Abstract: A polishing device having a table connected to a traction drive type reduction gear. The reduction gear includes an externally contacting shaft formed in a ring-shaped hollow cylinder and arranged at the center; a plurality of intermediate shafts which are equidistantly disposed at the circumference of the externally contacting shaft, at least one of which is an input shaft; and an internally contacting cylinder with which the intermediate shafts internally contact, and under free conditions, the externally contacting shaft formed in a hollow cylinder has a diameter which is a little bit larger than a diameter of an imaginary circle which externally contacts with a plurality of intermediate shafts whereby pressing load is created by means of deformation of the hollow cylinder.

Abstract: A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly comprised of a central pad mount on a central shaft. That central pad mount beneficially retains a center polishing pad. Also included is a ring polishing assembly comprised of a ring pad mount with a central aperture on a ring shaft with a central aperture. The ring pad mount beneficially retains a ring polishing pad having a central aperture. The central polishing assembly and the ring polishing assembly beneficially rotate and move axially independently of one another. The apparatus includes the CMP polishing tool and a rotating polishing table. The method includes rotating a semiconductor wafer on the rotating polishing table. Then, selectively and independently moving a solid center polishing pad having an axis of rotation and/or an axially aligned ring-shaped polishing pad into contact with the surface of the semiconductor wafer.

Abstract: A finishing apparatus modifies the physical structure along the edge of a metal knife blade wherein the edge is formed at the junction of two edge facets presharpened with abrasives. The finishing apparatus consists of at least one precision angular knife guide that positions the edge of the blade into contact with the rigid surface of a driven moving member and positions the plane of the adjacent edge facet at a precise predetermined angle relative to the plane of the rigid surface that is harder than the metal of the knife and is without tendency to abrade.

Abstract: In a hand power tool for surface machining, with a vibrating plate, which is suspended on a housing by vibrating elements, and with an electromotively driven eccentric drive, which is contained in the housing and sets the vibrating plate into an orbital oscillating motion, in order to produce a housing that is rather flat and short, which can be manually controlled in the same way as a grasping block, the coupling point is situated between the eccentric drive and the vibrating plate, close to the front edge of the vibrating plate, while the elastic vibrating elements engage the vibrating plate close to the opposite edge of the vibrating plate.

Abstract: An objective of the present invention is to provide a burnishing pad, capable of removing dirt by burnishing a place (i.e., a dirty point) onto which dirt attaches to impart sufficient luster, and being biodegraded; a burnishing machine equipped with the burnishing pad; and a burnishing method using the burnishing pad. The burnishing pad of the invention is comprised of a lock-like fiber composite in which adjacent fibers are bonded at intersection thereof, wherein said fiber is at least one selected from the group consisting of a vegetable fiber and an animal fiber. And another burnishing pad is a fiber composite comprised of thick fibers of 150 ?m or more in fiber diameter. These pads can be equipped with a porous supporting layer, respectively. The porous supporting layer has a mean 5% modulus strength of 20 N/5 cm width or more at 70° C. and a unit area weight of 100 g/m2 or less.

Abstract: In a slurry solution for chemical mechanical planarization (CMP) of a semiconductor wafer, an abrasive particle is provided having a central body and a plurality of extensions from the central body of the abrasive particle. The plurality of extension hold a center of mass of the abrasive particle a distance from the semiconductor wafer during the CMP process. The extensions extend 3-dimensionally from the central body, with the length of one extension being about 30 nm. The extensions reduce attractive forces acting on the central body allowing the abrasive particles to be removed from the semiconductor wafer during a post-CMP cleaning process.

Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.

Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.

Abstract: An improved method for lapping the opposed major surfaces of a wafer is provided. In this regard, a multi-step lapping process is provided in which lapping continues while transitioning from a first slurry having larger abrasive particles to a second slurry having smaller abrasive particles so as to reduce the overall length of the lapping process. In addition, the multi-step lapping process is optimized so as to remove no more than about 90 microns in total thickness from the opposed major surfaces of the wafer. By completing the lapping with slurry having smaller abrasive particles, subsequent etching of the wafers produces shallower surface pitting. As such, the wafers generally require less polishing than required by conventional processes.

Abstract: A finishing machine having a sandpaper positioning function includes a frame, a rotation wheel rotatably mounted on the frame, a sandpaper bonded on the rotation wheel, and an O-ring mounted on the rotation wheel and urged on the sandpaper. The rotation wheel has a periphery formed with an annular flange radially extending inward. The annular flange has an inner periphery formed with an annular groove. The O-ring is inserted into the annular groove of the rotation wheel and urged on the annular flange of the rotation wheel so as to position the sandpaper rigidly and stably.

Abstract: A sharpener includes a motor driven shaft with at least one slidably mounted sharpening assembly consisting of a supporting hub structure mounted by its central bore hole on the shaft. The hub structure supports a symmetrically shaped rotating surface containing an ultra fine abrasive material. The rotating surface is pressed with a force of less than 0.2 lb. by a spring action to make sustained rotating abrading contact with a facet of a knife positioned by a knife guide to align the facet into contact with the surface containing the abrasive materials.

Abstract: Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.

Abstract: A surface dresser for removing contaminants includes a body assembly with a stationary seat and an adjustable assembly with a dressing wheel. The adjustable assembly is rotatably mounted on an outer periphery of the stationary seat. Two pairs of pin holes are defined in the stationary seat, and a flexible pin with two short ends is movably mounted in each pair of pin holes. A latch is slidably attached on the outer periphery of the stationary seat and has two clamping holes and two detents corresponding to two adjacent pin holes. When the adjustable assembly is rotated relative to the body assembly by a specific angle, the flexible pins selectively engage the clamping holes and the detents in the latch to lock the adjustable assembly. Consequently, the angle of the dressing wheel is adjustable to accommodate various requirements.

Abstract: A backing plate for an abrasive flap wheel has a sunk inner part and an outer flange. The sunk inner part has a hub which is provided with a location hole having an internal thread. The internal thread serves to fasten the backing wheel to the threaded shaft of a driving machine.

Abstract: A polishing pad showing intrinsic abrasion automatically during processing. In the pad of the present invention, a polishing substrate has a first surface, a first index a first predetermined distance from the first surface, a second index a second predetermined distance from the first surface, and a third index a third predetermined distance from the first surface, wherein the third predetermined distance exceeds the second predetermined distance, and the second predetermined distance exceeds the first predetermined distance. The polishing pad shows the first pattern when abrasion from the first surface exceeds the first predetermined distance, and shows the first and second patterns when abrasion from the first surface exceeds the second predetermined distance. The first, second and third patterns appear when abrasion from the first surface exceeds the third predetermined distance.

Abstract: For a power grinder, in particular an oscillating grinder (10), with a platelike grinding sheet holder (14), on whose working face (15) a grinding sheet (16) can be braced whose grinding sheet ends (17, 19) can be held firmly on the grinding sheet holder (14) by means of clamping means (20, 23) disposed thereon, in which a lever with a pivot shaft (24) disposed on the top of the grinding sheet holder (14) acts as the clamping means (20, 23) and has a clamping jaw (22) on one end, braced on the grinding sheet holder (14), secure clamping of the grinding sheet and easy changing of the grinding sheet are possible by the provision that for equipping the power grinder (10), the grinding sheet (16) can be inserted between the clamping jaw (22) and the grinding sheet holder (14)—counter to the elastic prestressing of the clamping jaw (22)—and is firmly held increasingly strongly counter to the insertion direction in proportion to the tensile force engaging it.

Abstract: The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holder and engaging with the abrasive plate; a first O-ring being provided between the fixed engaging member and the abrasive plate; a second O-ring being provided between the plate holder and the abrasive plate; and a fluid supply-discharge mechanism for supplying a fluid to and discharging the same from a zone enclosed by the abrasive plate, the plate holder and the second O-ring. An outer circumferential face of the abrasive plate is separated from an inner circumferential face of the fixed engaging member.

Abstract: Working plate (10) is formed of forty-eight sections (10′), with groove (12) extending through the majority of the thickness of the plate. In one form, dovetail grooves are machined to the back of the sections of the plates (10′) attached to the base plate (19). In an alternative arrangement, fixing rails are attached to the backs of the sections and the dovetail grooves are in the base plate (19).

Abstract: A lapping method of a magnetic head slider provided with an element-forming surface, an ABS and an MR element formed on the element-forming surface, including a step of setting the magnetic head slider to be lapped on a lapping means, and a step of lapping by the lapping means the ABS of the magnetic head slider with while keeping an angle between the element-forming surface of the magnetic head slider and a lapping direction in a range greater than 0 degrees and equal to or less than 30 degrees.

Abstract: A drill bit sharpener includes a motor assembly and a drill bit grinding assembly. The motor assembly has a motor with a drive shaft to drive the drill bit grinding assembly, which includes a driven assembly, a sharpener housing, a grinding wheel assembly and a bit guide assembly. The sharpener housing is attached to the motor assembly, and the grinding wheel assembly is rotatably mounted in the sharpener housing and is rotated by the driven assembly. The bit guide assembly is mounted in the sharpener housing above the grinding wheel assembly. An adjusting screw in the bit guide assembly is used to adjust the grinding wheel assembly relative to the bit guide assembly. Multiple bit guide holes correspond to the grinding wheel assembly are defined in the bit guide assembly and allow a drill bit to pass through to abut the grinding wheel.

Abstract: The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus (100) includes a first spindle (110) having an eccentric-shaped abrasive matrix (112) coupled thereto and a second spindle (116) adapted to hold a substrate (118) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center (134) for only a portion of the time during grinding operations.

Abstract: A grinding apparatus for pointing electrodes for TIG welding including a rotatable grinding disc, a holding device for the electrode, and a feeding device for feeding the electrode toward the grinding disc, the holding device and the grinding disc being adjustable so that a longitudinal direction of the electrode forms a desired angle with the plane of the grinding disc. The feed device includes a drive roller which is adapted to press the electrode laterally toward the grinding disc and an axis of the rotation of the roller forms an angle with the longitudinal axis of the electrode so that the roller by rotation moves the electrode forwards towards the grinding disc.

Abstract: A polishing pad having a soft layer with a porous structure impregnated with a relatively hard material that locally deforms irreversibly under polishing pressure to a substantially flat polishing pad surface.

Abstract: An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.

Abstract: A grinding or polishing machine or device having a grinding or polishing disc for grinding or polishing a work piece for the condition of the work piece placed against the lower surface of the grinding or polishing disc. The grinding or polishing disc has a plurality of slots extending therethrough to allow visual inspection of the work piece during the grinding or polishing operation.

Abstract: A power sanding machine (10) has three circumferentially spaced cogged belts (40) that are under tension via bearings (36) to drive three discs (52). A grounded vacuum (16) with a metal canister (74) is mounted on the operating handle (14).

Abstract: A semiconductor wafer for use in the fabrication of semiconductor devices which includes a circular wafer (13) of semiconductor material having a perimeter and a notch (11) having a wall disposed in the wafer and extending to the perimeter which includes a preferably rounded apex (5) interior of the perimeter and a pair of rounded intersections (7, 9) between the wall and the perimeter. The notch is formed with a tool (23) for forming rounded corners in the semiconductor wafer which includes a body of a material having a hardness greater than the semiconductor wafer which has a generally rounded or paraboloidally shaped front portion having a forwardmost tip (25) portion and a wing portion (27) extending outwardly from the body and having a taper narrowing in the direction of the forwardmost tip portion. The wing portion can be one or more spaced apart wing members or the wing portion can be a single member which extends completely around the tool axis.

Abstract: A method for lapping a magnetic read/write element on a slider having a shear based transducer is disclosed. The shear based transducer is used during the fabrication process to more precisely lap the MR element. The method comprises measuring the stripe height of the MR element and actuating the shear based transducer to move the MR element to a desired position relative to a lapping apparatus. The MR element is then lapped to achieve a desired stripe height.

Abstract: A polishing tool used for a CMP process is disclosed. The polishing tool includes a polishing platen for holding a wafer faced-up thereon and carrying the wafer to move to and fro between a first position and a second position, a polishing pad for polishing the wafer, and a holder for holding the polishing pad to self-rotate and carrying the polishing pad to move across the wafer surface and further driving the polishing pad to polish the wafer.

Abstract: The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

Abstract: An method of making a metal bonded, abrasive tool uses a perforated stencil to place abrasive parcels in a pattern on the cutting surface of the tool. The stencil is placed against the tool preform so that the perforations define cavities. Metal brazing composition in the form of a paste is packed into the cavities and the stencil is removed to leave discrete parcels of brazing paste tacked to the cutting surface. Abrasive grains are deposited onto the paste particles and fixed in place by firing the preform at brazing conditions. The abrasive grains thus are precisely positioned and spaced apart on the cutting surface by abrasive free channels which are defined by the web of the stencil. The abrasive free channels provide paths to facilitate flow of coolant material and swarf particles at the cutting zone. The method can include initially placing the brazing paste parcels onto a resilient, transfer medium and subsequently transferring the parcels onto the preform cutting surface.

Abstract: An electrical hand tool is proposed, whose handle, with is rotatably maintained on the motor housing, and has a maintenance opening. By means of this, the structural length of the hand tool is reduced, servicing is simplified and the production costs are lowered.

Abstract: An apparatus for closed loop slurry distribution during semiconductor wafer polishing operations. The traditional peristaltic pump for slurry supply is eliminated thus eliminating irregularities in the conventional slurry supply. Common platform mounting of the slurry reservoir and the polishing apparatus resulting in concurrent and identical motion of the slurry supply reservoir and the polishing apparatus. The polishing medium is mounted on the outside of a cylinder as opposed to the conventional table mounting, the polishing medium rotates around the axis of the cylinder on which this polishing medium is mounted. The polishing pads are in direct physical contact with the slurry supply without the intervention of any slurry pumping arrangement.

Abstract: Processes for the production of a smooth translucent glass sheet comprise grinding at least one face of a clear glass sheet using a conventional abrasive such as sand. Preferably the clear glass sheet is a sheet of clear float glass. The process may be carried out using a conventional glass grinding and polishing facility operated in a manner that the ground sheet is ground but not polished. The product preferably has a satin finish and a roughness Ra of less than 5.0 &mgr;M and is sufficiently translucent as to be useful in privacy glazing. The ground glass products may have a haze value of from 80 to 90% and an Ra value of from 1.0 &mgr;M to 3.0 &mgr;M are believed to be novel.

Abstract: Polishing compositions and tools for achieving polishing

Abstract: To provide an electro-deposited thin-blade grindstone containing a plate-shaped base metal, depressed portions that are open from near the edge portion of the base metal to the edge portion and are formed alternately on both side surfaces of the base metal, and a number of abrasive grains fixedly deposited on the depressed portions and protruded from the side surfaces and edge portion of the base metal. The depressed portion is formed in a depth of ½ or more of the thickness of the base metal. The abrasive grain is a hard abrasive grain made of diamond, CBN or the like. The diameter of the abrasive grain is nearly equal to the thickness of the base metal.

Abstract: A porous, roll-grinding tool has an abrasive surface which is adapted to contact and grind the surface of a roll and configured to a planar polygonal shape having 4 to 20 sides. Using the grinding tool, a roll can be ground within a satisfactory dimensional tolerance, with feed marks crossing the circumferential direction of the roll at a small feed mark pitch inclination angle, so that no streaky printing defects will be produced when the ground roll is used in printing.

Abstract: An offset type grindstone having a circular metal substrate provided in a central section thereof with a recess having a hole used to mount the grindstone on a power tool, and a grindstone portion including one layer of either diamond grains or cBN grains and formed in one body so as to extend continuously in the direction of an outer circumference of a front surface of the recess, in which grindstone the concentration of the grains on the grindstone portion is set high in a region of an outer circumferential end section thereof, and low in the other region thereof. This grindstone is superior in lifetime with a very high grinding speed and a high flat grindability attained at once.

Abstract: A polishing material for chemical mechanical polishing has a mesh of fibers and a binder material holding the fibers in the mesh. The binder material coalesced among the fibers to leave pores in the interstices between the fibers of the mesh. The fibers and binder material provide the polishing material with a brittle texture. The fibers can be cellulose, and the binder material can be a phenolic resin.

Abstract: A machine tool for working stones and agglomerates of inert materials having a support for the abrasive or, respectively, cutting material to contact the stone during working and a connecting part for connecting the tool to the machine which generates and transmits to the tool the movement that the tool performs during working; the support and the connecting part are fastened to each other, in a detachable manner, by way of removable locking elements. Between the support and the connecting part a layer is interposed, made of a material which is suitable to damp the mechanical vibrations of the machine, reducing their transmission from the connecting part to the support, and suitable to damp the vibrations that occur in the support during working, and reducing further their transmission from the support to the connecting part.

Abstract: A rotary drive device of a polishing device such as a polishing table, a table for CMP or a rotary drive device of a polisher which is used to flatten an end face of a semiconductor wafer or an end face of liquid crystal glass, wherein disposed is a traction drive type reduction gear, which comprises: an externally contacting shaft formed in a ring-shaped hollow cylinder and arranged at the center; a plurality of intermediate shafts which are equidistantly disposed at the circumference of the externally contacting shaft, and at least one of which is an input shaft; and an internally contacting cylinder with which the intermediate shafts internally contact, and under free conditions, the externally contacting shaft formed in a hollow cylinder has a diameter which is a little bit larger than a diameter of an imaginary circle which externally contacts with a plurality of intermediate shafts whereby pressing load is created by means of deformation of the hollow cylinder.

Abstract: In a chemical-mechanical polishing machine (101) where a polishing head (100) holds a wafer (150) against a polishing pad (140), a retaining ring (300) that surrounds the wafer (150) has an open chamber (350) to distribute pressurized slurry (144) to the polishing pad (140) and to the periphery (153) of the wafer (150).

Abstract: Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Abstract: An apparatus 1 for polishing wafers in which a first pushing means 50 for imparting a pushing force to a carrier 20 is arranged along the outer peripheral portion under the lower surface of a head body 40, and a second pushing means 60 for imparting a pushing force to a retainer ring 30 is arranged at a central portion under the lower surface of the head body. The first and second pushing means are formed of air bags 51 and 61.

Abstract: The present disclosure relates to a fixture for holding a plurality of fiber optic connectors. The fixture includes a holding plate defining a plurality of ferrule receiving openings spaced about a reference axis. The holding plate includes a plurality of movable portions with each of the moveable portions at least partially defining one of the ferrule receiving openings. The moveable portions are moveable between open positions in which the ferrules can be inserted in the ferrule receiving openings, and clamped positions in which the ferrules can be clamped within the ferrule receiving openings. The fixture also includes a drive member mounted to allow relative rotation between the drive member and the holding plate, and a plurality of retaining members spaced about the reference axis. The retaining members are positioned between the drive member and the movable portions of the holding plate.

Abstract: A method of planarizing a semiconductor wafer having a polishing endpoint layer that includes a ligand is disclosed. One step of the method includes polishing a first side of the wafer in order to remove the ligand from the wafer. Another step of the method includes determining that a chelating agent has bound the ligand due to the polishing step removing the ligand of the polishing endpoint layer. The method also includes the step of terminating the polishing step in response to determining that the chelating agent has bound the ligand. A polishing system is also disclosed which detects a polishing endpoint based upon a chelating agent binding a ligand of a polishing endpoint layer of a semiconductor device.

Abstract: A parallel alignment device for chemical mechanical polishing using a plurality of carrier devices (123) rotatably coupled to a turret means. The apparatus (100) includes a turret and plurality of rotatable polishing surfaces (111) positioned around the turret. The apparatus also includes a plurality of carrier devices (123) rotatably coupled to the turret, where the carrier devices (123) are each adapted to hold a workpiece to be polished on at least one of the rotatable polishing surfaces. Each of the carrier devices is operably independently to each other during a process for chemical mechanical polishing.

Abstract: A composite polishing pad. A lower polishing pad is concentrically disposed on a turning table. The lower polishing pad has a same radius of the turning pad. A handler is installed at a periphery of the lower polishing pad to advantage a renewal process. An upper polishing pad is disposed on the lower polishing pad, again, concentrically to the turning table. The upper polishing pad has a radius between a covering range of polishing dresser (conditioner) and a covering range of a top ring. Therefore, while initiating, the projecting portions are not formed on the composite polishing pad, so that the manually notching step is skipped.

Abstract: A grinder is provided with a dust collecting structure comprising a base, a motor, a dust collecting cover, a blast wheel, a grinding body, and a dust collecting canister. The base is provided with a port. The motor is mounted on the base. The dust collecting cover has an open end and an opening corresponding to the port of the base. The blast wheel is disposed in the dust collecting cover such that a channel is formed between the blast wheel and the dust collecting cover and is in communication with the port of the base. The blast wheel is driven by the motor to turn. The grinding body is disposed at the outer side of the blast wheel and is driven by the motor to grind a workpiece. The dust collecting canister is in communication with the port of the base for collecting the dust from the grinding body via the channel.

Abstract: A device for lapping a bar of the type which carries a plurality of sliders used in magnetic storage systems includes first, second and third actuators adapted to couple to the bar, and impart a first, second and third controllable force in response to a first, second and third control signal, respectively. An arm couples to the first, second and third actuators and applies a lapping force to the bar which presses the bar against a lapping surface thereby causing material to be removed from the bar. A controller provides the first, second and third control signals to the first, second and third actuators, respectively, to impart a plurality of forces onto the bar. The actuators are controlled to obtain a desired profile of the bar and to obtain a desired distribution of the lapping force across the profile of the bar.