmosphere, palladium layers result which must be subsequently reduced. Such layers provide no or very small adhesion, when they are exposed to chemical or electrochemical process solutions.

Abstract: A method for attaching adherent metal components, particularly a copper film, on at least one surface of a polyimide substrate is provided. The method comprises the steps of: exposing at least one surface of the polyimide substrate to a reactive gas plasma that provides a level of ion bombardment of the polyimide surface sufficient to disrupt at least a portion of the imide groups on the surface and to form reactive carboxylate groups, carbonyl groups and other carbon-oxygen functional groups on the surface; and then depositing a metal film onto the chemically-modified surface without intervening exposure to air. The present invention also provides a copper-coated polyimide product comprising a polyimide substrate having a substantially smooth and chemically-modified surface and a copper film directly attached to the surface, i.e., the product is free of a polymeric adhesive layer or tie coat between the surface of the polyimide substrate and the copper film.

Abstract: A magnetic recording medium is prepared by forming on a plastic substrate, a nickel oxide underlayer having a plane (200) which is predominantly oriented in parallel with the surface of the plastic substrate, then forming on the nickel oxide underlayer at a substrate temperature of less 240° C., a cobalt-containing magnetite thin film having a plane (400) which is predominantly oriented in parallel with the surface of the plastic substrate, and finally oxidizing the cobalt-containing magnetite thin film in a plasma-activated oxygen atmosphere containing a rare gas at a substrate temperature of less than 240° C. while incorporating the rare gas into oxygen. This results in a cobalt-containing maghemite thin film as a perpendicular magnetic film having a spacing of a plane (400) of not more than 2.082 Å. The magnetic recording medium so produced is useful for high-density recording using a plastic substrate.

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.

Abstract: A method for providing anti-static characteristics for polymeric, integrated circuit (IC) trays, which allows gaseous ions, such as nitrogen and argon, or metal ions, such as Ti, Li and Al, to be implanted to a surface depth of 1.5 &mgr;m in IC trays. In addition to experiencing no dimensional changes during the antistaticity working, the IC trays have a uniform distribution of ions over their surfaces and range, in surface resistance, from 106 to 1012 &OHgr;/cm2.

Abstract: A surface treatment method wherein one or more active particle streams are generated and aimed at a surface to be treated so that the particle stream interacts therewith. The active particle stream consists of activated particles forming chemically active sites on the surface, and modifying particles occupying said sites. The energy of the activated particles is greater than the energy at break of the inhibited surface bonds of the surface, and lower than the radiative flaw formation energy on the surface. The strength of the particle stream at the treated surface is greater than a quantity N/t where N is the surface density of the inhibited bonds to be broken and t is the duration of exposure of any point on the treated surface to the stream. A device for carrying out the method is also provided.

Abstract: Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.

Abstract: A process for depositing metal coatings on polyimide surfaces for producing conductor tracks includes depositing a first metal coating by decomposition of volatile metal compounds by a glow discharge in a gas mixture containing inert gases and oxygen containing compounds, followed by electroless deposition of a second metal coating from an acid or neutral metallizing bath.

Abstract: A hybrid film, comprising a first polymer film having a plasma-treated surface and a second polymer film having first and second surfaces, with the first surface of the second polymer film being disposed along the first plasma-treated surface of the first polymer film, has superior thermal and mechanical properties that improve performance in a number of applications, including food packaging, thin film metallized and foil capacitors, metal evaporated magnetic tapes, flexible electrical cables, and decorative and optically variable films. One or more metal layers may be deposited on either the plasma-treated surface of the substrate and/or the radiation-cured acrylate polymer A ceramic layer may be deposited on the radiation-cured acrylate polymer to provide an oxygen and moisture barrier film. The hybrid film is produced using a high speed, vacuum polymer deposition process that is capable of forming thin, uniform, high temperature, cross-liked acrylate polymers on specific thermoplastic or thermoset films.

Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Abstract: A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides.

Abstract: A process for additive manufacture by energetic wire deposition is described. A source wire is fed into a energy beam generated melt-pool on a growth surface as the melt-pool moves over the growth surface. This process enables the rapid prototyping and manufacture of fully dense, near-net shape components, as well as cladding and welding processes. Alloys, graded materials, and other inhomogeneous materials can be grown using this process.

Abstract: A method of modifying the surface characteristics of a substrate, particularly a polymeric material. The method involves grafting ethylenically unsaturated monomers and attaching biomolecules, such as heparin, to the surface of the substrate, such as a polymeric material, in one step using an oxidizing metal, such as ceric ions.

Abstract: The present invention provides an improved method for making a solar control sheet having one or more metal layers. In the prior art solar control sheets, each metal layer would normally be non-porous so that water vapor would not be readily transmitted therethrough. However, in this invention the metal layer is rendered porous because it is deposited on a porosity inducing surface. The porosity inducing surface may be the surface of a porous primer layer or a surface which has been roughened. Consequently when the solar control film of this invention is mounted on a window with a water based mounting media, the water can quickly evaporate through the film without causing undesirable cloudiness which is normally associated with water which becomes trapped between the film and the window.

Abstract: A titanium/titanium nitride film stack can be formed with reduced amounts of impurity by depositing onto a substrate a film of titanium using plasma-enhanced chemical vapor deposition of titanium tetrachloride and hydrogen. This film is then subjected to a hydrogen/argon plasma which significantly reduces the chlorine content of the titanium film. The titanium film can then be subjected to an ammonia plasma which will form a thin layer of titanium nitride which is then coated with a thick layer of titanium nitride using plasma-enhanced chemical vapor deposition of titanium tetrachloride and ammonia. The hydrogen/argon anneal significantly reduces the chlorine content of the titanium film and thus the chlorine content at the titanium substrate interface, particularly when the substrate contains aluminum. This enhances the overall reliability of the formed product.

Abstract: A multi layer film having enhanced barrier properties against transmission of oxygen and water vapor is provided. The multi layer film includes a polypropylene base layer, with a high density polyethylene layer on at least one surface of the polypropylene base layer. The polyethylene layer includes a surface which has been subjected to plasma treatment with a hydroxyl-donating material such as a methanol. The film further includes a metal layer deposited on the plasma treated surface, such as a layer of vacuum deposited aluminum. Multi layer films according to the present invention are particularly useful as packaging films for food products.

Abstract: A method of fabricating nanometric structures on a substrate by dry etching includes setting the substrate at a temperature at which condensation of etching gas products of etching gas decomposed, recombined and reacted, or products of reactions between the etching gas and substrate material starts to occur, forming condensates at specific locations on the substrate. The condensates form an etching mask for the dry etching process.

Abstract: A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.

Abstract: A plastic wrapping film is provided with one or more aluminum layers by vapor deposition and the or each layer is only partially oxidized in an oxidizing plasma so that the resulting barrier layer is distinguishable by slight reduction in transparency but excellent prevention of penetration by moisture and oxygen.

Abstract: A tool is made in a coating vessel, depositing upon the base tool body of a hard metal or cermet, a coating by chemical vapor deposition by admitting to the vessel a reactive gas mixture capable of forming a composition selected from the group which consists of aluminum oxide and of titanium and zirconium carbide, nitride and carbonitride, and of mixtures thereof at a chemical vapor deposition pressure and temperature; and interrupting the chemical vapor deposition by a multiplicity of times by replacing the reactive gas mixture with a nonreactive gas mixture containing components selected from the group which consists of argon, hydrogen, nitrogen and mixtures thereof, lowering a pressure in the vessel to a plasma chemical vapor deposition pressure of 10 to 1000 Pa, effecting a glow discharge at the body with the body being cathodically connected at a negative D.C.

Abstract: Imaging elements, such as photographic, electrostatographic and thermal imaging elements, are comprised of a support, an image-forming layer and an electrically-conductive layer produced by coating a layer comprised of a metallo-organic compound and a film-forming binder and subjecting such layer to glow discharge treatment to render it electrically conductive. Use of a metallo-organic compound in combination with a glow discharge treatment provides a controlled degree of electrical conductivity and beneficial chemical, physical and optical properties which adapt the electrically-conductive layer for such purposes as providing protection against static or serving as an electrode which takes part in an image-forming process.

Abstract: An elemental titanium-free liner and cavity cleansing process is provided that allows for the elimination of conventional sputter etch and elemental titanium depositions. A low power plasma etch provides for pre-conditioning/cleansing of cavities such as contacts and vias. A refractory metal is provided as a cavity liner. Preferably, the liner is comprised of several discrete refractory metal liner layers, each having a thickness of about 25-100 .ANG., that can be applied by CVD and/or PVD. A low power plasma cleanse is preferably interposed between each liner layer deposition. A suitable metal plug can be deposited and directed into the cavity to complete cavity filling. Preferably, the metal plug is an elemental aluminum or aluminum alloy plug that is deposited by CVD and force-filled into the cavity to reduce the incidence of micro-voids within the cavity.Elimination of the conventional sputter etch and the high temperature processing (temp..gtoreq..sup..about. 400.degree. C.

Abstract: A process for the production of a carrier for surface plasmon resonance analysis comprising:A) depositing a preparatory layer on a surface, said preparatory layer comprising a metal selected from the group consisting of: nickel, titanium and chromium, wherein said preparatory layer is substantially uniform and has a thickness of 20-40 Angstroms,B) depositing a silver layer on said preparatory layer wherein said silver layer is substantially uniform and has a thickness of 500-600 Angstroms, andC) said carrier is suitable for surface plasmon resonance analysis.

Abstract: A maskless process generates a patterned coating on a polymeric substrate, wherein the pattern is at least partially defined by the substrate topography. The process uses a high intensity/high fluence energy source to strike a coated substrate, thus selectively removing a portion of the coating. The amount and area of the coating removed is dependent on the substrate topography and the applied energy, and this forms a pattern of residual coating material on the substrate.

Abstract: A method for sequentially depositing a barrier composition film as a barrier on a substrate. The film is useful for providing an effective barrier against gas permeability in containers and for extending shelf-life of containers, especially plastic evacuated blood collection devices.

Abstract: The high density plasma metal etch rate of a conductive material within a dense array of conductive lines is increased to no less than the etch rate of the conductive material in a bordering open field by injecting a sufficient amount of nitrogen into the total gas flow of the plasma. The injection of nitrogen in amounts of about 15% and 50% by volume of the total gas flow effectively reduces the etch rate differential between the dense array and open field, thereby reducing overetching, resist loss, and oxide loss in the open field, and facilitating planarization.

Abstract: Copper lines or molybdenum lines on a substrate are inspected for defects by coating a metallized substrate with an inspection layer followed by imaging the substrate, and removing the inspection layer after the imaging. The inspection layer can be a light reflecting metal or a combination of a light reflecting metal and light-absorbing organic compound.

Abstract: A method for enhancing hydrogenation of oxide-encapsulated materials includes forming an injection layer having a low reflectivity of monatomic hydrogen on an oxide-encapsulated material, and hydrogenating the material with an atomic hydrogen source such as a hydrogen plasma. The method results in a significant decrease in hydrogenation time required to passivate the oxide-encapsulated materials.

Abstract: This invention provides an improved process for surface modification of polymers, graphites and carbon-based composite materials, and improved surface-modified materials produced by the process. The preferred surface modification process of the present invention comprises the steps of: high dose single or multiple implantation of the substrate with energetic ions, including ions of at least one metal or semi-metal element able to form a stable, non-volatile oxide; and oxidative full or partial conversion of an upper portion of the implanted layer to a continuous, resistant oxide-enriched surface layer. The process may also comprise the additional implantation of a hardening non-metal element to participate in the formation of a glass-like surface layer or to form a carbonized, hardened sub-layer.

Abstract: A metallic film is disclosed. The film has a layer of an organic polymer substrate having an sulfur-reactive surface, to which is adhered a vapor deposited metallic layer. Optionally, a metallic halide layer is formed on the metallic layer to provide depolarizing capacity for the metallic film. Methods of making and using the metallic film are disclosed. Biomedical electrodes, including radiolucent defibrillation electrodes, window films, optical reflectors, and flexible electronic circuits are articles which can use the metallic film as a component.

Abstract: A method of making capacitors comprising, providing as the dielectric and/or conductive layers, a material made from a diamond-like nanocomposite solid-state material having interpenetrating atomic scale networks of carbon in a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and optionally at least one additional network of dopant elements or dopant compounds having elements from Groups 1-7b and 8 of the periodic table.